AN INTEGRATED MULTILAYER STRUCTURE AND A METHOD FOR MANUFACTURING A MULTILAYER STRUCTURE

Abstract

An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.

Claims

1.-30. (canceled)

31. An integrated multilayer structure comprising: a substrate film comprising an electrically substantially insulating material; a circuit design comprising electrically conductive elements, provided on the substrate film, said conductive elements defining a number of contact areas; a connector at an outermost edge of the substrate film, the connector comprising a number of electrically conductive elongated contact elements connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector, the connector including an electrically insulating connector housing for the contact elements, the contact elements at least partially positioned in contact with the outermost edge of the substrate film; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector, the covered portions including connection points of the contact elements with the contact areas and at least partially excluding the extended portions of the contact elements configured to couple to the external connecting element.

32. The structure of claim 31, wherein said circuit design comprises a number of electronic components.

33. (canceled)

34. The structure of claim 31, wherein the connector housing comprises or consists of a pre-prepared separate piece of material, said connector housing being at least partially overmolded by one or more layers of the at least one plastic layer.

35. The structure of claim 31, wherein the connector housing is at least partially defined by a plastic layer of the at least one plastic layer molded onto the substrate film, comprising a different material than at least one other layer of the at least one plastic layer, said housing-establishing plastic layer being at least partially overmolded by at least one further plastic layer of the at least one plastic layer.

36. The structure of claim 31, wherein the at least one plastic layer comprises at least two adjacent layers of mutually different material.

37. The structure of claim 31, wherein the at least one plastic layer comprises a functional layer with thermally conductive and/or optically transmissive or opaque material, said functional layer establishing at least portion of connector housing and/or embedding one or more electronic components included in the circuit design.

38. The structure of claim 31, wherein the edge of the substrate film is bent or angled, said substrate film substantially defining an L-profile.

39. The structure of claim 31, wherein the at least one plastic layer partially covering the connector, including the connection points, is located on one side of the substrate film, and the remote ends of the extended portions of the contact elements to contact the external connecting element are located on the same or opposite side of the substrate film.

40. The structure of claim 31, wherein the contact elements of the connector extend laterally beyond the edge of the substrate film, thereby substantially defining an I-profile, and/or transversely away from the substrate film, thereby substantially defining an L-profile.

41. The structure of claim 31, wherein one or more of the contact elements of the connector are bent or angled.

42. The structure of claim 31, further comprising a further substrate film having a further circuit design with electrically conductive elements thereon, wherein plastic material of one or more plastic layers of the at least one plastic layer is located between the substrate films, the circuit designs of the substrate films being electrically connected by the connector and/or a connecting member.

43. The structure of claim 42, wherein said number of contact elements of the connector comprises a first contact element and the connector further comprises a second contact element that is connected to the further circuit design of the further substrate film, the remote ends of said first and second contact elements extending from the respective substrate films being located adjacent each other.

44. The structure of claim 43, wherein the first and second contact elements are connected together, utilizing a removably attachable connecting element, such as an externally disposable jumper or other externally disposable connecting element.

45. The structure of claim 31, wherein at least one element or portion of the connector, comprising at least one contact element and/or connector housing or part thereof, has been secured to any remaining portion of the connector, the at least one plastic layer, the substrate film and/or the contact area thereon through the use of at least one element selected from the group consisting of: adhesive, conductive adhesive, mechanical securement, chemical securement, thermal securement, crimping, friction securement, and compressive force such as spring force based securement.

46. The structure of claim 31, wherein the connector is configured to provide galvanic electrical connectivity for signal and/or power transfer and a further connectivity, including optical and/or thermal connectivity, thereby rendering the connector a hybrid connector.

47. The structure of claim 31, wherein said connector comprises at least one feature selected from the group consisting of: pin header, crimped connector, crimped contact element, crimping spike, springy contact element, row connector, spring-loaded contact element, spring-loaded contact pin or slip, contact pad, contact area, contact pin, crimped contact pin, hole with walls and/or bottom of conductive material, socket, female socket, male plug or socket, hybrid socket, pin socket, and spring pin socket.

48. The structure of claim 31, wherein the contact elements of the connector protrude away from the inner, optionally substantially middle, or peripheral area of the outer surface of the structure.

49. The structure of claim 31, further comprising compressive material between at least a portion of at least one contact element of the connector and the substrate film

50. The structure of claim 31, further comprising a sealing member, configured on the substrate film, the at least one plastic layer or specifically, on at least a portion of the connector provided on the substrate film, so as to face and contact the external connecting member or a further portion of the connector implementing a hermetic seal between the connected elements.

51. The structure of claim 31, further comprising a locking member for removably securing a portion of the connector or the external connecting member to the structure.

52. A method for manufacturing a multilayer structure, comprising: obtaining a substrate film comprising an electrically substantially insulating material for accommodating electronics; providing, at least in part by printed electronics technology, a circuit design comprising electrically conductive elements, including traces, of electrically conductive material on the substrate film, said conductive elements defining a number of contact areas; arranging at least one connector at the outermost edge of the substrate film, the connector comprising a number of electrically conductive elongated, substantially rigid, contact elements connected to the contact areas of the conductive elements of the circuit design while being further configured to extend from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector, the at least one connector including an electrically insulating connector housing for the contact elements; at least partially positioning the contact elements in contact with the outermost edge of the substrate film; and molding, utilizing injection molding, thermoplastic or thermoset material on the substrate film so as to at least partially cover the circuit design and only partially the connector, the covered portions including connection points of the contact elements with the contact areas and at least partially omitting the extended portions of the contact elements configured to couple to the external connecting element.

53. The method of claim 52, comprising further securing the electrical connector, by bonding, such as crimping, or using adhesive, on the substrate film.

54. The method of claim 52, comprising forming, thermoforming or cold forming, the substrate film already provided with at least part of the circuit design and with at least part of the connector to shape the substrate film so as to at least locally exhibit a substantially three-dimensional target shape.

55. The method of claim 52, wherein at least portion of a housing of the connector is provided as a ready-made element on the substrate film, included in an insert for said molding.

56. The method of claim 52, wherein at least portion of a housing of the connector is established from the molded material.

57. The method of claim 52, wherein said molding comprises multi-shot molding, wherein at least one shot is utilized to establish at least a portion of a housing of the connector from a different material than the material used for at least one other molding shot.

