GALLIUM NITRIDE POWER TRANSISTOR

Abstract

The present disclosure relates to a Gallium Nitride (GaN) power transistor, comprising: a buffer layer; a barrier layer deposited on the buffer layer, wherein a gate region is formed on top of the barrier layer; a p-type doped GaN layer deposited on the barrier layer at the gate region; and a metal gate layer deposited on top of the p-type doped GaN layer, wherein the metal gate layer is contacting the p-type doped GaN layer to form a Schottky barrier, wherein a thickness of the p-type doped GaN layer, a metal type of the metal gate layer and a p-type doping concentration of the p-type doped GaN layer are based on a known relationship of a pGaN Schottky gate depletion region thickness with respect to a p-type doping concentration and a gate metal type.

Claims

1. A Gallium Nitride (GaN) power transistor, the GaN power transistor comprising: a buffer layer; a barrier layer deposited on the buffer layer, wherein a gate region is formed on top of the barrier layer; a p-type doped GaN layer deposited on the barrier layer at the gate region; and a metal gate layer deposited on top of the p-type doped GaN layer, wherein the metal gate layer is contacting the p-type doped GaN layer to form a Schottky barrier, wherein a thickness of the p-type doped GaN layer, a metal type of the metal gate layer and a p-type doping concentration of the p-type doped GaN layer are based on a known relationship of a pGaN Schottky gate depletion region thickness with respect to a p-type doping concentration and a gate metal type.

2. The GaN power transistor according to claim 1, wherein the thickness of the p-type doped GaN layer is smaller than 65 nanometers.

3. The GaN power transistor according to claim 1, wherein the metal gate layer is made of any one of the following metals: aluminium (Al), titanium (Ti), Titanium nitride (TiN), gold (Au), palladium (Pd), nickel (Ni), tungsten (W) or any combination thereof in a stacked way.

4. The GaN power transistor according to claim 1, wherein the p-type doping concentration of the p-type doped GaN layer is within a range of 1e18 cm.sup.−3 and 1e19 cm.sup.−3.

5. The GaN power transistor according to claim 1, wherein the p-type doped GaN layer is fully depleted in operation of the GaN power transistor.

6. The GaN power transistor according to claim 1, wherein the known relationship of the pGaN Schottky gate depletion region thickness with respect to the p-type doping concentration and the gate metal type is based on a predetermined dataset that enables a stable operation of the GaN power transistor.

7. The GaN power transistor according to claim 6, wherein the predetermined dataset enables an optimum operation of the GaN power transistor with respect to static performance, dynamic performance and gate reliability.

8. The GaN power transistor according to claim 1 configured to enable normally-off operation.

9. The GaN power transistor according to claim 1, wherein the p-type doped GaN layer and the metal gate layer are lithographically defined only in the gate region of the barrier layer.

10. The GaN power transistor according to claim 1, wherein the buffer layer comprises a GaN layer or an Aluminum Gallium Nitride (AlGaN) layer.

11. The GaN power transistor according to claim 1, wherein the barrier layer comprises an Aluminum Gallium Nitride (AlGaN) layer.

12. The GaN power transistor according to claim 1, wherein the buffer layer is formed on at least one transition layer that is formed on a silicon substrate.

13. A metal-semiconductor junction of a Gallium Nitride (GaN) power transistor, the metal-semiconductor junction comprising: a p-type doped GaN layer; and a metal gate layer deposited on top of the p-type doped GaN layer, wherein the metal gate layer is contacting the p-type doped GaN layer to form a Schottky barrier, wherein a p-type doping concentration of the p-type doped GaN layer is within a range of 1e18 cm.sup.−3 and 1e19 cm.sup.−3.

14. The metal-semiconductor junction according to claim 13, wherein a thickness of the p-type doped GaN layer is smaller than 65 nanometers.

