Film deposition using enhanced diffusion process

Abstract

Embodiments described herein relate to methods of seam-free gapfilling and seam healing that can be carried out using a chamber operable to maintain a supra-atmospheric pressure (e.g., a pressure greater than atmospheric pressure). One embodiment includes positioning a substrate having one or more features formed in a surface of the substrate in a process chamber and exposing the one or more features of the substrate to at least one precursor at a pressure of about 1 bar or greater. Another embodiment includes positioning a substrate having one or more features formed in a surface of the substrate in a process chamber. Each of the one or more features has seams of a material. The seams of the material are exposed to at least one precursor at a pressure of about 1 bar or greater.

Claims

1. A method for filling features formed on a substrate, the method comprising: positioning a substrate having one or more features formed in a surface of a material formed on the substrate in a process chamber; exposing the one or more features to at least one precursor at a pressure of 5 bar to 15 bar; and forming a gap fill layer over the one or more features to fill the one or more features, wherein the gap fill layer comprises at least one of a silicon-containing film or a carbon-containing gap fill layer.

2. The method of claim 1, wherein the at least one precursor is at least one silicon-containing precursor.

3. The method of claim 2, wherein the at least one silicon-containing precursor comprises at least one of silane (SiH.sub.4), disilane (H.sub.6Si.sub.2), dichlorosilane (DCS), trisilane (H.sub.8Si.sub.3), tetrasilane (Si.sub.4H.sub.10), tetraethyl orthosilicate (Si(OC.sub.2H.sub.5).sub.4), trimethylamine (TMA), dimethylsilane (C.sub.2H.sub.8Si), tetramethyldisilane (((CH.sub.3).sub.2SiHSiH(CH.sub.3).sub.2), hexamethyldisilane ((Si(CH.sub.3).sub.3).sub.2), hexamethyldisiloxane (HMDSO), and trisilyl-pentane (C.sub.8H.sub.19NSi).

4. The method of claim 2, the one or more features are exposed for a duration of 1 minute to about 180 minutes.

5. The method of claim 1, wherein the gap fill layer constitutes an amorphous silicon or an amorphous carbon film.

6. The method of claim 1, wherein the at least one precursor is at least one carbon-containing precursor.

7. The method of claim 6, wherein the at least one carbon-containing precursor comprises at least one of methane (CH.sub.4), acetylene (C.sub.2H.sub.2), propene (C.sub.3H.sub.6), trimethylamine (TMA), dimethylsilane (C.sub.2H.sub.8Si), tetramethyldisilane (((CH.sub.3).sub.2SiHSiH(CH.sub.3).sub.2), hexamethyldisilane ((Si(CH.sub.3).sub.3).sub.2), and hexamethyldisiloxane (HMDSO), trisilyl-pentane (C.sub.8H.sub.19NSi).

8. The method of claim 1, wherein the at least one precursor is provided at a flow rate of 50 sccm to 1000 sccm.

9. The method of claim 1, wherein a temperature of the process chamber is 150° C. to 450° C.

10. The method of claim 9, wherein a temperature of the substrate is 200° C. to 800° C.

11. A method for filling features formed on a substrate, the method comprising: positioning a substrate having one or more features formed in a surface of a material disposed on the substrate in a process chamber, a material disposed over the one or more features and a seam disposed in the material; exposing the material to at least one precursor at a pressure of 12 bar to 50 bar; and filling the seam with a filling material formed from the at least one precursor, the seam filling material comprising at least one of a silicon containing seam filling layer or a carbon containing seam filling layer.

12. The method of claim 11, wherein exposing the material to the at least one precursor further comprises exposing the material to the at least one precursor at a pressure of 12 bar to 20 bar.

13. The method of claim 11, wherein the filling of the seam heals the seam to form a seam-free material.

14. The method of claim 13, wherein the at least one precursor comprises at least one of silane (SiH.sub.4), disilane (H.sub.6Si.sub.2), dichlorosilane (DCS), trisilane (H.sub.8Si.sub.3), tetrasilane (Si.sub.4H.sub.10), tetraethyl orthosilicate (Si(OC.sub.2H.sub.5).sub.4), trimethylamine (TMA), dimethylsilane (C.sub.2H.sub.8Si), tetramethyldisilane (((CH.sub.3).sub.2SiHSiH(CH.sub.3).sub.2), hexamethyldisilane ((Si(CH.sub.3).sub.3).sub.2), hexamethyldisiloxane (HMDSO), and trisilyl-pentane (C.sub.8H.sub.19NSi).

