TESTING METHOD FOR A THERMAL CONTACT

Abstract

A testing method for a thermal contact between a temperature sensor and a battery cell of a battery module, includes measuring a temperature T.sub.1 of the temperature sensor at a time point t.sub.1, heating the temperature sensor for a defined time (t.sub.2−t.sub.1) and/or (t.sub.3−t.sub.1), measuring a temperature T.sub.2 of the temperature sensor at a time point t.sub.2 and/or a temperature T.sub.3 of the temperature sensor at a time point t.sub.3, and determining the thermal contact between the temperature sensor and the battery cell based on at least one of the temperature differences ΔT.sub.2,1=(T.sub.2−T.sub.1), ΔT.sub.3,1=(T.sub.3−T.sub.1) and ΔT.sub.3,2=(T.sub.3−T.sub.2) and a heat transfer coefficient determined thereby. Also, a testing circuit for a temperature sensor of a battery module includes a thermistor with a first node connected to a first supply voltage and a second node connected to ground, a switch interconnected between the first node of the thermistor and a second supply voltage, and an analog-to-digital converter connected in parallel to the thermistor. Also, a cell supervision circuit for a battery module including a circuit carrier, a testing circuit, and a temperature sensor surface mounted to the circuit carrier and having a measuring head with a thermistor configured to be brought into thermal contact with a battery cell of the battery module.

Claims

1. A testing method for a thermal contact between a temperature sensor and a battery cell of a battery module, the method comprising: measuring a temperature T.sub.1 of the temperature sensor at a time point t.sub.1; heating the temperature sensor for a predefined period of time (t.sub.2−t.sub.1) and/or (t.sub.3−t.sub.1); measuring a temperature T.sub.2 of the temperature sensor at a time point t.sub.2 and/or a temperature T.sub.3 of the temperature sensor at a time point t.sub.3; and determining the thermal contact between the temperature sensor and the battery cell based on at least one temperature difference ΔT.sub.2,1=(T.sub.2−T.sub.1), ΔT.sub.3,1=(T.sub.3−T.sub.1), and ΔT.sub.3,2=(T.sub.3−T.sub.2).

2. The testing method as claimed in claim 1, wherein the temperature sensor includes a measuring head in thermal contact with the battery cell of the battery module.

3. The testing method as claimed in claim 2, wherein heating the temperature sensor includes applying a heating current to the thermistor for the predefined period of time.

4. The testing method as claimed in claim 2, wherein the temperatures T.sub.1, T.sub.2, and/or T.sub.3 are measured based on a voltage drop over the thermistor.

5. The testing method as claimed in claim 1, wherein a heat transfer coefficient (τ) corresponding to the thermal contact between the temperature sensor and the battery cell is determined based on at least one of the temperature differences ΔT.sub.2,1=(T.sub.2−T.sub.1), ΔT.sub.3,1=(T.sub.3−T.sub.1), and/or ΔT.sub.3,2=(T.sub.3−T.sub.2).

6. The testing method as claimed in claim 5, wherein the heat transfer coefficient (t) is determined based on a look-up table determined during testing of the temperature sensor.

7. The testing method as claimed in claim 2, wherein the measuring head includes a thermistor in thermal contact with the battery cell.

Description

DESCRIPTION OF DRAWINGS

[0032] Features will become apparent to those of ordinary skill in the art by describing in detail exemplary embodiments with reference to the attached drawings in which:

[0033] FIG. 1 illustrates a schematic perspective view of a battery module with a cell supervision circuit, CSC, according to an embodiment;

[0034] FIG. 2 illustrates a schematic side view of a battery module with a cell supervision circuit, CSC, according to an embodiment;

[0035] FIG. 3 schematically illustrates a testing circuit according to an embodiment;

[0036] FIG. 4 schematically illustrates a temperature curve obtained in a method according to an embodiment; and

[0037] FIG. 5 schematically illustrates another temperature curve obtained in a method according to an embodiment.

BEST MODE

[0038] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. Effects and features of the exemplary embodiments, and implementation methods thereof will be described with reference to the accompanying drawings. In the drawings, like reference numerals denote like elements, and redundant descriptions are omitted. The present invention, however, may be embodied in various different forms, and should not be construed as being limited to only the illustrated embodiments herein. Rather, these embodiments are provided as examples so that this disclosure will be thorough and complete, and will fully convey the aspects and features of the present invention to those skilled in the art.

