COMPOSITE MULTI-STACK SEED LAYER TO IMPROVE PMA FOR PERPENDICULAR MAGNETIC PINNING

Abstract

The invention comprises a novel composite multi-stack seed layer (CMSL) having lattice constant matched crystalline structure with the Co layer in above perpendicular magnetic pinning layer (pMPL) so that an excellent epitaxial growth of magnetic super lattice pinning layer [Co/(Pt, Pd or Ni)].sub.n along its FCC (111) orientation can be achieved, resulting in a significant enhancement of perpendicular magnetic anisotropy (PMA) for perpendicular spin-transfer-torque magnetic-random-access memory (pSTT-MRAM) using perpendicular magnetoresistive elements as basic memory cells which potentially replace the conventional semiconductor memory used in electronic chips, especially mobile chips for power saving and non-volatility.

Claims

1. A perpendicular magnetic pinning element (pMPE) comprising a composite multi-stack seed layer (CMSL) provided on the surface of a substrate and comprising: a base layer (BL), a FCC structure initiation and smoothening (SIS) layer disposed over the BL layer, a FCC grain-growth promotion (GGP) layer having a face-center-cubic (FCC) crystalline structure and disposed over the SIS layer, a structure buffer (SB) layer disposed over the GGP layer, and a PMA seed layer (PSL) disposed over the SB layer; a perpendicular magnetic pinning layer (pMPL) provided on the surface of the CMSL and having a face-center-cubic (FCC) crystalline structure and having a perpendicular magnetic anisotropy(PMA) and having an invariable magnetization direction; an antiferromagnetic coupling spacer (AFCS) provided on the surface of the pMPL; a perpendicular magnetic reference layer (pMRL) provided on the surface of the AFCS and having a perpendicular magnetic anisotropy and having an invariable magnetization direction; wherein said pMPE forming a strong perpendicular antiferromagnetic coupling (pAFC) between the pMPL and the pMRL through said AFCS.

2. The element of claim 1, wherein said BL is made of a metal layer or a metal nitride layer comprising at least one transition metal element selected from the group consisting of Ta, Hf, Ti, Zr, Nb, W, Cr, and having a thickness between 2-10 nm.

3. The element of claim 1, wherein said SIS layer is made of a metal layer comprising at least one selected from the group of NiFe, NiCo, NiFeCo, NiCr, NiTa, NiZr, NiRh, NiFeCr, NiFeTa, NiFeZr, NiFeRh, Ru, NiMn, IrMn and FeMn, and having a thickness between 1-10 nm.

4. The element of claim 1, wherein said SIS layer is a multilayer comprising at least two sub-layers selected from the group of NiFe, NiCo, NiFeCo, NiCr, NiTa, NiZr, NiRh, NiFeCr, NiFeTa, NiFeZr, NiFeRh, Ru, NiMn, IrMn and FeMn, and having a thickness between 1-10 nm.

5. The element of claim 1, wherein said GGP layer is made of Cu, CuN or CuNi and having a thickness between 3-30 nm.

6. The element of claim 1, wherein said SB layer is made of Ta, W, Ru or Ir and having a thickness between 0-1.5 nm.

7. The element of claim 1, wherein said PSL layer is made of Pt, Pd, Ni or Ir and having a thickness between 1-3 nm.

8. The element of claim 1, wherein said pMPL comprises a multilayer stack structure selected from the group of [Co/(Pt, Pd or Ni)].sub.n/Co, [Co/(Pt, Pd or Ni)].sub.n/Co/CoFe and [Co/(Pt, Pd or Ni)].sub.n/CoFe, wherein n is an integer between 2 and 6 inclusive, and thicknesses of each said Co sub-layer and (Pt, Pd or Ni) sub-layer are between 0.25 nm-0.7 nm and between 0.2 nm-0.8 nm, respectively.

