NARROW BAND INFRARED EMITTER THROUGH THERMAL MANNER

Abstract

In some examples, an infrared emitter is provided with a heating layer sandwiched by top and bottom optical layers that allow only narrow-band infrared light to pass through. A reflective layer may be further provided below the bottom optical layers. This configuration greatly reduces the energy loss and can be manufactured with simple method and low cost.

Claims

1. An infrared emitter, comprising: a heating layer; a first bandpass filter formed on an upper surface of the heating layer; and a second bandpass filter formed on a lower surface of the heating layer; wherein the heating layer is heated to a certain temperature and emits a light, the first bandpass filter selectively transmits a range of wavelengths Δλ1 of the light, and the second bandpass filter selectively transmitting the range of wavelengths Δλ1 or a range of wavelengths Δλ2 of the light.

2. The infrared emitter as recited in claim 1, further comprising: a reflective layer formed on a lower surface of the second bandpass filter.

3. The infrared emitter as recited in claim 2, wherein the reflective layer is made of a metal selected from the group consisting of aurum (Au), silver (Ag), copper (Cu), aluminum (Al), platinum (Pt).

4. The infrared emitter as recited in claim 2, wherein the reflective layer consists of alternating layers of high and low refractive index dielectrics.

5. The infrared emitter as recited in claim 1, wherein both the first bandpass filter and the second bandpass filter comprise alternating high-refractive-index layers and low-refractive-index layers.

6. The infrared emitter as recited in claim 5, wherein the alternating high-refractive-index layers and the low-refractive-index layers comprise Ge/ZnS, Ge/ZnSe, TiO.sub.2/SiO.sub.2, Si/Al.sub.2O.sub.3, TiO.sub.2/Al.sub.2O.sub.3, or Si/TiO.sub.2 alternating layers.

7. The infrared emitter as recited in claim 1, wherein both the first bandpass filter and the second bandpass filter consist of periodically arranged metal strips.

8. The infrared emitter as recited in claim 1, wherein the heating layer is made of a material selected from the group consisting of tungsten (W), titanium nitride (TiN), aurum (Au), aluminum (Al), and a doped polysilicon.

9. The infrared emitter as recited in claim 1, further comprising: a positive electrode and a negative electrode formed on the upper surface of the heating layer.

10. The infrared emitter as recited in claim 1, wherein the heating layer is patterned.

11. An infrared emitter, comprising: a heating layer; a first bandpass filter formed on an upper surface of the heating layer; and a reflective layer formed on a lower surface of the heating layer; wherein the heating layer is heated to a certain temperature and emits a light, and the first bandpass filter selectively transmits a range of wavelengths Δλ1 of the light.

12. The infrared emitter as recited in claim 11, wherein the reflective layer consists of alternating layers of high and low refractive index dielectrics.

13. The infrared emitter as recited in claim 11, wherein the first bandpass filter comprises alternating high-refractive-index layers and low-refractive-index layers.

14. The infrared emitter as recited in claim 13, wherein the alternating high-refractive-index layers and the low-refractive-index layers comprise Ge/ZnS, Ge/ZnSe, TiO.sub.2/SiO.sub.2, Si/Al.sub.2O.sub.3, TiO.sub.2/Al.sub.2O.sub.3, or Si/TiO.sub.2 alternating layers.

15. The infrared emitter as recited in claim 11, wherein the first bandpass filter consists of periodically arranged metal strips.

16. An infrared emitter, comprising: a substrate; a first insulating layer formed on the substrate; a heating layer formed on the first insulating layer; a second insulating layer formed on the heating layer; and an infrared light emitter formed on the second insulating layer; wherein the infrared light emitter comprising: a first metal bonding layer formed on the second insulating layer; a lower metal layer formed on the first metal bonding layer; a second metal bonding layer formed on the lower metal layer; a dielectric layer formed on the second metal bonding layer; a third metal bonding layer formed on the dielectric layer; an upper metal layer formed on the third metal bonding layer; and a fourth metal bonding layer formed on the upper metal layer.

17. The infrared emitter as recited in claim 16, further comprising: a positive electrode and a negative electrode formed on the upper surface of the heating layer.