[0039] Accordingly, processes, elements, and techniques that are not considered necessary to those having ordinary skill in the art for a complete understanding of the aspects and features of the present invention may not be described. In the drawings, the relative sizes of elements, layers, and regions may be exaggerated for clarity.

[0040] As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Further, the use of “may” when describing embodiments of the present invention refers to “one or more embodiments of the present invention.” In the following description of embodiments of the present invention, the terms of a singular form may include plural forms unless the context clearly indicates otherwise.

[0041] It will be understood that although the terms “first” and “second” are used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be named a second element and, similarly, a second element may be named a first element, without departing from the scope of the present invention. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of.” when preceeding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.

[0042] As used herein, the term “substantially.” “about.” and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art. Further, if the term “substantially” is used in combination with a feature that could be expressed using a numeric value, the term “substantially” denotes a range of +/−5% of the value centered on the value.

[0043] FIGS. 1 and 2 illustrates a schematic perspective view and a schematic side view of a battery module 30 with a PCB 45 carrying a cell supervision circuit 40. CSC, according to an embodiment.

[0044] Referring to FIGS. 1 and 2, a temperature sensor 50 according to an embodiment is mounted directly to the PCB 45 of carrying the CSC 40 of a battery module 30. Therein, the PCB 45 is placed over the cells 10, particularly above the cell terminals 20, and thermally coupled thereto via a measuring head 51 of the temperature sensor 50 that is connected via wires 52 to an evaluation circuit 53 as part of the CSC 40.

[0045] The temperature of the PCB 45 might differ significantly from the temperature of the cells 10. As only the temperature of the cells 10 shall be measured while an influence of the PCB's temperature shall be negligible, it is critical that the thermal coupling of the temperature sensor 50, particularly of its measuring head 51, to the cells 10 is significantly better than the thermal coupling of the sensor 50 to the PCB 45. Preferably, a thermal coupling of the sensor 50 to the cells 10 exceeds the thermal coupling between the sensor 50 and the PCB 45 by a factor of 10 to 100 in order to ensure accurate temperature measurements.

[0046] The CSC 40 may form an embodiment of the present invention if it comprises a testing circuit 60 according to an embodiment of the invention as described with reference to FIG. 3 below.

[0047] The CSC 40 on the PCB of FIGS. 1 and 2 is configured for setting up a communication connection between multiple battery modules 30 of a battery system and a BMS of the battery system. Therefore, the cell supervision circuit carrier 40 comprises a connector (not shown) for setting up a daisy chain. The connector serves as input/output for a communication between the BMS and the CSCs 40 of the battery modules 30. The CSC 40 is preferably configured to monitor the cell voltages of some or each of a battery module's 30 battery cells 10 via the at least one cell voltage input pin and may further be configured to actively or passively balance the voltages of the individual battery cells of the module via control signals output via respective output pins. Exemplarily, the CSC 40 might comprise a plurality of resistors that are connectable to the individual cells 10 for passively balancing the battery module 30 by dissipating energy of the highest voltage battery cells 10.

[0048] FIG. 3 schematically illustrates a testing circuit according to an embodiment. The testing circuit comprises a first line 65 providing a first supply voltage VDD1 and a second line 66 providing a second supply voltage VDD2. The first supply voltage 65 is supplied via a resistor 62 and a first thermistor node 67 to a NTC thermistor 61 and via a second thermistor node 68 to a ground line 69. In other words, the thermistor 61 is interconnected between a first supply voltage 65 VDD1 (via the resistor 62) and ground 69. The first thermistor node 67 is further connected to a second supply voltage VDD2 on second line 66 via the switch 63. Further an ADC 64 is connected to the first thermistor node 67 and the second thermistor node 68 for measuring a voltage drop over the thermistor 61.

[0049] Also not shown in FIG. 3, the testing circuit 60 further comprises a control unit that is connected via a first output pin to the switch 63 for either setting the switch conductive or non-conductive depending on an output of the control unit. A first input pin of the control unit is further connected to the ADC 64 for receiving a digital output of the ADC 64 corresponding to the voltage drop over the thermistor 61 and output via an output line of the ADC 64. A second output pin of the control unit is connected to the first line 65 and provides the first supply voltage VDD1 thereto and a third output pin of the control unit is connected to the second line 66 and provides the second supply voltage thereto.