15. The method of claim 13, wherein the at least one precursor comprises at least one of methane (CH.sub.4), acetylene (C.sub.2H.sub.2), propene (C.sub.3H.sub.6), trimethylamine (TMA), dimethylsilane (C.sub.2H.sub.8Si), tetramethyldisilane (((CH.sub.3).sub.2SiHSiH(CH.sub.3).sub.2), hexamethyldisilane ((Si(CH.sub.3).sub.3).sub.2), and hexamethyldisiloxane (HMDSO), trisilyl-pentane (C.sub.8H.sub.19NSi).

16. The method of claim 11, wherein a temperature of the process chamber is 150° C. to 450° C., and wherein a temperature of the substrate is 200° C. to 800° C.

17. The method of claim 11, wherein the at least one precursor comprises an element also present in the material.

18. A method for filling features formed on a substrate, the method comprising: flowing a precursor containing at least one of silicon or carbon into a processing region of a processing chamber containing a substrate; maintaining a pressure of the precursor disposed within the processing region containing the substrate at 5 bar to 15 bar; and gapfilling a feature or healing a seam disposed on a material disposed on the substrate disposed within the processing region containing the precursor.

19. The method of claim 18, wherein a temperature of the substrate is 150° C. to 800° C.

20. The method of claim 18, wherein the precursor is heated by a heater before flowing into the processing region.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, and may admit to other equally effective embodiments.

(2) FIG. 1 is a front, cross-sectional view of a chamber according to an embodiment.

(3) FIG. 2 is a schematic, cross-sectional view of a substrate illustrating seams in a material layer conventionally disposed in features of a substrate according to an embodiment.

(4) FIG. 3 is a flow diagram of a method for gapfilling features of a substrate according to an embodiment.

(5) FIG. 4A and FIG. 4B are schematic, cross-sectional views of a substrate in accordance with a method for gapfilling features of a substrate according to an embodiment.

(6) FIG. 5 is a flow diagram of a method for filling seams of a material disposed over one or more features of a substrate according to an embodiment.

(7) FIG. 6 is a schematic, cross-sectional view of a substrate in accordance with a method for filling seams of a material disposed over one or more features of a substrate according to an embodiment.

(8) To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

(9) Embodiments described herein include methods of seam-free gapfilling and seam healing. Embodiments described herein will be described below in reference to methods of seam-free gapfilling and seam healing that can be carried out using a chamber operable to maintain a supra-atmospheric pressure (e.g., a pressure greater than atmospheric pressure). The supra-atmospheric pressure process advantageously allows for seams within a previously deposited material to be filled or healed. The supra-atmospheric pressure process described herein additionally provides a method for seam-free gapfilling, wherein structures are filled, without the formation of seams, and film conformity is improved. The substantially seam-free or seam healed material can then be utilized to produce more robust and better performing electronic devices. The apparatus description described herein is illustrative, and should not be construed or interpreted as limiting the scope of the implementations described herein.

(10) FIG. 1 a is simplified front cross-sectional view of a chamber 100 suitable for performing the methods of seam-free gapfilling and seam healing described herein. It is contemplated that the methods of seam-fee gapfilling and seam healing described herein may alternatively be practiced in other chambers. The chamber 100 has a body 110 with an outer surface 112 and an inner surface 113 that encloses a processing region 115. The chamber 100 has a door 120 configured to sealably enclose the processing region 115 within the body 110 such that the processing region 115 can be accessed when the door 120 is open. A supra-atmospheric seal 122 is utilized to seal the door 120 to the body 110 in order to seal the processing region 115 for processing.