18. The infrared emitter as recited in claim 16, wherein the lower metal layer is made of a material selected from the group consisting of aluminum (Al), silver (Ag), aurum (Au), platinum (Pt), Chromium (Cr), titanium (Ti), nickel (Ni), iron (Fe), tantalum (Ta), copper (Cu), tungsten (W), cobalt (Co), and molybdenum (Mo).

19. The infrared emitter as recited in claim 16, wherein the upper metal layer is made of a material selected from the group consisting of aluminum (Al), silver (Ag), aurum (Au), platinum (Pt), Chromium (Cr), titanium (Ti), nickel (Ni), iron (Fe), tantalum (Ta), copper (Cu), tungsten (W), cobalt (Co), and molybdenum (Mo).

20. The infrared emitter as recited in claim 16, wherein the first metal bonding layer, the second metal bonding layer, the third metal bonding layer, and the fourth metal bonding layer are made of a material selected from the group consisting of titanium (Ti), zirconium (Zr), tantalum (Ta), and chromium (Cr).

21. The infrared emitter as recited in claim 16, wherein the thickness of the dielectric layer ranges between 80 nm and 160 nm.

22. The infrared emitter as recited in claim 16, wherein the thickness of the upper metal layer ranges between 80 nm and 240 nm.

23. The infrared emitter as recited in claim 16, wherein the thickness of the lower metal layer ranges between 80 nm and 240 nm.

24. The infrared emitter as recited in claim 16, wherein the heating layer is patterned.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1 is a schematic diagram showing an infrared emitter 1 in accordance with a first embodiment of the invention.

[0012] FIG. 2A is a schematic diagram showing an infrared emitter 2 in accordance with a second embodiment of the invention.

[0013] FIG. 2B is a schematic diagram showing an infrared emitter 3 in accordance with a third embodiment of the invention.

[0014] FIG. 3A is a schematic diagram showing the configuration of the first and second bandpass filter 11/12 in accordance with an embodiment of the invention.

[0015] FIG. 3B is a schematic diagram showing the configuration of the first or second bandpass filter 11/12 in accordance with another embodiment of the invention.

[0016] FIG. 4 is a top view showing a grid-patterned heating layer 10 in accordance with an embodiment of this invention.

[0017] FIG. 5 is a schematic side view illustrating an infrared emitter 4 according to another embodiment of this invention.

[0018] FIGS. 6A and 6B show two measured temperature versus input power curves in accordance with the infrared emitter provided in FIG. 5.

[0019] FIG. 7 shows the emission spectrum of an infrared emitter having a configuration shown in FIG. 5.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0020] Reference will now be made in detail to those specific embodiments of the invention. Examples of these embodiments are illustrated in accompanying drawings. While the invention will be described in conjunction with these specific embodiments, it will be understood that it is not intended to limit the invention to these embodiments. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be practiced without some or all of these specific details. In other instances, well-known process operations and components are not described in detail in order not to unnecessarily obscure the present invention. While drawings are illustrated in detail, it is appreciated that the quantity of the disclosed components may be greater or less than that disclosed, except where expressly restricting the amount of the components. Wherever possible, the same or similar reference numbers are used in drawings and the description to refer to the same or like parts.

[0021] FIG. 1 is a schematic diagram showing an infrared emitter 1 in accordance with a first embodiment of the invention. Referring to FIG. 1, the infrared emitter 1 for generating infrared light includes a heating layer 10, a first bandpass filter 11, and a second bandpass filter 12. The first bandpass filter 11 is formed on a first surface 101, e.g., an upper surface, of the heating layer 10. The second bandpass filter 12 is formed on a second surface 102, e.g., a lower surface, of the heating layer 10. In one embodiment, the second bandpass filter 12 is omitted and a substrate may be further provided below the heating layer 10.

[0022] In some embodiments, both the first bandpass filter 11 and the second bandpass filter 12 consist of layers with alternating high and low refractive indices. The first bandpass filter 11 selectively transmits a certain range of wavelengths Δλ1 (passband) with a peak wavelength λ1. The second bandpass filter 12 selectively transmits the same range of wavelengths Δλ1 (passband) with peak wavelength λ1 as the first bandpass filter 11. Alternatively, the second bandpass filter 12 selectively transmits a certain range of wavelengths Δλ2 (passband) with a peak wavelength λ2. In this embodiment, infrared lights are emitted from both the top side and bottom side of the infrared emitter 1.

