MAGNET, AND SMALL DEVICE, MICROACTUATOR, AND SENSOR THAT USE SAID MAGNET

Abstract

Provided is a magnet including a yoke portion that contains a soft magnetic material, and a magnet portion that is formed on a main surface of the yoke portion and contains a hard magnetic material. An interface of the magnet portion and the yoke portion has an uneven shape.

Claims

1. A magnet comprising: a yoke portion that contains a soft magnetic material; and a magnet portion that is formed on a main surface of the yoke portion and contains a hard magnetic material, wherein an interface of the magnet portion and the yoke portion has an uneven shape.

2. The magnet according to claim 1, wherein the degree of unevenness of the uneven shape of the interface satisfies a relationship of 1.0<degree of unevenness<2.0.

3. The magnet according to claim 1, wherein the yoke portion contains Sm.sub.2Co.sub.17 as the soft magnetic material, the magnet portion contains SmCo.sub.5 as the hard magnetic material, Sm.sub.2Co.sub.17 is formed on a main surface of SmCo.sub.5, and a crystal orientation [00L] of SmCo.sub.5 is oriented in a thickness direction of SmCo.sub.5.

4. The magnet according to claim 1, wherein the thickness of the magnet portion is 1 to 200 μm.

5. A small device that uses the magnet according to claim 1.

6. A microactuator that uses the magnet according to claim 1.

7. A sensor that uses the magnet according to claim 1.

8. The magnet according to claim 2, wherein the yoke portion contains Sm.sub.2Co.sub.17 as the soft magnetic material, the magnet portion contains SmCo.sub.5 as the hard magnetic material, Sm.sub.2Co.sub.17 is formed on a main surface of SmCo.sub.5, and a crystal orientation [00L] of SmCo.sub.5 is oriented in a thickness direction of SmCo.sub.5.

9. The magnet according to claim 2, wherein the thickness of the magnet portion is 1 to 200 μm.

10. The magnet according to claim 3, wherein the thickness of the magnet portion is 1 to 200 μm.

11. The magnet according to claim 8, wherein the thickness of the magnet portion is 1 to 200 μm.

12. A small device that uses the magnet according to claim 2.

13. A microactuator that uses the magnet according to claim 2.

14. A sensor that uses the magnet according to claim 2.

15. A small device that uses the magnet according to claim 3.

16. A microactuator that uses the magnet according to claim 3.

17. A sensor that uses the magnet according to claim 3.

18. A small device that uses the magnet according to claim 4.

19. A microactuator that uses the magnet according to claim 4.

20. A sensor that uses the magnet according to claim 4.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0019] FIG. 1 is a schematic cross-sectional view of a magnet according to an embodiment of the invention.

[0020] FIG. 2 is a schematic view of a portion that is cut out from an SEM photograph of a cross-section of the magnet according to the embodiment of the invention.

[0021] FIG. 3 is a schematic cross-sectional view of an SmCo-based magnet film according to an embodiment of the invention.

[0022] FIG. 4 is a schematic cross-sectional view of an SmCo-based magnet according to an embodiment of the invention.

[0023] FIG. 5 is a schematic view of a measurement site for confirming presence or absence of radial orientation.

[0024] FIG. 6 is a schematic cross-sectional view of a method of manufacturing the SmCo-based magnet film according to the embodiment of the invention.

[0025] FIG. 7 is a schematic cross-sectional view of a method of manufacturing an SmCo-based magnet film according to an embodiment of the invention.

[0026] FIG. 8 is a schematic cross-sectional view of a method of manufacturing an SmCo-based magnet according to an embodiment of the invention.

[0027] FIG. 9 is an X-ray diffraction profile obtained by irradiating an SmCo.sub.5 film of an SmCo-based magnet film obtained in Example 2 with X-rays.

[0028] FIG. 10 is a pole diagram obtained by executing an EBSD method with respect to an SmCo-based magnet obtained in Example 10.

DESCRIPTION OF EMBODIMENTS

<Magnet>

[0029] A magnet according to an embodiment will be described with reference to the accompanying drawings.

[0030] As illustrated in FIG. 1, a magnet 200 according to this embodiment includes a yoke portion 15 containing a soft magnetic material, and a magnet portion 17 that is formed on a main surface of the yoke portion 15 and contains a hard magnetic material.

[0031] The yoke portion 15 contains a soft magnetic material. Examples of the soft magnetic material include metal Co, metal Fe, metal Ni, and an alloy and a compound which contain the metals. Examples of the alloy include Sm.sub.2Co.sub.17 and a silicon steel. Examples of the compound include ferrite.

[0032] For example, a ratio of the soft magnetic material contained in the yoke portion 15 may be 80% by mass or more, 85% by mass or more, 90% by mass or more, or 95% by mass or more.

[0033] The thickness of the yoke portion 15 is not particularly limited, and can be appropriately selected in correspondence with applications, but can be set to, for example, 0.0010 to 1 mm.

[0034] The magnet portion 17 contains a hard magnetic material. Examples of the hard magnetic material include SmCo.sub.5, Sm.sub.5Fe.sub.17 (an alloy of Sm and Fe with an Nd.sub.5Fe.sub.17 type crystal structure), SmFe.sub.7 (an alloy of Sm and Fe with a TbCu.sub.7 type crystal structure), Sm.sub.2Fe.sub.17N.sub.3 (an alloy of Sm, Fe, and N with a Pr.sub.2Mn17C.sub.1.77 type crystal structure), SmFe.sub.12 (an alloy of Sm and Fe with a ThMn.sub.12 type crystal type structure), and Nd.sub.2Fe.sub.14B (an alloy of Nd, Fe, and B with an Nd.sub.2Fe.sub.14B crystal structure). Atomic ratios of atoms contained in the alloys may deviate from a stoichiometric ratio.