(11) The chamber 100 has a port 117 through the body 110. The port 117 has a pipe 118 therethrough, which is coupled to a heater 119. One end of the pipe 118 is connected to the processing region 115. The other end of the pipe 118 bifurcates into an inlet conduit 157 and an outlet conduit 161. The inlet conduit 157 is fluidly connected to a gas panel 150 via an isolation valve 155. The inlet conduit 157 is coupled to a heater 158. The outlet conduit 161 is fluidly connected to a condenser 160 via an isolation valve 165. The outlet conduit 161 is coupled to a heater 162. The heaters 119, 158 and 162 are configured to maintain a processing gas flowing through the pipe 118, inlet conduit 157 and the outlet conduit 161 respectively at a temperature above the condensation point, such that the processing gas does not condense to form a liquid. The temperature of the processing gas flowing through the pipe 118, inlet conduit 157, and the outlet conduit 161 is kept at a temperature that is above the condensation point, but does not compromise the structural integrity of the chamber by increasing the pressure above a predetermined limit. The predetermined pressure limit can be 25 bar or higher, such as 50 bar or higher, or 100 bar or higher. In one embodiment, the temperature is between the condensation point of the processing gas and about 250 degrees Celsius. In another embodiment, the temperature is kept between the condensation point of the processing gas and about 350 degrees Celsius. In another embodiment, the temperature is kept at any temperature above the condensation point of the processing gas, as long as the pressure within the processing chamber that is caused by the temperature increase, does not pass a predetermined pressure load threshold. The heaters 119, 158 and 162 are powered by a power source 145.

(12) The gas panel 150 is configured to provide a processing gas under pressure into the inlet conduit 157 for transmission into the processing region 115 through the pipe 118. The pressure of the processing gas introduced into the processing region 115 is monitored by a pressure sensor 114 coupled to the body 110. The condenser 160 is fluidly coupled to a cooling fluid and configured to condense a gaseous product flowing through the outlet conduit 161 after removal from the processing region 115 through the pipe 118. The condenser 160 converts the gaseous products from the gas phase into liquid phase. A pump 170 is fluidly connected to the condenser 160 and pumps out the liquefied products from the condenser 160. The operation of the gas panel 150, the condenser 160 and the pump 170 are controlled by the controller 180.

(13) The isolation valves 155 and 165 are configured to allow only one fluid to flow through the pipe 118 into the processing region 115 at a time. When the isolation valve 155 is open, the isolation valve 165 is closed such that a processing gas flowing through inlet conduit 157 enters into the processing region 115, preventing the flow of the processing gas into the condenser 160. On the other hand, when the isolation valve 165 is open, the isolation valve 155 is closed such that a gaseous product is removed from the processing region 115 and flows through the outlet conduit 161, preventing the flow of the gaseous product into the gas panel 150.

(14) One or more heaters 140 are disposed on the body 110 and configured to heat the processing region 115 within the chamber 100. The heaters 140 are powered by the power source 145. Power to the heaters 140 is controlled by the controller 180 through feedback received from the temperature sensor 116. The temperature sensor 116 is coupled to the body 110 and monitors the temperature of the processing region 115.

(15) A cassette 130 coupled to an actuator (not shown) is moved in and out of the processing region 115. The cassette 130 has a top surface 132, a bottom surface 134, and a wall 136. The wall 136 of the cassette 130 has a plurality of substrate storage slots 138. Each substrate storage slot 138 is evenly spaced along the wall 136 of the cassette 130. Each substrate storage slot 138 is configured to hold a substrate 135 therein. The cassette 130 may have as many as fifty substrate storage slots 138 for holding the substrates 135. The cassette 130 provides an effective vehicle both for transferring a plurality of substrates 135 into and out of the chamber 100 and for processing the plurality of substrates 135 in the processing region 115. Although the chamber 100 described in FIG. 1 is configured to process a plurality of substrates as a batch, the chamber 100 may alternatively be configured to process a single substrate one at a time within the chamber 100.

(16) The controller 180 controls the operation of the chamber 100. The controller 180 controls the operation of the gas panel 150, the condenser 160, the pump 170, the isolation valve 155 and the isolation valve 165 as well as the power source 145. The controller 180 is also communicatively connected to the temperature sensor 116, the pressure sensor 114 and the cooling channel 124. The controller 180 includes a central processing unit (CPU) 182, a memory 184, and a support circuit 186. The CPU 182 may be any form of a general-purpose computer processor that may be used in an industrial setting. The memory 184 may be a random access memory, a read-only memory, a floppy, or a hard disk drive, or other form of digital storage. The support circuit 186 is conventionally coupled to the CPU 182 and may include cache, clock circuits, input/output systems, power supplies, and the like.