[0023] FIG. 2A is a schematic diagram showing an infrared emitter 2 in accordance with a second embodiment of the invention. The infrared emitter 2 differs from the infrared emitter 1 in that a reflective layer 13 is further provided below a bottom surface 121 of the second bandpass filter 12. In this embodiment, an infrared light is emitted from the top side of the infrared emitter 2.

[0024] FIG. 2B is a schematic diagram showing an infrared emitter 3 in accordance with a third embodiment of the invention. The infrared emitter 3 differs from the infrared emitter 2 in that the infrared emitter 3 does not include the second bandpass filter 12, and the reflective layer 13 is provided below the second surface 102 of the heating layer 10.

[0025] Referring to FIGS. 2A and 2B, the reflective layer 13 is preferably made of a material with high reflectance for the light transmitted or emitted from the second bandpass filter 12 or the heating layer 10. In some embodiments, the reflective layer 13 is made of a metal selected from the group consisting of aurum (Au), silver (Ag), copper (Cu), aluminum (Al), platinum (Pt), and so forth. In one embodiment, the reflective layer 13 consists of alternating layers of high and low refractive index materials or dielectrics. Referring to FIG. 2A, the reflective layer 13 may have high reflectance for the wavelength bandwidth Δλ1 or the wavelength bandwidth Δλ2 transmitted from the second bandpass filter 12. Referring to FIG. 2B, the reflective layer 13 may have high reflectance for all wavelengths emitted from the heating layer 10

[0026] FIG. 3A is a schematic diagram showing the configuration of the first or second bandpass filter 11/12 in accordance with an embodiment of the invention. Referring to FIG. 3A, the first or second bandpass filter 11/12 may consist of alternating high- and low-refractive index layers. In some embodiments, the first or second bandpass filter 11/12 may consist of N pairs of high/low refractive index dielectrics or materials; where Nis a positive integer, such as 2, 3, or 4. In some embodiments, the positive integer N ranges between 5 and 50. Each pair includes a high-refractive-index layer 30 and a low-refractive-index layer 31. In some embodiments, the alternating high-refractive-index layers 30 and the low-refractive-index layers 31 comprise Ge/ZnS, Ge/ZnSe, TiO.sub.2/SiO.sub.2, Si/Al.sub.2O.sub.3, TiO.sub.2/Al.sub.2O.sub.3, or Si/TiO.sub.2 alternating layers. Where the high-refractive-index layers 30 may be formed of Ge, TiO.sub.2, or Si, and the low-refractive-index layers 31 may be formed of ZnS, ZnSe, SiO.sub.2, Al.sub.2O.sub.3, or TiO.sub.2. Although specific materials have been illustrated, other similar alternating materials may be used.

[0027] FIG. 3B is a top or bottom view showing the configuration of the first and the second bandpass filter 11/12 in accordance with another embodiment of the invention. Referring to FIG. 3B, the first or second bandpass filter 11/12 comprises metal nanostructures 312, such as metal strips 312. For example, periodically arranged metal strips 312 are placed on or below the heating layer 10, and its light transmission wavelength is related to the dimension of the metal strips 312 and obey a relationship: λ=2 n.sub.eff×d, where λ denotes a wavelength of the light through which the metal strips 312 selectively transmits, d denotes the width of the metal strips 312, and n.sub.eff denotes the effective refractive index of the metal strips 312.

[0028] Referring to FIGS. 1, 2A, and 2B, the heating layer 10 is preferably made of a conductive material with proper electric resistivity. In some embodiments, the heating layer 10 may be made of a material selected from the group consisting of tungsten (W), titanium nitride (TiN), aurum (Au), aluminum (Al), a doped polysilicon, and so forth.

