HEAT DISSIPATING CARBON FIBER LIGHT FIXTURE

Abstract

Electrical lighting housings and heat sinks constructed of pitch-based carbon fiber that act as heat sinks for light emitting diode (“LED”/“LEDs”) lights. Greater heat dissipation cools the LED lights and power suppling components, which in turns increases the life span of these components, without the need for active cooling. Due to the improved physical strength of pitch-based carbon fiber over aluminum and other typical heat sink and housing materials, the wall thickness of a housing can be decreased when using pitch-based carbon fiber which can further aid in thermal transfer.

Claims

1. A light fixture comprising: a housing adapted to receive a printed circuit board having at least one light emitting diode; the printed circuit board being in contact with the housing; and wherein at least a portion of the housing in contact with the printed circuit board is constructed of pitch-based carbon fiber.

2. The light fixture of claim 1, wherein the housing is sealed via bonding.

3. The light fixture of claim 1, further comprising a reflector configured to direct light produced by the at least one light emitting diode in a predetermined direction.

4. The light fixture of claim 1, further comprising a transparent lens bonded to the housing.

5. The light fixture of claim 1, wherein the printed circuit board is configured to conduct electricity from a power source to the at least one light emitting diode.

6. The light fixture of claim 1, further comprising a reflector configured to direct light produced by the at least one light emitting diode in a predetermined direction, a transparent lens bonded to the housing configured to allow light produced by the at least one light emitting diode to pass in the predetermined direction, and wherein the printed circuit board is configured to conduct electricity from a power source to the at least one light emitting diode.

7. A method of manufacturing a light emitting diode light fixture comprising the steps of: fabricating a pitch based carbon fiber impregnated with a resin putty; compressing and heating the pitch based carbon fiber impregnated with the resin putty to a predetermined pressure and a predetermined temperature until the pitch based carbon fiber impregnated with the resin putty has cured, creating a pitch-based carbon fiber part; deflashing and cleaning the pitch-based carbon fiber part; and attaching a printed circuit board having at least one light emitting diode to the pitch-based carbon fiber part.

8. The method of claim 7, further comprising the step of bonding a transparent lens to the pitch-based carbon fiber part.

9. The method of claim 7, further comprising the step of coupling the printed circuit board to a reflector configured to direct light produced by the at least one light emitting diode in a predetermined direction.

10. The method of claim 7, further comprising the steps of: coupling the printed circuit board to a reflector configured to direct light produced by the at least one light emitting diode in a predetermined direction, and bonding a transparent lens to the pitch-based carbon fiber part, wherein the transparent lens bonded to the housing is configured to allow light produced by the at least one light emitting diode to pass in the predetermined direction.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIG. 1 is an isometric exploded view of an embodiment of the LED light fixture;

[0008] FIG. 2 is aside view of the embodiment of the LED light fixture (shown in FIG. 1);

[0009] FIG. 3 is a front view of the embodiment of the LED light fixture (shown in FIG. 1);

[0010] FIG. 4 is a cross sectional view along line A-A (shown in FIG. 3) of the embodiment of the LED light fixture; and

[0011] FIG. 5 is a flow chart of a method making the embodiment of the LED light fixture (shown in FIG. 1);

DETAILED DESCRIPTION OF THE INVENTION

[0012] Prior to proceeding with the more detailed description of the present invention it should be noted that, for the sake of clarity, identical components which have identical functions have been designated by identical reference numerals throughout the several views illustrated in the drawings.

[0013] Referring in particular to FIGS. 1-4, in a first aspect the present invention provides an apparatus, generally designated 10, including a transparent lens 12 bonded to a reflector 14 via epoxy 16. The apparatus 10 further includes a printed circuit board 18 with LEDs 20 disposed thereon. The printed circuit board 18 is connected to a power supply (not shown) via power cable 22. Pitch carbon fiber housing, generally designated 24, comprises first element 26 and second element 28. First element 26 and second element 28 may be constructed as two parts that are bonded together, or as a single uniform part. The pitch carbon fiber housing 24 is attached and in direct contact with at least a portion of the printed circuit board 18 once the apparatus 10 is fully assembled. Integrated mounting shoulders 30 are configured to receive mounting bolts 32 for attachment to bulkhead 34 or the like. The apparatus 10 may also be mounted via epoxy 16 to any suitable surface. Adhesive, tape, or the like could be used in place of epoxy 16 above.

[0014] Referring to FIG. 5, an illustrative example of a method of producing a LED assembly of the present invention includes the following steps: [0015] Fabricate a pitch carbon putty 36; [0016] Load putty into a matched metal tool, compress and heat the putty until the resin binding the pitch carbon cures 38; (As the carbonization temperature is increased, the concentration of point defects is reduced and the crystalline perfection increases, thereby resulting in an improved thermal conductivity. A high fiber fraction and a low void content is preferred); [0017] Remove the cured part from the tool 40; [0018] Deflash and clean up the part 42; [0019] Insert the LED module and secure the module and its seals in place with the pitch carbon backplate 44 (which keeps the PCB board and attached LED's at a lower temperature); and [0020] Using a thermosetting resin pot in the LED module to bond in the pitch carbon backplate 46 (This seals the entire housing against dust and water).

[0021] While presently preferred embodiments of the present invention has been described in detail above, it should be understood that various other adaptations and/or modifications of the invention can be made by those persons who are particularly skilled in the art without departing from either the spirit of the invention or the scope of the appended claims.