[0035] For example, a ratio of the hard magnetic material contained in the magnet portion 17 may be 80% by mass or more, 85% by mass or more, 90% by mass or more, or 95% by mass or more.

[0036] The thickness of the magnet portion 17 is preferably 1 μm or more from the viewpoint that the surface magnetic flux density of the magnet 200 tends to be further improved, more preferably 1 μm or more, and still more preferably 5 μm or more. The thickness of the magnet portion 17 is preferably 200 μm or less from the viewpoint that the magnet 200 can be preferably used in a small device, more preferably 100 μm or less, and still more preferably 20 μm or less. The thickness of the magnet portion 17 can be measured by embedding the magnet 200 in a resin, polishing the resultant obtained sample to expose a cross-section of the magnet 200 from the resin, and observing the exposed cross-section of the magnet 200 with a scanning electron microscope (SEM).

[0037] An interface of the magnet portion 17 and the yoke portion 15 has an uneven shape. The shape of the interface can be measured by embedding the magnet 200 in a resin, polishing the resultant obtained sample to expose a cross-section of the magnet 200 from the resin, and observing the exposed cross-section of the magnet 200 with a scanning electron microscope (SEM).

[0038] The degree of unevenness of the interface of the magnet portion 17 and the yoke portion 15 preferably satisfies a relationship of 1.0<degree of unevenness<2.0, more preferably a relationship of 1.15<degree of unevenness<1.6, and still more preferably a relationship of 1.2<degree of unevenness<1.5. When the degree of unevenness exceeds 1.0, a magnetic flux density of a convex portion can be made to be larger than a magnetic flux density of a concave portion. When the degree of unevenness is less than 2.0, there is a tendency that a heat treatment temperature in a heat treatment process of manufacturing the magnet 200 can be lowered, and a time can be shortened. Accordingly, decomposition of the magnet portion 17 can be suppressed, and the magnetic flux density is further improved.

[0039] The degree of unevenness of the interface of the magnet portion 17 and yoke portion 15 can be measured by observing the interface with a scanning electron microscope (SEM). Specifically, the magnet 200 is embedded in a resin, and the resultant obtained sample is polished to expose a cross-section of the magnet 200 from the resin. The cross-section is observed with an SEM to obtain a backscattered electron image. An acceleration voltage when obtaining the backscattered electron image is set to 10 to 15 kV, and a working distance (WD) is set to 10 to 15 mm A portion (rectangle) to be provided for analysis is cut out from the obtained backscattered electron image, and the degree of unevenness is calculated by analyzing the cut-out image. FIG. 2 is a schematic view of a portion that is cut out from an SEM photograph (backscattered electron image) of a cross-section of the magnet 200. As illustrated in FIG. 2, cutting-out of the backscattered electron image is performed so that any one side of the cut-out image and a side opposite to the side intersect an interface B1 of the magnet portion 17 and the yoke portion 15 (b1 and b2), and the interface B1 is placed between the remaining two sides. In addition, cutting-out of the backscattered electron image is performed so that a length of a straight line connecting b1 and b2 to be described later becomes 100 μm or more. The cut-out image is subjected to image quality adjustment, binarization processing, and edge (contour) extraction processing. Then, a length from one end b1 to the other end b2 of the interface B1 in the cut-out image is measured. In addition, a length of a straight line connecting b1 and b2 is measured. As a reference of the length, a length displayed in a scale bar is used. The degree of unevenness can be calculated by dividing the length of the interface B1 by the length of the straight line connecting b1 and b2. A measurement magnification is 1000 times. The number of sites for observation by the SEM is set to two or more so as not to analyze only a part. The degree of unevenness is set to an average value of the degree of unevenness obtained from each of images of two or more sites.

[0040] Applications of the magnet 200 are not particularly limited, and the magnet 200 is suitable for, for example, a small device since the surface magnetic flux density is high. As the small device, a micromotor, a microactuator, and a sensor are suitable.

<SmCo-Based Magnet Film>

[0041] As an example of the magnet according to the embodiment, an SmCo-based magnet film according to an embodiment will be described. The SmCo-based magnet film according to the embodiment will be described with reference to the accompanying drawings.

[0042] As illustrated in FIG. 3, an SmCo-based magnet film 100 (hereinafter, referred to as “magnet film 100”) according to this embodiment includes an Mo substrate 10, an Sm.sub.2Co.sub.17 film 20 formed on the Mo substrate 10, and an SmCo.sub.5 film 30 formed on the Sm.sub.2Co.sub.17 film 20. In the magnet film 100, the Sm.sub.2Co.sub.17 film 20 corresponds to the yoke portion, and the SmCo.sub.5 film 30 corresponds to the magnet portion.

[0043] The Mo substrate 10 is a metal Mo plate. The purity of Mo in the Mo substrate may be 99% by mass or more, or 99.998% by mass or more. Another base material may be provided below the Mo substrate 10.

[0044] The thickness of the Mo substrate 10 is not particularly limited and can be appropriately selected in correspondence with applications, but can be set to, for example, 0.0010 to 0.5 mm.

[0045] The Sm.sub.2Co.sub.17 film 20 contains Sm.sub.2Co.sub.17 as a main phase. Sm.sub.2Co.sub.17 is an alloy of Sm and Co with a Th.sub.2Zn.sub.17 type crystal structure. A ratio between Sm atoms and Co atoms in Sm.sub.2Co.sub.17 may deviate from a stoichiometric ratio. The ratio between the Sm atoms and the Co atoms in Sm.sub.2Co.sub.17 may not be the stoichiometric ratio when adding various elements, for example, for improvement and the like of magnetic characteristics. Therefore, as long as Sm.sub.2Co.sub.17 has the Th.sub.2Zn.sub.17 type crystal structure, the ratio between the Sm atoms and the Co atoms may deviate from the stoichiometric ratio.