(17) The chamber 100 provides a supra-atmospheric pressure for methods of seam-free gapfilling and seam healing. The methods utilize chemical vapor deposition (CVD) under a supra-atmospheric pressure provided via the chamber 100. The supra-atmospheric pressure is maintained in the chamber 100 while exposing at least one substrate 135 to the processing gases in the processing region 115 maintained within a range of about 1 bar to about 100 bar, such as about 1 bar to about 50 bar, such as about 1 bar to about 20 bar, for example about 5 bar to about 15 bar. In another example, the pressure within the process chamber is maintained within a range of about 12 bar to about 50 bar, such as about 12 bar to about 20 bar, for example about 12 bar to about 15 bar. The application of supra-atmospheric pressure in the presence of the processing gases during CVD facilitates seam-free gapfilling and seam healing. In one embodiment, the chamber 100 maintains the processing region 115 and the substrate 135 at a temperature within a range of about 150 degrees Celsius to of about 800 degrees Celsius. In one embodiment, a temperature of the substrate 135 and a temperature of the processing region 115 are different.

(18) FIG. 2 is a schematic, cross-sectional view of a substrate having a material deposited over one or more features of the substrate to fill the one or more features. A substrate 135 includes one or more features 204 (shown as three high aspect ratio trenches) formed in a layer 202, such as a silicon or carbon-containing layer, on the substrate 135. The substrate 135 is generally any suitable substrate for processing, including but not limited to, silicon (Si) and/or germanium (Ge) substrates, and may include other elements such as, oxygen (O), nitrogen (N), and carbon (C). A material 206 is conventionally deposited over the one or more features 204. Examples of the conventional deposition processes include, but are not limited to, chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD, atomic layer deposition (ALD), and plasma-enhanced ALD (PEALD). However, the conventional processes result in one or more seams 208 formed in the one or more features 204 during the deposition of the material 206. The one or more seams 208 can also be described as small gaps or voids within the material 206 that are caused by in-complete filling of a trench or similar feature during gap-fill deposition. Stated differently, a seam 208 is not a purposefully formed trench or similar purposefully formed feature. The one or more seams 208 are exposed to the surface of the material 206, such that at least one end of the seam 208 is exposed to the processing region 115. The seams 208 can be thin seams down the middle of the features 204 formed in the layer 202 and can be of varying depths and thicknesses. In another embodiment, the seams 208 can be formed in only certain features 204, such that not all features 204 have a seam 208. The seams 208 can be off-center within the features and can include a variety of shapes and sizes. If left untreated, the one or more seams 208 often open up during further processing of the substrate 135, which leads to defective device performance.

(19) FIG. 3 is a flow diagram of a method 300 for gapfilling features of a substrate. To facilitate explanation, FIG. 3 will be described with reference to FIG. 1, FIG. 4A, and FIG. 4B. However, it is to be noted that a chamber other than chamber 100 of FIG. 1 may be utilized in conjunction with the method 300. FIG. 4A and FIG. 4B are schematic, cross-sectional views of a substrate in accordance with the method 300.

(20) At operation 301, the substrate 401 is positioned in an environment, such as a chamber, for processing. In one example, a plurality of substrates 401 are positioned as a batch for processing in the chamber 100. As shown in FIG. 4A, the substrate 401 has the one or more features 404 (shown as three high aspect ratio trenches) formed in the layer 402, such as a silicon or carbon-containing layer, on the substrate 401. In one embodiment, a plurality of substrates 401, loaded on the cassette 130, are transferred into the processing region 115 of the chamber 100. The door 120 is then closed to seal the chamber 100. The processing region 115 of the chamber 100 is pumped and purged with a non-reactive gas. After purging the processing region, the pressure is increased to slightly above 1 atm absolute pressure, such as about 1 atm to about 2 atm, such as about 1 atm to about 1.5 atm or about 1 atm to about 1.1 atm. The processing region 115 of the chamber 100 is pressurized to turn the chamber 100 into a supra-atmospheric chamber for gapfilling the one or more features 404. In one embodiment, the precursor is heated to a predetermined temperature within the inlet conduit 157 and the pipe 118 before entering the chamber. The chamber may be relatively cool, such that the temperature of the chamber is approximately the same temperature as the precursor heated within the conduit 157 and the pipe 118. In this embodiment, the chamber is heated after the introduction of the precursor, such that a pressure increase is caused by the temperature increase, until the chamber reaches a predetermined processing temperature. In another embodiment, the precursor is introduced into a pre-heated chamber that is already at the processing temperature. In this embodiment, the pressure increase is at least partially attributed to the introduction and heating of the precursor gas within the chamber.