[0029] In some embodiments, the heating layer 10 includes two electrodes, e.g., a positive electrode 103 and a negative electrode 104 formed on its upper surface, and the heating layer 10 is heated up by applying electric current through the positive electrode 103 and the negative electrode 104. Once the heating layer 10 is heated to a certain temperature, it emits a light with a broad bandwidth. The first bandpass filter 10 selectively transmits a range of wavelengths Δλ1 of the light. The second bandpass filter 12 selectively transmitting the range of wavelengths Δλ1 or a range of wavelengths Δλ2 of the light. Typically the heating layer 10 is heated below 2000° C. and emits a light with a peak wavelength greater than 2 micrometers. In some embodiments, the heating layer 10 is heated to a temperature between 50° C. and 300° C. In some embodiments, the heating layer 10 is heated to a temperature between 100° C. and 200° C.

[0030] In one embodiment, the heating layer 10 may have a rectangular cross sectional area. In some embodiments, the heating layer 10 may be patterned, such as grid-patterned, spiral-patterned, or snake patterned. And the patterns are designed with certain cross sectional areas and lengths, so the resistivity gives the required heat when the heating layer 10 is biased at some certain voltages. FIG. 4 is a top view showing a grid-patterned heating layer 10 in accordance with an embodiment of this invention. Referring to FIGS. 1, 2A, 2B, and 4, the grid-patterned heating layer 10 includes a positive electrode 103 and a negative electrode 104 parallel with each other, and several horizontal fingers 105 evenly spaced between the positive electrode 103 and the negative electrode 104.

[0031] FIG. 5 is a schematic side view illustrating an infrared emitter 4 in accordance with an embodiment of this invention. Referring to FIG. 5, the infrared emitter 4 preferably includes a substrate 50, a first insulating layer 51, a second insulating layer 52, an infrared light emitter 53, and a heating layer 58. The first insulating layer 51, typically made of oxide or nitride, is formed on the substrate 50. The heating layer 58 is formed on the first insulating layer 51. The second insulating layer 52, typically made of oxide or nitride, is formed on the heating layer 58. The infrared light emitter 53 is formed on the second insulating layer 52.

[0032] In detail, the infrared light emitter 53 preferably includes a lower metal layer 530, a first metal bonding layer 531, a second metal bonding layer 532, a third metal bonding layer 533, a fourth metal bonding layer 534, a dielectric layer 535, and an upper metal layer 536. The lower metal layer 530 is formed on the second insulating layer 52 and is sandwiched between the first metal bonding layer 531 and the second metal bonding layer 532. The dielectric layer 535 is formed on the lower metal layer 530 and is sandwiched between the second metal bonding layer 532 and the third metal bonding layer 533. The upper metal layer 536 is formed on the dielectric layer 535 and is sandwiched between the third metal bonding layer 533 and the fourth metal bonding layer 534.

[0033] Physical or chemical processes, e.g., sputtering, evaporation, chemical vapor deposition, metal-organic chemical vapor deposition (MOCVD), or atomic layer deposition (ALD), may be utilized to fabricate the lower metal layer 530, the first metal bonding layer 531, the second metal bonding layer 532, the third metal bonding layer 533, the fourth metal bonding layer 534, the dielectric layer 535, and the upper metal layer 536.

[0034] In addition, the substrate 50 may be a glass substrate, a plastic substrate, a semiconductor substrate, a metal substrate, a dielectric substrate, a composite substrate, and so forth. The lower metal layer 530 may be made of aluminum (Al), silver (Ag), aurum (Au), platinum (Pt), Chromium (Cr), titanium (Ti), nickel (Ni), iron (Fe), tantalum (Ta), copper (Cu), tungsten (W), cobalt (Co), molybdenum (Mo), and so forth. The dielectric layer 535 may be made of oxide, nitride, or other insulating materials. The upper metal layer 536 may be made of aluminum (Al), silver (Ag), aurum (Au), platinum (Pt), Chromium (Cr), titanium (Ti), nickel (Ni), iron (Fe), tantalum (Ta), copper (Cu), tungsten (W), cobalt (Co), molybdenum (Mo), and so forth. The heating layer 58 may be made of a conductive material, for example but is not limited to: titanium nitride (TiN), aurum (Au), aluminum (Al), a doped polysilicon, chromium (Cr), or other conductive materials. The first metal bonding layer 531, the second metal bonding layer 532, the third metal bonding layer 533, and the fourth metal bonding layer 534 may be made of a material selected from the group consisting of titanium (Ti), zirconium (Zr), tantalum (Ta), chromium (Cr), and the like.

