METHOD FOR CONNECTION BY BRAZING ENABLING IMPROVED FATIGUE RESISTANCE OF BRAZED JOINTS

Abstract

The connection method between at least two elements (E1, E2) corresponding to a printed circuit (4) and to an electronic component (5), comprises a step of forming a plurality of pad-type stacks (2) of bosses (3), the stacks (2) of bosses (3) being formed on a face (10) of a first (E1) of the elements (E1, E2), the stacks (2) of bosses (3) each comprising the same given number of bosses (3), said method also comprising a step of depositing a brazing product (7) on this first element (E1) provided with stacks (2) of bosses (3), a step of arranging the second (E2) of the elements (E1, E2) on the first element (E1), and a step of remelting the assembly thus formed, in order to obtain an electronic device (1). This method makes it possible to produce a precise and flexible raising of surface mounted electronic components.

Claims

1. A method for connection, by brazing, between at least two elements, said two elements corresponding respectively to a printed circuit and to an electronic component characterised in that it comprises at least the following sequence of steps: a) a step of forming a plurality of stacks of stud bump, said stacks of bumps being formed on a face of a first of said elements, said stacks of bumps each comprising the same given number of bumps; b) a step of depositing a brazing product on this first element provided with stacks of bumps or on the second element; c) a step of arranging the second of said elements on said first element; and d) a step of remelting the assembly thus formed in the arranging step, in order to obtain an electronic device.

2. The method according to claim 1, characterized in that the forming step consists, for each stack of bumps, in implementing, in succession, a predetermined number of forming sub-steps, each of said forming sub-steps consisting in forming a bump, the bumps of each stack of bumps being formed in succession by being stacked on top of each other.

3. The method according to claim 2, characterised in that each forming sub-step comprises at least the following operations: an operation of heating of a metal wire by means of an electrode; an operation of depositing a metal ball formed at the end of the heated metal wire; an operation of crushing and welding the metal ball; and an operation of separating the metal wire from the crushed metal ball to form the bump.

4. The method according to claim 1, characterised in that each bump has a height of between 20 μm and 30 μm.

5. The method according to claim 1, characterised in that each stack of bumps has a height of between 110 μm and 150 μm.

6. The method according to claim 1, characterised in that at least some of said stacks of bumps are separated from each other by a distance of between 0.05 mm and 0.1 mm on said first element.

7. The method according to claim 1, characterised in that the bumps are made of one of the following materials: gold, copper, silver, platinum.

8. The method according to claim 1, characterised in that it comprises a plurality of sequences of steps, each of these sequences of steps enabling to connect an electronic component onto the same printed circuit so as to obtain an electronic device comprising a single printed circuit provided with a plurality of electronic components.

9. The method according to claim 1, characterised in that said first element corresponds to the printed circuit, and said second element corresponds to the electronic component.

10. The method according to claim 1, characterized in that said first element corresponds to the electronic component, and said second element corresponds to the printed circuit.

11. An electronic device, characterised in that it is obtained by implementing the method according to claim 1.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0042] The attached figures will make it clear how the invention can be implemented. In these figures, identical references denote similar elements. More particularly:

[0043] FIG. 1 is a block diagram of a connection method according to the invention;

[0044] FIG. 2 is a schematic cross-sectional view of a connection according to the invention between a printed circuit and an electronic component;

[0045] FIG. 3 is a perspective view of an example of an electronic component suitable for connection to a printed circuit board;

[0046] FIG. 4 is a schematic perspective view of a plurality of stacks of bumps;

[0047] FIG. 5 is a schematic view of a stud bump implemented from thermosonic bonding;

[0048] FIG. 6 shows a stack of two bumps such as that shown in FIG. 5;

[0049] FIG. 7 shows a stack of four bumps as in FIG. 5;

[0050] FIGS. 8A to 8E show schematically different successive operations of a sub-step of forming a stud bump made by thermosonic bonding;

[0051] FIG. 9 is a partial perspective view of an electronic component provided with a plurality of stacks of bumps;

[0052] FIG. 10 is a schematic partial perspective view of an element provided with a cavity for receiving stacks of bumps; and

[0053] FIG. 11 is a schematic partial perspective view of an element having a raised base for receiving stacks of bumps.

