METHOD FOR CONNECTING A FILM TO A SUBSTRATE

Abstract

A method for connecting a film (102) to a substrate (101) includes providing (402) a film (102) and a substrate (101), bringing (403) the film (102) and the substrate (101) together, applying (404) at least one clamping force in at least one clamping region (201), in which the clamping force acts to establish a contact of the film (102) with the substrate (101), and heating (405) the film (102) and/or substrate (101) in at least a respective connecting region (103) in which the film (102) and the substrate (101) are connected together. The clamping force is maintained during the heating process, yet the film (102) and the substrate (101) can be moved relative to one another in the clamping region (201).

Claims

1. A method for connecting a film (102) to a substrate (101), comprising the following steps: providing (402) a film (102) and a substrate (101), bringing (403) the film (102) and the substrate (101) together, applying (404) a clamping force in at least one clamping region (201), in which the clamping force acts to establish a contact of the film (102) with the substrate (101), heating (405) the film (102) and/or substrate (101) in at least a respective connecting region (103) in which the film (102) and the substrate (101) are connected together, wherein the clamping force is maintained during the heating process, wherein in the step of heating, the film (102) and the substrate (101) can be moved relative to one another in the clamping region (201).

2. The method according to claim 1, wherein the film (102), at least in the step of heating, is loosely mounted outside the clamping region (201.

3. The method according to claim 1, wherein, at least in the step of heating, the clamping force is applied by a compression force of at least one fluid stream (302).

4. The method according to claim 1, wherein, at least in the step of heating, the clamping force is applied substantially perpendicular to a surface of the film (102) and/or the substrate (101).

5. The method according to claim 1, wherein, at least in the step of heating, the clamping force is applied by a weight force of at least one mass element (104) in contact with the film (102).

6. The method according to claim 5, wherein, at least in the step of heating, the at least one mass element (104) is slidably mounted perpendicular to a surface of the film (102).

7. The method according to claim 6, wherein, at least in the step of heating, the at least one mass element (104) is slidably mounted along a direction parallel to a surface of the film (102), wherein the direction corresponds to a mean thermal expansion direction in the at least one clamping region (201).

8. The method according to claim 1, wherein the film (102) and the substrate (101) are each coated with metal or formed as a polymer.

9. The method according to claim 1, wherein, in the step of heating, at least one laser substrate (106) is used for introducing energy into the film (102) and/or the substrate (101).

10. An apparatus for carrying a method according to claim 1, comprising a first element configured to provide the film (102) and the substrate (101), a second element configured to bring the film (102) and the substrate (101) together, a third element configured to apply the clamping force in the at least one clamping region (201), and a fourth element configured to heat the film (102) and/or the substrate (101) in the connecting region (103).

11. The method according to claim 2, wherein the film (102) is loosely mounted outside the clamping region in a direction facing away from the connecting region (103).

12. The method according to claim 3, wherein the at least one fluid stream is a gas stream, directed at the film (102).

13. The method according to claim 8, wherein the film (102) and the substrate (101) are each coated with copper.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Exemplary embodiments of the invention are illustrated in the drawings and explained in further detail in the following description.

[0024] The following are shown:

[0025] FIG. 1 in an aerial view, an embodiment of the step of heating of the method according to the invention,

[0026] FIG. 2 a sectional view of the embodiment of FIG. 1 along the line AA′,

[0027] FIG. 3 in a sectional view, an embodiment of the step of heating of the method according to the invention,

[0028] FIG. 4 a flow chart of an embodiment according to the invention.

DETAILED DESCRIPTION

[0029] FIG. 1 shows, in an aerial view, an embodiment of the step of heating.

[0030] Here, a film 102 is in contact with a substrate 101, wherein mass elements 104 are arranged above the film 102 in contact with the film 102. Further shown are also guides 105 of the mass elements 104, as well as a connecting region 103 in which the film 102 and the substrate 101 are connected.

[0031] FIG. 2 shows a sectional view of the embodiment of FIG. 1 along a line AA′. Here, the mass elements 104 are slidably mounted perpendicular to the surface of the film 102, so that the weight forces of the mass elements 104 can act entirely as clamping forces substantially perpendicular to the surface of the film 102 within the clamping regions 201.

[0032] In this exemplary embodiment, the film 102 is loosely mounted outside the clamping regions 201 on the edges, i.e., the film 102 lies freely on the substrate 101 outside the clamping regions 201. This ensures that no mechanical stresses are introduced by a mounting of the film 102.

[0033] In this embodiment, a laser substrate 106 is provided in order to heat the film 102 and the substrate 101, which introduces electromagnetic radiation into the connecting region 103.

[0034] The mass of the mass elements 104 is selected such that the film 102 and the substrate 101 can be moved relative to one another in the clamping region 201. Additionally, a gap is formed between the mass elements 104 and the guides 105 such that the mass elements 104 are slidably mounted parallel to the surface of the film 102. As a result, mechanical stresses due to thermal expansion of the film 102 and the substrate 101 can degrade without a bulging of the film 102.

[0035] FIG. 3 shows a sectional view of an embodiment of the step of heating of the method according to the invention. Here, a clamping force is applied within the clamping regions 201 by compressive forces from gas flows 302 directed at the film 102, which are aligned by nozzles 301.

[0036] FIG. 4 shows a flow chart of an embodiment according to the invention.

[0037] After a starting step 401, a film 102 and a substrate 101 are provided in step 402.

[0038] In step 403, the film and the substrate are brought together.

[0039] In step 404, at least one clamping force is applied in at least one clamping region 201, wherein the clamping force acts within the clamping region 201 to establish a contact between the film 102 and the substrate 101.

[0040] In step 405, the film 102 and/or the substrate 101 is heated in a respective connecting region 103, wherein the film 102 and the substrate 101 are connected within the connecting region 103. The clamping force is maintained during the heating process. The film 102 and the substrate 101 can be moved relative to one another.

[0041] In step 406, the method ends in this embodiment.