Tin or tin alloy plating solution

Abstract

A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, ##STR00001##
here, in the Formula (1), X is C.sub.aH.sub.2a (a is 1 or 3) and m is 2 to 12.

Claims

1. A method of forming a tin or tin alloy plating deposition layer comprising: a step of forming the tin or tin alloy plating deposition layer on a substrate with vias having different via diameters by using a tin or tin alloy plating solution and applying a single current density to produce the tin or tin alloy deposition layer comprising a pattern having bumps with different bump diameters and a uniform height of the formed bumps, wherein the tin or tin alloy plating solution consists of: a soluble salt consisting of a stannous salt or a mixture of a stannous salt and a salt of a metal selected from copper, bismuth, nickel, antimony, indium, and zinc; an acid selected from an organic acid and an inorganic acid or a salt thereof; a surfactant; a leveling agent; and ion exchange water, wherein the surfactant contains a phenyl-based surfactant and the phenyl-based surfactant is a polyoxyethylene bisphenol ether represented by General Formula (1), ##STR00014## in the Formula (1), X is C.sub.aH.sub.2a (a is 1 or 3) and m is a value selected from 9 to 10, the polyoxyethylene bisphenol ether has a mass average molecular weight of 1000 to 1100, the leveling agent is made of a first leveling agent and a second leveling agent the first leveling agent is one or more selected from a group consisting of aliphatic aldehyde, aromatic aldehyde, aliphatic ketone and aromatic ketone, and the second leveling agent is α,β-unsaturated carboxylic acid or α,β-unsaturated carboxylic acid amide, or a salt thereof.

2. A method for forming a bump comprising the step of performing a reflow process on the tin or tin alloy plating deposition layer formed by the method of forming a tin or tin alloy plating deposition layer according to claim 1.

3. A method for producing a circuit board using a bump formed by the method according to claim 2.

4. A method of forming a tin or tin alloy plating deposition layer comprising: a step of forming the tin or tin alloy plating deposition layer on a substrate with vias having different via diameters by using a tin or tin alloy plating solution and applying a single current density to produce the tin or tin alloy deposition layer comprising a pattern having bumps with different bump diameters and a uniform height of the formed bumps, wherein the tin or tin alloy plating solution consists of: a soluble salt consisting of a stannous salt or a mixture of a stannous salt and a salt of a metal selected from copper, bismuth, nickel, antimony, indium, and zinc; an acid selected from an organic acid and an inorganic acid or a salt thereof; a surfactant containing a phenyl-based surfactant; a leveling agent; ion exchange water; and two or more of: a surfactant other than the phenyl-based surfactant; an antioxidant; and an alcohol having 1 to 3 carbon atoms, wherein the phenyl-based surfactant is a polyoxyethylene bisphenol ether represented by General Formula (1), ##STR00015## in the Formula (1), X is C.sub.aH.sub.2a (a is 1 or 3) and m is a value selected from 9 to 10, the polyoxyethylene bisphenol ether has a mass average molecular weight of 1000 to 1100, the leveling agent is made of a first leveling agent and a second leveling agent the first leveling agent is one or more selected from a group consisting of aliphatic aldehyde, aromatic aldehyde, aliphatic ketone and aromatic ketone, and the second leveling agent is α,β-unsaturated carboxylic acid or α,β-unsaturated carboxylic acid amide, or a salt thereof.

5. A method for forming a bump comprising the step of performing a reflow process on the tin or tin alloy plating deposition layer formed by the method of forming a tin or tin alloy plating deposition layer according to claim 4.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1(a) is a cross-sectional configuration diagram in which a plating deposition layer is formed in a via of the invention, and FIG. 1(b) is a cross-section configuration diagram after peeling off a dry film and a copper seed layer and heating the plating deposition layer.