9. The element of claim 1, wherein said pMRL comprises a single layer CoFeB or a multilayer stack structure [Co/(Pt, Pd or Ni)].sub.m/(Co or Ta/Co)/(W or Mo)/CoFeB or Fe/[Co/(Pt, Pd or Ni)].sub.m/(Co or Ta/Co)/(W or Mo)/CoFeB, wherein m is an integer between 2 and 4 inclusive; and said Co layer has a thickness between 0.25-0.7 nm, said (Pt, Pd or Ni) layer has a thickness between 0.2-0.8 nm, said CoFeB layer has a thickness between 0.7-1.5 nm, said (W or Mo) layer has a thickness between 0.1-0.5 nm, said Ta layer has a thickness between 0.05-0.2 nm.

10. The element of claim 1, wherein said pMRL comprises a bi-layer stack structure Fe/CoFeB, Fe/FeB, FeB/CoFeB, or Fe/CoFe, wherein said Fe layer has a thickness between 0.1-0.5 nm, said CoFeB, FeB and CoFe layer have thicknesses between 0.7 nm-1.3 nm.

11. The element of claim 1, wherein said pMRL is made of a single layer of CoFeB and having a thickness between 0.7 nm-1.3 nm.

12. The element of claim 1, wherein said AFCS is made of a single layer of (Ru, Rh or Ir) or a composite non-magnetic spacer (CnmS) with a bi-layer structure of (Ru, Rh or Ir)/(Cr, Mo, W or V) or tri-layer structure of (Ru, Rh or Ir)/(W, Mo or V)/Cr.

13. The element of claim 1, wherein said pMPE has its magnetization direction perpendicular to a film surface, and said pMPE further forms a perpendicular magnetic tunnel junction (pMTJ) further comprising a tunnel barrier (TB) and a storage layer (SL), wherein said TB is sandwiched between said SL and said pMRL.

14. The element of claim 14, wherein said TB is an MgO layer having a thickness between 0.8 nm to 1.5 nm, and said SL is a single layer CoFeB or tri-layer CoFeB/(W or Mo)/CoFeB having a total CoFeB thickness between 1 nm-2.0 nm, wherein said W or Mo layer has a thickness between 0.1 nm-0.5 nm.

15. The element of claim 14, wherein said pMTJ comprises a film stack of CMSL/pMPL/AFCS/pMRL/TB/SL/capping layer counting from bottom to top, forming a bottom-pinned pSTT-MRAM film element.

16. The element of claim 16, wherein said bottom-pinned pSTT-MRAM film element comprises a film stack of substrate/CMSL/[Co/(Pt, Pd or Ni)].sub.n/Co/(Ru, Rh or Ir)/[Co/(Pt, Pd or Ni)].sub.m/Co/(Ta, W or Mo)/CoFeB/MgO/CoFeB/(W or Mo)/CoFeB/MgO/W/Ru/Ta, with said repetition numbers n and m ranging from 2 to 6 and 1 to 4, respectively.

17. The element of claim 16, wherein said bottom-pinned pSTT-MRAM film element comprises a film stack of substrate/CMSL/[Co/(Pt, Pd or Ni)].sub.n/Co/(Ru, Rh or Ir)/Cr/Fe/CoFeB/MgO/CoFeB/W or Mo/CoFeB/MgO/W/Ru/Ta or substrate/CMSL/[Co/(Pt, Pd or Ni)].sub.n/Co/(Ru, Rh or Ir)/(W, Mo or V)/Cr/Fe/CoFeB/MgO/CoFeB/W or Mo/CoFeB /MgO/W/Ru/Ta.