58. The method of 52, wherein a further substrate film comprising electrically substantially insulating material for accommodating electronics is obtained and provided with a further circuit design comprising electrically conductive elements, said conductive elements defining a number of contact areas on the further substrate film; wherein said number of contact elements of the connector comprises a first contact element and the connector additionally comprises a second contact element that is connected to a contact area of said number of contact areas on the further substrate film, the remote ends of said first and second contact elements being configured to extend from the respective substrate films and directed adjacent each other.

59. The method of claim 58, wherein the first and second contact elements are connected together, utilizing a removable external connecting element, such as an externally disposable jumper or other externally disposable connecting element.

60. The method of claim 52, comprising providing a sealing member to seal the internals of the external connecting member or a portion of the connector with the rest of the multilayer structure.

61. The structure of claim 31, wherein the electrically conductive elongated contact elements include pins.

62. The structure of claim 31, wherein the outermost edge is a side edge that extends between a top surface and a bottom surface of the substrate film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0114] Next the present invention will be described in a greater detail with reference to the accompanying drawings, in which:

[0115] FIG. 1 illustrates, via a cross-sectional side view, a general embodiment of a multilayer structure in accordance with the present invention, incorporating an in-mold connector.

[0116] FIG. 2A depicts a cross-sectional side view of an embodiment of the multilayer structure in accordance with the present invention.

[0117] FIG. 2B depicts a further cross-sectional side view of an embodiment of the multilayer structure in accordance with the present invention.

[0118] FIG. 2C depicts still a further cross-sectional side view of an embodiment of the multilayer structure in accordance with the present invention.

[0119] FIG. 3 illustrates an embodiment of the connector, particularly its contact members, in terms of structure and connection to the circuit design on the substrate film.

[0120] FIG. 4 is an axonometric illustration of an embodiment of the multilayer structure in accordance with the present invention, incorporating e.g., contact elements similar to the ones in FIG. 3.

[0121] FIG. 5A illustrates an embodiment of the multilayer structure in its final or interim stage.

[0122] FIG. 5B illustrates a connector insert that could be utilized in connection with the embodiments of the present invention, such as in the embodiment of FIG. 5A.

[0123] FIG. 5C is a side view of the insert of FIG. 5B when overmolded by plastic material.

[0124] FIG. 6A illustrates two substrate films provided with circuit designs and contact elements for use in various embodiments of the present invention.

[0125] FIG. 6B illustrates an embodiment of providing several adjacent or stacked rows of contact elements in an embodiment of the multilayer structure of the present invention for connecting several layers of electronics, such as the circuit designs of FIG. 6A, together and/or to the external device, element or system.

[0126] FIGS. 7A and 7B illustrate an embodiment of the multilayer structure manufactured preferably through utilization of multi-shot molding.

[0127] FIG. 8 is a flow diagram of a method in accordance with an embodiment of the present invention.

[0128] FIG. 9 illustrates an embodiment incorporating a multi-part connector.

[0129] FIG. 10 illustrates an embodiment of utilizing compressive material between the contact elements and the circuit design.

[0130] FIG. 11 illustrates one other embodiment of exploiting compressive material.

[0131] FIG. 12 illustrates a further embodiment of a multilayer structure (or related work product) in accordance with the present invention.

[0132] FIGS. 13 and 14 illustrate via axonometric sketches certain applicable embodiments of the present invention such as the ones already depicted in FIG. 2A via a cross-sectional side view.

DETAILED DESCRIPTION

[0133] FIG. 1 illustrates, via a (cross-sectional) side view, an embodiment 100 of a multilayer structure in accordance with the present invention.

[0134] The multilayer structure 100 may establish an end product per se, e.g. an electronic device, or be disposed in or at least connected to a host device, host system or host structure 120 as an aggregate part or module, for example. It 100 may comprise a number of other elements or layers not explicitly shown in the figure for clarity reasons. Item 130 refers to an external device, system, or structure whereto the structure 100 functionally, in terms of e.g. power and/or data signal transfer, connects via an included connector 110. In some embodiments the connected external entity 130 may be at least part of the host entity 120.

[0135] The structure 100 contains at least one, so-called first, substrate film 102 with two opposing sides 102A, 102B that typically have substantially greater dimensions (width, length) than the actual material thickness of the film 102, wherein the thickness may only be e.g. few millimetres or even considerably less (e.g. few tenths or hundredths of a mm). The film 102 and the remaining surrounding structure are shown as planar for illustrative purposes but as discussed herein, it 102 may have been formed to exhibit a desired overall and/or local 3D-shape.

[0136] Item 104 refers to a plastic layer molded upon the film 102. In some embodiments, there may be at least one other, supplementary or alternative, molded plastic layer or otherwise established layer 105 in the structure 100 on the other, opposing side 102B of the film 102 as shown in the figure. It 105 may have a protective, securing, other functional and/or aesthetic purpose, for instance. Several molded plastic layers 104, 104B, 105 may be generally established as adjacent, potentially stacked, layers and/or on different sides of the film 102 by a number of molding shots, wherein utilizing e.g. openings provided in the film 102 both sides of the film 102 can be overmolded also using a single shot instead of or in addition to multiple ones. In some embodiments, at least portion of the other plastic layer 105 may thus result from plastic material of the first layer 104 penetrating and flowing into the opposing side of the film 104 during molding, e.g. via a thinned portion or pre-prepared hole therein (merely exemplary hole in the substrate film 102 in general has been indicated as item 116 in the fig; as discussed also herein elsewhere, one or more holes may have been established in the film 102 for various purposes such as communication or fixing, not only for molding), or vice versa. Accordingly, the layer 105 may establish desired functional forms and features such as securing or protective features on the film 102.

[0137] On the other side of the molded plastic layer 104, a further (substrate) film 103 may have been provided. This optional film 103 of same or different material with the first film 102 may accommodate e.g. electronics, graphics and/or other features considered advantageous. The film 103 may include e.g. a circuit design comprising printed and/or mounted elements (traces, components, etc.), but these have been omitted from FIG. 1 in favour of clarity. Accordingly, the films 102, 103 or features thereon such as circuit designs or components may be connected together as discussed herein elsewhere, for example.

