METHOD FOR PRODUCING HOSELINES AND PIPELINES WITH RFID CHIPS

Abstract

A method for producing hoselines having at least the following working steps: a) providing a hoseline or pipeline blank (1, 2, 3) of at least one elastomeric and/or thermoplastic base material in a production device, while reinforcing elements may be embedded in the base material; and b) introducing an RFID structure (4, 4A, 4B, 4C) into the outer layer (3) of the hoseline or pipeline blank (1) in the axial direction parallel to the longitudinal axis of the hoseline or pipeline blank (1) and synchronously with the feed rate of the production device, the RFID structure having at least one carrier (4A) and the RFID structure (4, 4A, 4B, 4C) having RFID chips (4B) securely arranged on the carrier (4A) at predetermined spaced intervals.

Claims

1.-8. (canceled)

9. A method for producing hoselines with RFID chips, wherein the method comprises the steps of: a) providing a hoseline blank of at least one elastomeric and/or thermoplastic base material in a production device, while reinforcing elements may be embedded in the base material; and, b) attaching an RFID structure on the hoseline blank in the axial direction parallel to a longitudinal axis of the hoseline blank and synchronously with the feed rate of the production device; wherein the RFID structure has at least one carrier; and, wherein the RFID structure comprises RFID chips securely arranged on the carrier at predetermined spaced intervals.

10. The method according to claim 9, wherein the RFID chips have in each case at least one antenna, which are respectively connected in an electrically conducting manner to the RFID chips at the front and/or rear in the longitudinal direction of the RFID structure.

11. The method according to claim 9, wherein the carrier comprises one or more yarns.

12. The method according to claim 11, wherein the antennas are twisted with the carrier.

13. The method according to claim 11, wherein the carrier is formed in an electrically conducting manner.

14. The method according to claim 13, wherein the antennas of the RFID chips are formed by the carrier.

15. The method according to claim 9, wherein the RFID chips are protected by a protective enclosure.

16. The method according to claim 9 further comprising: c) applying a further layer to the hoseline blank in such a way that the RFID structure is covered by the further layer.

17. The method according to claim 9 further comprising extruding an outer layer onto the hose blank structure.

18. The method according to claim 9 further comprising a final vulcanization step, after which the RFID structure is securely embedded in the wall of the then finished hoseline.

19. A method for producing pipelines with RFID chips, wherein the method comprises the steps of: a) providing a pipeline blank of at least one elastomeric and/or thermoplastic base material in a production device, while reinforcing elements may be embedded in the base material; and, b) attaching an RFID structure on the pipeline blank in the axial direction parallel to a longitudinal axis of the pipeline blank and synchronously with the feed rate of the production device; wherein the RFID structure has at least one carrier; and, wherein the RFID structure comprises RFID chips securely arranged on the carrier at predetermined spaced intervals.

20. The method according to claim 19, wherein the RFID chips have in each case at least one antenna, which are respectively connected in an electrically conducting manner to the RFID chips at the front and/or rear in the longitudinal direction of the RFID structure.

21. The method according to claim 19, wherein the carrier comprises one or more yarns.

22. The method according to claim 21, wherein the antennas are twisted with the carrier.

23. The method according to claim 21, wherein the carrier is formed in an electrically conducting manner.

24. The method according to claim 23, wherein the antennas of the RFID chips are formed by the carrier.

25. The method according to claim 19, wherein the RFID chips are protected by a protective enclosure.

26. The method according to claim 19 further comprising: c) applying a further layer to the pipeline blank in such a way that the RFID structure is covered by the further layer.

27. The method according to claim 19 further comprising a final vulcanization step, after which the RFID structure is securely embedded in the wall of the pipeline.

28. The method according to claim 27 further comprising ascertaining a specific location of the finished pipeline.

Description

[0030] An example of the invention is explained in more detail below on the basis of the drawing. FIG. 1 shows a basic representation of a hoseline 1. The hoseline 1 has an internal structure 2, which comprises one or more layers in a way that is not shown any more specifically here. Applied to an intermediate layer 3 is an RFID structure 4, which lies on or is pressed into the intermediate layer 3 parallel to the longitudinal axis 5 of the hoseline 1.

[0031] The RFID structure 4 has a carrier 4A and RFID chips 4B, the RFID chips 4B being arranged on the carrier 4A such that they are spaced apart from one another by a predetermined amount along the carrier 4A and being surrounded in a way not shown any more specifically by a protective enclosure 4C. The RFID chips 4B have antennas not shown here, which are twisted in the carrier 4A and lie before and after the respective RFID chips 4B in the direction of the carrier and are connected in an electrically conducting manner to the enclosed RFID chips 4B.

[0032] The hoseline 1 also has an outer layer 5, which is extruded on the underlying hose blank structure 2, 3, 4 and protects the RFID structure 4 from external influences before and after vulcanization to form a finished hoseline.

LIST OF REFERENCE SIGNS

Part of the Description

[0033] 1 Hoseline [0034] 2 Internal structure of the hoseline 1 [0035] 3 Intermediate layer [0036] 4 RFID structure [0037] 4A Carrier of the RFID structure 4 [0038] 4B RFID chips on the carrier 4A [0039] 4C Protective enclosure of the RFID chips 4B [0040] 5 Outer layer