DETAILED DESCRIPTION

[0054] The method P illustrating the invention and shown schematically in FIG. 1 is a connection method (implementing a brazing) in the field of electronic assembly to generate a connection between at least two elements E1 and E2, as shown in FIG. 2.

[0055] These two elements E1 and E2 correspond, one to a printed circuit 4 (or PCB type (Printed Circuit Board)), and the other to an electronic component 5.

[0056] This electronic component 5 may, in particular, be a printed circuit 6 of the QFN type (for “Quad Flat No-leads package”) as shown in FIG. 2, of the BGA type (“Ball Grid Array”), or of the WL CSP type (for “Wafer Level Chip Scale Package”).

[0057] According to the invention, said method P comprises, as shown in FIG. 1, at least the following sequence of steps SF: [0058] a forming step F1, by thermosonic bonding, consisting of forming a plurality of stacks 2 of bumps 3. These stacks 2 (of bumps 3) are formed on a face 10 of a first E1 of said elements, as shown in FIG. 4. This first element E1 may be either the printed circuit 4 (as shown in FIG. 2) or the electronic component 5 (as shown in FIG. 9), depending on the embodiment to be conceived. Each of the stacks 2 comprises the same given (and predetermined) number N of bumps 3, N being an integer, as illustrated in FIG. 6 (where N is equal to 2) and FIG. 7 (where N is equal to 4). The bumps 3 are of the stud bumps, as shown for the bump 3 represented in FIG. 5; [0059] a depositing step F2 consisting of depositing, in the usual way, an electrically conductive brazing product 7 (FIG. 2) in the form of a paste, in particular a brazing alloy, on this first element E1 provided with the stacks 2 formed in the forming step F1. An electrically conductive adhesive based on epoxy resin may also be used. By way of illustration, the deposition can be carried out by screen printing, by dispensing solder cream with a syringe, or by jetting micro-droplets of solder cream. It is also possible to conceive a thermosonic bonding step F1 on the element E2 combined with a depositing step F2 in the usual way on the element E1; [0060] a arranging step F3 consisting of arranging, in the usual way, the other element E2 (i.e., the second E2 of said elements E1 and E2) on said first element E1, by bringing it into contact with one 9 of its faces (at the level of ranges 8) of the stacks 2 arranged on the face 10 of the first element E1, as shown in FIG. 2; and [0061] at least one remelting step F4 consisting of implementing, in the usual way, a remelting of the assembly thus formed (in the arranging step F3) in order to finally obtain an electronic assembly referred to hereinafter as the electronic device 1 (FIG. 2). This remelting is implemented at a limited temperature, of the order of 240° C.

[0062] Thus, thanks to the method P, an elevation is generated at the forming step F1 by the installation of stacks 2 of stud bumps 3, which enables to increase the height of the brazed joints of the first element E1 with respect to the second element E2, thus enabling to increase the robustness and, more precisely, the thermo-mechanical fatigue resistance of the electronic device 1 obtained after carrying out said method P.

[0063] This method P enables to improve the behaviour in a severe environment (as mentioned above) for “consumer” components. More particularly, the electronic device 1 thus formed is able to withstand a number of temperature cycles, between −55° C. and +125° C., over a period of about 25 years, as required in the military field.

[0064] The forming step F1 consists, for each stack 2 of bumps 3, in implementing, successively, a predetermined number N of forming sub-steps F1i, i varying from 1 to N.

[0065] Each of said successive forming sub-steps F11, F12, . . . , to F1N (FIG. 1) consists of forming a single bump 3, for example such as that shown in FIG. 5. The bumps 3 of each stack 2 are formed, successively, one after the other by being stacked on top of each other.