[0138] Nevertheless, the first film 102 preferably accommodates a circuit design on either or both sides 102A, 102B and respective surfaces thereof, comprising a number of electrically conductive elements 106, defining e.g. contact areas 107 (e.g. pads, also on either or both sides) and wiring/electrical conductor traces, potentially but not necessarily, as discussed hereinbefore, additively produced thereon by means of printed electronics technology such as screen printing, tampo printing, flexography or ink jetting.

[0139] A number of elements such as electronic components and/or other functional/decorative components or elements 109, such as optical elements (lightguide, reflector, diffusor, diffractor, mask, graphical element, etc.), micromechanical, electromechanical and/or thermal management elements, may have been further provided in the structure 100, preferably upon the film 102 on either or both sides 102A, 102B and respective surfaces thereof, and further preferably forming part of the circuit design. A number of e.g. electrically conductive vias (e.g. holes filled with conductive element/material) or other elements 106B may have been arranged through the substrate film(s) 102, 103 and/or other layers, e.g. through molded layer(s) 104, 105, to connect e.g. the circuitry or other features of different material layers together or to external elements.

[0140] The circuit design and related components or elements 109 may further comprise a number of (internal) connecting components, optionally including a bridge, a circuit and/or other device, configured to connect other electrically conductive elements such as multiple contact elements at least operatively such as electrically together to enable high current flow via them. The connecting components may be (directly) coupled to the conductive elements 106 and e.g. positioned on or adjacent to them, for instance.

[0141] In addition to or instead of printed implementations, various elements and components 109 discussed herein may include one or more ready-made components that are disposable such as mountable. These components may be mounted on the substrate film(s) 102, 103 of the structure 100, for example. The (mountable) components may especially include so-called surface-mount components or surface-mount devices (SMD), which may essentially be electronic components but also optical, micromechanical, electromechanical or thermal management components (insulative, conductive, e.g. heat sinks, etc.) among other options. For example, adhesive or mechanical locking members may be utilized for mechanically securing them on the substrate.

[0142] Additional electrically conductive material(s) such as conductive adhesive and/or solder may be applied for establishing or enhancing electrical and potentially also mechanical connections between selected features such as conductive areas 106 and the components 109. In more general terms, electrically conductive or non-conductive adhesive(s) may be utilized in various embodiments of the present invention to secure features such as the connector(s), their components and/or other elements such as electronic, optoelectronic, micromechanical or thermal management components to the substrate and specifically e.g. to the circuit design thereon.

[0143] In view of the above, the components 109 may in many embodiments include electronic components such as passive components, active components, optoelectronic (or opto-electrical) components, electromechanical components, ICs (integrated circuit), printed, such as screen printed, components and/or electronic sub-assemblies. For instance, one or more components 109 may have been first provided on a separate substrate, e.g. a circuit board such as an FPC (flexible printed circuit) or e.g. rigid, e.g. FR4 type (flame retardant), board, and subsequently attached as a whole (i.e. as a sub-assembly) to the target substrate 102.

[0144] Generally, the multilayer 100 structure may comprise or implement e.g. at least one feature (component, element) selected from the group consisting of: electronic component, electromechanical component, electro-optical component, radiation-emitting component, light-emitting component, LED (light-emitting diode), OLED (organic LED), side-shooting LED or other light source, top-shooting LED or other light source, bottom-shooting LED or other light source, radiation detecting component, light-detecting or light-sensitive component, photodiode, phototransistor, photovoltaic device, sensor, micromechanical component, switch, touch switch, touch panel, proximity switch, touch sensor, atmospheric sensor, temperature sensor, pressure sensor, moisture sensor, gas sensor, proximity sensor, capacitive switch, capacitive sensor, projected capacitive sensor or switch, single-electrode capacitive switch or sensor, capacitive button, multi-electrode capacitive switch or sensor, self-capacitance sensor, mutual capacitive sensor, inductive sensor, sensor electrode, micromechanical component, UI element, user input element, vibration element, sound producing element, communication element, transmitter, receiver, transceiver, antenna, infrared (IR) receiver or transmitter, wireless communication element, wireless tag, radio tag, tag reader, data processing element, data storage element, electronic sub-assembly, light directing element, lightguide, lens and reflector.

[0145] Item 110 refers to a preferably at least electrical connector that has been provided at the edge 102E (periphery) of the substrate film 102. The “edge” refers herein to the immediate edge of the substrate film or at least to a greater periphery region that spans e.g. about 10%, 20%, 30%, or 40% of the edge-neighbouring surface area or volume of the film 102 or less. In some embodiments the connector 110 may contain a housing, or “body member”, 110B of e.g. monolithic or composite construction provided at the edge 102E. The housing 110B may thus either fully (in its entirety) or at least partially lie on the edge region. The connector 110 such as the housing/body member 110B thereof may comprise e.g. electrically substantially insulating material such as selected plastics (e.g. polycarbonate, polyimide), rubbery or ceramic material as contemplated hereinbefore. It is still to be understood by a skilled person that the connector 110 included in the structure 100 does not have to necessarily contain a particular dedicated, e.g. insert or direct in situ molding based, housing 110B, with reference to e.g. a pin header or card edge connection type arrangements adopted, because the necessary contact elements 118 included may be still protected and potentially secured by the molded plastics layer(s) 104, 105, and their 118 installation does not require a housing 110B either.

[0146] In terms of providing electrical connectivity, the connector 110, indeed, preferably comprises a number of electrically conductive contact elements 118, such as pins or other features. The contact elements 118 may optionally stick out from the possible housing 110B or from the bottom of a receptacle defined by it, at least to an extent to enable desired level of external connectivity having regard to the element 112. The contact elements 118 of the connector 110 may, for example, extend laterally (essentially e.g. along or parallel to the surface direction or major orientation direction of the substrate film 102) beyond the edge of the substrate film 102, which has been illustrated in FIG. 1.

[0147] Alternatively, one more contact elements 118 could have been configured, by an included bent or otherwise, to extend more transversely, optionally parallel to the surface normal, away from the substrate film 102 at the edge thereof (see also e.g. the embodiments of FIGS. 2A-2B).

