OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURE THEREOF

Abstract

A method of fabricating an optoelectronic component, performed on a multi-layered wafer disposed on a substrate. The method comprises the steps of: etching the multi-layered wafer, thereby defining a slab and a multi-layered ridge, the slab having an upper surface below the ridge and being located between the multi-layered ridge and the substrate; selectively epitaxially growing a III-V semiconductor cladding adjacent to a first and second sidewall of the ridge, the cladding layer extending from the upper surface of the slab along the first and second sidewalls, and thereby cladding an optically active waveguide within the multi-layered ridge; and providing a first and second electrical contact, which electrically connect to a layer of the multi-layered ridge and the slab respectively.

Claims

1. A method of fabricating an optoelectronic component, performed on a multi-layered wafer disposed on a substrate, the method comprising the steps of: performing one or more etches to the multi-layered wafer, thereby defining a slab and a multi-layered ridge, the slab having an upper surface below the ridge and being located between the multi-layered ridge and the substrate; selectively epitaxially growing a III-V semiconductor cladding adjacent to a first and second sidewall of the ridge, the cladding layer extending from the upper surface of the slab along the first and second sidewalls, and thereby cladding an optically active waveguide within the multi-layered ridge; and providing a first and second electrical contact, which electrically connect to a layer of the multi-layered ridge and the slab respectively.

2. The method of claim 1, wherein the III-V semiconductor cladding is undoped.

3. The method of claim 1, wherein the III-V semiconductor cladding is doped with iron.

4. The method of claim 1, wherein the III-V semiconductor cladding is formed from one of: InP, GaAs, GaSb, or GaP.

5. The method of claim 1, wherein the multi-layered wafer includes one or more III-V semiconductor layers.

6. The method of claim 1, wherein the optically active waveguide forms a part of one of: a photodiode; an electro-absorption modulator; and a laser.

7. The method of claim 1, wherein the cladding extends from the upper surface of the slab along the first and second sidewalls of the ridge to a point equal in height to an upper surface of a doped layer of the multi-layered ridge.

8. The method of claim 1, wherein prior to a first etch of the multi-layered wafer, the method includes depositing a first mask over a region of the multi-layered wafer which is to form the multi-layered ridge, and subsequently etching the unmasked region.

9. The method of claim 8, wherein the first mask is retained after the etching, and is present during the selective epitaxial growth of the III-V semiconductor cladding layer.

10. The method of claim 8, wherein the first mask is formed of silicon dioxide.

11. The method of claim 8, wherein the first etch extends only part way into a base layer of the multi-layered wafer which is adjacent to the substrate.

12.-16. (canceled)

17. An optoelectronic device, comprising: a multi-layered ridge, containing an optically active waveguide; a slab, located between the multi-layered ridge and a substrate; a III-V semiconductor cladding, located adjacent to a first and second sidewall of the ridge, and extending from the upper surface of the slab along the first and second sidewalls, thereby cladding the optically active waveguide within the multi-layered ridge; and a first and second electrical contact, which electrically connect to a layer of the multi-layered ridge and the slab respectively.

18. The optoelectronic device of claim 17, wherein the III-V semiconductor cladding is undoped.

19. The optoelectronic device of claim 17, wherein the III-V semiconductor cladding is doped with iron.

20. The optoelectronic device of claim 17, wherein the III-V semiconductor cladding is formed from one of: InP and GaAs.

21. The optoelectronic device of claim 17, wherein the multi-layered ridge includes one or more III-V semiconductor layers.

22. The optoelectronic device of claim 17, wherein the optically active waveguide forms a part of one of: a photodiode; an electro-absorption modulator; and a laser.

23. The optoelectronic device of claim 17, wherein the cladding extends from the upper surface of the slab along the first and second sidewalls of the ridge to a point equal in height to an upper surface of a doped layer of the multi-layered ridge.

24. The optoelectronic device of claim 17, wherein the first electrical contact includes a metal layer, located on top of the multi-layered ridge, said metal layer being electrically connected to an uppermost layer of the multi-layered ridge, and also electrically connected to a first contact pad located on an upper surface of the cladding.

25. The optoelectronic device of any of claim 17, wherein the second electrical contact is provided in a via through the cladding, said second electrical contact being electrically connected to the slab and a second contact pad located on an upper surface of the cladding.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Embodiments of the invention will now be described by way of example with reference to the accompanying drawings in which:

[0037] FIG. 1 shows an SEM image of a prior art device formed with a SiON cladding layer;

[0038] FIG. 2 is a perspective view of a multi-layered wafer;

[0039] FIG. 3 is a perspective view of the multi-layered wafer of FIG. 2 after a first etch;

[0040] FIG. 4 is a perspective view of a slab and multi-layered ridge formed by a second etch performed on the structure of FIG. 3;

[0041] FIG. 5 is a perspective view of the slab and multi-layered ridge after a III-V semiconductor cladding layer has been epitaxially grown;

[0042] FIG. 6 is a perspective view of the slab and multi-layered ridge after a third etch which removes the SiO2 mask and exposes the semiconductor top surface to form the contact with metal;

[0043] FIG. 7 is a perspective view of the slab and multi-layered ridge after a metallization step;

[0044] FIG. 8 is a perspective view of the slab and multi-layered ridge after a via is opened in the cladding layer; and

[0045] FIG. 9 is a perspective view of the slab and multi-layered ridge after an n and p contact are provided.