(21) At operation 302, the substrate is exposed to a precursor and a gap fill layer 400 is deposited over the one or more features 404 of the substrate 401 to fill the one or more features 404, as shown in FIG. 4B. The gap fill layer 400 is deposited by CVD at supra-atmospheric pressure. In one embodiment, the supra-atmospheric pressure is within a range of about 1 bar to about 50 bar, such as about 1 bar to about 20 bar, for example about 5 bar to about 15 bar. In another example, the supra-atmospheric pressure within the process chamber is maintained within a range of about 12 bar to about 50 bar, such as about 12 bar to about 20 bar, for example about 12 bar to about 15 bar. In one embodiment, at least one precursor is introduced into the processing region 115 of the chamber 100 at the supra-atmospheric pressure. In some embodiments, at least one precursor can be introduced into the processing region 115 of the chamber 100 at about atmospheric pressure and the pressure increases to obtain a predetermined process chamber pressure. As shown in FIG. 4B, the gap fill layer 400 is deposited over the one or more features 404 of the substrate 401 to fill the one or more features 404 without one or more seams (as shown as reference numeral 208 in the layer 202 illustrated in FIG. 2) formed in the one or more features 404. The gap fill layer 400 deposited without one or more seams 208 leads to improved device performance.

(22) In one embodiment, the gap fill layer 400 is an X material-containing film and the depositing the gap fill layer 400 includes exposing the one or more features 404 of the substrate 401 to an X material-containing precursor, wherein X is an element. Suitable examples of X are, but are not limited to, silicon and carbon, among others. The X material-containing precursor may optionally be heated prior to or while disposed within the chamber 100.

(23) In one embodiment, the gap fill layer 400 is a silicon-containing film and the depositing the gap fill layer 400 includes exposing the one or more features 404 of the substrate 401 to at least one silicon-containing precursor. Examples of suitable silicon-containing precursors include, but are not limited to, one or more of silane (SiH.sub.4), disilane (H.sub.6Si.sub.2), dichlorosilane (DCS), trisilane (HsSi.sub.3), tetrasilane (Si.sub.4H.sub.10), tetraethyl orthosilicate (Si(OC.sub.2H.sub.5).sub.4), trimethylamine (TMA), dimethylsilane (C.sub.2H.sub.8Si), tetramethyldisilane (((CH.sub.3).sub.2SiHSiH(CH.sub.3).sub.2), hexamethyldisilane ((Si(CH.sub.3).sub.3).sub.2), hexamethyldisiloxane (HMDSO), and trisilyl-pentane (C.sub.8H.sub.19NSi). In one embodiment, the at least one silicon-containing precursor is optionally heated via components of the chamber 100.

(24) In another embodiment, the gap fill layer 400 is a carbon-containing film and the depositing the gap fill layer 400 includes exposing the one or more features 404 of the substrate 401 to at least one carbon-containing precursor. Examples of suitable carbon-containing precursors include, but are not limited to, one or more of methane (CH.sub.4), acetylene (C.sub.2H.sub.2), propene (C.sub.3H.sub.6), tetraethyl orthosilicate (Si(OC.sub.2H.sub.5).sub.4), trimethylamine (TMA), dimethylsilane (C.sub.2H.sub.8Si), tetramethyldisilane (((CH.sub.3).sub.2SiHSiH(CH.sub.3).sub.2), hexamethyldisilane ((Si(CH.sub.3).sub.3).sub.2), hexamethyldisiloxane (HMDSO), trisilyl-pentane (C.sub.8H.sub.19NSi), other alkenes, and other vinyl hydrocarbons. In one embodiment, the at least one carbon-containing precursor is optionally heated via components of the chamber 100.