[0046] In this specification, “as a main phase” represents that a mass ratio in a film is the largest. The Sm.sub.2Co.sub.17 film 20 may include a phase different from Sm.sub.2Co.sub.17, for example, another crystal phase and a grain boundary phase. A ratio of Sm.sub.2Co.sub.17 in the Sm.sub.2Co.sub.17 film 20 may be, for example, 70% by mass or more, 80% by mass or more, 90% by mass or more, or 95% by mass or more.

[0047] The thickness of the Sm.sub.2Co.sub.17 film 20 is not particularly limited, and can be appropriately selected in correspondence with applications, but can be set to, for example, 1 to 100 μm. The thickness of the Sm.sub.2Co.sub.17 film 20 can be measured by embedding the magnet film 100 with a resin, polishing the resultant obtained sample to expose a cross-section of the magnet film 100 from the resin, and observing the exposed cross-section of the magnet film 100 with a scanning electron microscope (SEM).

[0048] The SmCo.sub.5 film 30 contains SmCo.sub.5 as a main phase. SmCo.sub.5 is an alloy of Sm and Co with a CaCu.sub.5 type crystal structure. A ratio between Sm atoms and Co atoms in SmCo.sub.5 may deviate from a stoichiometric ratio. The ratio between the Sm atoms and the Co atoms in SmCo.sub.5 may not be the stoichiometric ratio when adding various elements, for example, for improvement and the like of magnetic characteristics. Therefore, as long as SmCo.sub.5 has the CaCu.sub.5 type crystal structure, the ratio between the Sm atoms and the Co atoms may deviate from the stoichiometric ratio.

[0049] The SmCo.sub.5 film 30 may include a phase different from SmCo.sub.5, for example, another crystal phase and a grain boundary phase. A ratio of SmCo.sub.5 in the SmCo.sub.5 film 30 may be, for example, 70% by mass or more, 80% by mass or more, 90% by mass or more, or 95% by mass or more. Examples of the different phase include an Sm-rich phase in which a content ratio of Sm is higher in comparison to SmCo.sub.5.

[0050] A crystal orientation [00L] of the SmCo.sub.5 film 30 is oriented in a thickness direction of the SmCo.sub.5 film, that is, in a direction perpendicular to a film surface A1. L is an any natural number. L indicates the same direction in any case. For example, L is 2.

[0051] In a case where the crystal orientation [00L] of the SmCo.sub.5 film is oriented in the thickness direction of the SmCo.sub.5 film, this case represents that the degree of orientation defined by Expression (1) is 50% or more.

[0052] The degree of orientation is based on a vector-corrected Lotgering method, and represents a ratio of the sum of diffraction peaks based on a crystal orientation [00L] component to the sum of diffraction peaks based on a crystal plane (hk1) of the SmCo.sub.5 film. From the viewpoint that the surface magnetic flux density of the magnet film 100 is further improved, the degree of orientation is preferably 60% or more, more preferably 70% or more, and still more preferably 75% or more.

[0053] In Expression (1), I represents the intensity of a diffraction peak based on a crystal plane (hk1) when irradiating the SmCo.sub.5 film 30 with X-rays. Each diffraction peak pertains to any one crystal plane indicated by mirror indexes. Examples of a crystal plane of the SmCo.sub.5 film include a (002) plane, a (111) plane that is oblique to the (002) plane, a (110) plane that is perpendicular to the (002) plane, and the like in a case where 2θis 30° to 60°.

[0054] In the following Expression (1), a numerator of a fraction on a right side is a value obtained by totaling the product of the intensity I of each peak and a vector correction coefficient β given to a crystal plane of each peak with respect to each diffraction peak of the SmCo.sub.5 film which is observed in a range of 2θ=30° to 60°.

[0055] The vector correction coefficient β is cosine (cosθ) of an angle θ made between a (00L) plane that is a reference plane, and each crystal plane (hk1), and is a value different for each crystal plane (hk1) as described later.

[0056] On the other hand, a denominator of the fraction of the right side is the sum of the intensity I of each diffraction peak of the SmCo.sub.5 film in the range of 2θ=30° to 60°.

[00001]$\left[\mathrm{Mathematical}\mathrm{Formula}1\right]$$\begin{array}{cc}\mathrm{Degree}\mathrm{of}\mathrm{orientation}\left(\%\right)=\frac{\underset{2\theta =30°}{\overset{2\theta =60°}{.Math.}}\beta .Math.I\left(\mathrm{hkl}\right)}{\underset{2\theta =30°}{\overset{2\theta =60°}{.Math.}}I\left(\mathrm{hkl}\right)}\times 100& \left(1\right)\end{array}$

[0057] From the viewpoint that the surface magnetic flux density of the magnet film 100 is further improved, the thickness of the SmCo.sub.5 film 30 is preferably 1 μm or more, more preferably 2 μm or more, and still more preferably 5 μm or more. An upper limit value of the thickness of the SmCo.sub.5 film 30 is not particularly limited, and may be, for example, 200 μm or less, 100 μm or less, or 20 μm or less. The thickness of the SmCo.sub.5 film 30 can be measured by embedding the magnet film 100 with a resin, polishing the resultant obtained sample to expose a cross-section of the magnet film 100 from the resin, and observing the exposed cross-section of the magnet film 100 with a scanning electron microscope (SEM).

[0058] A port or the entirety of the film surface A1 on a side opposite to a surface that is in contact with the Sm.sub.2Co.sub.17 film 20 in the SmCo.sub.5 film 30 may be covered or may with Sm.sub.2O.sub.3, or may not be covered with Sm.sub.2O.sub.3.