[0148] The contact elements 118 are preferably configured (material, dimensions/shapes, positioning and alignment, etc.) and utilized to electrically (galvanically) couple an external connecting element such as another connector 112, equipped e.g. with compatible contact elements 119 (e.g. pins or pin receptacles), with the circuit design (typically selected electrically conductive areas 106 thereof) of the multilayer structure 100. The external connecting element 112 may provide electrical connection e.g. through cabling 113 between the internals of the multilayer structure 100 and external or host device(s) 130 associated therewith.

[0149] In various preferred embodiments, the contact element(s) 118 do not have to necessarily pierce or penetrate into or through the substrate films 102, 103 (unless e.g. crimped contact element(s) 118 are utilized). However, the connector 110 may be in some embodiments (not particularly illustrated in FIG. 1) provided or assembled relative to the substrate film 102 so that it extends to both sides 102A, 102B of the film 102 in terms of at least some elements of the connector 110 such as housing 110B and/or contact element(s) 118. This may be for facilitating or enhancing the securement to the substrate film 102 and/or for enhancing electrical contact with the circuit design 106 and contact areas 107 thereon, for example. In such scenarios, a portion of the connector 110 may have been directed around and/or through the substrate film 102. To achieve this, suitably dimensioned and shaped such as curved or angular (e.g. bent) contact elements 118 and/or pre-prepared (e.g. by drilling, cutting, etching or molding) or dynamically created (upon piercing/crimping of the connector 110, for example) hole(s) 116 may have been utilized. For example, at least one or more contact elements 118 or their portions may have been conveyed from the initial installation side 102A, 102B to the opposite side 102B, 102A of the substrate film 102 to enable e.g. electrical coupling around and/or through the substrate film 102 with the circuit design and/or with the external connecting element 112.

[0150] In various embodiments there may indeed be one or multiple through or non-through (blind) holes 116 arranged in the substrate film 102, For example, a portion such as an end portion of any or each contact element 118 to contact with the circuit design on the substrate film 102 may be associated with a blind or through-hole in the film 102 with reference to e.g. crimped connectors or specifically, their contact elements and associated crimping spikes.

[0151] The housing 110B of the connector 110 element, however, may be located on either side 102A, 102B side of the film 102 substantially completely, with reference to the scenario sketched in FIG. 1, for example. In other embodiments, also the housing 110B itself may have been partially arranged through and/or around (the edge of) the film 102.

[0152] One or more locking members (elements) may have been additionally provided on either or both sides 102A, 102B of the substrate 102 for additionally securing (at least portion of) the connector 110 and/or external connecting element 112 as deliberated herein earlier.

[0153] Based on the foregoing, the connector 110, or different elements thereof, may thus have been secured to the substrate film 102 using a variety of means with reference to configuration and dimensioning of its various internal features of the connector 110 such as housing 110B and contact elements 118, and use of additional securing features such as plastic 104, 105 molded thereon, locking members, and/or e.g. non-conductive adhesive, conductive adhesive, paste, etc.

[0154] For example, in some embodiments incorporating at least one hole 116 in the substrate film 102, the housing 110B and/or contact elements 118 may have been dimensioned and/or shaped, either initially or subsequent to arranging e.g. a portion of the connector 110 through the film 102, such that there is no excessive or substantial slack between the connector 110 and the edges of the hole 116 and/or such that the connector 110 cannot be provided at least completely through the film 102 in either or both directions, not at least without enlarging the hole 116 and potential other surrounding features. In some embodiments, the molded plastics 104, 105 may be used to seal the hole 116. In some embodiments, the connector 110 or specifically the housing 110B thereof may include a feature such as a flange or generally a bulging portion that prevents it from fully fitting through the hole 116.

[0155] In various embodiments, the connector 110 or e.g. specifically the aforesaid housing 110B thereof may be made substantially rigid or stiff. It may then better withstand e.g. repeated physical mounting and removal of external connectors 112 into or away from contact therewith, respectively. The mounting and removal may refer to simple push and pull type actions or require more complex activities if the procedure involves use of e.g. additional locking members as discussed hereinafter. The rigidity or generally durability of the connector 110 may be obtained by means of suitable materials and related dimensions such as material thicknesses. The connector 110 may in addition to or instead of rigid portions include elastic, flexible and/or springy portions e.g. in the contact elements 118 or housing 110B thereof.

[0156] Yet, the multilayer structure 100 or specifically connector 110 thereof may contain one or more mechanical locking members (not shown in FIG. 1 for clarity reasons) for securing the external connector 112. Such member(s) may be established from the molded plastics, for example.

[0157] In various embodiments, the molded layer(s) 104, 105 preferably embed at least a portion of the circuit design and of the connector 118, such as their interconnection.

[0158] In some embodiments, subsequent to mating of the external connector 112, desired portion(s) of the resulting aggregate structure 100, 112 including e.g. the connection region may be provided with additional material to further protect and/or secure, among other potential objectives, the connection and related elements. For example, low pressure molding or resin dispensing (provision of epoxy) of suitable plastic or other material may be utilized for the purpose.

[0159] The film(s) 102, 103 may have been shaped according to the requirements set by each use scenario. Therefore, forming such as thermoforming may have been applied to the film 102, 103, optionally subsequent to provision of at least some features such as conductive areas, connector and/or components of the circuit design thereon, to at least locally provide e.g. a desired 3D shape such as a curved, pocket or protrusion shape in the film 102, 103.

[0160] The features described having regard to the sketch of FIG. 1 are freely and selectively applicable in connection with various embodiments of the connector elements and multilayer structures of the present invention in general, including the solutions explained in more detail hereinbelow, unless otherwise stated or being otherwise clear to a person skilled in the art with reference to e.g. clearly mutually exclusive features. Yet, various features of the embodiments described hereinbelow are similarly freely, selectively mutually combinable as being easily apprehended by the skilled person.

[0161] FIG. 2A depicts, at 200, an embodiment (or a portion of an embodiment) of a multilayer structure of the present invention via a cross-sectional side sketch.

[0162] The discussion above regarding the present invention in general (summary) and FIG. 1 generally applies also to the scenario of FIG. 2A. The connector 110 comprises one or more contact elements 118 that have been arranged in a bent configuration at the edge 102E of the substrate film 102. Yet, the contact elements 118 have been essentially configured near the edge 102E on at least one side of the substrate film 102. There the contact elements 118 may further connect to the contact areas 107 of the underlying circuit design, such as additively produced (printed, for example) planar elements of electrically conductive material, according to the basic principles of the present invention (circuit design and related contact areas 107 not illustrated in FIG. 2A in favour of clarity). The contact elements 118 may be in galvanic contact with the conductive ink or other electrically conductive material of the circuit design.