[0050] The function of the testing circuit 60 as shown in FIG. 3 is now described with respect to the temperature curves as illustrated in FIGS. 4 and 5. For performing a testing method of the invention, a measuring head 51 of a temperature sensor as shown in FIG. 2 and comprising the thermistor 61 is first brought into thermal contact with the battery cell 10. At a time point t.sub.1 the temperature of the thermistor 61 is determined based on a voltage drop of the first supply voltage VDD1 supplied to the thermistor via first line 65 and resistor 62. Further, at time point t.sub.1 and subsequent to this measurement, the control unit outputs a control signal to the switch 63 for setting it conductive such that also the second supply voltage VDD2 is applied to the thermistor via the second line 66. Hence an additional heating current I.sub.heat is supplied to the thermistor during the time span t.sub.2−t.sub.1 thus heating up the thermistor 61. At time point t.sub.2 the switch 63 is set non-conductive again by ceasing the control signal of the control unit. Consequently, the thermistor is allowed to cool down in a time span t.sub.3−t.sub.2. A temperature T.sub.1, T.sub.2 and T.sub.3 of the thermistor 61 is determined via the ADC 64 based on a voltage drop over the thermistor 61 measured at each of the time points t.sub.1, t.sub.2 and t.sub.3, respectively.

[0051] In FIG. 4 the temperature curve of a NTC thermistor 61 with a bad thermal coupling to the battery cell 10 of the battery module 30 is depicted. In FIG. 5 the temperature curve of a NTC thermistor 61 with a good thermal coupling to the battery cell 10 of the battery module 30 is depicted In FIG. 4 the temperature T.sub.2 at point t.sub.2 is much higher than the temperature T.sub.2 at time t.sub.2 at the thermally well coupled NTC thermistor 61 of FIG. 5. Based on such differences a bad thermal contact between the thermistor 61 of FIG. 4 and the battery cell 10 is easily detected. The differences between the temperature curves of FIGS. 4 and 5 are due to that in FIG. 4 the additional energy provided by the heating current I.sub.heat due to the second supply voltage VDD2 is predominantly heating up the thermistor 61, while in FIG. 5 the predetermined amount of heat generated in thermistor 61 due to the heating current I.sub.heat is effectively transferred onto the battery cell 10 due to a good thermal contact there between. The same consideration applies to the temperatures at the time points t.sub.3, wherein the thermally bad coupled (to battery cell 10) thermistor 61 of FIG. 4 cools down much slower than the thermally well coupled thermistor 61 of FIG. 5.

[0052] The electronic or electric devices and/or any other relevant devices or components according to embodiments of the present invention described herein, except those described explicitly as hardware, may be implemented utilizing any suitable hardware, firmware (e.g. an application-specific integrated circuit), software, or a combination of software, firmware, and hardware. For example, the various components of these devices may be formed on one integrated circuit (IC) chip or on separate IC chips. Further, the various components of these devices may be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on one substrate. The electrical connections or interconnections described herein may be realized by wires or conducting elements, e.g. on a PCB or another kind of circuit carrier. The conducting elements may comprise metallization. e.g. surface metallizations and/or pins, and/or may comprise conductive polymers or ceramics. Further electrical energy might be transmitted via wireless connections, e.g. using electromagnetic radiation and/or light.

[0053] Further, the various components of these devices may be a process or thread, running on one or more processors, in one or more computing devices, executing computer program instructions and interacting with other system components for performing the various functionalities described herein. The computer program instructions are stored in a memory which may be implemented in a computing device using a standard memory device, such as, for example, a random access memory (RAM). The computer program instructions may also be stored in other non-transitory computer readable media such as, for example, a CD-ROM, flash drive, or the like.

[0054] Also, a person of skill in the art should recognize that the functionality of various computing devices may be combined or integrated into a single computing device, or the functionality of a particular computing device may be distributed across one or more other computing devices without departing from the scope of the exemplary embodiments of the present invention.

REFERENCE SIGNS

[0055] 10 battery cell [0056] 20 cell terminal [0057] 30 battery module [0058] 40 Cell Supervision Circuit [0059] 45 printed circuit board (PCB) [0060] 50 temperature sensor [0061] 51 measuring head [0062] 52 wires [0063] 53 evaluation circuit [0064] 60 testing circuit [0065] 61 thermistor (NTC) [0066] 62 resistor [0067] 63 switch [0068] 64 analog-to-digital-converter (ADC) [0069] 65 first supply voltage (VDD1) [0070] 66 second supply voltage (VDD2) [0071] 67 thermistor first node [0072] 68 thermistor second node [0073] 69 ground