15. The metal-semiconductor junction according to claim 13, wherein the metal gate layer is made of any one of the following metals: aluminium (Al), titanium (Ti), Titanium nitride (TiN), gold (Au), palladium (Pd), nickel (Ni), tungsten (W) or any combination thereof in a stacked way.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0062] Further embodiments of the invention will be described with respect to the following figures, in which:

[0063] FIG. 1 shows a design of a GaN power transistor 100 with Schottky barrier according to embodiments of the disclosure;

[0064] FIG. 2 shows a design of a GaN power transistor 200 with Schottky barrier according to embodiments of the disclosure;

[0065] FIG. 3 shows an equivalent circuit design 300 for the gate module of a GaN power transistor with Schottky barrier according to embodiments of the disclosure;

[0066] FIG. 4 shows an example of design guidelines according to the disclosure for the Schottky interface with respect to depletion region over doping concentration 400, according to embodiments of the disclosure;

[0067] FIG. 5 shows an exemplary performance simulation 500 of the threshold voltage stability for the pGaN Schottky gate as a function of the stress time, according to embodiments of the disclosure; and

[0068] FIG. 6 shows a design of a metal-semiconductor junction 700 of a GaN power transistor according to according to embodiments of the disclosure.

DETAILED DESCRIPTION

[0069] In the following detailed description, reference is made to the accompanying drawings, which form a part thereof, and in which is shown by way of illustration specific aspects in which the disclosure may be practiced. It is understood that other aspects may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims.

[0070] It is understood that comments made in connection with a described method may also hold true for a corresponding device or system configured to perform the method and vice versa. For example, if a specific method step is described, a corresponding device may include a unit to perform the described method step, even if such unit is not explicitly described or illustrated in the figures. Further, it is understood that the features of the various exemplary aspects described herein may be combined with each other, unless specifically noted otherwise.

[0071] The semiconductor devices and systems described herein may be implemented in wireless communication schemes, in particular communication schemes according to 5G. The described semiconductor devices may be used to produce integrated circuits and/or power semiconductors and may be manufactured according to various technologies. For example, the semiconductor devices may be utilized in logic integrated circuits, analog integrated circuits, mixed signal integrated circuits, optical circuits, memory circuits and/or integrated passives.

[0072] A Schottky barrier as described in this disclosure is a potential energy barrier for electrons formed at a metal-semiconductor junction. Schottky barriers have rectifying characteristics, suitable for use as a diode. One of the primary characteristics of a Schottky barrier is the Schottky barrier height. The Schottky barrier height depends on the combination of metal and semiconductor. Not all metal—semiconductor junctions form a rectifying Schottky barrier; a metal—semiconductor junction that conducts current in both directions without rectification, perhaps due to its Schottky barrier being too low, is called an ohmic contact.

[0073] FIG. 1 shows a design of a GaN power transistor 100 with Schottky barrier according to a first example.

[0074] The GaN power transistor 100 comprises a buffer layer 110; a barrier layer 111 deposited on the buffer layer 110, wherein a gate region 112 is formed on top of the barrier layer 111; a p-type doped GaN layer 113 deposited on the barrier layer 111 at the gate region 112; and a metal gate layer 114 deposited on top of the p-type doped GaN layer 113, wherein the metal gate layer 114 is contacting the p-type doped GaN layer 113 to form a Schottky barrier 115. A thickness of the p-type doped GaN layer 113, a metal type of the metal gate layer 114 and a p-type doping concentration of the p-type doped GaN layer 113 are based on a known relationship, e.g. a relationship 400 as shown in FIG. 4, of a pGaN Schottky gate depletion region thickness 401 with respect to a p-type doping concentration 402 and a gate metal type.

[0075] A source (S) metal layer 120 and a drain (D) metal layer 121 may be formed laterally to the barrier layer 111. Source metal layer 120 and drain metal layer 121 may be separated by the barrier layer 111 from the pGaN layer 113 and the metal gate layer 114. Source metal layer 120 and drain metal layer 121 may extend to the same height as the barrier layer 111 and hence to a lower level than the metal gate layer 114.

[0076] The buffer layer 110 may comprise a GaN layer or an Aluminum Gallium Nitride, AlGaN, layer. The barrier layer 111 may comprise an AlGaN layer.

[0077] In one example of the transistor 100, the thickness of the p-type doped GaN layer 113 may be smaller than 65 nanometers.

[0078] In one example of the transistor 100, the metal gate layer 114 may be made of one of the following metals: Al, Ti, TiN, Au, Pd, Ni, W or any combination thereof in a stacked way.

[0079] In one example of the transistor 100, the p-type doping concentration of the p-type doped GaN layer 113 may be within a range of 1e18 cm.sup.−3 and 1e19 cm.sup.−3.

[0080] In one example of the transistor 100, the p-type doped GaN layer 113 may be fully depleted in operation of the GaN power transistor 100.

