ALIGNMENT OF HTS TAPES
20210343452 · 2021-11-04
Inventors
- Robert Slade (Abingdon Oxfordshire, GB)
- Greg Brittles (Abingdon Oxfordshire, GB)
- Bas van Nugteren (Abingdon Oxfordshire, GB)
Cpc classification
Y02E40/60
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01B12/00
ELECTRICITY
H01F6/06
ELECTRICITY
G21B1/21
PHYSICS
International classification
G21B1/21
PHYSICS
Abstract
A cable for carrying electrical current in a coil of a magnet. The cable comprises a stack of tape assemblies. Each tape assembly has a length and a width, such that the length is much larger than the width, and each tape assembly comprises an HTS layer of anisotropic high temperature superconductor, HTS material, wherein a c-axis of the HTS layer is at a non-zero angle to a vector perpendicular to the plane of the HTS layer. The tape assemblies are stacked as a series of pairs, each pair comprising first and second HTS tape assemblies and a copper layer therebetween. The tape assemblies in each pair are arranged such that the c-axis of the HTS layer of the first HTS tape assembly of each pair have reflective symmetry to the c-axis of the HTS layer of the second HTS tape assembly of each pair about a plane which is parallel to and equidistant from each HTS layer.
Claims
1. A cable for carrying electrical current in a coil of a magnet, comprising: a stack of tape assemblies, each tape assembly having a length and a width, such that the length is much larger than the width and each tape assembly comprises an HTS layer of anisotropic high temperature superconductor, HTS material, wherein a c-axis of the HTS layer is at a non-zero angle to a vector perpendicular to the plane of the HTS layer; wherein the tape assemblies are stacked as a series of pairs, each pair comprising first and second HTS tape assemblies and a copper layer therebetween; wherein the tape assemblies in each pair are arranged such that the c-axis of the HTS layer of the first HTS tape assembly of each pair have reflective symmetry to the c-axis of the HTS layer of the second HTS tape assembly of each pair about a plane which is parallel to and equidistant from each HTS layer.
2. The cable according to claim 1, wherein the HTS material is one of: ReBCO; and BSCCO.
3. The cable according to claim 1, wherein each HTS tape assembly comprises a substrate.
4. The cable according to claim 3, wherein each pair is arranged such that the HTS layers of the HTS tape assemblies are arranged between the substrates of the HTS tape assemblies.
5. The cable according to claim 3, wherein each pair is arranged such that the substrates of the tape assemblies are arranged between the HTS layers of the HTS tape assemblies.
6. The cable according to claim 3, wherein each pair is arranged such that one HTS layer is arranged between the substrates of the HTS tape assemblies, and the other HTS layer is arranged outside the substrates of the HTS tape assemblies.
7. The cable according to claim 1, wherein each HTS tape assembly comprises exfoliated HTS tape.
8. The cable according to claim 1, wherein the thickness of the copper layer is between 10 microns and 400 microns.
9. A method of manufacturing a cable for carrying electric current in a coil of a magnet, the method comprising: providing first and second tape assemblies, each tape assembly comprising a high-strength metal substrate layer, and an HTS layer of anisotropic high temperature superconductor, HTS, material, wherein a c-axis of the HTS layer is at a non-zero angle to a vector perpendicular to the plane of the HTS layer; applying the first tape assembly to a copper layer; applying the second tape assembly to the copper layer, such that the HTS layer of the first tape and the HTS layer of the second tape are parallel and separated by the copper layer, and such that a c-axis of the second HTS tape assembly has reflective symmetry to the c-axis of the HTS layer of the second HTS tape assembly of each pair about a plane which is parallel to and equidistant from each HTS layer.
10. The method according to claim 9, wherein each HTS tape assembly comprises a substrate layer.
11. The method according to claim 10, wherein the first and second HTS tape assemblies are applied to the copper layer such that the respective HTS layer is between the respective substrate layer and the copper layer.
12. The method according to claim 10, wherein the first and second HTS tape assemblies are applied to the copper layer such that the respective substrate layer is between the respective HTS layer and the copper layer.
13. The method according to claim 10, wherein the first and second HTS tape assemblies are applied to the copper layer such that the HTS layer of the first HTS tape assembly is between the substrate layer of the first HTS tape assembly and the copper layer, and the substrate layer of the second HTS tape assembly is between the HTS layer of the second HTS tape assembly and the substrate layer.