(25) Depositing the gap fill layer 400 over the one or more features 404 of the substrate 401 occurs at a temperature in the processing region 115 between about 150 degrees Celsius (° C.) and about 450° C. and a temperature of the substrate 401 between about 200° C. and about 800° C. In one embodiment, the one or more features 404 are exposed for a duration of about 1 minute to about 180 minutes. The at least one silicon-containing precursor is provided at a flow rate of about 100 sccm to about 2000 sccm. The at least one carbon-containing precursor is provided at a flow rate of about 100 sccm to about 2000 sccm. In one embodiment, a temperature of 300-400° C. and a supra-atmospheric pressure of about 1 to about 10 bar will result in a gapfill layer 400 that is a conformal film, as shown in FIG. 4B. In another embodiment, a temperature of 500-800° C. and a supra-atmospheric pressure of about 1 bar to about 10 bar will result in a gapfill layer 400 that is non-conformal, such as a bottom-up deposited film. In some embodiments the gap fill layer 400 may be a low hydrogen containing film. In some embodiments the gap fill layer 400 may be a film with substantially no hydrogen concentration within the film. In some embodiments, the gap fill layer 400 constitutes an amorphous silicon film. In some embodiments, the seam filling layer 600 constitutes an amorphous carbon film. In some embodiments, the seam filling layer 600 comprises at least one of a silicon containing gap fill layer or a carbon containing gap fill layer.

(26) FIG. 5 is a flow diagram of a method 500 for filling seams of a material disposed over one or more features of a substrate. To facilitate explanation, FIG. 5 will be described with reference to FIG. 1, FIG. 2, and FIG. 6. However, it is to be noted that a chamber other than chamber 100 of FIG. 1 may be utilized in conjunction with method 500. FIG. 6 is a schematic, cross-sectional view of a substrate in accordance with the method 500.

(27) At operation 501, the substrate 135 is provided into a position or environment, such as a chamber, for processing. In one example, a plurality of substrates 135 are positioned as a batch for processing in the chamber 100. In another example, one substrate 135 is processed in the chamber 100 at a time. As shown in FIG. 2, the substrate 135 has one or more seams 208 of a material 206. Stated differently, the material 206 disposed on the substrate 135 includes one or more seams 208. The material 206 is disposed over one of more features 204 formed in the layer 202 of the substrate 135. In one embodiment, substrates 135 are loaded on the cassette 130 into the processing region 115 of the chamber 100. The door 120 is then closed to seal the chamber 100. The processing region 115 of the chamber 100 is pressurized to turn the chamber 100 into a supra-atmospheric chamber for filling seams 208 of a material 206.

(28) At operation 502, a seam filling layer 600 is deposited in the one or more seams 208 of the substrate 135 to fill the one or more seams 208, as shown in FIG. 6. The seam filling layer 600 is deposited by CVD at supra-atmospheric pressure. Suitable precursors are used at a supra-atmospheric pressure and driven into the seams 208 within the one or more features 204, so that the precursors are driven into the low-pressure seams. This helps enable the precursors to enter the seams 208 to form the seam filling layer 600 within, and thus heal, the seams 208. Seam filling layer 600 is formed within seams that are exposed to the surface of the material 206. In one embodiment, the supra-atmospheric pressure is within a range of about 1 bar to about 50 bar, such as about 1 bar to about 20 bar, for example about 5 bar to about 15 bar. In another example, the pressure within the process chamber is maintained within a range of about 12 bar to about 50 bar, such as about 12 bar to about 20 bar, for example about 12 bar to about 15 bar. In one embodiment, at least one precursor is introduced the processing region 115 of the chamber 100 at the supra-atmospheric pressure. As shown in FIG. 6, the seam filling layer 600 is deposited within the one or more seams 208 to fill the one or more seams 208 without additional seams forming in the seams 208. The use of high pressure, such as described herein, acts as a driving force and allows for the seam filling layer 600 to fill the seams 208. In some embodiments it is contemplated that filling the seams 208 with the seam filling layer 600 will also cause some of the seam filling layer 600 to be deposited on the material 206, outside of the seams 208 and on top of the material 206. This section of the seam filling layer 600 can be later removed via other substrate processing methods, such as chemical mechanical polishing or a selective etch back.