(2) FIG. 2(a) is a cross-sectional configuration diagram showing an example in which a plating deposition layer is formed uniformly in a pattern having different bump diameters (via diameters), FIG. 2(b) is a cross-sectional configuration diagram showing an example in which a plating deposition layer is formed non-uniformly in a pattern having different bump diameters (via diameters), FIG. 2(c) is a cross-sectional configuration diagram showing an example in which a height of formed bump becomes uniform, after peeling off a dry film and a copper seed layer and heating the plating deposition layer in FIG. 2(a), and FIG. 2(d) is a cross-sectional configuration diagram showing an example in which the height of formed bump varies, after peeling off a dry film and a copper seed layer and heating the plating deposition layer in FIG. 2(b).

BEST MODE FOR CARRYING OUT THE INVENTION

(3) Next, an embodiment for carrying out the invention will be described.

(4) The tin or tin alloy plating solution of the invention includes (A) a soluble salt containing at least a stannous salt, (B) an acid selected from an organic acid and an inorganic acid or a salt thereof, (C) a surfactant, and (D) a leveling agent. This surfactant contains a phenyl-based surfactant, and the phenyl-based surfactant is polyoxyethylene bisphenol ether represented by the General Formula (1).

(5) The soluble salt consists of any of a stannous salt and a mixture of a stannous salt and a salt of a metal selected from silver, copper, bismuth, nickel, antimony, indium, and zinc.

(6) The tin alloy of the invention is an alloy of tin and a predetermined metal selected from silver, copper, bismuth, nickel, antimony, indium, and zinc, and examples thereof include a tin-silver alloy, a tin-copper alloy, a tin-bismuth alloy, a tin-nickel alloy, a tin-antimony alloy, a tin-indium alloy, a binary alloy of a tin-zinc alloy, and a ternary alloy such as a tin-copper-bismuth alloy or tin-copper-silver alloy.

(7) Therefore, the soluble salt (A) of the invention means any soluble salt that generates various metal ions such as Sn.sup.2+, Ag.sup.+, Cu.sup.+, Cu.sup.2+, Bi.sup.3+, Ni.sup.2+, Sb.sup.3+, In.sup.3+, and Zn.sup.2+ in the plating solution, and examples thereof include an oxide and a halide of the metal, and the metal salt of inorganic acid or organic acid.

(8) Examples of metal oxide include a stannous oxide, a copper oxide, a nickel oxide, a bismuth oxide, an antimony oxide, an indium oxide, and a zinc oxide. Examples of the halide of metal include a stannous chloride, a bismuth chloride, a bismuth bromide, a cuprous chloride, a cupric chloride, a nickel chloride, an antimony chloride, an indium chloride, and a zinc chloride.

(9) Examples of the metal salt of inorganic acid or organic acid include copper sulfate, stannous sulfate, bismuth sulfate, nickel sulfate, antimony sulfate, bismuth nitrate, silver nitrate, a copper nitrate, antimony nitrate, indium nitrate, nickel nitrate, zinc nitrate, copper acetate, nickel acetate, nickel carbonate, sodium stannate, stannous borofluoride, stannous methanesulfonate, silver methanesulfonate, copper methanesulfonate, bismuth methanesulfonate, nickel methanesulfonate, indium methanesulfonate, zinc bismethanesulfonate, stannous ethanesulfonate, and bismuth 2-hydroxypropanesulfonate.

(10) The acid or a salt thereof (B) of the invention is selected from an organic acid, an inorganic acid, or a salt thereof. Examples of the organic acid include organic sulfonic acid such as alkanesulfonic acid, alkanolsulfonic acid, and aromatic sulfonic acid, and aliphatic carboxylic acid. Examples of the inorganic acid include borofluoric acid, hydrofluorosilicic acid, sulfamine acid, hydrochloric acid, sulfuric acid, nitric acid, and perchloric acid. Examples of the salt thereof include a salt of alkali metal, a salt of alkaline earth metal, an ammonium salt, an amine salt, and a sulfonate. The component (B) is preferably organic sulfonic acid from a viewpoint of solubility of the metal salt or ease of wastewater treatment.