[0163] As illustrated by way of example, the contact elements 118 have indeed been configured to have a bent portion. Specifically, the contact elements 118 have been configured so as to bend around the edge 102E and protrude away from the substrate film 102 towards the environment from the opposite side (bottom side in the shown orientation). There the exposed ends of the contact elements 118 may galvanically connect to the external connecting element 112 and especially to dimensions-wise compatible or “matching” conductive elements thereof, with reference to e.g. sockets or other receptacles. The structure 200 may include at least one further material layer such as molded plastic layer 105 through which the contact elements 118 extend on the opposite side. Further substrate film(s) may be included as well. FIGS. 13 and 14 additionally illustrate, via axonometric sketches 1300 and 1400, scenarios similar to the one of FIG. 2A with and without additional molded layer 105, respectively.

[0164] The connector 110 may again include one or more further elements such as housing 110B. The contact elements 118 may have been secured to the substrate film 102 utilizing e.g. adhesive such as non-conductive or conductive adhesive. Alternatively or additionally, the contact elements 118 may include securing or locking members such as crimping spikes or similar protrusions, extensions or generally features in case the contact elements 118, or the connector 110 in general, are of crimped type. The spikes/features may penetrate into and potentially through the film 102 and/or elements such as circuit design/contact area thereon. Accordingly, the spikes may enhance or secure electrical contact of the contact elements 118 (via the spikes and/or via the opposing side of the contact elements 118 wherefrom the spikes extend) to the circuit design on the film 102 in addition to enhancing mechanical fastening of the contact elements 118 to the film 102 and multilayer structure in general. Through spikes or other features, a contact element 118 essentially provided on one side of the film 102, may connect to the opposing side of the film 102 and e.g. circuit design thereon.

[0165] The connector 110 may include a housing that is a pre-manufactured element at least partially manufactured from plastics overmolded on the film 102 as contemplated also herein elsewhere.

[0166] In the embodiment 240 of FIG. 2B, the contact elements 118 still have bent or angled portions, which thus enables lateral coupling to the substrate film 102 and e.g. circuit design (contact areas 107) thereon, while the remote ends of the contact element 118 extend transversely away from the film 102.

[0167] In contrast to the scenario of FIG. 2A, here the contact elements 118 are essentially positioned and remain (notwithstanding possible presence of e.g. crimping spikes that could in some embodiments extend to the opposite, “top” side of the film 102) on the same, single side (“exit” side, i.e. bottom side in the figure) of the film 102 instead of being directed around it, or at least to a greater extent through it, from a side 102A, 102B to another.

[0168] FIG. 2C illustrates, at 280, a further embodiment, wherein in contrast to the previous two embodiments, the substrate film 102 itself includes a bent (curved) portion at its end where also the connector with contact elements 118 is substantially located. The substrate film 102 may thus define a lip, flange or a similar protrusion that extends from the remaining structure to selected direction. Orientation and dimensions of the concerned extension may naturally differ from the illustrated ones depending on the needs of each use scenario (e.g. shape and size of the external connecting element, host device or host structure, etc.). Nevertheless, the resulting 3D shape of the film 102 may have been at least partially obtained through 3D forming (shaping) of the film by thermoforming, for example. Alternatively, the film 102 may have been directly manufactured from a used raw material to the intended 3D shape including the bent through molding among other options.

[0169] As indicated by broken lines, also in this embodiment as well as in other embodiments including the embodiments of FIGS. 2A and 2B, the edge of the substrate film 102 may but does not have to substantially correspond to the edge of the overall multilayer structure and e.g. of molded layers 104, 105, i.e. the remaining structure may extend beyond the film 102 or the edge of the film 102 in a selected direction (laterally by layer 105 in the scenario of FIG. 2C) so that the edge of the substrate film 102 and related connector with contact elements 118 protrudes away from the remaining structure at the more central portion thereof.

[0170] FIG. 3 illustrates, at 300, an embodiment of the connector 110, particularly contact members 118, in terms of both structure and connection to the circuit design that comprises conductive elements 106 on the substrate film 102, 103. Overmolded plastics layer(s) 104, 105, optional connector housing 110B and potential other elements of the overall multilayer structure are not illustrated in the figure for clarity reasons.

[0171] In this and various other embodiments, the circuit design provided in the multilayer structure generally includes contact areas 107, which may be just selected portions of the overall circuit, e.g. of traces, without any particular further difference to other circuit elements such as traces in terms of e.g. materials and/or dimensions, or the contact areas 107 may contain e.g. one or more materials or material combinations different from one or more other areas of the circuit design. For example, the material(s) of the contact areas 107 may be made particularly conductive and/or any of the concerned conductive material(s) may also be of adhesive type in contrast to e.g. a conductive trace or feature elsewhere in the design 106.

[0172] The contact elements 118 illustrated are distinctly elongated, e.g. pin, rod, spike or needle-like, elements that extend laterally from the substrate film 102. In some embodiments, e.g. pin connectors or at least related pins could be utilized in constructing the connector 110 and overall multilayer structure of the present invention. The contact elements 118 may be of crimped (with spikes) or non-crimped (secured using adhesive, for example) type.

[0173] FIG. 4 illustrates, at 400, an axonometric illustration of an embodiment of the multilayer structure in accordance with the present invention, incorporating e.g. the connector and/or contact elements similar to the ones as shown FIG. 3.

[0174] A plastic layer 104 has been produced here by molding on the substrate film 102 so that at least the connection points (area or region of the joint) between the contact areas 107 and contact elements 118 are covered and thereby protected and also additionally secured. Yet, at least part of the circuit design comprising e.g. conductive elements 106 such as traces (wiring) and e.g. associated electronic components 109 are at least partially embedded in the plastics. The ends of the contact elements 118 remain accessible from outside the structure 300, i.e. they stick out from the structure or at least from the molded plastics 104 for connection with the external connecting element 112.