14. The method according to claim 8, wherein each HTS tape assembly comprises exfoliated HTS tape.
15. The method according to claim 8, and comprising partially transferring a master HTS tape assembly from a first reel to a second reel, separating the portion of the master HTS tape assembly on the first reel from the portion of the master HTS tape assembly on the second reel, and applying the first HTS tape assembly from the first reel and the second HTS tape assembly from the second reel.
16. The method according to claim 8, wherein the first HTS tape assembly is applied in the opposite direction along the copper layer to the direction in which the second HTS tape assembly is applied.
17. The method according to claim 8, wherein the first and second HTS tape assemblies are formed by folding a master HTS tape assembly about an axis in the plane of the HTS layer and perpendicular to the length of the master HTS tape assembly, and removing a region of the master HTS tape assembly containing the fold.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0011]
[0012]
[0013]
[0014]
[0015]
[0016]
[0017]
[0018]
DETAILED DESCRIPTION
[0019] The invention describes a method of combining pairs of HTS tapes such that any variation in the angle at which peak critical current occurs along the tape is averaged out in the pair, leading to a more consistent behaviour.
[0020]
[0021] Each tape has a c-axis 412, 422 at an angle a from the perpendicular to the plane of the ReBCO layer (i.e. the z-axis), and a peak Ic angle (i.e. the angle of applied magnetic field for which the critical current is greatest) which is perpendicular to the c-axis.
[0022] Conventionally, the type-0 pair would be constructed by first applying the tape 410 from a spool of ReBCO tape to the copper lamination 430 from one end to the other and then applying the tape 420 from the same spool of HTS tape in the same direction on the opposite side of the copper lamination. This results in the c-axis of the ReBCO 412, 422 and the a/b plane 413, 423 (i.e. the angle of applied magnetic field for which Ic is maximised) being oriented as shown in
[0023] As an alternative, the type-0 pair can be constructed as shown in
[0024] The application of the tape to form the construction of
[0025] If the tape does not need to be applied directly from a spool, the “flipped pair” orientation is most easily achieved by: [0026] 1. Spooling off two equal lengths of tape from a spool. [0027] 2. Turning over one tape about its y axis so that the HTS coated sides face each other. [0028] 3. Rotating one tape 180 degrees lengthways about the z-axis.
[0029] Alternatively, this can be achieved by spooling off one tape of greater than twice the required length, folding it in the middle about the x axis (i.e. end-to-end), and cutting off or otherwise removing a section containing the fold, to leave two tapes which are then arranged in a type-0 pair in a “flipped” orientation (or a type-2 pair if the tape is folded such that the substrates face each other).
[0030]
[0031] As can be seen from the figures, the use of the construction of
[0032] For tapes with a small angle (<5 degrees) offset between the c-axis and z-axis, the flipped-pair arrangement has the beneficial effect of averaging out the impact of any changes in the angle at which peak critical current occurs at any position along the tape. This is because the peaks of the individual tapes in the pair are merge into one lower broader peak, as shown in
[0033] Furthermore, where the flipped pair is made from a single reel of tape, if the critical current at the start of the reel is lower or higher than at the end of the reel, as supplied, this will also be averaged out by the flipped type-0 orientation.
[0034] The net effect of flipped pair orientation is to average out production variations in peak critical current along the HTS tape. The advantages for translating a magnet design, which assumes uniform critical current along the tape, into a real working magnet are clear.
[0035] However, it should be noted that in some commercially available tapes, the c-axis 320 diverges by as much as 30-35 degrees from the perpendicular to the plane of the tape. The flipped pair orientation is less useful with these tapes, because the peak Ic becomes split into two peaks, both lower than the peak in the un-flipped arrangement of tape pairs. This is illustrated in
[0036] In addition, the use of the “flipped tape” construction results in a symmetrical distribution of current sharing within a magnet coil wound using the type-0 pairs and pushed close to critical current.
[0037] While the above description has focussed on arrangements of type-0 pairs of HTS tapes, similar arrangements may be used for type-1 pairs (i.e. where the HTS layer of one tape faces the substrate layer of the other, such that one HTS layer is between the substrates and one is not) or type-2 pairs (i.e. where the substrate layers face each other, such that they are between the HTS layers), arranged such that the c-axes of the HTS tapes have reflective symmetry about a plane parallel to the HTS layers. Furthermore, the above disclosure may also be applied to cases where one or both tapes in a pair are “exfoliated” HTS tape, i.e. HTS tape without a substrate.