ANTENNA DEVICE, RADAR SENSOR DEVICE AND METHOD FOR PRODUCING AN ANTENNA DEVICE

Abstract

An antenna device. The antenna device includes a carrier element having at least one first strip conductor and having a second strip conductor; at least one fastening structure, which is formed in or on the carrier element; at least one antenna element, which is arranged or fastened on or in the fastening structure and is connected to the strip conductor; a transmitter device, which is arranged on the carrier element and is connected to the second strip conductor, and is designed to transmit a transmitter signal to the at least one antenna element and/or to receive a transmitter signal from the at least one antenna element.

Claims

1. An antenna device, comprising: a carrier element having a strip conductor; at least one fastening structure, which is formed in or on the carrier element; at least one antenna element, which is arranged or fastened on or in the fastening structure and is connected to the strip conductor; and a transmitter device, which is arranged on the carrier element and is connected to the strip conductor, and is configured to transmit a transmitter signal to the at least one antenna element and/or to receive a transmitter signal from the at least one antenna element.

2. The antenna device as recited in claim 1, which is formed as a chip and wherein the at least one antenna element is configured to emit and receive radar radiation.

3. The antenna device as recited in claim 1, wherein the at least one antenna element includes a dielectric resonator antenna.

4. The antenna device as recited in claim 3, wherein the dielectric resonator antenna has a cylindrical form or cuboidal form.

5. The antenna device as recited in claim 1, wherein the transmitter device includes an IC chip and is arranged on an underside or upper side of the carrier element, and the at least one antenna element is arranged on an upper side or on the underside of the carrier element, the strip conductor including a first strip conductor and a second strip conductor, the antenna element being connected to the first strip conductor and the transmitter device being connected to the second strip conductor.

6. The antenna device as recited in claim 1, wherein the fastening structure includes a slot or a microstrip line or a patch coupling.

7. The antenna device as recited in claim 1, herein the antenna element include a pair of individual antennas.

8. A radar sensor device, comprising: a printed circuit board; an antenna device, which is arranged on the printed circuit board, the antenna device including: a carrier element having a strip conductor, at least one fastening structure, which is formed in or on the carrier element, at least one antenna element, which is arranged or fastened on or in the fastening structure and is connected to the strip conductor, and a transmitter device, which is arranged on the carrier element and is connected to the strip conductor, and is configured to transmit a transmitter signal to the at least one antenna element and/or to receive a transmitter signal from the at least one antenna element; a radome, which covers the printed circuit board and allows radar radiation to pass through; a heat conductor, which is thermally connected to the printed circuit board and/or to the antenna device.

9. The radar sensor device as recited in claim 8, wherein the antenna device is arranged on an upper side of the printed circuit board and the at least one antenna element extends away from the printed circuit board in a direction of the radome.

10. The radar sensor device as recited in claim 8, wherein the antenna device is arranged on an underside of the printed circuit board and the at least one antenna element extends through an opening in the printed circuit board in a direction of the radome.

11. A method for producing an antenna device, comprising the following steps: providing a carrier element having a strip conductor; forming at least one fastening structure, which is formed in or on the carrier element; arranging at least one antenna element, which is arranged or fastened on or in the fastening structure and is connected to the strip conductor; and arranging a transmitter device, which is arranged on the carrier element and is connected to the strip conductor, and is configured to transmit a transmitter signal to the at least one antenna element and/or to receive a transmitter signal from the at least one antenna element.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The present invention is explained in more detail below with reference to the exemplary embodiments specified in the schematic figures.

[0041] FIG. 1 shows a schematic side view of an antenna device according to an exemplary embodiment of the present invention.

[0042] FIG. 2 shows a schematic plan view of a carrier in an antenna device according to an exemplary embodiment of the present invention.

[0043] FIG. 3 shows a schematic plan view of a carrier in an antenna device according to a further exemplary embodiment of the present invention.

[0044] FIG. 4 shows a schematic side view of a radar sensor device according to an exemplary embodiment of the present invention.

[0045] FIG. 5 shows a schematic side view of a radar sensor device according to a further exemplary embodiment of the present invention.

[0046] FIG. 6 shows a block diagram of method steps of the method for producing an antenna device according to an exemplary embodiment of the present invention.