[0175] FIG. 5A illustrates, at 500, an embodiment of the multilayer structure. In the shown case the connector 110 is, in accordance with the principles of the present invention, at the edge of the substrate film 102. A connector housing 110B defining e.g. a receptacle may be included in the connector 110 and established from pre-prepared element(s) and/or through in situ molding on the film 102 as discussed herein.

[0176] FIG. 5B illustrates, at 540, an embodiment of a connector insert (pre-manufactured piece utilized as an insert in injection molding or generally overmolding procedure of the substrate film 102) that may be utilized in connection with the embodiments of the present invention, such as in the embodiment of FIG. 5A, to provide at least part of the connector housing 110B. Roughly similar shapes as provided by the pre-manufactured (e.g. pre-molded) insert could be alternatively obtained by molding plastic material upon the film 102 to establish at least portion of the housing 110B in situ (on the film 102 from a selected (plastic) source material). The insert may be secured e.g., by adhesive or essentially mechanical locking members as discussed hereinbefore to the film 102.

[0177] FIG. 5C illustrates, at 580, a side view of an embodiment of the insert type of a connector housing of FIG. 5B when overmolded by plastic material. The molded plastic layer 104 at least partially covers and embeds the housing 110B as well as the connection points between the contact elements 118 and the circuit design on the substrate film 102. However, the layer 104 preferably still leaves at least the necessary portion(s) including the ends of the contact elements 118 (farthest from the film 102) and e.g., potential receptacle shape defined by the housing 110B, exposed for coupling with a matching (compatible) external connecting element such as a plug type connector.

[0178] FIG. 6A illustrates, at 600, two substrate films 102, 103 both provided with circuit designs comprising conductive elements 106 (may be mutually more or less similar) and respective contact elements 118A, 118B assigned to the films for use in various embodiments of the present invention. Although in the visualized scenario, each film 102, 103 comprises a mutually same or similar number of mutually similar contact elements 118, 118A, 118B thereat, in other embodiments the type and/or number of contact elements 118 provided to each film 102, 103 of the multilayer structure may mutually vary. The films 102, 103, associated circuit designs and/or related contact elements 118A, 118B may be aligned in a selected stacked or overlapping fashion, such as superimposed or superposed.

[0179] Accordingly, FIG. 6B illustrates, at 640, provision of several adjacent or stacked contact elements or essentially rows of contact elements, such as metal pins or terminals, in an embodiment of the multilayer structure of the present invention for connecting several layers of electronics, such as the circuit designs of FIG. 6A, included in the multilayer structure either together and/or to external device, element or system. As a result, film-to-film and circuit-design-to-circuit-design connections may be established, for instance.

[0180] Multiple mutually aligned, e.g. essentially parallel in terms of at least some of the included contact elements 118 or their portions such as end portions, connectors 110 such as row connectors may be thus produced in a common multilayer structure. Yet, a common or joint connector 110 such as a multi-row connector (in the shown case, essentially a double-row connector), spatially thus bringing together or at least exposing contact elements 118 from different layers (118A, 118B), which is highlighted by a broken line around end portion of the illustrated multilayer structure may be constructed. It may contain a housing 110B of insert and/or in situ-prepared type as discussed hereinbefore, for example. A number of molded plastic layer(s) 104, 104B, 105 of mutually similar or different materials (that may in turn be the same material or different material used for preparing the housing 110B) have been provided on the underlying substrate films 102, 103, preferably at least between the films 102, 103 and optionally on any of the opposite, exterior (from the structure's view) side(s) thereof.

[0181] As sketched in the figure, an optionally removable and e.g. re-usable external connecting element 642, such as a so-called jumper, may be configured either during the manufacture of the structure or afterwards, e.g. during subsequent use, to the connector 110 to electrically connect and optionally essentially short circuit two or more of the contact elements 118 together, e.g. at least one contact element 108A, 108B from different films 102, 10 or other layers present in the structure. By the connecting element 642, circuit designs on multiple films 102, 103 of the structure may be electrically connected.

[0182] FIGS. 7A and 7B illustrate, at 700 and 740, respectively an embodiment of the multilayer structure manufactured preferably through utilization of multi-shot molding. On a substrate film 102, a circuit design has been provided as well as a number of contact elements 118 connecting to the circuit design via associated connection points. The film 102 including the connection points has been overmolded by plastic layer 104 using at least a single molding shot. Yet, at least one further shot of optionally different material has been applied to produce at least one more covering plastic layer 104B and/or at least portion of the connector housing 110B. Still, as in other preferred embodiments, the contact elements 118 remain externally accessible.

[0183] FIG. 9 illustrates, at 900, an embodiment incorporating a multi-part connector. The connector 900 may include a portion including, for example, a number of contact elements 118, which has been initially provided and preferably secured to the substrate film 102 or an element or a layer such as a molded plastic layer thereon. Preferably, the portion has been overmolded by plastics at least having regard to connection points between the contact elements 118 and respective contact areas of the circuit design.

[0184] A further portion 944 of the connector, which may have been fabricated as a pre-manufactured piece or an aggregate piece of smaller components (e.g. housing hosting a number of conductive elements such as contact elements or their portions), may have been then brought into contact with and secured to the existing portion on the film 102 by adhesive, overmolded plastics, and/or locking members 942 (e.g. an optionally elastic protrusion such as a barbed protrusion potentially established from molded plastics), 942B (a compatible, matching feature or shape such as a recess, bevel or edge) provided in any portion of the connector and/or in the structure elsewhere. In some embodiments, the subsequently connected attachable portion 944 could be removably attachable and optionally also remain removably attached in the multilayer structure (see the bidirectional arrow illustrating this option in the figure) whereas in some embodiments, it could be more permanently attached using e.g. adhesive or overmolding for the securement, or more permanently interlocking locking members. Removability would facilitate dynamically updating the connectivity of the structure based on the nature of external connecting elements, for instance, or replacing a damaged part, among other potential benefits.

[0185] Yet, at least one sealing member 940, optionally a gasket of e.g. rubbery and/or compressive material, such as elastomer, may have been provided, e.g. on an area of the substrate film 102E or on the at least one molded layer, or specifically, on a portion of the connector itself.