(11) As the alkanesulfonic acid, a material represented by a chemical formula C.sub.nH.sub.2n+1SO.sub.3H (for example, n=1 to 5, preferably 1 to 3) can be used, and specific examples thereof include methanesulfonic acid, ethanesulfonic acid, 1-propanesulfonic acid, 2-propanesulfonic acid, 1-butanesulfonic acid, 2-butanesulfonic acid, pentanesulfonic acid, hexanesulfonic acid, decanesulfonic acid, and dodecanesulfonic acid.

(12) As the alkanolsulfonic acid, a material represented by a chemical formula C.sub.pH.sub.2p+1—CH(OH)—C.sub.qH.sub.2q—SO.sub.3H (for example, p=0 to 6, q=1 to 5) can be used, and specific examples thereof include 2-hydroxyethane-1-sulfonic acid, 2-hydroxypropane-1-sulfonic acid, 2-hydroxybutane-1-sulfonic acid, 2-hydroxypentane-1-sulfonic acid, 1-hydroxypropane-2-sulfonic acid, 3-hydroxypropane-1-sulfonic acid, 4-hydroxybutane-1-sulfonic acid, 2-hydroxyhexane-1-sulfonic acid, 2-hydroxydecane-1-sulfonic acid, and 2-hydroxydodecane-1-sulfonic acid.

(13) The aromatic sulfonic acid is basically benzene sulfonic acid, alkyl benzene sulfonic acid, phenol sulfonic acid, naphthalene sulfonic acid, or alkyl naphthalene sulfonic acid, and specific examples thereof include 1-naphthalene sulfonic acid, 2-naphthalene sulfonic acid, toluenesulfonic acid, xylenesulfonic acid, p-phenolsulfonic acid, cresolsulfonic acid, sulfosalicylic acid, nitrobenzenesulfonic acid, sulfobenzoic acid, and diphenylamine-4-sulfonic acid.

(14) Examples of the aliphatic carboxylic acid include acetic acid, propionic acid, butyric acid, citric acid, tartaric acid, gluconic acid, sulfosuccinic acid, and trifluoroacetic acid.

(15) The phenyl-based surfactant contained in the surfactant of the invention is polyoxyethylene bisphenol ether represented by General Formula (1).

(16) ##STR00003##

(17) Here, in the Formula (1), X is C.sub.aH.sub.2a (a is 1 or 3) and m is 2 to 12. Here, in a case where m is less than 2, it is difficult to dissolve in the plating solution or abnormal appearance of the plating may occur, and in a case where it exceeds 12, via filling properties may be deteriorated or abnormal appearance of the plating may occur. m is preferably 5 to 10. The polyoxyethylene bisphenol ether represented by General Formula (1) may contain ortho, meta, and para isomers, and a mixture thereof.

(18) The leveling agent (D) of the invention is added to form a uniform and dense plating film and to smooth the plating film. In order to improve the via filling properties and prevent the generation of empty spaces, two types of a first leveling agent (D-1) and a second leveling agent (D-2) are used. Examples of the first leveling agent (D-1) include one or two or more selected from the group consisting of aliphatic aldehyde, aromatic aldehyde, aliphatic ketone, and aromatic ketone, and examples of the second leveling agent (D-2) include α,β-unsaturated carboxylic acid or amide thereof, and salt thereof.

