HEAT-DISSIPATION DEVICE OF LED

Abstract

A heat-dissipation device for LEDs includes a plurality of heat conducting material wires. The heat-dissipation housing of an LED chip is in contact with one end of the heat conducting material wires through a heat conducting material or in a direct manner so that heat is transferred from the housing to the wires and further to the surrounding air. The heat conducting material wires are arranged in an air flowing pipeline and the heat is taken away by the flowing air. The pipeline is made of insulation materials.

Claims

1. A heat-dissipation device of an LED, wherein the device comprises a large number of heat conducting material wires made of a heat conducting material, the diameters of the heat conducting material wires are greater than 0.01 mm and less than 0.3 mm, and the ratios of length to diameter of the heat conducting material wires are greater than 20, a heat-dissipation housing of an LED chip is contacted with one end of the heat conducting material wires made of the heat conducting material through the heat conducting material or in a direct manner, in order to heat air around the heat conducting material wires, and the heat is taken away by the flowing air, wherein, one end of the heat conducting material wires is integrated with the heat-dissipation housing of the LED chip by welding, casting or thermally conductive adhesive bonding.

2. The heat-dissipation device of the LED of claim 1, wherein the ratios of length to diameter of the heat conducting material wires are greater than 30.

3. The heat-dissipation device of the LED of claim 1, wherein the ratios of length to diameter of the heat conducting material wires are greater than 50.

4. The heat-dissipation device of the LED of claim 1, wherein the ratios of length to diameter of the heat conducting material wires are greater than 100.

5. The heat-dissipation device of the LED of claim 1, wherein the heat conducting material is copper; and the heat conducting material wires are copper wires.

6. The heat-dissipation device of the LED of claim 1, wherein surfaces of the heat conducting material wires are covered by a protective layer for preventing the heat conducting material wires from being oxidized, corroded or polluted.

7. The heat-dissipation device of the LED of claim 6, wherein the protective layer covering the surfaces is a silver plating.

8. The heat-dissipation device of the LED of claim 1, wherein the heat conducting material wires are arranged in an air-flowing pipeline; a blower is connected into the pipeline, and air is circulated by means of the blower to take away heat.

9. The heat-dissipation device of the LED of claim 1, wherein the heat conducting material wires are arranged in an air-flowing pipeline; an outlet and an inlet of the pipeline have a certain height difference, air becomes light by means of heating expansion to form a pressure difference between the outlet and the inlet, and air circulation is accelerated to take away heat.

10. The heat-dissipation device of the LED of claim 8, wherein the pipeline is made of an insulation material, in order to ensure ground insulation of the entire heat-dissipation device.

11. The heat-dissipation device of the LED of claim 9, wherein the pipeline is made of an insulation material, in order to ensure ground insulation of the entire heat-dissipation device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG. 1 is a schematic diagram of one end of heat conducting material wires being integrated with a heat-dissipation housing of an LED chip according to an embodiment of the present invention; and

[0034] FIG. 2 is a schematic diagram of heat conducting material wires being arranged in an air-flowing pipeline according to an embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

[0035] In specific implementations, in order to obtain the best heat dissipation effect, the heat conducting material wires are always selected as thin as possible when the situation permits. However, very thin heat conducting material wires may bring a lot of inconvenience to processing, and too long heat conducting material wires may make the structure complex and cause trouble. Therefore, selection of both the cable diameters and the lengths of the heat conducting material wires needs to be based on a power of a specific heating element, an operating environment, and other specific conditions to meet a required height-diameter ratio h/d (height/diameter) for heat dissipation.

Embodiment 1. A 1 W LED Lamp Bead

[0036] Taking an AWG (American wire gauge) No. 30 copper wire (a cable diameter of 0.255 mm), cutting a large number of copper wires with each length of 20 mm, and sticking these copper wires together with a 6 mm wide soldering tin. Fixing a heat-dissipation surface of an LED lamp bead with a current of 350 MA and a voltage of 3.2-3.4V on the soldering tin in the middle of these copper wires with the thermally conductive adhesive. Connecting a DC power supply correctly and inputting a current of 350 MA. The LED chip operates normally and emits light.

[0037] After the LED chip operates and emits light for 1 hour, a thermocouple probe is used to measure the temperature rise on the heat-dissipation surface of the LED chip. After repeated measurements, the temperature rise is always less than 30° C.

[0038] At this time, a length of the heat-dissipation copper wire is 7 mm with a height-diameter ratio of h/d=7/0.255=27.

Embodiment 2. A 30 W LED Lamp

[0039] The heat conducting material wires are copper wires of copper braids usually used by electricians. A diameter of the copper wire is 0.12 mm, and a braid width is about 30 mm.

[0040] Take 3 sections of the copper braid, and each section is 150 mm in length. Stretching the braid to form a cylinder, and cutting the cylinder to obtain 3 groups of interwoven copper wires, which is forming 3 planes with a length of 150 mm and a width of 60 mm.

[0041] The LED chip adopts LED lamp beads with a current of 350 MA and a voltage of 3.2-3.4V per piece. Fixing heat-dissipation surfaces of 30 lamp beads on the copper wires of the foregoing 3 sections of braids with the soldering tin and the thermally conductive adhesive, and ensuring that the heat-dissipation surfaces of the lamp beads and the copper wires of the braids can conduct heat well. Enabling the copper wires of the 3 sections of copper braid to be overhead to ensure that air circulation around the copper wires is not affected.

[0042] Herein, a width of the soldering tin in the middle of the braid is 6 mm, lengths of the heat-dissipation copper wires on both sides are 27 mm, and cable diameters of the copper wires are 0.12 mm with a height-diameter ratio of h/d=27/0.12=225.

[0043] The LED chip is connected correctly to drive the power supply with 30 W constant power output to supply power to the LED chip. After the LED chip operates and emits light for 1 hour, a thermocouple probe is used to measure the temperature rise on the heat-dissipation surface of the LED chip. After repeated measurements, the temperature rise is always less than 25° C.

[0044] What is mentioned above is the description of the embodiments of the present invention. However, the present invention is not limited to the foregoing description of the embodiments. The foregoing description of the embodiments is only illustrative but not restrictive. Under the enlightenment of the present invention, those of ordinary skills in the art can make many forms without departing from the purpose of the present invention and the protection scope of the claims, and these all fall within the protection of the present invention.