[0066] By way of illustration, in FIG. 6, a stack 2 of two bumps 3 is shown, and in FIG. 7, a stack 2 of four bumps 3 is shown.

[0067] To this end, in a preferred embodiment, each forming step F1i, by thermosonic bonding, is carried out, as shown in FIGS. 8A to 8E, the following operations, using a tool 13 comprising a capillary body 14 and a gripping element 15 such as a clamp: [0068] an heating operation O1 consisting of heating a metal wire 16 held in the tool 13, via an electrode 17, as shown in FIG. 8A so as to form a metal ball 18. The wire 16 is made of the metal to be used for the bump to be formed; [0069] an depositing operation O2 consisting of depositing the metal ball 18 formed at the end of the heated metal wire 16, on the face 10 of the element E1 when it is the first bump of the stack, as shown in FIGS. 8B (in which the gripping element 15 releases the metal wire 16 which rises) and 8C (which illustrates the deposition), or on another bump already formed on this face 10. The element E1 is subjected to heating, illustrated by arrows A. FIG. 6 shows, by way of illustration, the formation of a bump 3 on another bump 3 already formed, with deposition in the direction illustrated by an arrow G. An ultrasonic energy supply may also be provided; [0070] an crushing and welding operation O3 consisting of generating a force (illustrated by arrows B in FIG. 8D), a temperature of typically 150° C. as well as ultrasound on the metal ball 18, using a part of the preferably ceramic tool 13, so as to flatten it slightly as shown in FIG. 8D; and [0071] an separating operation O4 consisting of separating the metal wire 16 from the crushed metal ball 18 and withdrawing the tool 13 (in the direction illustrated by an arrow C in FIG. 8E, with the metal wire 16 being held by the gripping element 15) so as to form the bump 3. The breaking of the metal wire 16 to form the bump 3 takes place at a thermally affected zone.

[0072] For the purpose of the present invention: [0073] each bump 3 preferably has a height h (shown in FIG. 5) which is between 20 μm and 30 μm; [0074] a very varied number N of bumps 3 per stack 2 can be provided, for example from 2 to 30 bumps per stack and preferably from 3 to 6 bumps per stack.

[0075] Thus, by way of illustration, each stack 2 of bumps 3 preferably has a height H (shown in FIGS. 2 and 7) which is between 110 μm and 150 μm.

[0076] Furthermore, with the aforementioned method P, it is possible to bring the stacks 2 close to each other at a short distance, if this is necessary or desired in the forming step F1. By way of example, it is conceivable that at least some of the stacks 2 of bumps are separated from each other, on said first element E1, by a distance D (shown in FIG. 4) which is between 0.05 mm and 0.1 mm. These characteristics can be adapted according to the matrix of the component as well as the number of breakage cycles that the component must withstand.

[0077] In a particular embodiment, the bumps 3 are made of one of the following materials: copper, gold, silver or platinum. Preferably, however, said bumps 3 are made of copper or silver so as to allow better cohesion with the brazing product 7 and avoid dissolution (in the case of gold) of the bump by the brazing.

[0078] The method P and in particular the forming step F1 can be integrated into standard brazing connection methods. Thus, in particular the depositing step F2 can be implemented in a standard way.

[0079] Therefore, the method P, as described above: [0080] is flexible and adaptable; [0081] is not limited by the pitch (or distance) of the inputs/outputs (distance D between the inputs/outputs); [0082] can be carried out with precise and wide control of the height variation range, with for example 2 to 30 levels of stacked bumps 3 (per stack of bumps); and [0083] enables to limit the thermal stresses for the elements E1 and E2 during the assembly phases. The thermal stresses undergone while carrying out the method are limited, with a maximum temperature of the order of 150° C. during the thermosonic bonding step F1.

[0084] In a particular embodiment (not shown), the method P comprises a plurality of sequences of steps SF. Each of these sequences of steps SF is intended to connect another electronic component on the same printed circuit. This enables to obtain an electronic device comprising a single printed circuit provided with a plurality of electronic components.