(19) The first leveling agent (D-1) is a carbonyl compound containing aldehyde or ketone, and does not include α,β-unsaturated carboxylic acid of the second leveling agent (D-2). Specific examples are as follows. Examples of the aliphatic aldehyde include formaldehyde, acetaldehyde, and allyl aldehyde. Examples of the aromatic aldehyde include benzaldehyde, 2-chlorobenzaldehyde, 3-chlorobenzaldehyde, 4-chlorobenzaldehyde, 2,4-dichlorobenzaldehyde, 2,6-dichlorobenzaldehyde, 2,4,6-trichlorobenzaldehyde, 1-naphthaldehyde, 2-naphthaldehyde, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde, 2-methylbenzaldehyde, 3-methylbenzaldehyde, 4-methylbenzaldehyde, m-anisaldehyde, o-anisaldehyde, and p-anisaldehyde. In addition, examples of the aliphatic ketone include acetylacetone. Further, examples of the aromatic ketone include benzylideneacetone (synonymous with benzalacetone), 2-chloroacetophenone, 3-chloroacetophenone, 4-chloroacetophenone, 2,4-dichloroacetophenone, and 2,4,6-trichloroacetophenone. These may be used alone or in combination of two or more types thereof. A preferred content of the first leveling agent (D-1) in an electroplating bath (an amount of a single substance, in a case where it is used alone, and a total amount of substances, in a case where two or more types are included) is 0.001 g/L. to 0.3 g/L and more preferably 0.01 g/L to 0.25 g/L. In a case where the content of the component is small, the effect of adding the component is not sufficient, and on the other hand, in a case where the content of the component is excessively large, the smoothing of the plating film may be inhibited.

(20) Examples of the second leveling agent (D-2) include acrylic acid, methacrylic acid, picolinic acid, crotonic acid, 3-chloroacrylic acid, 3,3-dimethylacrylic acid, 2,3-dimethylacrylic acid, methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, 2-ethylhexyl acrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-dimethylaminoethyl methacrylate, methacrylic anhydride, and methyl methacrylic acid. In addition, the second leveling agent (D-2) also includes amide of α,β-unsaturated carboxylic acid (for example, acrylamide or the like) and a salt of α,β-unsaturated carboxylic acid (for example, potassium, sodium, or ammonium). A preferred content of the second leveling agent (D-2) in an electroplating bath (an amount of a single substance, in a case where it is used alone, and a total amount of substances, in a case where two or more types are included) is 0.01 g/L. to 50 g/L, more preferably 0.05 g/L to 30 g/L, and even more preferably 0.05 g/L to 10 g/L. In a case where the content of the component is small, the effect of adding the component is not sufficient, and on the other hand, in a case where the content of the component is excessively large, the smoothing of the plating film may be inhibited.

(21) The tin or tin alloy plating solution of the invention preferably further includes two or more of a surfactant (E) other than the phenyl-based surfactant, an antioxidant (F), and alcohol (G) having 1 to 3 carbon atoms.

(22) In this case, examples of the other surfactant (E) include an ordinary anionic surfactant, a cationic surfactant, a nonionic surfactant, and an amphoteric surfactant.

(23) Examples of the anionic surfactant include polyoxyalkylene alkyl ether sulfate such as sodium polyoxyethylene (ethylene oxide: containing 12 mol) nonyl ether sulfate, polyoxyalkylene alkyl phenyl ether sulfate such as sodium polyoxyethylene (ethylene oxide: containing 12 mol) dodecylphenyl ether sulfate, alkyl benzene sulfonate such as sodium dodecylbenzene sulfonate, naphthol sulfonate such as sodium 1-naphthol-4-sulfonate or disodium 2-naphthol-3,6-disulfonate, (poly)alkylnaphthalenesulfonate such as sodium diisopropylnaphthalenesulfonate or sodium dibutylnaphthalenesulfonate, and alkyl sulfate such as sodium dodecyl sulfate or sodium oleyl sulfate.

(24) Examples of cationic surfactant include mono-trialkylamine salt, dimethyldialkylammonium salt, trimethylalkylammonium salt, dodecyltrimethylammonium salt, hexadecyltrimethylammonium salt, octadecyltrimethylammonium salt, dodecyldimethylammonium salt, octadecenyl dimethylethylammonium salt, dodecyldimethylbenzylammonium salt, hexadecyldimethylbenzylammonium salt, octadecyldimethylbenzylammonium salt, trimethylbenzylammonium salt, triethylbenzylammonium salt, hexadecylpyridinium salt, dodecylpyridinium salt, dodecylpicolinium salt, dodecylimidazo linium salt, oleyl imidazolinium salt, octadecylamine acetate, and dodecylamine acetate.