18. A method of forming a bottom-pinned pSTT-MRAM film stack comprising: forming a composite multi-stack seed layer (CMSL), on a substrate, having a five-layer stack in a form of a base layer (BL)/a FCC structure initiation and smoothening (SIS) layer/a FCC grain-growth promotion (GGP) layer/a structure buffer (SB) layer/a PMA seed layer (PSL), or a four-layer stack in a form of a base layer (BL)/a FCC structure initiation and smoothening (SIS) layer/a FCC grain-growth promotion (GGP) layer/a PMA seed layer (PSL); forming a perpendicular magnetic pinning layer (pMPL) on the surface of said CMSL and having a face-center-cubic (FCC) crystalline structure and having an invariable perpendicular magnetization direction; forming an antiferromagnetic coupling spacer (AFC) provided on the surface of the pMPL and having a single layer structure of (Ru, Rh or Ir), bi-layer structure of (Ru, Rh or Ir)/Cr or tri-layer structure of (Ru, Rh or Ir)/(W, Mo or V)/Cr; forming a perpendicular magnetic reference layer (pMRL) provided on the surface of the AFC and having an invariable magnetization direction; forming a tunnel barrier (TB) layer on the surface of said pMRL; forming a magnetic storage layer (SL) on the surface of said TB; forming a capping layer on the surface of said SL; annealing said film stack substrate/CMSL/pMPL/AFMs/PMRL/TB/SL/capping layer at temperature between 350-450 C for 30-150 minutes.

19. The element of claim 18, wherein said BL is made of a metal layer or metal nitride comprising at least one transition metal element selected from the group consisting of Ta, Hf, Ti, Zr, Nb, W, Cr, and having a thickness between 2-10 nm; said SIS layer is made of a metal layer comprising at least one selected from the group of NiFe, NiCo, NiFeCo, NiCr, NiTa, NiZr, NiRh, NiFeCr, NiFeTa, NiFeZr, NiFeRh, Ru, NiMn, IrMn and FeMn and having a thickness between 1-10 nm; said GGP layer is made of Cu, CuN or CuNi and having a thickness between 3-30 nm; said SB layer is made of Ta, W, Ru or Ir and having a thickness between 0-1.5 nm; said PSL layer is made of Pt, Pd, Ni or Ir and having a thickness between 1-3 nm.

20. The method of claim 18 makes a pSTT-MRAM device having said bottom-pinned pSTT-MRAM film stack electrically connected between a top electrode and a bottom electrode and having write/read operations as a storage device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG. 1 A conventional pSTT-MRAM film stack with a perpendicular synthetic antiferromagnetic (pSAF) pinning layer.

[0015] FIG. 2 A pSTT-MRAM film stack with a thin synthetic antiferromagnetic (tSAF) pinning layer.

[0016] FIG. 3 A building stack of a composite multi-stack seed layer (CMSL).

[0017] FIG. 4 A bottom-pinned pSTT-MRAM with a thick pSAF film stack having a CMSL.

[0018] FIG. 5 A bottom-pinned pSTT-MRAM with a thin tSAF film stack having a CMSL.

DETAILED DESCRIPTION OF THE INVENTION

[0019] The perpendicular magnetic anisotropy (PMA) of said pMPL [Co/Pt, Pd or Ni)].sub.n multilayer is closely related to its lattice structure. In this invention, we employ a composite multi-stack seed layer (CMSL) having a FCC crystalline structure with (111) orientation plane normal to a film surface, i.e., FCC (111) texture, at the bottom of pMPL multilayer to provide a specially engineered lattice mold (bedding) for the growth of closed packed Co layer in the [Co/(Pt, Pd or Ni)].sub.n multilayer to maximize its PMA. Among the various materials in periodical table, there are some metallic elements which naturally form an FCC crystalline structure in their solid phase with lattice constant close to the closed packed (either FCC or HCP) Co, which is the key element that form [Co/(Pt, Pd or Ni)].sub.n multilayer, which sometimes is referred as a superlattice due to its periodic structure in atomic level. The Co layer in said pMPL is directly deposited over the top layer (Pt, Pd, Ni or Ir) of said CMSL stack, which has a perfect FCC (111) orientation normal to the film surface.

