SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

Abstract

The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid. The shield body system comprises a shield body and an agitation unit. The shield body has a plurality of openings to direct the process fluid flow and/or a current density distribution towards the substrate to be treated. The agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a distribution body. Alternatively or additionally, the agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a deposition chamber for chemical and/or electrolytic surface treatment.

Claims

1. A shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, wherein the shield body system comprises a shield body and an agitation unit, wherein the shield body comprises a plurality of openings to direct a process fluid flow and/or a current density distribution towards the substrate to be treated, and wherein the agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a distribution body and/or relative to a deposition chamber for chemical and/or electrolytic surface treatment.

2. The shield body system according to claim 1, wherein the shield body is positioned and/or dimensioned so that the openings of the shield body correspond to surface elements of the substrate, which are to be deposited.

3. The shield body system according to claim 1, further comprising a rotation unit configured to rotate the shield body together with the substrate on an axis relative to a distribution body and/or relative to a deposition chamber for chemical and/or electrolytic surface treatment.

4. The shield body system according to claim 1, further comprising a distribution body with a plurality of openings to direct the process fluid flow and/or the current density distribution towards the shield body, wherein the shield body is arranged next to the distribution body with a distance of 50 μm to 12 mm.

5. The shield body system according to claim 1, wherein the shield body comprises at least a return aperture configured to direct a return flow of the process fluid in an opposite direction to the direction towards the substrate.

6. The shield body system according to claim 5, wherein the at least one return aperture has an aperture surface, which is smaller than a combined openings surface of the plurality of openings of the shield body.

7. The shield body system according to claim 1, further comprising an attachment unit configured to attach the shield body to the substrate or a substrate holder holding the substrate.

8. The shield body system according to claim 1, further comprising an alignment unit configured to align the shield body relative the substrate.

9. A method of using a shield body system according to claim 1 for depositing surface elements on a substrate.

10. The method according to claim 9, wherein surface elements of the substrate at least partially have a thickness of 0.1 μm to 12 μm.

11. The method according to claim 9, wherein the surface elements are line shaped, and wherein adjacent surface elements have a distance between each other of 0.1 μm to 12 μm.

12. The method according to claim 9, wherein the surface elements are pillar shaped, and wherein adjacent surface elements have a distance between each other of 5 μm to 80 μm.

13. The method according to claim 9, wherein a shield body of the shield body system has a size essentially equal to a size of the substrate.

14. A method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid, comprising: providing a shield body, wherein the shield body comprises a plurality of openings, providing an agitation unit, wherein the agitation unit is configured to move the shield body together with the substrate vertically and/or horizontally relative to a distribution body and/or relative to a deposition chamber for chemical and/or electrolytic surface treatment, directing a process fluid flow and/or a current density distribution out of the shield body towards the substrate, and chemically and/or electrolytically treating the surface elements of the substrate.

15. The method according to claim 14, further comprising a moving of the shield body together with the substrate vertically and/or horizontally relative to a distribution body and/or relative to a deposition chamber for chemical and/or electrolytic surface treatment.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Exemplary embodiments of the disclosure will be described in the following with reference to the accompanying drawing:

[0045] FIG. 1 shows schematically and exemplarily an embodiment of a shield body system according to the disclosure for a process fluid for chemical and/or electrolytic surface treatment of a substrate.

[0046] FIG. 2 shows schematically and exemplarily a top view on a die with a plurality of circular and line shaped openings.

DETAILED DESCRIPTION OF EMBODIMENTS

[0047] FIG. 1 shows schematically and exemplarily an embodiment of a shield body system 10 for a process fluid for chemical and/or electrolytic surface treatment of a substrate 1.