(25) Examples of the nonionic surfactant include a material obtained by adding and condensing 2 to 300 mol of ethylene oxide (EO) and/or propylene oxide (PO) to sugar ester, fatty acid ester, C.sub.1 to C.sub.25 alkoxyl phosphoric acid (salt), sorbitan ester, and C.sub.1 to C.sub.22 aliphatic amide, and sulfated or sulfonated adducts of the condensation products of silicon-based polyoxyethylene ether, silicon-based polyoxyethylene ester, fluorine-based polyoxyethylene ether, fluorine-based polyoxyethylene ester, ethylene oxide and/or propylene oxide and alkylamine or diamine.

(26) Examples of the amphoteric surfactant include betaine, carboxybetaine, imidazolinium betaine, and sulfobetaine, aminocarboxylic acid.

(27) The antioxidant (F) is used for preventing the oxidation of the soluble stannous salt to the tin dioxide salt. Examples of antioxidant include hypophosphorous acids, ascorbic acid or a salt thereof, phenolsulfonic acid (Na), cresolsulfonic acid (Na), hydroquinonesulfonic acid (Na), hydroquinone, α- or β-naphthol, catechol, resorcin, phloroglucin, hydrazine, phenolsulfonic acid, catecholsulfonic acid, hydroxybenzenesulfonic acid, naphtholsulfonic acid, and salts thereof.

(28) The alcohol (G) having 1 to 3 carbon atoms is used for improving the solubility of the surfactant. Examples of the alcohol include methanol, ethanol, 1-propanol, and 2-propanol. The alcohol can be used alone or in combination of two or more kinds thereof.

(29) A content of the phenyl-based surfactant (C) in the plating solution is 0.5 g/L to 50 g/L and preferably 1 g/L to 5 g/L. In a case where the content is less than the lower limit, plating failure such as a dendrite occurs due to an excessive supply of Sn ions. On the other hand, in a case where the value exceeds the upper limit, Sn ions hardly reach the surface to be plated, and the via-filling properties is deteriorated (decreased).

(30) The predetermined soluble metal salt (A) can be used alone or in combination, and a content thereof in the plating solution is 30 g/L to 100 g/L and preferably 40 g/L to 60 g/L. In a case where the content is less than the appropriate range, the productivity is reduced, and in a case where the content increases, the cost of the plating solution increases.

(31) The organic acid and inorganic acid or a salt thereof (B) can be used alone or in combination, and a content thereof in the plating solution is 80 g/L to 300 g/L and preferably from 100 g/L to 200 g/L. In a case where the content is less than the appropriate range, electrical conductivity is low and a voltage increases, and in a case where the content increases, viscosity of the plating solution increases and a stirring speed of the plating solution decreases.

(32) Meanwhile, a temperature of the electroplating solution of the invention is generally 70° C. or lower and preferably 10° C. to 40° C. A current density during the formation of a plating film by electroplating is in a range of 0.1 A/dm.sup.2 to 100 A/dm.sup.2 and preferably in the range of 0.5 A/dm.sup.2 to 20 A/dm.sup.2. In a case where the current density is excessively low, the productivity deteriorates, and in a case where the current density is excessively high, the height uniformity of the bumps deteriorates.

(33) By applying the plating solution of the tin or tin alloy containing the phenyl-based surfactant (C) of the invention to a circuit board which is a material to be plated, a predetermined metal film can be formed on the circuit board. Examples of the circuit board include a printed circuit board, a flexible printed circuit board, and a semiconductor integrated circuit board.

EXAMPLES

(34) Next, examples of the invention will be described in detail together with comparative examples.