[0020] Said CMSL comprises (see FIG. 3) a base layer (BL) 12 made of a metal layer or metal nitride layer comprising at least one element selected from the group consisting of transition metal material, such as Ta, Hf, Ti, Zr, Nb, W, Cr, with a thickness between 2-10 nm, a FCC structure initiation and smoothening layer (SIS) 13 made of a metal layer comprising at least one selected from the group of NiFe, NiCo, NiFeCo, NiCr, NiTa, NiZr, NiRh, NiFeCr, NiFeTa, NiFeZr, NiFeRh, Ru, NiMn, IrMn and FeMn with a thickness between 1-10 nm, a FCC grain-growth promotion layer (GGP) 14 having a face-center-cubic (FCC) crystalline structure made of Cu, CuN or CuNi with a thickness between 7-30 nm, a structure buffer (SB) layer 15 made of Ta, W, Ru or Ir with a thickness between 0-1.5 nm, and a thin (Pt, Pd, Ni or Ir) PMA seed layer (PSL) 16 with a thickness between 1-3 nm, and said CMSL is stacked in a form of BL/SIS/GGP/SB/PSL (see FIG. 3) or BL/SIS/GGP/PSL by skipping the SB layer 15 (not shown). Normally, the average grain size in thin films tends to increase with increasing film thickness. A flat and smooth surface with a large crystalline grain will be established after the growth of BL/SIS/GGP which gives rise to a strong FCC (111) texture as well as large grain size of PSL layer and helps the PSL to form a perfect lattice matched FCC bedding for the growth of pMPL even if a very thin (0.5-1 nm) PSL is used, which is particularly good for a cost-effective mass production of pSTT-MRAM device since Pt, Pd or Ir are very expensive materials. The SIS layer can be either a single layer or multilayer. The SB layer is less than one atomic layer thick and serves to better protect the top surface FCC crystalline structure of the Cu containing GGP layer from the deposition bombardment of heavy metal atoms during the deposition processing of the PSL layer, and is optional, i.e., the SB layer is not needed if the bombardment energy during the PSL layer deposition is adjusted to be small enough. For an example, the CMSL structure having a single SIS layer can be Ta(4 nm)/Ni.sub.0.55Cr.sub.0.44(5 nm)/Cu(10 nm)/Ru(0.5 nm)/Pt(1.5 nm). And one example of the CMSL having a multilayer-structured SIS can be Ta(4 nm)/(Ni.sub.0.5Fe.sub.0.5).sub.0.55Cr.sub.0.44 (5 nm)/(Ni.sub.0.81Fe.sub.0.19).sub.0.55Cr.sub.0.44(5 nm)/Cu(5 nm)/Ta(0.5 nm)/Pt(1.5 nm).

[0021] The following lists are some typical embodiments to illustrate the use of said CMSL to improve PMA for perpendicular magnetic stabilization for bottom-pined pSTT-MRAM having either a thick pSAF or thin tSAF film stack:

First Embodiment

[0022] FIG. 4 is bottom-pinned pSTT-MRAM (300) having a thick pASF film stack. A composite multi-stack seed layer (CMSL) (20) was first grown on a device substrate, followed by a thick pSAF stack (21/22/23) of [Co/Pt or Pd].sub.nCo/(Ru or Ir)/Co/[(Pt or Pd)/Co].sub.m with thickness values of (0.3-0.7) for Co and 0.2-0.8 for Pt (or Pd) and repetition number (n>m) between 2-6 for n and 1 to 4 for m, followed by a crystalline structure transition layer (24) of Ta, W, or Mo with thickness between 0.1-0.5 nm, and magnetic reference layer (25) of CoFeB with thickness between 0.9-1.3 nm, a tunnel barrier (26) of MgO between 0.8-1.2 nm, a composite storage layer of first magnetic CoFeB (27) with thickness between 1.0-1.5 nm, B absorption layer (28) of Ta, W, Mo) with thickness between 0.15-0.5 nm, second magnetic CoFeB (29) with thickness between 0.5-1.0 nm and a capping stack (30) of MgO/W/Ru with thickness of (1.0-1.5 nm)/1-3 nm)/(2-5 nm) respectively. The annealing temperature of above film stack is between 350 C-450 C for 30 min to 150 min. With the help of said CMSL, after annealing the bottom portion of the film stack including layers 20-23 will be converted into FCC crystalline structure with (111) orientation normal to substrate surface and upper portion of the film stack including layer 25-29 into a BCC (100) crystalline structure to achieve a large PMA while maintaining high tunnel magnetoresistive (TMR) value. During annealing the layer (24) of Ta, W or Mo helps crystalline transition between bottom FCC to top BCC structure (see FIG. 4).