[0059] A total thickness of the Sm.sub.2Co.sub.17 film 20 and the SmCo.sub.5 film 30 is not particularly limited, and can be appropriately changed in correspondence with applications, but the total thickness may be, for example, 0.002 to 0.2 mm.

[0060] The magnet film 100 may not include the Mo substrate 10. For example, the Mo substrate may be removed by etching or the like after manufacturing.

[0061] The magnet film 100 may include a Co substrate instead of the Mo substrate 10. The purity of Co in the Co substrate may be similar to the purity of Mo in the Mo substrate. The thickness of the Co substrate may be similar to the thickness of the Mo substrate.

[0062] A planar shape of the magnet film 100 is not particularly limited, and can be appropriately set in correspondence with applications. A shape of the magnet film 100 when viewed from a Z-axis direction may be, for example, a square shape, a rectangular shape, and a circular shape. In a case where the shape of the magnet film 100 when viewed from the Z-axis direction is the square shape, a length of one side thereof may be, for example, 0.1 to 100 mm. In a case where the shape of the magnet film 100 when viewed from the Z-axis direction is the rectangular shape, a length in a long side direction may be, for example, 1 to 100 mm, and a length in a short side direction may be, for example, 0.1 to 50 mm When the shape of the magnet film 100 when viewed from the Z-axis direction is the circular shape, a diameter thereof may be, for example, 0.1 to 50 mm.

[0063] The surface magnet flux density of the magnet film 100 is preferably 5 mT or more, more preferably 7 mT or more, and still more preferably 10 mT or more. The surface magnetic flux density of the magnet film 100 can be measured by bringing a probe of a Hall element into contact with the film surface A1 of the SmCo.sub.5 film of the magnet film 100 to trace the film surface A1, and converting an output voltage into a magnet flux density.

[0064] Applications of the magnet film 100 are not particularly limited, and from the viewpoint that the magnet film 100 has a high surface magnetic flux density, for example, a sensor, a micromotor, and a microactuator are suitable. The applications of the magnet film 100 are not particularly limited, and from the viewpoint that the magnet film 100 has a high surface magnetic flux density, a small device is suitable.

(Operational Effect)

[0065] The magnet film 100 includes the Sm.sub.2Co.sub.17 film 20 that has saturation magnetization higher than that of SmCo.sub.5 and is soft magnetic. According to this, the Sm.sub.2Co.sub.17 film 20 operates as a back yoke that collects a magnetic flux. In addition, since the crystal orientation [00L] of the SmCo.sub.5 film 30 is oriented in the thickness direction of the SmCo.sub.5 film 30, that is, the crystal orientation [00L] that is an axis of easy magnetization of SmCo.sub.5 and a thickness direction (direction perpendicular to the film surface A1 (Z-axis direction)) of the SmCo.sub.5 film 30 match each other, the surface magnetic flux density of the magnet film 100 becomes high. In addition, since SmCo.sub.5 has a Curie point of 700° C. or higher, thermal stability is excellent.

<Cylindrical SmCo-Based Magnet>

[0066] As an example of the magnet according to the embodiment, description will be given of a cylindrical SmCo-based magnet according to an embodiment with reference to the accompanying drawings.

[0067] FIG. 4 is a schematic view of a cross-section perpendicular to an axial direction of a cylindrical SmCo-based magnet 300 (hereinafter, also referred to as “magnet 300”) according to this embodiment. The magnet 300 includes a Co base material 12, an Sm.sub.2Co.sub.17 film 20 that is formed on the Co base material 12, and an SmCo.sub.5 film 30 that is formed on the Sm.sub.2Co.sub.17 film 20. In the magnet 300, the Co base material 12 and the Sm.sub.2Co.sub.17 film 20 corresponds to the yoke portion, and the SmCo.sub.5 film 30 corresponds to the magnet portion.

[0068] A diameter of the Co base material 12 is not particularly limited, and can be appropriately selected in correspondence with applications, but the diameter can be set to, for example, 0.1 to 2.0 mm. The purity of Co in the Co base material 12 may be similar to the purity of Mo in the Mo substrate of the magnet film 100 according to the above-described embodiment.

[0069] The Sm.sub.2Co.sub.17 film 20 and the SmCo.sub.5 film 30 according to this embodiment may be similar to the Sm.sub.2Co.sub.17 film 20 and the SmCo.sub.5 film 30 in the magnet film 100 according to the above-described embodiment.

[0070] From the viewpoint that the surface magnetic flux density of the magnet 300 is further improved, it is preferable that a crystal orientation [00L] of the SmCo.sub.5 film 30 is radially oriented in the magnet 300. Presence or absence of the radial orientation can be confirmed as follows. Specifically, the magnet 300 is embedded in a resin. A part of the resin is polished to expose a cross-section perpendicular to an axial direction of the cylindrical magnet 300 from the resin. In SmCo.sub.5 of the exposed cross-section, orientation of the crystal orientation of SmCo.sub.5 is measured by an electron back scatter diffraction patterns (EBSD) method. As illustrated in FIG. 5, in SmCo.sub.5 of an exposed cross-section having an approximately circular shape, a measurement site is set to totally four sites including a site Y1 that is spaced apart in a Y direction perpendicular to a normal direction at the center of gravity of the cross-section, a site Y2 that is spaced apart in a −Y direction opposite to the Y direction, a site X1 that is spaced apart in an X direction perpendicular to the Y direction, and a site X2 that is spaced apart in a −X direction opposite to the X direction. In the Y1, a pole diagram of the crystal orientation [00L] of SmCo.sub.5 in a case of observing the Y1 in the −Y direction with an XZ plane set as the front is obtained. In the Y2, a pole diagram of the crystal orientation [00L] of SmCo.sub.5 in a case of observing the Y2 in the Y direction with the XZ plane set as the front is obtained. In the X1, a pole diagram of the crystal orientation [00L] of SmCo.sub.5 in a case of observing the X1 in the −X direction with a YZ plane set as the front is obtained. In the X2, a pole diagram of the crystal orientation [00L] of SmCo.sub.5 in a case of observing the X2 in the X direction with the YZ plane set as the front is obtained. The pole diagrams are diagrams showing a crystal orientation with a stereo projection method. In each of the pole diagrams, in a case where a dot is placed in the center, it is determined that the crystal orientation [00L] of SmCo.sub.5 is radially oriented in the cylindrical magnet 300.