[0085] Furthermore, thanks to the embodiment of the method P, the bumps 3 (and thus the element E2) can thus be arranged on an element E1, the face 10 of which has a substantially flat shape, as shown in FIG. 9. Moreover, the method P as described above also allows to form, in an advantageous way, stacks 2 of bumps 3 on an element E1, the face 10 of which is not flat, in particular, at the level of a cavity 19 of this element E1 as shown in FIG. 10 or at the level of a raised base 20 of this element E1 as shown in FIG. 11. For the sake of simplicity of the drawings, only one of the plurality of stacks 2 of bumps 3 is shown in FIGS. 10 and 11. In these situations in FIGS. 10 and 11, the element E2 is therefore arranged in the cavity 19 or on the base 20.

[0086] As indicated above, for the purpose of the present invention, said first element E1 on which the stacks 2 of bumps 3 are formed may be either the printed circuit board 4 or the electronic component 5.

[0087] Thus: [0088] in a first embodiment, as shown in FIG. 2, said first element E1 corresponds to the printed circuit 4, and said second element E2 corresponding to the electronic component 5; and [0089] in a second embodiment, said first element E1 corresponds to the electronic component 5 (FIG. 9), and said second element E2 corresponding to the printed circuit.

[0090] With method P, there is great freedom and therefore flexibility regarding the number and location of the stacks on the element E1. In particular, as illustrated in FIG. 9, when the element E1 is an electronic component 5, the stacks 2 may in particular be formed on the central part 11 of the face 10 of the electronic component 5 and/or on the periphery 12 of this face 10.

[0091] The stack 2 of bumps 3 on an element E1, for example on an electronic component 5 such as an integrated circuit, thus enables to raise it and to obtain a maximum of brazing under this element E1. This stack 2 thus increases the height of the brazed joint (obtained in steps F3 and F4 using the brazing product 7) and improves the thermomechanical fatigue resistance of the electronic device 1.

[0092] Thus, thanks to the invention, a method P is obtained which is: [0093] flexible: [0094] in height, by choosing an appropriate height H per stack 2; [0095] in positioning on the element E1, with, for example, a formation of stacks 2 on heat dissipation ranges or on inputs/outputs of the element E1; [0096] in the number of stacks 2. By way of illustration, several thousand stacks 2 can be provided per element E1, in particular per electronic component 5; and [0097] adaptable. This method P can be integrated into standard brazing connection methods, and is adaptable according to the applications related to the electronic component and the printed circuit.

[0098] This method P can be implemented via automatic equipment and standard methods existing in the field of consumer electronics.

[0099] Furthermore, there is a possibility of isostatic formation of three stacks of bumps or hyperstatic formation of a large number of stacks of bumps.

[0100] Furthermore, said method P has no impact on repairs, and is adaptable to any type of stack distribution (or design).

[0101] Furthermore, the method P is in particular applicable to electronic components having: [0102] Bottom Terminations Components (BTC), for example QFN, DFN, or LCC; [0103] Ball Terminations in arrays, e.g. BGA or flip chip; [0104] Area terminations under the component, e.g. LGA.

[0105] The method P as described above, which is thus based on the formation of stacks 2 of bumps 3, has, in particular, the following features and advantages: [0106] a microelectronic precision adaptable to existing and future needs (distance (or pitch) D of 0.05 mm for example); [0107] a temperature to which the electronic component in particular is subjected, which is reduced, of the order of 150° C. during the thermosonic bonding; [0108] a repeatability of the geometry by automating the method; [0109] a self-controlled method; [0110] flexibility; [0111] controlled cost; and [0112] increased integration density.

[0113] This method is therefore mainly suitable for improving the fatigue life of the brazed joints. However, due to the high accuracy, this method can also perform specific secondary alignment functions (optical function alignment, three-axis function alignment, . . . ).