(29) In one embodiment, the material 206 is an X containing film and the depositing the seam filling layer 600 includes exposing the one or more seams 208 of the substrate 135 to an X containing precursor, wherein X is an element. Suitable examples of X are, but are not limited to, silicon and carbon, among others. The X containing precursor may optionally be heated prior to or while disposed within the chamber 100. The X containing film may be similar to the material 206 or the gap filling layer 400. The X containing film may also be created by the reaction of the X containing precursor with the material 206.

(30) In one embodiment, the material 206 contains silicon and the depositing the seam filling layer 600 includes exposing the one or more seams 208 to at least one silicon-containing precursor. The seam filling layer 600 may be a silicon containing layer formed from the silicon-containing precursor. Examples of suitable silicon-containing precursors include, but are not limited to, one or more of silane (SiH.sub.4), disilane (H.sub.6Si.sub.2), dichlorosilane (DCS), trisilane (H.sub.8Si.sub.3), tetrasilane (Si.sub.4H.sub.10), tetraethyl orthosilicate (Si(OC.sub.2H.sub.5).sub.4), trimethylamine (TMA), dimethylsilane (C.sub.2H.sub.8Si), tetramethyldisilane (((CH.sub.3).sub.2SiHSiH(CH.sub.3).sub.2), hexamethyldisilane ((Si(CH.sub.3).sub.3).sub.2), hexamethyldisiloxane (HMDSO), and trisilyl-pentane (C.sub.8H.sub.19NSi). In one embodiment, the at least one silicon-containing precursor is optionally heated via components of the chamber 100.

(31) In another embodiment, the material 206 contains carbon and depositing the seam filling layer 600 includes exposing the one or more seams 208 to at least to at least one carbon-containing precursor to form a carbon containing seam filling layer 600. Examples of suitable carbon-containing precursors include, but are not limited to, one or more of methane (CH.sub.4), acetylene (C.sub.2H.sub.2), propene (C.sub.3H.sub.6), tetraethyl orthosilicate (Si(OC.sub.2H.sub.5).sub.4), trimethylamine (TMA), dimethylsilane (C.sub.2H.sub.8Si), tetramethyldisilane (((CH.sub.3).sub.2SiHSiH(CH.sub.3).sub.2), hexamethyldisilane ((Si(CH.sub.3).sub.3).sub.2), hexamethyldisiloxane (HMDSO), trisilyl-pentane (C.sub.8H.sub.19NSi), other alkenes, and other vinyl hydrocarbons. In one embodiment, the at least one carbon-containing precursor is optionally heated via components of the chamber 100.

(32) In some embodiments, healing the seam 208 comprises depositing a seam filling layer 600 into the seam 208, such that the seam 208 is filled with the seam filling layer 600. Depositing the seam filling layer 600 occurs at a temperature in the processing region 115 between about 150° C. and about 450° C. and a temperature of the substrate 135 between about 200° C. and about 800° C. In one embodiment, the one or more seams 208 are exposed for a duration of about 1 minute to about 60 minutes. The at least one silicon-containing precursor is provided at a flow rate of about 50 sccm to about 1000 sccm. The at least one carbon-containing precursor is provided at a flow rate of about 50 sccm to about 1000 sccm. In some embodiments the seam filling layer 600 may be a hydrogen containing layer. In some embodiments the seam filling layer 600 may have substantially no hydrogen within the layer. In some embodiments, the seam-filling layer 600 constitutes an amorphous silicon layer. In some embodiments, the seam filling layer 600 constitutes an amorphous carbon layer. In some embodiments, the seam filling layer 600 comprises at least one of a silicon containing seam filling layer or a carbon containing seam filling layer. After healing the seam 208 with the seam filling layer 600, some excess seam filling layer 600 may also be deposited on top of the material 206 and outside of the seams 208. This excess may be removed during a later removal process. This removal can be completed in a batch or a single wafer process.

(33) Embodiments of the present disclosure provide methods of seam-free gapfilling and seam healing of semiconductor device features. Since the gapfilling and seam healing is seam-free the overall performance of the semiconductor device is improved.

(34) While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.