[0071] A height of the magnet 300 may be, for example, 5 to 30 mm. A diameter of the magnet 300 may be, for example, 0.5 to 3 mm. The surface magnetic flux density of the magnet 300 may be similar to that of the magnet film 100. Applications of the magnet 300 may be similar to that of the magnet film 100.

<Method of Manufacturing SmCo-Based Magnet Film>

FIRST EMBODIMENT

[0072] Next, a method of manufacturing an SmCo-based magnet film according to a first embodiment will be described in detail. The method of manufacturing the SmCo-based magnet film according to this embodiment, for example, may be a method including a process of immersing the Mo substrate 10 in a first plating bath containing an Sm source and a Co source, and forming the Sm.sub.2Co.sub.17 film on at least one main surface of the Mo substrate 10 by an electrolytic plating method (hereinafter, also referred to as “first electrolytic plating process”), a process of immersing an obtained stacked film 50 in a second plating bath containing the Sm source and the Co source and forming a non-oriented SmCo.sub.5 film at least on a main surface opposite to the main surface that is in contact with the Mo substrate 10 in the Sm.sub.2Co.sub.17 film by an electrolytic plating method (hereinafter, also referred to as “second electrolytic plating process”), and a process of heating an obtained alloy film. In the method, a molar ratio of the Co source to the Sm source in the second plating bath is smaller than a molar ratio of the Co source to the Sm source in the first plating bath.

(First and Second Electrolytic Plating Processes)

[0073] FIG. 6 is a schematic cross-sectional view of the method of manufacturing the SmCo-based magnet film according to an embodiment. In the first electrolytic plating process, the Sm.sub.2Co.sub.17 film 20 is formed on a main surface of the Mo substrate 10 illustrated in FIG. 6(a) by an electrolytic plating method, and the stacked film 50 including the Mo substrate 10 and the Sm.sub.2Co.sub.17 film 20 as illustrated in FIG. 6(b) is obtained. In FIG. 6(b), the Sm.sub.2Co.sub.17 film is illustrated on only one main surface of the Mo substrate 10, but the Sm.sub.2Co.sub.17 film may be formed on the other main surface of the Mo substrate 10 and a side surface of the Mo substrate 10.

[0074] In the second electrolytic plating process, a non-oriented SmCo.sub.5 film is formed on at least a main surface opposite to the main surface that is in contact with the Mo substrate 10 in the Sm.sub.2Co.sub.17 film. According to this, an alloy film 70 including the Mo substrate 10, the Sm.sub.2Co.sub.17 film 20, and a non-oriented SmCo.sub.5 film 40 in this order as illustrated in FIG. 6(c) is obtained. In FIG. 6(c), the non-oriented SmCo.sub.5 film is illustrated only on the main surface opposite to the main surface that is in contact with the Mo substrate 10 in the Sm.sub.5Co.sub.17 film, but the non-oriented SmCo.sub.5 film may be formed on the other main surface of the Mo substrate 10 and a side surface of the Mo substrate 10.

[0075] In the first electrolytic plating process, the Mo substrate 10 is immersed in a plating bath containing an Sm source and a Co source, the Mo substrate 10 is set as a cathode, and a current is caused to flow between the cathode and an anode. Accordingly, Sm ions and Co ions reductively precipitate on the main surface of the Mo substrate 10, and the Sm.sub.2Co.sub.17 film 20 is formed on the main surface of the Mo substrate 10.

[0076] In the second electrolytic plating process, the stacked film 50 is immersed in a plating bath containing the Sm source and the Co source, the stacked film 50 is set as a cathode, and a current is caused to flow between the cathode and an anode. According to this, Sm ions and Co ions reductively precipitate on the main surface of the Sm.sub.2Co.sub.17 film 20, and the non-oriented SmCo.sub.5 film 40 is formed on the main surface of the Sm.sub.2Co.sub.17 film 20.

[0077] The plating bath in the first and second electrolytic plating processes may be a molten salt of the Sm source, the Co source, and an inorganic salt other than the Sm source.

[0078] Examples of the Sm source include SmCl.sub.3 and SmF.sub.3. Examples of the Co source include CoCl.sub.2 and CoF.sub.2. With regard to the Sm source and the Co source, one kind may be used alone or two or more kinds may be used in combination.

[0079] Examples of an inorganic salt other than the Sm source and the Co source include KCl, LiCl, and NaCl. With regard to the inorganic salts, one kind can be used alone, or two or more kinds can be used in combination.

[0080] The molar ratio of the Co source to the Sm source in the first electrolytic plating process may be 1.3 or more, and preferably 1.4 or more from the viewpoint of efficiently forming the Sm.sub.2Co.sub.17 film 20. The molar ratio of the Co source to the Sm source in the first electrolytic plating process may be 1.5 or less.

[0081] The molar ratio of the Co source to the Sm source in the second electrolytic plating process may be 1.1 or less, and preferably 1.0 or less from the viewpoint of efficiently forming the SmCo.sub.5 film 40. The molar ratio of the Co source to the Sm source in the second electrolytic plating process may be 0.9 or more.