Phenyl-Based Surfactant (C) Used in Examples and Comparative Examples

(35) Tables 1 and 2 show each structural formula of polyoxyethylene bisphenol ether which is the phenyl-based surfactant (C) used in Examples 1 to 7 and Comparative Examples 1 and 2.

(36) TABLE-US-00001 TABLE 1 Compound of phenyl-based surfactant Structural formula of compound of phenyl-based surfactant c-1 (a = 1) (m = 5) c-2 (a = 1) (m = 10) c-3 (a = 3) (m = 2) c-4 (a = 3) (m = 3) c-5 (a = 3) (m = 5) c-6 (a = 3) (m = 9) c-7 (a = 3) (m = 10) 0 c-8 (a = 3) (m = 12)

(37) TABLE-US-00002 TABLE 2 Compound of phenyl-based surfactant Structural formula of compound of phenyl-based surfactant c-9 (a = 3) (m = 1) c-10 (a = 3) (m = 15)

Example 1

Preparation of Sn Plating Solution

(38) Methanesulfonic acid as a free acid, hydroquinone as an antioxidant, 1-naphthaldehyde as a first leveling agent, and methacrylic acid as a second leveling agent were mixed with a Sn methanesulfonate aqueous solution to form a uniform solution, and then, the polyoxyethylene bisphenol ether (mass average molecular weight: approximately 600 g/mol) of the (C-1) was further added thereto as a surfactant. Ion-exchanged water was finally added to prepare a Sn plating solution having the following composition. The Sn methanesulfonate aqueous solution was prepared by electrolyzing a metal Sn plate in a methanesulfonic acid aqueous solution.

Composition of Sn Plating Solution

(39) Sn methanesulfonate (as Sn.sup.2+): 50 g/L

(40) Potassium methanesulfonate (as free acid): 100 g/L

(41) Phenyl-based surfactant (C-1): 2 g/L

(42) Hydroquinone (as the antioxidant (F)): 1 g/L

(43) 1-naphthaldehyde (as the first leveling agent (D-1)): 0.1 g/L

(44) Methacrylic acid (as the second leveling agent (D-2)): 2 g/L

(45) Ion-exchanged water: balance

Examples 2 to 8 and Comparative Examples 1 and 2

(46) In Examples 2 to 8 and Comparative Examples 1 and 2, polyoxyethylene bisphenol ether ((C-2) to (C-10)) of the structural formulae shown in Tables 1 and 2 were used as the phenyl-based surfactant (C). Except this, Sn plating solutions of Examples 2 to 8 and Comparative Examples 1 and 2 were prepared in the same manner as in Example 1. In Example 3 and Comparative Example 2, Ag was included as metal other than Sn (1.0 g/L as Ag+), and in Example 5, Cu was included as metal other than Sn (0.5 g/L as Cu2+).

Comparative Test and Evaluation

(47) The plating was performed on a substrate having a pattern having different bump diameters using the 10 types of the prepared plating solutions of Examples 1 to 8 and Comparative Examples 1 and 2 under the condition of a current density of 2ASD, and tin or tin alloy plating deposition layers were formed in vias. It was heated to 280° C. using a reflow apparatus, the plating deposition layer was dissolved, and a bump was formed. These plating deposition layers and bumps were evaluated.

(48) “Via filling properties of the tin or tin alloy plating deposition layer in the via” and “appearance of the tin or tin alloy plating deposition layer in the via” which will be described later are measured regarding the plating deposition layer before the reflow, and “deviation in bump height” and “ease of generation of empty spaces” are measured regarding the bump formed after the reflow of the plating deposition layer. The results thereof are shown in Table 3.

(1) Via Filling Properties of Tin or Tin Alloy Plating Deposition Layer in Via

(49) The tin or tin alloy plating deposition layer in the via was observed with a laser microscope, and a difference in height between the highest point and the lowest point of the plating deposition layer was measured. A case where the difference in height exceeded 5 μm was determined as “poor”, a case where the difference in height was 5 μm or less was determined as “excellent”, and these were shown in the column of “via filling properties” of Table 3.