[0047] In the figures, similar or functionally similar elements are denoted by the same reference signs.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0048] FIG. 1 shows a schematic side view of an antenna device according to an exemplary embodiment of the present invention.

[0049] The antenna device 10 comprises a carrier element T having at least one first strip conductor LE1, for instance as a coating on an upper side of the carrier element T, and having a second strip conductor LE2, for instance as a coating on an underside of the carrier element T; advantageously, a plurality of fastening structures BS, which are formed in or on the carrier element T; a plurality of antenna elements AE, which may be arranged or fastened on or in a respective fastening structure BS and may be connected to the first strip conductor LE1; a transmitter device SR, which is arranged on the carrier element T and is connected to the second strip conductor LE2, and is designed to transmit a transmitter signal to the at least one antenna element AE and/or to receive a transmitter signal from the at least one antenna element AE.

[0050] The antenna device AE may be formed as a chip (package), wherein the at least one antenna element AE is formed to emit and receive radar radiation. The antenna element AE may comprise a dielectric resonator antenna and the dielectric resonator antenna may have a cylindrical form or a cuboidal form. The transmitter device SR may comprise an IC chip and be arranged on an underside of the carrier element T and the at least one antenna element AE may be arranged on an upper side or on the underside of the carrier element T.

[0051] The antenna device 10 may be formed as a radar package and the transmitter device SR may comprise an RF IC (MMIC or SoC) in a housing with a conductive coating on the carrier element (routing layer). Package variants are possible here, for example eWLB (embedded Wafer Level Ball grid array), BGA (Ball Grid Array), LGA (Land Grid Array), FCCSP (Flip-Chip Chip Scale Package) as currently used package variants.

[0052] A wide variety of packages with an interposer and, if necessary, a molding compound in eWLB, BGA or LGA form, for example, may be used as the package. A transmitter device SR using Flip Clip technology mounted on a carrier element as an interposer is shown by way of example as an IC. The routing of the high frequency signals takes place in the package using a proven type of line routing via the routing layer. Examples of this are stripline, microstrip line, grounded coplanar waveguides or substrate integrated waveguides, which may be encompassed by the first and/or second strip conductor (strip conductor in the sense of a power line and/or wave line). High frequency through-connections through various layers may be realized by a galvanic connection using vias or a field coupling. The carrier element T may be mounted in a radar sensor device (FIG. 4 or FIG. 5) with solder points LB on the underside of the package.

[0053] A signal transfer between the two strip conductors may be realized using a through-contact or via.

[0054] FIG. 2 shows a schematic plan view of a carrier in an antenna device according to an exemplary embodiment of the present invention.

[0055] In a plan view looking onto the surface of the carrier element from the direction of the antenna elements, it is possible to see the fastening structures BS in which the antenna elements AE are arranged. It should be noted here that “fastening structures” is a generic term, since these may represent both a material for fastening the antenna elements and a structure, for example a slot or socket region, for inserting the antenna elements, specifically the region in which the antenna elements may be placed and fastened. Since the signal may be transported via the carrier (as a routing, for instance via the strip conductors) and may be conducted from an underside through to the upper side of the carrier (and vice versa), the fastening structures in this case may also serve as coupling structures for coupling the antenna elements to the carrier and forwarding the signal to the transmitter device.

[0056] By way of example, FIG. 2 shows 8 such regions comprising fastening structures BS, which may be formed as circular sockets with holders (slots or other holders) with or without an adhesive connection or soldered connection. The fastening structure BS may comprise a slot or a microstrip or a patch coupling. Furthermore, the antenna element AE may comprise a pair of individual antennas. The holder or fastening structure may also constitute an opening through the carrier element and be connected to a routing (strip conductor for power and/or waves) on the upper side and on the underside of the carrier element, via which a transmitter signal may be conducted from the upper side to the underside (and, from there, to the antenna element and/or the transmitter device) and vice versa.

[0057] In its simplest form, each such fastening structure BS represents an antenna channel and comprises a DRA element. The 8 channels may each possess a DRA antenna. The coupling of the DRAs is realized via fastening elements on or in the package or molding compound (soldered connection or potting compound). This may be a slot, microstrip coupling or patch coupling, for example. The DRAs may be fastened on the package using an adhesive connection, for example. The DRAs may have a cylindrical or cuboidal design or they may have any other desired geometric form.