[0081] In one example of the transistor 100, the known relationship (e.g. relationship 400 shown in FIG. 4) of the pGaN Schottky gate depletion region thickness 401 with respect to the p-type doping concentration 402 and the gate metal type may be based on a predetermined dataset, e.g. dataset 403 shown in FIG. 4, that enables a stable operation of the GaN power transistor 100.

[0082] In one example of the transistor 100, the predetermined dataset enables an optimum (or improved) operation of the GaN power transistor 100 with respect to static performance, dynamic performance and gate reliability.

[0083] During tests with different parameters, it was found that a suitable dataset for a pGaN Schottky gate module can be summarized as follows: [0084] (1) pGaN thickness<65 nm [0085] (2) p-type doping concentration: [1el8 cm.sup.−3−1el9 cm.sup.−3] [0086] (3) Metal type of the metal gate: Al, Ti, TiN, Au, Pd, Ni, W or any combination thereof in a stacked way

[0087] In one example of the transistor 100, the transistor 100 may be configured to enable normally-off operation.

[0088] In one example of the transistor 100, the p-type doped GaN layer 113 and the metal gate layer 114 may be lithographically defined only in the gate region of the barrier layer 111.

[0089] In one example of the transistor 100, the buffer layer 110 may be formed on at least one transition layer (e.g. layers 202, 203 as shown in the Example of FIG. 2) that is formed on a Silicon substrate (e.g. substrate 201 as shown in the Example of FIG. 2).

[0090] FIG. 2 shows a design of a GaN power transistor 200 with Schottky barrier according to a second example.

[0091] The GaN power transistor 200 may be designed similarly to the transistor 100 described above with respect to FIG. 1.

[0092] The GaN power transistor 100 comprises a buffer layer 110; a barrier layer 111 deposited on the buffer layer 110, wherein a gate region 112 is formed on top of the barrier layer 111; a p-type doped GaN layer 113 deposited on the barrier layer 111 at the gate region 112; and a metal gate layer 114 deposited on top of the p-type doped GaN layer 113, wherein the metal gate layer 114 is contacting the p-type doped GaN layer 113 to form a Schottky barrier 115. The buffer layer 110 is formed on a transition layer 203 that is formed on a nucleation layer 202. The nucleation layer 202 is formed on a Silicon substrate 201.

[0093] A thickness of the p-type doped GaN layer 113, a metal type of the metal gate layer 114 and a p-type doping concentration of the p-type doped GaN layer 113 are based on a known relationship, e.g. a relationship 400 as shown in FIG. 4, of a pGaN Schottky gate depletion region thickness 401 with respect to a p-type doping concentration 302 and a gate metal type.

[0094] A source (S) metal layer 120 and a drain (D) metal layer 121 may be formed laterally to the barrier layer 111. Source metal layer 120 and drain metal layer 121 may be separated by a passivation layer 204 from the pGaN layer 113 and the metal gate layer 114. Source metal layer 120 and drain metal layer 121 may extend to the same height as the metal gate layer 114. Alternatively, source metal layer 120 and drain metal layer 121 may extend to a lower level than the metal gate layer 114, e.g. according to the design shown in FIG. 1.

[0095] The buffer layer 110 may comprise a GaN layer or an Aluminum Gallium Nitride, AlGaN, layer. The barrier layer 111 may comprise an AlGaN layer.

[0096] In one example of the transistor 200, the thickness of the p-type doped GaN layer 113 may be smaller than 65 nanometers.

[0097] In one example of the transistor 200, the metal gate layer 114 may be made of one of the following metals: Al, Ti, TiN, Au, Pd, Ni, W or any combination thereof in a stacked way.

[0098] In one example of the transistor 200, the p-type doping concentration of the p-type doped GaN layer 113 may be within a range of 1e18 cm.sup.−3 and 1e19 cm.sup.−3.

[0099] In one example of the transistor 200, the p-type doped GaN layer 113 may be fully depleted in operation of the GaN power transistor 100.

[0100] In one example of the transistor 200, the known relationship (e.g. relationship 400 shown in FIG. 3) of the pGaN Schottky gate depletion region thickness 401 with respect to the p-type doping concentration 402 and the gate metal type may be based on a predetermined dataset, e.g. dataset 403 shown in FIG. 4, that enables a stable operation of the GaN power transistor 200.