[0186] Instead of or in addition to utilizing one or more sealing members 940 to seal portions of the connector together, or the connector or its portion e.g., onto the substrate film 102 and/or onto a molded plastic layer, at least one sealing member could be configured so as to contact the external connecting member when installed. An example of such situation could be considered also based on the scenario shown in in FIG. 9, if item 944 is alternatively considered to represent the external connecting element (connector) and the locking member 942 secures, optionally removably (by surpassing the elastic force or spring force introduced by the locking member 942, for example) its attachment to the connector of the multilayer structure including contact elements 118.

[0187] Preferably, the sealing member 940 provides at least a desired level of dust protection if not a hermetic seal between the connected elements.

[0188] FIGS. 10 and 11 illustrate, at 1000 and 1100, respective two embodiments of exploiting compressive material 1002, 1102 between the contact elements 118 and the circuit design comprising conductive elements 106 defining also contact areas 107 for the contact elements 118 of the connectors 110.

[0189] In the depicted scenarios, the contact elements are of crimped type. When crimp spikes or similar protrusions are subjected to varying conditions in terms of e.g. heat and pressure, which may take place in the context of the present invention during overmolding such as injection molding, they may be prone to breakage or detachment, whereupon having compressive material configured between them and the contact areas 107, or the substrate film 102 in general, is considered beneficial in terms of preserving the established electrical contact and the associated elements. Naturally the provision of compressive material 1002, 1102 may be preferred also in connection with different type of contact elements 118.

[0190] In FIG. 10, the instances of compressive material 1002, 1102 have been configured as more local dots or deposits at the connection points between the contacts 118 and the contact areas 107 whereas in FIG. 11, they are larger slip or sheet-like elements or layers extending parallel to the contact elements 118 over a larger area. The compressive material 1002, 1102 may be provided by installing ready-made elements at the connection points or directly producing the instances from source materials using a suitable coating, deposition, spraying, or other method.

[0191] Preferably, the compressive material 1002, 1102 is electrically conductive, e.g. conductive rubber (or generally elastomer), rubbery or other suitable composite material. Yet, it may be penetrable and eventually penetrated by the contact elements 118 such as crimping spikes upon their installation.

[0192] FIG. 12 illustrates, at 1200, a further embodiment of a multilayer structure (or related work product) in accordance with the present invention. For example, the connector structures depicted in FIGS. 10 and 11, and obviously many others, could be included in the shown kind of a multilayer structure by selectively overmolding them by one or more plastic layers 104, 104B as discussed herein elsewhere. In the illustrated example, at least the topmost molded layer 104, 104B is provided only at the connector end of the structure and is thus spatially limited. There may still be e.g. underlying one or more molded layers (item 104 placed in parenthesis in connection with the substrate film 102 highlighting this option) in the structure that cover larger and/or other areas of the substrate film 102. Accordingly, the multilayer structure 1200 may have a gradually or more step-wise changing overall thickness. In the scenario of FIG. 12, the connector end or region is thicker than the neighbouring areas.

[0193] FIG. 8 includes, at 800, a flow diagram of an embodiment of a method in accordance with the present invention.

[0194] At the beginning of the method for manufacturing the multilayer structure, a start-up phase 802 may be executed. During start-up, the necessary tasks such as material, component and tools selection, acquisition, calibration and other configuration tasks may take place. Specific care must be taken that the individual elements and material selections work together and survive the selected manufacturing and installation process, which is naturally preferably checked up-front on the basis of the manufacturing process specifications and component data sheets, or by investigating and testing the produced prototypes, for example. The used equipment such as molding/IMD (in-mold decoration), lamination, bonding, (thermo)forming, electronics assembly, cutting, drilling and/or printing equipment, among others, may be thus ramped up to operational status at this stage.

[0195] At 804, at least one, optionally flexible, substrate film of plastics or other material for accommodating electronics is obtained. The substrate film may initially be substantially planar or e.g. curved. A ready-made element, e.g. a roll or sheet of plastic film, may be acquired for use as the substrate material. In some embodiments the substrate film itself may be first produced in-house by molding or other methods from selected starting material(s). Optionally, the substrate film may be processed further at this stage. It may be, for example, provided with holes, notches, recesses, cuts, etc.

[0196] At 806, a number of conductive elements defining e.g. conductor lines (traces) and/or contact areas to construct a circuit design are provided on the substrate film(s), either or both sides thereof, preferably by one or more additive techniques of printed electronics technology. For example, screen, inkjet, flexographic, gravure or offset lithographic printing may be utilized. In some cases, also subtractive or semi-additive processes may be utilized. Further actions cultivating the film(s) involving e.g. printing or generally provision of graphics, visual indicators, optical elements, etc. thereon may take place here.

[0197] At 808 (optional), one or more typically ready-made components including electronic components such as various SMDs may be attached to the contact areas on the film(s) e.g. by solder and/or adhesives. Alternatively or additionally, printed electronics technology may be applied to actually manufacture at least part of the components, such as OLEDs, directly onto the film(s). Accordingly, the execution of items 1806, 1808 may temporally overlap as being understood by a skilled person.

[0198] Item 810 refers to arranging at least portion of at least one connector at the edge of the substrate. The connector and/or its components such as housing and/or contact elements may be provided to the substrate utilizing any feasible positioning or installation technique such as standard pick and place method/equipment (when applicable). Applicable bonding (using e.g. adhesive or other bonding substance), gluing, and/or further securing techniques involving e.g. the use of locking members may be additionally utilized. For example, one or more contact elements may be crimped to the substrate. As discussed hereinbefore, in some embodiments at least portion of e.g. connector housing may be manufactured in situ preferably from plastics molded onto the substrate, which is discussed in more detail with reference to item 814.

[0199] In some embodiments, at least one sealing member may be provided e.g. at this stage, if not earlier or later, as a ready-made element (e.g. rubbery ring or gasket), which may be additionally secured to a host surface (substrate, connector, molded plastic layer, etc.) mechanically or chemically (e.g. by adhesive) or produced directly e.g. as a material layer from source material utilizing a suitable production technology such as spraying, printing (e.g. jetting), or deposition. The host surface may contain or be provided with a receiving surface structure such as a ridge and/or a recess for the sealing element.