[0082] A ratio of the Sm source to the Sm source, the Co source, and the inorganic salt other than the Sm source and the Co source may be, for example, 0.05 to 2 mol % on the basis of the sum of the number of moles of the Sm source and the Co source contained in the plating bath, and the number of moles of the inorganic salt, which is contained in the plating bath, other than the Sm source and the Co source. A ratio of the Co source to the Sm source, the Co source, and the inorganic salt other than the Sm source and the Co source may be, for example, 0.025 to 1 mol % on the basis of the sum of the number of moles of the Sm source and the Co source contained in the plating bath, and the number of moles of the inorganic salt, which is contained in the plating bath, other than the Sm source and the Co source.

[0083] For example, the plating bath may be adjusted by drying the inorganic salt for dehydration, heating the inorganic slat to a plating temperature to be described later to melt the inorganic salt, and adding the Sm source and the Co source to the molten inorganic salt.

[0084] A material of the anode that is used in the first and second electrolytic plating process is not particularly limited as long as the material is used as the anode in electrolytic plating, and examples thereof include graphite, glassy carbon, and Mo. A shape of the anode is not particularly limited, and may be, for example, a rectangular parallelepiped shape. In a case where the anode has the rectangular parallelepiped shape, the thickness of the anode may be, for example, 0.1 to 10 mm, a length in a long side direction may be, for example, 10 to 100 mm, and a length in a short side direction may be, for example, 1 to 50 mm.

[0085] A plating temperature in the first and the second electrolytic plating processes is not particularly limited as long as the temperature is equal to or higher than a melting temperature of the inorganic salt, and from the viewpoint that the Sm.sub.2Co.sub.17 film 20 and the non-oriented SmCo.sub.5 film 40 are efficiently formed, the plating temperature is preferably 400° C. or higher, more preferably 500° C. or higher, and still more preferably 600° C. or higher. Here, the plating temperature represents a temperature of the plating bath during plating.

[0086] An electrolysis type of the first and second electrolytic plating processes may be a constant current. From the viewpoint that the Sm.sub.2Co.sub.17 film 20 and the non-oriented SmCo.sub.5 film 40 are efficiently formed, a current value in the electrolytic plating processes is preferably 0.05 A or more, more preferably 0.1 A or more, and still more preferably 0.2 A or more.

[0087] A plating time in the first and second electrolytic plating processes can be appropriately changed in correspondence with the current value as long as the Sm.sub.2Co.sub.17 film 20 and the non-oriented SmCo.sub.5 film 40 can be formed in a desired thickness. It is not necessary to set the plating time to be longer than necessary from the viewpoint of efficiency, and the plating time may be, for example, 1 to 60 minutes.

[0088] It is preferable that the Sm.sub.2Co.sub.17 film 20 contains Sm.sub.2Co.sub.17 as a main phase. The Sm.sub.2Co.sub.17 film 20 may include a crystal phase (different phase) different from the main phase or a grain boundary. For example, a ratio of the main phase may be 50% by mass or more, 70% by mass or more, or 90% by mass or more. Examples of the different phase include an Sm-rich phase in which a content ratio of Sm is higher in comparison to Sm.sub.2Co.sub.17.

[0089] It is preferable that the non-oriented SmCo.sub.5 film 40 contains SmCo.sub.5 as a main phase. The non-oriented SmCo.sub.5 film 40 may include a crystal phase (different phase) different from the main phase or a grain boundary. For example, a ratio of the main phase may be 50% by mass or more, 70% by mass or more, or 90% by mass or more. Examples of the different phase include an Sm-rich phase in which a content ratio of Sm is higher in comparison to SmCo.sub.5.

[0090] The obtained alloy film 70 may be washed before a heating process to be described later. A washing method is not particularly limited, and examples thereof include an organic solvent such as ethanol and water.

(Heating Process)

[0091] In the heating process, the alloy film 70 is heated until reaching a holding temperature, the alloy film 70 is heated at the holding temperature while applying a magnet filed in a direction perpendicular to a main surface of the alloy film 70, and the alloy film 70 is cooled down while applying a magnetic field in a direction perpendicular to the main surface of the alloy film 70. According to this, the orientation of the crystal orientation [00L] of the non-oriented SmCo.sub.5 film 40 varies, and the SmCo.sub.5 film 30 in which the crystal orientation [00L] is oriented in a thickness direction of the SmCo.sub.5 film is formed from the non-oriented SmCo.sub.5 film 40.

[0092] A temperature-rising rate in the heating process is not particularly limited, and may be, for example, 0.1 to 100° C./second. From the viewpoint that the surface magnetic flux density of the magnet film 100 is further improved, the holding temperature is preferably 800° C. or higher, more preferably 850° C. or higher, and still more preferably 900° C. or higher. From the viewpoint that the surface magnetic flux density of the magnet film 100 is further improved, a temperature-dropping rate is preferably 5° C./second or more, more preferably 10° C./second or more, and still more preferably 20° C./second or more. The applied magnet field during the temperature holding process and the cooling process is not particularly limited, and may be, for example, 2 to 3 T.

[0093] From the viewpoint that a decrease in the surface magnetic flux density of the SmCo.sub.5 film 30 is further suppressed, a holding time in the heating process is preferably 60 seconds or shorter, more preferably 30 seconds or shorter, and still more preferably 15 seconds or shorter.

[0094] An atmosphere in the heating process is not particularly limited, but an inert gas atmosphere is preferable from the viewpoint of suppressing oxidization, and examples of the inert gas include Ar and N.sub.2.