[0101] In one example of the transistor 200, the predetermined dataset enables an optimum (or improved) operation of the GaN power transistor 100 with respect to static performance, dynamic performance and gate reliability.

[0102] During tests with different parameters, it was found that a suitable dataset for a pGaN Schottky gate module can be summarized as follows: [0103] (1) pGaN thickness<65 nm [0104] (2) p-type doping concentration: [1e18 cm.sup.−3−1el9 cm.sup.−3] [0105] (3) Metal type of the metal gate: Al, Ti, TiN, Au, Pd, Ni, W or any combination thereof in a stacked way

[0106] In one example of the transistor 200, the transistor 200 may be configured to enable normally-off operation.

[0107] In one example of the transistor 200, the p-type doped GaN layer 113 and the metal gate layer 114 may be lithographically defined only in the gate region of the barrier layer 111.

[0108] FIG. 3 shows an equivalent circuit design 300 for the gate module of a GaN power transistor with Schottky barrier according to the disclosure.

[0109] In the Schottky approach as shown in FIG. 3, a reverse-biased Schottky diode 302 is inserted in series with the pn-pGaN/AlGaN diode 301 as shown in the driving scheme 300b. This allows a massive DC gate current reduction, as illustrated in the example of FIG. 3. The series connection of the reverse-biased Schottky diode 302 with its parallel connected capacitance C.sub.W and the pn-pGaN/AlGaN diode 301 with its parallel connected capacitance C.sub.p is illustrated in the equivalent circuit 300a.

[0110] Threshold voltage instabilities (positive and negative) are observed in the Schottky approach which can make the device more prone to spurious turn-on effects (for negative V.sub.TH shift) or degrade the device on-state resistance (for positive V.sub.TH shift). A threshold voltage dynamic behavior can be observed for a pGaN Schottky gate, for example in case of positive stress voltage applied to the gate electrode.

[0111] Weak gate robustness is also observed for the Schottky approach. A time dependent dielectric breakdown (TDDB) behavior is observed, similarly to the breakage of gate dielectrics in conventional Si-based power devices. Several theories have been proposed to explain the gate failure mechanisms and one possible root cause has been identified as impact ionization effects, within the depletion region of the reversed biased Schottky diode, triggered by electrons injected from the AlGaN barrier into the pGaN layer. Tests with the electric field distribution within the pGaN layer under positive voltage applied to the gate electrode have shown that the maximum electric field is located at the metal/pGaN interface.

[0112] Most Schottky gate pGaN approaches today rely on very high doping in the pGaN layer (>5e19 cm.sup.−3). The typical thickness of the pGaN layer is, generally, between 80 nm and 250 nm. The p-type doping concentration can be extracted via conventional SIMs profile measurements.

[0113] It has been demonstrated that holes depletion and accumulation (time dependent and geometry dependent) causes threshold voltage instability. Moreover, the very high doping concentration used in the pGaN layer induces a very narrow depletion region at the metal/pGaN interface. Main drawback of this approach is that the electric field within the narrow depletion region reaches very high values (˜5-10 MV/cm) and strongly compromise the overall gate reliability. It is believed that the high electric field in the depletion region causes strong acceleration of electrons injected from the 2DEG into the pGaN layer. Those accelerated electrons can promote carrier multiplication via impact ionization effects and the presence of large number of highly energetic carriers, it is believed to create damages (percolation paths) at the metal/pGaN interface and, eventually, to compromise the overall gate reliability.

[0114] Several attempts have been investigated in the past years to improve the gate reliability of pGaN gate modules and to alleviate the threshold voltage instabilities of pGaN Schottky gate. For example, a direct correlation between the static DC gate current and the overall gate reliability has been observed. The reduction of the static gate current, unfortunately, translates into higher threshold voltage instabilities due to the presence of a large amount of floating holes in the pGaN layer that can be injected into the AlGaN barrier and/or recombine with electrons injected from the 2DEG into the pGaN layer, without being replenished by the metal gate electrode.

[0115] For the aforementioned reasons, the present disclosure presents a solution how to overcome the above described drawbacks of pGaN Schottky gate modules, which are: Large positive and negative threshold voltage instabilities; and poor gate reliability.