[0200] In some embodiments, a number of through-holes or at least thinned portion(s) may be first arranged in a hosting substrate film so that a portion of the connector such as part of the housing and/or electrical contact elements, e.g. pins, thereof may be directed through them to establish a contact with the circuit design. In some embodiments, in addition to or instead of using pre-prepared hole(s), the necessary hole(s) may be dynamically established upon piercing the substrate by e.g. contact elements of the connector responsive to the aforesaid crimping or other suitable method. The connector may be configured to contact the circuit design(s) on either or both sides of the substrate film.

[0201] The procedure may further involve bending e.g. the ends or central portions of the contact elements so as to make them extend substantially parallel to the surface of the substrate and e.g. conductive elements/circuit design thereon and/or perpendicular thereto to better interface with an external connecting element, for example, depending on the embodiment.

[0202] Yet, in some embodiments as discussed hereinbefore, in addition to or instead of providing the connector or a portion thereof physically through the substrate film, the connector may comprise e.g. two portions or parts (initially separate or integral) on opposing sides of the substrate that are joined together by at least one intermediate feature (e.g. one bridging feature or e.g. two connecting, lateral extensions on each side of the substrate), extending from one side of the substrate to the other side, over the edge thereof. Such arrangement thus enables the connector structure to at least functionally extend through the substrate, if not directly physically through it via e.g. a hole.

[0203] Item 809 refers to possible attachment of one or more sub-systems or ‘sub-assemblies’ that may incorporate an initially separate, secondary substrate provided with electronics such as IC(s) and/or various components. At least part of the electronics of the multilayer structure may be provided to the substrate film(s) via such sub-assembly. Optionally, the sub-assembly may be at least partially overmolded by a protective plastic layer prior to attachment to the main substrate. For example, adhesive, pressure and/or heat may be used for mechanical bonding of the sub-assembly with the primary (host) substrate. Solder, wiring and conductive ink are examples of applicable options for providing the electrical connections between the elements of the sub-assembly and with the remaining electrical elements on the primary substrate. Item 1809 could also be executed e.g. upon item 806 or 810. The shown position thereof is primarily exemplary only.

[0204] In some embodiments, prior to or upon the molding phase the substrate film(s) preferably already containing e.g. at least part of the circuit design, such as (printed) conductive elements and optionally electronic components, and/or of the connector (see the bi-directional curved arrow highlighting the fact that forming could alternatively or additionally take place e.g. between items 808 and 810, or even prior to item 806 or 808) may be formed 812 using thermoforming or cold forming, for instance, to exhibit a desired shape such as at least locally a three-dimensional (essentially non-planar) shape. The substrate containing suitable formable material may therefore be shaped to better fit the target environment/device and/or to better accommodate features such as the electrical connector (e.g. in a recess). Additionally or alternatively, forming could take place after molding in case the already-established multilayer stack is designed to survive such processing.

[0205] At 814, at least one plastic layer, preferably thermoplastic or thermoset layer, is produced, preferably molded such as injection molded, upon either or both sides of the substrate(s) so as to preferably at least partially embed the connector and especially e.g. the connection points of the associated contact elements and the contact areas of the circuit design in the molded material such as selected thermoplastic or thermoset resin. As discussed hereinbefore, the molded material(s) may be provided using several molding steps or shots, or via a single step, wherein molded material may even optionally flow through the film from one side thereof to the opposing side via a hole prepared therein or by penetrating through the substrate material itself (e.g. through a thinned/thinner portion), for example.

[0206] In some embodiments, also at least a portion of a connector housing may be produced by molding, optionally injection molding. It may be molded using the same material and common process step, such as a molding shot, as one or more other features or material layers (e.g. 103, 104) of the multilayer structure, or it may be prepared from other material(s) such as other resin(s) through separate process steps such as molding shot(s).

[0207] In practice, at least one substrate film already provided with a number of further features such as a circuit design, various components, a connector or its components, etc. may be used as an insert in an injection molding process. One side of the substrate film may be, in some embodiments, left free from the molded plastics depending on the embodiment.

[0208] In case two films are used, both of them may be inserted in their own mold halves so that the plastic layer is injected at least between them. Alternatively, the second film could be attached to an aggregate of the first film and plastic layer afterwards by suitable lamination technique.

[0209] In the case of e.g. a multi-part connector, a portion of the connector could be provided to the structure either after molding or between several molding actions, for example, with reference to e.g., the embodiment of FIG. 9.

[0210] Regarding the resulting overall thickness of the obtained stacked multilayer structure, it depends e.g. on the used materials and related minimum material thicknesses providing the necessary strength in view of the manufacturing and subsequent use. These aspects have to be considered on case-by-case basis. For example, the overall thickness of the structure could be in the order of magnitude of about 1 mm or a few millimetres, but considerably thicker or thinner embodiments are also feasible. Item 816 refers to possible additional tasks such as post-processing tasks. Further layers may be added into the multilayer structure by molding, lamination or suitable coating (e.g. deposition) procedure. The layers may be of protective, indicative and/or aesthetic value (graphics, colors, figures, text, numeric data, etc.) and contain e.g. textile, leather or rubber materials instead of or in addition to further plastics. Additional elements such as electronics may be installed at the outer surface(s) of the structure, such as the exterior surface of the substrate or a molded layer thereon depending on the embodiment. Shaping/cutting may take place. The connector may be connected to a desired external connecting element such as am external connector of an external device, system or structure. For example, these two connectors may together form a plug-and-socket type connection and interface.

[0211] Following connecting of the external connecting element to the connector element of the multilayer structure, the established connection and related elements may be further secured and/or protected by additional processing, such as low pressure molding of plastics or resin dispensing (epoxy), whereupon the resulting layer may at least partially encapsulate desired elements in the connection region, for example. Low pressure molding or resin dispensing may be exploited to protect and/or secure also other elements, such as electrical elements, of the structure.

[0212] At 818, method execution is ended.

[0213] The scope of the present invention is determined by the attached claims together with the equivalents thereof. A person skilled in the art will appreciate the fact that the disclosed embodiments were constructed for illustrative purposes only, and other arrangements applying many of the above principles could be readily prepared to best suit each potential use scenario. For instance, in some scenarios instead of molding, the plastic or other layer of similar function could be produced on the substrate using a suitable deposition or a further alternative method. Yet, instead of printed traces, the traces could be produced/provided otherwise. E.g. a conductor film manufactured utilizing etching, among other options, could be applied.