(2) Appearance of Plating Deposition Layer

(50) The tin or tin alloy plating deposition layer in the via was observed with a laser microscope, and a surface roughness Ra was measured. A case where the surface roughness Ra of the plating deposition layer exceeded 2 μm was determined as “poor”, a case where the surface roughness Ra was 2 μm or less was judged as “excellent”, and these were shown in the column of “appearance of plating deposition layer” of Table 3.

(3) Deviation in Bump Height

(51) The height of the bump on the substrate was measured using an automatic appearance inspection device. A height deviation σ (standard deviation) was calculated from the measured bump heights. A case where the height deviation σ is 3 or less was determined as “uniform”, and a case where the height deviation σ exceeded 3 was determined as “non-uniform”, and the result thereof were shown in the column of “bump height deviation σ” of Table 3.

(4) Ease of Generation of Empty Spaces

(52) Transmission X-ray images were captured for bumps (2,000 in total) arranged at pitch intervals of 180 μm, 250 μm, and 360 μm and having diameters of 70 μm, 90 μm, and 120 μm. The captured image was visually observed. A case where one or more empty spaces having a size of 1% or more with respect to the size of the bump was observed was determined as “NG”, and a case where no empty spaces were observed was determined as “OK”. The results thereof were shown in the column of “empty spaces” of Table 3.

(53) TABLE-US-00003 TABLE 3 Phenyl-based surfactant Evaluation Mass Metal Appearance average other Via of plating Bump Compound molecular than filling deposition height Empty No. weight Sn properties layer deviation σ spaces Example 1 C-1  600 — Excellent Excellent Uniform OK Example 2 C-2 1050 — Excellent Excellent Uniform OK Example 3 C-3  400 Ag Excellent Excellent Uniform OK Example 4 C-4  500 — Excellent Excellent Uniform OK Example 5 C-5  650 Cu Excellent Excellent Uniform OK Example 6 C-6 1000 — Excellent Excellent Uniform OK Example 7 C-7 1100 — Excellent Excellent Uniform OK Example 8 C-8 1300 — Excellent Excellent Uniform OK Comparative C-9  300 — Excellent Poor Non-uniform OK Example 1 Comparative  C-10 1550 Ag Poor Poor Non-uniform OK Example 2

(54) As clearly shown in Table 3, in Comparative Example 1 in which the compound No. C-9 was used as the phenyl-based surfactant, m in General Formula (1) was excessively small as 1. Accordingly, although via filling properties were excellent and the ease of generation of empty spaces was OK due to no empty spaces observed in the bump, the appearance of the plating deposition layer was poor and the bump height deviation was not uniform. In addition, in Comparative Example 2 in which the compound No. C-10 was used as the phenyl-based surfactant, m in General Formula (1) was excessively large as 15. Accordingly, although the ease of generation of empty spaces was OK due to no empty spaces observed in the bump, the via filling properties and the appearance of the plating deposition layer were poor and the bump height deviation was not uniform.

(55) In contrast, in Examples 1 to 8 in which the compounds No. C-1 to C-8 were used as the phenyl-based surfactant, m in General Formula (1) was in an appropriate range of 2 to 12 (2 to 12), the via filling properties and the appearance of the plating deposition layer were excellent, the bump height deviation was entirely uniform, and the ease of generation of empty spaces was OK due to no empty spaces observed in the bump.

Examples 9 to 18

(56) In Examples 9 to 18, a Sn plating solution was prepared in the same manner as in Example 1, except that any of the first leveling agent (D-1), the second leveling agent (D-2), or the metal other than Sn, and the mass average molecular weight of the phenyl-based surfactant were changed as shown in Table 4. In the first leveling agent (D-1) of Table 4, D1A is benzaldehyde, D1B is 4-chlorobenzaldehyde, and D1C is 1-naphthaldehyde. In addition, in the second leveling agent (D-2) of Table 4, D2A is methacrylic acid, D2B is acrylic acid, and D2C is acrylamide.