[0058] FIG. 3 shows a schematic plan view of a carrier in an antenna device according to a further exemplary embodiment of the present invention.

[0059] FIG. 3 shows fields of double antenna elements AE-F, which may be arranged in or on the fastening elements BS. This shows a plan view of the carrier element T in the sense of FIG. 2. This relates to a package variant with exemplary array arrangements with double antenna elements for further forming the radiation pattern and focusing or defocusing it in desired regions or optimizing antenna parameters such as side lobes. The arrangement and number of elements may be varied in this case in order to configure the emission profile according to the desired requirements.

[0060] FIG. 4 shows a schematic side view of a radar sensor device according to an exemplary embodiment of the present invention.

[0061] The radar sensor device RE comprises a printed circuit board PCB in a housing H; an antenna device 10 according to the present invention, which is arranged on the printed circuit board PCB; a radome RD, which covers the printed circuit board and allows radar radiation to pass through; a heat conductor WL, which is thermally connected to the printed circuit board and/or to the antenna device 10. The antenna device 10 may be arranged on an upper side of the printed circuit board PCB and the at least one antenna element AE extends away from the printed circuit board PCB in the direction of the radome. The antenna device 10 may be arranged on the printed circuit board PCB as a package, i.e. as a package arrangement, and thus integrated in the sensor. In this case, the package may be mounted on the upper side of the printed circuit board.

[0062] The thermal intermediate layer ZS (thermal connecting element) may be arranged on the heat conductor WL and both may be arranged within the housing H and covered by the radome RD. Thermal through-contacts TK may extend from the intermediate layer ZS through the printed circuit board PCB to the antenna device 10 and be thermally connected to this latter on the upper side of the printed circuit board PCB. The printed circuit board PCB may be arranged on the intermediate layer ZS, or be in contact therewith, at least in some regions.

[0063] FIG. 5 shows a schematic side view of a radar sensor device according to a further exemplary embodiment of the present invention.

[0064] In the radar sensor device RE according to FIG. 5, the antenna device 10 may be arranged on an underside of the printed circuit board PCB and the at least one antenna element AE may extend through an opening DK in the printed circuit board PCB in the direction of the radome and then in the direction of the radome RD. The carrier or the transmitter device of the antenna device 10 may be arranged directly on a thermal intermediate layer ZS (thermal connecting element). Consequently, the transmitter device of the antenna device 10, designed, for instance, as an RF IC, may be mounted on the rear side of the printed circuit board PCB. In this case, the antenna elements AE may project upwards through the respective openings DK in the printed circuit board PCB towards the radome RD. If the transmitter device is placed on the rear side (on the underside and facing away from the radome), improved thermal cooling may be advantageously achieved by directly connecting the package to a heat conductor WL or to the housing rear wall on the rear side. Advantages are furthermore realized due to a lower interference emission of the radar package due to a shielding effect of the printed circuit board PCB to the lateral side and to the underside. In addition, the openings DK in the printed circuit board may be used to further optimize the antenna characteristics. Relevant factors here are the size of the openings DK and the type of material used for the surface of the openings, it being possible for the surfaces of the openings (the walls of the openings) to be metalized for this purpose. The thermal intermediate layer ZS (thermal connecting element) may be arranged on the heat conductor WL and both may be arranged within the housing H and covered by the radome RD.

[0065] FIG. 6 shows a block diagram of method steps of the method for producing an antenna device according to an exemplary embodiment of the present invention.

[0066] The method for producing an antenna device involves: providing S1 a carrier element having at least one first strip conductor and having a second strip conductor; forming S2 at least one fastening structure, which is formed in or on the carrier element; arranging S3 at least one antenna element, which is arranged or fastened on or in the fastening structure and is connected to the first strip conductor; arranging S4 a transmitter device, which is arranged on the carrier element and is connected to the second strip conductor, and is designed to transmit a transmitter signal to the at least one antenna element and/or to receive a transmitter signal from the at least one antenna element.

[0067] Although the present invention was described in its entirety above with reference the preferred exemplary embodiment, it is not limited thereto, but may be modified in a variety of ways.