[0116] The solution according to the disclosure is to provide exemplary guideline optimization for the Schottky gate module of a p-Gate of a GaN power transistor. A set of precise relationship between the different dimensions and doping concentration of a pGaN gate module is provided in this disclosure that optimizes the overall performance and allows to solve the main issues of state-of-the-art pGaN Schottky gate, i.e. threshold voltage instabilities and gate reliability. A fully depleted pGaN Schottky Gate solution can be achieved by properly dimensioning the pGaN gate geometry in relation to the p-type doping concentration, for example achieved my means of Magnesium doping though any other doping can used as well.

[0117] As described above with respect to FIGS. 1 and 2, such a suitable guideline optimization strategy for a pGaN Schottky gate module can include one or more of the following features: [0118] (1) pGaN thickness<65 nm [0119] (2) p-type doping concentration: [1e18 cm.sup.−3−1el9 cm.sup.−3] [0120] (3) Metal type of the metal gate: Al, Ti, TiN, Au, Pd, Ni, W or any combination thereof in a stacked way

[0121] FIG. 4 shows an example of design guidelines according to the disclosure for the Schottky interface with respect to depletion region over doping concentration 400.

[0122] In the example of FIG. 4, the thickness of the depletion region at the metal/pGaN interface, e.g. between the layers 114 and 113 as illustrated in FIGS. 1, 2 and 6, is shown as a function of the p-type doping concentration, e.g. for Mg used as dopant element. However, any other dopant element can be used as well. The thick line 410 with symbols defines the extension of the depletion region formed at the interface between the metal gate 114 and the p-type doped GaN layer 113 underneath as a function of the p-type doping concentration used in the pGaN layer 113, and for a certain metal type of the metal gate 114. FIG. 4 also shows the dependence of the depletion region on the metal type of the metal gate 114 used to create the Schottky interface 115 with the pGaN layer 113 underneath.

[0123] FIG. 4 also depicts one horizontal line B and one vertical line A. Those two lines represent the boundaries, together with the depletion region line, of the safe operating area for a Schottky pGaN gate module. In particular, line A represent the threshold p-type doping concentration below which tunnelling events of holes injection from the metal layer into the pGaN layer, are strongly attenuated. Lowering the p-type doping concentration below this threshold value allows also a drastic reduction of the static gate current, under positive voltages applied to the gate electrode.

[0124] Line B, on the other side, represents the maximum thickness of the pGaN layer 113 that is suggested in order to have an optimized operation of the pGaN Schottky gate module. This maximum thickness is chosen according to the following main three guidelines criteria:

[0125] 1) pGaN etching process optimization: metal gate 114 and p-type doped layer 113 may be lithography defined only in the gate region 112. Metal gate 114 and p-type doped layer 113 generally undergo some masking steps followed by etching steps. Etching may be carefully controlled in order to selectively stop at the pGaN/AlGaN barrier interface 113, 111. When this etching step is not properly controlled, an unwanted etch of the AlGaN barrier 111 can occur with consequent degradation of the device performance. The p-type GaN thickness can also affect the selectivity of the etching process.

[0126] 2) Transconductance optimization: pGaN layer 113 may be minimized in order to boost the device transconductance (gm).

[0127] 3) Threshold voltage: device threshold voltage increases with increasing pGaN thickness.

[0128] Based on the following guidelines for the gate module optimization, the following range of device dimensions and doping concentration is presented in this disclosure that would allow to have an optimum (or improved) operation of the pGaN Schottky gate module. The optimum (or improved) operation is defined in terms of static performance (threshold voltage, gate current), dynamic performance (dynamic threshold voltage) and, last but not least, in terms of improved gate reliability.

[0129] In particular, FIG. 4 shows the simulated performance of a pGaN Schottky gate as a function of the voltage applied to the gate electrode and for different values of the p-type doping concentration used in the pGaN layer 113. It is possible to observe how a reduction of the p-type concentration, following the guidelines given below, allows contemporary to suppress the dynamic threshold voltage instabilities and, at the same time, to achieve a drastic reduction of the peak electric field at the metal/pGaN interface 114, 113. The reduction in the peak electric field will translate into a direct improvement in the overall gate module reliability. It is indeed believed that the main reason for Schottky pGaN gate breakdown is triggered by impact ionization events promoted and sustained by the high electric field in the Schottky depletion region.

[0130] The depletion region also depends on the metal type of the metal gate.

[0131] It has shown that a progressive reduction of the p-type concentration in the pGaN layer 113, together with the geometry optimization of the gate module, can bring outstanding advantages in terms of both threshold voltage instability and reduction of the peak electric field in the pGaN layer.