DETAILED DESCRIPTION AND FURTHER OPTIONAL FEATURES

[0046] Aspects and embodiments of the present invention will now be discussed with reference to the accompanying figures. Further aspects and embodiments will be apparent to those skilled in the art.

[0047] FIG. 2 is a perspective view of a multi-layered wafer 100. In this example, the wafer comprises four layers disposed on top of a substrate 101. The substrate is a semi-insulating indium phosphide (InP) substrate. On top of the substrate is an n-doped indium phosphide layer 102, which functions as a lower cladding layer to an undoped waveguide core layer 103. The undoped waveguide core layer 103 is sandwiched between the n-doped layer 102 and a p-doped indium phosphide layer 104, which functions as an upper cladding layer. On top of the p-doped indium phosphide layer 104 is a heavily p-doped (i.e. p+) indium gallium arsenide (InGaAs) layer 105. The wafer is provided, for example, by sequentially blanket or epitaxially depositing the material for each layer and performing appropriate doping steps. Whilst in this example the multi-layered wafer comprises four layers on a substrate, the wafer may contain further or fewer layers.

[0048] FIG. 3 is a perspective view of the multi-layered wafer of FIG. 2 after a first etch. Prior to the first etch, a first mask 201 is deposited over the upper surface of the uppermost layer in the multi-layered wafer (in this example the heavily p doped InGaAs layer 105). Next, the mask is patterned through lithography and etched as patterned. Finally, as shown in FIG. 3, the unmasked region of the wafer is etched through layers 104, 103, and only part way through 102. In this example, the first mask is formed of silicon dioxide (SiO.sub.2). The width of the mask 201, when patterned, defines the width multi-layered ridge 210 which is a result of the first etch. The multi-layered ridge includes layers 105-103, as well as a portion of layer 102.

[0049] FIG. 4 is a perspective view of a slab 310 formed by a second etch performed on the structure of FIG. 3. Prior to the second etch, a second mask (not shown) is deposited over the upper surface of the entire structure. This second mask is then patterned through lithography and etched as patterned. The pattern defines the width of the slab 310 to be formed through the subsequent etch, which removes the remainder of layer 102 not covered by the mask and exposes an upper surface of the substrate. In this example, the second mask is formed of silicon nitride (SiN.sub.x). The result is a slab region 310, which is located between the substrate 101 and the multi-layered ridge 210 and extends only partway across a width of the substrate. The slab region 310 has a first 312a and second 312b upper surface, which are the surfaces of the slab furthest from substrate 101.

[0050] FIG. 5 is a perspective view of the slab and multi-layered ridge after a III-V semiconductor cladding layer has been epitaxially grown. This involves the use of a selective area growth technique, in which a III-V cladding material 401 is epitaxially grown from at least the first 312a and second 312b upper surfaces of the slab 310. The cladding material is also grown from the exposed substrate 101, either side of the slab 10. The growth is halted when an uppermost surface of the cladding material 401 adjacent to the multi-layered ridge 210 is aligned with an uppermost surface of the uppermost layer of the ridge (not including the mask 201). A planarized device results. As can be seen in FIG. 5, because of the uniform growth rate, this results in a ‘step’ between the cladding material 401 which has been grown from the upper surface(s) of the slab 310 and the cladding material which has been grown from the substrate.

[0051] FIG. 6 is a perspective view of the slab and multi-layered ridge after a third etch. In the third etch, the first mask 201 is etched away using a dry or wet etching technique. This exposes an uppermost surface of the uppermost layer 104 in the multi-layered ridge 210. FIG. 7 is a perspective view of the slab and multi-layered ridge after a metallization step. In the metallization step, a metal layer 601 is disposed over the upper surface of the uppermost layer 104 in the ridge 210. The metal layer is therefore in electrical contact with this layer 104.

[0052] FIG. 8 is a perspective view of the slab and multi-layered ridge after a via 701 is opened in the cladding layer. The via 701 is opened by first patterning the upper surface of the device, and then etching through the cladding layer so as to expose a portion of the upper surface 312b. FIG. 9 is a perspective view of the slab and multi-layered ridge after a p contact pad 801 and an n contact pad 802 are provided. The n and p contact pads are provided through a further metallization process. The p contact pad 801 extends to and electrically connects with the metal layer 601 provided previously. The n contact pad 802 extends through the via, so as to electrically connect to the upper surface 312 of the slab 310. It is also disposed on an upper surface of the cladding 401, so that wire bonds or other connectors can be attached to both the p and n contact pads.

[0053] While the invention has been described in conjunction with the exemplary embodiments described above, many equivalent modifications and variations will be apparent to those skilled in the art when given this disclosure. Accordingly, the exemplary embodiments of the invention set forth above are considered to be illustrative and not limiting. Various changes to the described embodiments may be made without departing from the spirit and scope of the invention.

LIST OF FEATURES

[0054] 100 Multi-layered wafer [0055] 101 Substrate [0056] 102 Lower doped layer [0057] 103 Undoped core [0058] 104 Upper doped layer [0059] 105 Heavily doped layer [0060] 201 First mask [0061] 210 Multi-layered ridge [0062] 310 Slab [0063] 312a 312b Upper surface of slabs [0064] 401 Cladding [0065] 601 Metal layer [0066] 701 Via [0067] 801 First contact pad [0068] 820 Second contact pad