[0048] The shield body system 10 comprises a shield body 2 and an agitation unit (not shown). The shield body 2 has a plurality of openings 2a to direct a process fluid flow and/or a current density distribution towards the substrate 1 to be treated. The agitation unit is configured to move the shield body 2 together with the substrate 1 vertically and/or horizontally relative to a distribution body 3. Alternatively or additionally, the agitation unit is configured to move the shield body 2 together with the substrate 1 vertically and/or horizontally relative to a deposition chamber (not shown) for chemical and/or electrolytic surface treatment.

[0049] The shield body 2 is positioned and/or dimensioned so that the openings 2a of the shield body 2 correspond to surface elements 1a of the substrate 1, which are to be treated. The number, position, size, shape, and/or the like of the shield body 2 is designed to correspond to the number, position, size, shape, and/or the like of the surface elements 1a of the substrate 1. By dimensioning and arranging the openings 2a corresponding to the surface elements 1a, an accurate treatment on the targeted surface elements 1a and a uniform electroplating of the substrate 1 is ensured. Further, the shield body 2 has approximately the size of the substrate 1 to be plated. More specifically, the shield body 2 has the size of the surface of the substrate 1 to be plated to achieve an even more uniform electroplating of the substrate 1.

[0050] The shield body system 10 further comprises a rotation unit (not shown) configured to rotate the shield body 2 together with the substrate 1 relative to the distribution body 3 and/or relative to a deposition chamber (not shown) on a parallel axis for chemical and/or electrolytic surface treatment. The rotation unit rotates the shield body 2 with the same speed, acceleration and/or the like as the substrate 1. The rotation unit allows a homogenous surface treatment (an even and thorough deposition on the surface elements 1a) by rotating the substrate 1 relative to the distribution body 3 and/or the deposition chamber. Simultaneous rotation of the shield body 2 and the substrate 1 allows the openings 2a and the surface elements 1a to stay engaged and aligned throughout the process.

[0051] The shield body system 10 further comprises a distribution body 3 with a plurality of openings 3a to direct the process fluid flow and/or a current density distribution towards the shield body 2. The shield body 2 is arranged next to the distribution body 3 with a distance of 50 μm to 12 mm. The distribution body 3 is a plate comprising an array of openings 3a for a process fluid distribution. As shown in FIG. 1, the distribution body 3 is arranged between an anode 4 and the shield body 2, at a side of the shield body 2 facing the anode 4 and at a distance of 50 μm to 12 mm to the shield body 2. Accordingly, the process fluid is firstly directed by the distribution body 3 onto the shield body 2, and therefrom passes through the openings 2a of the shield body 2, arriving onto the substrate 1. By such two-level directing of process fluid onto the substrate 1, a more accurate surface treatment on the targeted surface elements 1a is achieved.

[0052] The distribution body 3 has essentially the same size as the substrate 1, more specifically, the same size of the surface of the substrate 1 facing the distribution body 3. Accordingly, the process fluid flow and/or a current density distribution is applied to all parts of the substrate 1.

[0053] FIG. 1 shows the shield body 2 in a form of a flat plate. The flat plate shape of the shield body 2 corresponds to the shape of the substrate 1.

[0054] The shield body 2 has approximately the size of the substrate 1 to be plated. More specifically, the shield body 2 has the size of the surface of the substrate 1 to be plated.

[0055] FIG. 2 shows schematically and exemplarily a top view on a die with a plurality of circular and line shaped openings. FIG. 2 can also be considered as a top view on a shield body with a plurality of circular and line shaped openings. Further, FIG. 2 can be considered as a top view on a substrate with a plurality of circular and line shaped openings. The die, the shield body and/or the substrate are positioned and/or dimensioned so that the openings of the die, the shield body and/or the substrate correspond each other.

[0056] It has to be noted that embodiments of the disclosure are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims whereas other embodiments are described with reference to the device type claims. However, a person skilled in the art will gather from the above and the following description that, unless otherwise notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application. However, all features can be combined providing synergetic effects that are more than the simple summation of the features.

[0057] While the disclosure has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The disclosure is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed disclosure, from a study of the drawings, the disclosure, and the dependent claims.

[0058] In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single processor or other unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.