SECOND EMBODIMENT

[0095] A method of manufacturing an SmCo-based magnet film according to another embodiment will be described. For example, the method of manufacturing the SmCo-based magnet film according to this embodiment may be a method including an electrolytic plating process of immersing a Co substrate 12 in a plating bath containing an Sm source to form an SmCo.sub.2 film 25 on at least one main surface of the Co substrate 12 by an electrolytic plating method, and a process of heating an obtained stacked film 51.

[0096] FIG. 7 is a schematic cross-sectional view of a method of manufacturing an SmCo-based magnet film according to an embodiment. In an electrolytic plating process, the SmCo.sub.2 film 25 is formed on a main surface of the Co substrate 12 illustrated in FIG. 7(a) by an electrolytic plating method to obtain the stacked film 51 including the Co substrate 12 and the SmCo.sub.2 film 25 as illustrated in FIG. 7(b).

[0097] It is preferable that the SmCo.sub.2 film 25 includes SmCo.sub.2 as a main phase. SmCo.sub.2 is an alloy of Sm and Co which has an MgCu.sub.2 type crystal structure. A ratio between Sm atoms and Co atoms in SmCo.sub.2 may deviate from a stoichiometric ratio. The ratio between the Sm atoms and the Co atoms in SmCo.sub.2 may not be the stoichiometric ratio when adding various elements, for example, for improvement and the like of magnetic characteristics. Therefore, as long as SmCo.sub.2 has the MgCu.sub.2 type crystal structure, the ratio between the Sm atoms and the Co atoms may deviate from the stoichiometric ratio.

[0098] The SmCo.sub.2 film 25 may include a crystal phase (different phase) different from the main phase or a grain boundary. For example, a ratio of the main phase may be 50% by mass or more, 70% by mass or more, or 90% by mass or more. Examples of the different phase include an Sm-rich phase in which a content ratio of Sm is higher in comparison to SmCo.sub.2.

[0099] In FIG. 7(b), the SmCo.sub.2 film 25 is illustrated on only one main surface of the Co substrate 12, but the SmCo.sub.2 film 25 may be formed on the other main surface of the Co substrate 12 and a side surface of the Co substrate 12.

[0100] In the electrolytic plating process, the Co substrate 12 is immersed in a plating bath containing an Sm source, the Co substrate 12 is set as a cathode, and a current is caused to flow between the cathode and an anode. Accordingly, Sm ions reductively precipitate on the main surface of the Co substrate 12, and the SmCo.sub.2 film 25 is formed on the main surface of the Co substrate 12.

[0101] The plating bath in the electrolytic plating process may be a molten salt of the Sm source and an inorganic salt other than the Sm source.

[0102] As the Sm source and the inorganic salt other than the Sm source, a similar Sm source and a similar inorganic salt other than the Sm source as in the method of manufacturing the SmCo-based magnet film according to the first embodiment can be used.

[0103] A ratio of the Sm source in the Sm source and the inorganic salt other than the Sm source may be, for example, 0.05 to 2 mol % on the basis of the sum of the number of moles of the Sm source contained in the plating bath and the number of moles the inorganic salt, which is contained in the plating bath, other than the Sm source.

[0104] For example, the plating bath may be adjusted by drying the inorganic salt for dehydration, heating the inorganic slat to a plating temperature to be described later to melt the inorganic salt, and adding the Sm source to the molten inorganic salt.

[0105] A material and a shape of the anode that is used in the electrolytic plating process may be similar as in the method of manufacturing the SmCo-based magnet film according to the first embodiment.

[0106] The plating temperature in the electrolytic plating process is not particularly limited as long as the plating temperature is equal to or higher than a melting temperature of the inorganic salt, and from the viewpoint of efficiently forming the SmCo.sub.2 film 25, the plating temperature is preferably 400° C. or higher, more preferably 500° C. or higher, and still more preferably 600° C. or higher. Here, the plating temperature represents a temperature of the plating bath during plating.

[0107] An electrolysis type of the electrolytic plating process may be a constant current. A current value in the electrolytic plating process may be similar as in the electrolytic plating process in the method of manufacturing the SmCo-based magnet film according to the first embodiment.

[0108] A plating time in the electrolytic plating process can be appropriately changed in correspondence with the current value as long as the SmCo.sub.2 film 25 can be formed in a desired thickness. It is not necessary to set the plating time to be longer than necessary from the viewpoint of efficiency, and the plating time may be, for example, 1 to 120 minutes.

[0109] The obtained stacked film 51 may be washed before a heating process to be described later. A washing method is not particularly limited, and examples thereof include an organic solvent such as ethanol and water.

(Heating Process)

[0110] In a heating process, the stacked film 51 is heated until reaching a holding temperature, and is cooled down. According to this, SmCo.sub.2 and Co react with each other, and the Sm.sub.2Co.sub.17 film 20 and the SmCo.sub.5 film 30 in which the crystal orientation [00L] is oriented in a thickness direction of the SmCo.sub.5 film are formed from the Co substrate 12 and the SmCo.sub.2 film 25.

[0111] A temperature-rising rate, a holding temperature, and a temperature-dropping rate in the heating process may be similar as in the heating process in the method of manufacturing the SmCo-based magnet film according to the first embodiment.

[0112] The holding time in the heating process may be one hour or longer, and 36 hours or shorter.

[0113] An atmosphere in the heating process may be similar as in the method of manufacturing the SmCo-based magnet film according to the first embodiment.

[0114] The magnet film can be used such as in an MEMS device that is an actuator for driving of a lens of a smartphone, and the like.

<Method of Manufacturing Cylindrical SmCo-based Magnet>

[0115] A method of manufacturing a cylindrical SmCo-based magnet according to an embodiment will be described in detail. For example, the method of manufacturing the cylindrical SmCo-based magnet according to this embodiment may be a method including a reaction diffusion process of immersing a Co base material 12 in a bath containing an Sm source to form an SmCo.sub.2 film 25 on the Co base material 12 by reaction diffusion, and a process of heating an obtained stacked body 52.