Second Embodiment

[0023] FIG. 5 is a bottom-pinned pSTT-MRAM having a thin film stack (400) with an enhanced synthetic antiferromagnetic (eSAF) coupling. A composite multi-stack seed layer (CMSL) (20) was first grown on a device substrate, followed by a magnetic superlattice (21) selected from the group of [Co/X].sub.n/Co, [Co/X)].sub.n/Co/CoFe and [Co/X].sub.n/CoFe on is an integer between 2-6 with thickness of Co(0.25-0.6 nm)/X(0.2-0.4 nm) on top of said CMSL (20) where X is selected among Pt, Pd or Ni, a composite non-magnetic spacer (CnmS-221) [(Ru, Rh or Ir)/Cr or (Ru, Rh or Ir)/(W, Mo or V)/Cr]/Fe, an amorphous FeB or CoFeB reference layer (25) in contact with Fe from below, a tunnel barrier MgO (26), a tri-layer recording layer formed with a first magnetic layer (27), a non-magnetic bridging layer (28) and a second magnetic layer (29), a capping layer (30), such as MgO, W or W/Ru. In the above stack, the thickness of Ru, Ru or Ir is between 0.3 to 0.7 nm and Cr or (W or Mo)/Cr thickness is between 0.1 to 0.5 nm, with a combined CnmS [(Ru, Rh or Ir)/Cr or (Ru, Rh or Ir)/(W, Mo or V)/Cr] thickness chosen to reach the first or the second peak for an effective RKKY coupling, the amorphous FeB or CoFeB reference layer (25) has a B composition between 15-35% with a thickness between 0.8 to 1.4 nm, the thickness of MgO TB (26) is between 0.8-1.2 nm, the thickness of the first magnetic memory layer (27) can be selected among CoFeB, FeB, Fe/CoFeB with a B composition between 15-30% and preferably at 20% and a thickness between 1-1.6 nm, the non-magnetic bridging layer (28) is selected among W, Mo, Ta with a thickness between 0.1-0.6 nm, the second magnetic memory layer (29) is selected from CoFeB, FeB with a B composition between 15-30% with a thickness between 0.4-0.8 nm, the capping layer (30) can be either (1-1.5 nm)MgO/(2-5 nm)W, (2-5 nm)W/(2-4 nm)Ru or MgO/W/Ru. The use of Fe at the Cr interface, not only increases the RKKY coupling hence improving magnetic stability for the device, but also creates a good BCC structure right starting from the CoFeB reference layer, throughout the barrier MgO layer to the entire memory tri-layer layer owing to the intrinsic BCC structure of Fe. Such a bottom-pinned pSTT-MRAM film stack will have strong magnetic pinning with sharp layer interfaces and higher and stable TMR characteristics, which is good for pSTT-MRAM device application. The annealing temperature of above bottom-pinned film pSTT-MRAM stacks are between 350 C-450 C for between 30 min to 150 min. With the help of said CMSL (20), after annealing the low portion (20-21) of the stack will be converted into FCC crystalline structure with (111) orientation normal to film surface and upper portion of the stack (25-29) above Cr into a BCC (100) crystalline structure to achieve a large PMA while having a high tunnel magnetoresistive (TMR) value.

[0024] While certain embodiments have been described above, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.