Comparative Test 2 and Evaluation

(57) The plating was performed on a substrate having a pattern having different bump diameters using the 10 types of the prepared plating solutions of Examples 9 to 18 under the condition of a current density of 2ASD in the same manner as in the comparative test 1, and tin or tin alloy plating deposition layers were formed in vias. It was heated to 280° C. using a reflow apparatus, the plating deposition layer was dissolved to form a bump, and the “via filling properties of the tin or tin alloy plating deposition layer in the via”, the “appearance of the tin or tin alloy plating deposition layer in the via”, the “deviation in bump height”, and “ease of generation of empty spaces” were evaluated. Table 4 shows the results thereof.

(58) TABLE-US-00004 TABLE 4 Amine-based surfactant Evaluation First leveling Second leveling Mass Metal Appearance Ease of agent (D-1) agent (D-2) average other Via of plating Bump generation Concentration Concentration Compound molecular than filling deposition height of empty Type (g/L) Type (g/L) No. weight Sn properties layer deviation σ spaces Example 9 D1A 0.1 D2A  2 C-1 1300 — Excellent Excellent Uniform OK Example 10 D1B 0.1 D2A  2 C-1 1300 — Excellent Excellent Uniform OK Example 11 D1C 0.1 D2B  7 C-1 1300 — Excellent Excellent Uniform OK Example 12 D1C 0.1 D2C  2 C-1 1300 — Excellent Excellent Uniform OK Example 13 D1A 0.1 D2A  2 C-1 1300 Cu Excellent Excellent Uniform OK Example 14 D1C 0.1 D2C  7 C-1 1300 Ag Excellent Excellent Uniform OK Example 15 D1C  0.001 D2A  2 C-1 1300 — Excellent Excellent Uniform OK Example 16 D1C 0.3 D2A  2 C-1 1300 — Excellent Excellent Uniform OK Example 17 D1C 0.1 D2A    0.05 C-1 1300 — Excellent Excellent Uniform OK Example 18 D1C 0.1 D2A 30 C-1 1300 — Excellent Excellent Uniform OK

(59) As clearly shown from Table 4, in Examples 9 to 12 in which the first leveling agent (D-1) was changed to any of benzaldehyde, 4-chlorobenzaldehyde, or 1-naphthaldehyde, and the second leveling agent (D-2) was changed to any of methacrylic acid or acrylic acid, the via filling properties and the appearance of the plating deposition layer were both excellent, the bump height deviation was uniform, and ease of generation of empty spaces was OK due to no empty spaces observed in the bump.

(60) In addition, in Examples 13 and 14 in which the first leveling agent (D-1) was changed to benzaldehyde or 1-naphthaldehyde, the second leveling agent (D-2) was changed to methacrylic acid or acrylamide, and Cu or Ag was added as the metal other than Sn, the via filling properties and the appearance of the plating deposition layer were both excellent, the bump height deviation was uniform, and ease of generation of empty spaces was OK due to no empty spaces observed in the bump.

(61) Further, in Examples 15 and 16 in which the concentration of the first leveling agent (D-1) was changed to 0.001 g/L and 0.3 g/L, respectively, and in Examples 17 and 18 in which the concentration of the second leveling agent (D-2) was changed to 0.05 g/L and 30 g/L, respectively, the via filling properties and the appearance of the plating deposition layer were both excellent, the bump height deviation was uniform, and ease of generation of empty spaces was OK due to no empty spaces observed in the bump.

INDUSTRIAL APPLICABILITY

(62) The tin or tin alloy plating solution of the invention can be used for a circuit board such as a printed circuit board, a flexible printed circuit board, and a semiconductor integrated circuit.

REFERENCE SIGNS LIST

(63) 1: Substrate 2: Solder resist layer 3: Copper seed layer 4: Dry film resist layer 6: Via 7: Tin plating deposition layer (tin plating film) 8: Tin bump