[0035] In one prefer embodiment, two electrodes, e.g., a positive electrode 581 and a negative electrode 582, are formed on the upper surface of the heating layer 58, and the heating layer 58 is heated up by applying electric current through the positive electrode 581 and the negative electrode 582. The positive electrode 581 and the negative electrode 582 may be made of a material same as the heating layer 58.

[0036] Referring to FIG. 5, once the heating layer 58 is heated to a certain temperature, the infrared light emitter 53 emits an infrared light with a narrow bandwidth. The wavelength of the infrared light emitted from the infrared light emitter 53 generally relates to the materials and the thicknesses of the lower metal layer 530, the dielectric layer 535, and/or the upper metal layer 536.

[0037] In some embodiments, the thickness of the lower metal layer 530 ranges between 80 nm and 240 nm, the thickness of the dielectric layer 535 ranges between 80 nm and 160 nm, the thickness of the upper metal layer 536 ranges between 80 nm and 240 nm, and the thicknesses of the first to fourth metal bonding layer range between 5 nm and 30 nm.

[0038] FIG. 6A shows a measured temperature versus input power of the heating layer 58 in the infrared emitter 4 of FIG. 5, where a snake-patterned aluminum layer is employed as the heating layer. Referring to FIG. 6A, the infrared emitter 3 is heated to a temperature between about 100° C. and about 230° C. in response to a voltage between 5 and 10 V applied to the positive electrode 581 and the negative electrode 582.

[0039] FIG. 6B shows another measured temperature versus input power curve similar to FIG. 6A, where a rectangular aluminum layer is employed as the heating layer. Referring to FIG. 6B, the infrared emitter 3 is heated to a temperature between about 85° C. and about 320° C. in response to a voltage between 2 and 4 V applied to the positive electrode 581 and the negative electrode 582.

[0040] FIG. 7 shows the emission spectrum of an infrared emitter having a configuration shown in FIG. 5. A Fourier-transform infrared (FTIR) spectrometer is employed to measure the emission spectrum. In this example, a SiO.sub.2 layer is deposited on a 3.8×3.8 mm.sup.2 substrate 50 as the first insulating layer 51. Then an aluminum layer 58 is deposited on the first insulating layer 51, and two aluminum electrodes 581/582 are deposited on the upper surface of the aluminum layer 58. Another SiO.sub.2 layer 52 is deposited on the upper surface of the aluminum layer 58. After that, the layers of the infrared light emitter 53, including a first titanium layer 531, a first aluminum layer 530, a second titanium layer 532, a SiO.sub.2 dielectric layer 535, a third titanium layer 533, a second aluminum layer 536, and a fourth titanium layer 534, are deposited in sequence. Where the thicknesses of the first, second, third, and fourth titanium layers 531/532/533/534 are 5 nm, the thicknesses of the first and second aluminum layers 530/536 are 120 nm, and the thickness of the SiO.sub.2 dielectric layer 535 is 100 nm. Referring to FIG. 7, the exemplary infrared emitter emits an infrared light with a peak wavelength of 4.26 um and a full width at half maximum (FWHM) about 0.15 um. It is also possible to design the layer structures and patterns of the infrared emitter for other desired emitting wavelengths and their corresponding FWHM.

[0041] The intent accompanying this disclosure is to have each/all embodiments construed in conjunction with the knowledge of one skilled in the art to cover all modifications, variations, combinations, permutations, omissions, substitutions, alternatives, and equivalents of the embodiments, to the extent not mutually exclusive, as may fall within the spirit and scope of the invention.

[0042] Conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that embodiments include, and in other interpretations do not include, certain features, elements and/or steps. Thus, such conditional language is not generally intended to imply that features, elements and/or steps are in any way required for one or more embodiments, or interpretations thereof, or that one or more embodiments necessarily include logic for deciding, with or without user input or prompting, whether these features, elements and/or steps are included or are to be performed in any particular embodiment.

[0043] Although specific embodiments have been illustrated and described, it will be appreciated by those skilled in the art that various modifications may be made without departing from the scope of the present invention, which is intended to be limited solely by the appended claims.