[0132] A suitable guideline optimization strategy for a pGaN Schottky gate module can be summarized as follows: [0133] 1. pGaN thickness<65 nm [0134] 2. p-type doping concentration: [1e18 cm.sup.−3−1el9 cm.sup.−3] [0135] 3. Metal type of the metal gate: Al, Ti, TiN, Au, Pd, Ni, W or any combination thereof in a stacked way

[0136] FIG. 4 shows an exemplary dataset 403 which follows these guidelines.

[0137] FIG. 5 shows an exemplary performance simulation 500 of the threshold voltage stability 501 for the pGaN Schottky gate as a function of the stress time 502.

[0138] A first graph 510 shows the performance of a pGaN Schottky gate that is designed according to the guidelines described in this disclosure, i.e. having pGaN thickness<65 nm; p-type doping concentration between [1e18 cm.sup.−3−1el9 cm.sup.−3] and metal gate type Al, Ti, TiN, Au, Pd, Ni, W or any combination thereof in a stacked way. Its threshold voltage is very stable, also for long stress times 502.

[0139] A second graph 511 shows the performance of another pGaN Schottky gate that is designed closely to the guidelines described above. The threshold voltage of graph 511 is also quite stable, small instabilities occur only after long stress times 502.

[0140] A third graph 512 and a fourth graph 513 are not designed according to the guidelines of this disclosure. Instead a common design is used relying on very high doping in the pGaN layer (>5e19 cm.sup.−3) and having a thickness of the pGaN layer between 80 nm and 250 nm. The threshold voltage of both graphs 512 and 513 shows instable behavior from the beginning.

[0141] FIG. 6 shows a design of a metal-semiconductor junction 600 of a GaN power transistor according to an example. The metal-semiconductor junction 600 may be implemented in a GaN power transistor 100 as shown in FIG. 1 or a GaN power transistor 200 as shown in FIG. 2, for example.

[0142] The metal-semiconductor junction 600 comprises: a p-type doped GaN layer 113; and a metal gate layer 114 deposited on top of the p-type doped GaN layer 113. The metal gate layer 114 is contacting the p-type doped GaN layer 113 to form a Schottky barrier 115. A p-type doping concentration of the p-type doped GaN layer 113 is within a range of 1el8 cm.sup.−3 and 1e19 cm.sup.−3.

[0143] A thickness of the p-type doped GaN layer 113 may be smaller than 65 nanometers.

[0144] The metal gate layer 114 can be made of one of the following metals: Al, Ti, TiN, Au, Pd, Ni, W or any combination thereof in a stacked way.

[0145] The thickness of the p-type doped GaN layer 113, a metal type of the metal gate layer 114 and a p-type doping concentration of the p-type doped GaN layer 113 can be based on a known relationship 400 of a pGaN Schottky gate depletion region thickness 401 with respect to a p-type doping concentration 402 and a gate metal type as shown in FIG. 4 and described above with respect to FIGS. 1 and 2.

[0146] While a particular feature or aspect of the disclosure may have been disclosed with respect to only one of several implementations, such feature or aspect may be combined with one or more other features or aspects of the other implementations as may be desired and advantageous for any given or particular application. Furthermore, to the extent that the terms “include”, “have”, “with”, or other variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term “comprise”. Also, the terms “exemplary”, “for example” and “e.g.” are merely meant as an example, rather than the best or optimal. The terms “coupled” and “connected”, along with derivatives may have been used. It should be understood that these terms may have been used to indicate that two elements cooperate or interact with each other regardless whether they are in direct physical or electrical contact, or they are not in direct contact with each other.

[0147] Although specific aspects have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific aspects shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the specific aspects discussed herein.

[0148] Although the elements in the following claims are recited in a particular sequence with corresponding labeling, unless the claim recitations otherwise imply a particular sequence for implementing some or all of those elements, those elements are not necessarily intended to be limited to being implemented in that particular sequence.

[0149] Many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the above teachings. Of course, those skilled in the art readily recognize that there are numerous applications of the invention beyond those described herein. While the embodiments of the invention has been described with reference to one or more particular embodiments, those skilled in the art recognize that many changes may be made thereto without departing from the scope of the embodiments of the invention. It is therefore to be understood that within the scope of the appended claims and their equivalents, the invention may be practiced otherwise than as specifically described herein.