[0116] FIG. 8 is a schematic cross-sectional view of the method of manufacturing the cylindrical SmCo-based magnet according to the embodiment. In the reaction diffusion process, the SmCo.sub.2 film 25 is formed on the Co base material 12 illustrated in FIG. 8(a) through reaction diffusion, and the stacked body 52 including the Co base material 12 and the SmCo.sub.2 film 25 as illustrated in FIG. 8(b) is obtained.

[0117] It is preferable that the SmCo.sub.2 film 25 contains SmCo.sub.2 as a main phase. SmCo.sub.2 is an alloy of Sm and Co which has an MgCu.sub.2 type crystal structure. A ratio between Sm atoms and Co atoms in SmCo.sub.2 may deviate from a stoichiometric ratio. For example, the ratio between the Sm atoms and the Co atoms in SmCo.sub.2 may not be the stoichiometric ratio when adding various elements, for example, for improvement and the like of magnetic characteristics. Therefore, as long as SmCo.sub.2 has the MgCu.sub.2 type crystal structure, the ratio between the Sm atoms and the Co atoms may deviate from the stoichiometric ratio.

[0118] The SmCo.sub.2 film 25 may include a crystal phase (different phase) different from the main phase, or a grain boundary. For example, a ratio of the main phase may be 50% by mass or more, 70% by mass or more, or 90% by mass or more. Examples of the different phase include an Sm-rich phase in which a content ratio of Sm is higher in comparison to SmCo.sub.2.

[0119] In the reaction diffusion process, when the Co base material 12 is immersed in a bath containing an Sm source, reaction diffusion occurs between the Sm source that diffuses in the bath and the Co base material 12 on a main surface of the Co base material 12, and the SmCo.sub.2 film 25 is formed on the Co base material 12.

[0120] The bath in the reaction diffusion process may be a molten salt of the Sm source and an inorganic salt other than Sm source.

[0121] Examples of the Sm source include metal Sm and an Sm alloy. With regard to the Sm source, one kind can be used alone, or two or more kinds can be used in combination.

[0122] Examples of the inorganic salt other than the Sm source include KCl, LiCl, and NaCl. With regard to the inorganic salts, one kind can be used alone, or two or more kinds can be used in combination.

[0123] A ratio of the Sm source in the Sm source and the inorganic salt other than the Sm source may be, for example, 1 to 6 mol % on the basis of the sum of the number of moles of the Sm source contained in the bath and the number of moles the inorganic salt, which is contained in the bath, other than the Sm source.

[0124] For example, the bath may be adjusted by drying the inorganic salt for dehydration, heating the inorganic slat to a reaction diffusion temperature to be described later to melt the inorganic salt, and adding the Sm source to the molten inorganic salt.

[0125] The plating temperature in the reaction diffusion process is not particularly limited as long as the reaction diffusion temperature is equal to or higher than a melting temperature of the inorganic salt, and from the viewpoint of efficiently forming the SmCo.sub.2 film 25, the reaction diffusion temperature is preferably 400° C. or higher, more preferably 500° C. or higher, and still more preferably 600° C. or higher. Here, the reaction diffusion temperature represents a temperature of the bath during reaction diffusion.

[0126] A reaction diffusion time in the reaction diffusion process can be appropriately changed in correspondence with the reaction diffusion temperature and a molar concentration of the Sm source in the bath as long as the SmCo.sub.2 film 25 can be formed in a desired thickness. It is not necessary to set the reaction diffusion time to be longer than necessary from the viewpoint of efficiency, and the reaction diffusion time may be, for example, 1 to 48 hours.

[0127] The obtained stacked body 52 may be washed before a heating process to be described later. A washing method is not particularly limited, and examples thereof include an organic solvent such as ethanol and water.

(Heating Process)

[0128] In a heating process, the stacked body 52 is heated until reaching a holding temperature, and is cooled down. According to this, SmCo.sub.2 and Co react with each other, and the Sm.sub.2Co.sub.17 film 20 and the SmCo.sub.5 film 30 in which the crystal orientation [00L] is radially oriented are formed from the Co base material 12 and the SmCo.sub.2 film 25.

[0129] A temperature-rising rate in the heating process is not particularly limited, and may be, for example, 0.1 to 100° C./second. From the viewpoint that a surface magnetic flux density of a magnet 300 is further improved, a holding temperature is preferably 800° C. or higher, more preferably 850° C. or higher, and still more preferably 900° C. or higher. From the viewpoint that the surface magnetic flux density of the magnet 300 is further improved, a temperature-dropping rate is preferably 5° C./second or more, more preferably 10° C./second or more, and still more preferably 20° C./second or more.

[0130] The holding time in the heating process may be 6 hours or longer, and 36 hours or shorter.

[0131] An atmosphere in the heating process is not particularly limited, but an inert gas atmosphere is preferable from the viewpoint of suppressing oxidization, and examples of the inert gas include Ar and Nz.

EXAMPLES

[0132] Hereinafter, the invention will be described in more detail with reference to examples, but the invention is not limited to the following examples.

<Manufacturing of SmCo-based Magnet Film>

Example 1

(First Electrolytic Plating Process)

[0133] KCl and LiCl were mixed in a molar ratio of KCl:LiCl=41.5:58.5, thereby obtaining a mixture. The obtained mixture was dried for dehydration. A temperature of the mixture after dehydration was raised to 650° C. in a ceramic container by an external heater, thereby melting the mixture. SmCl.sub.3 and CoCl.sub.2 were added to the molten mixture as the Sm source and the Co source. Addition of the Sm source and the Co source was performed so that a molar ratio of KCl and LiCl, SmCl.sub.3, and CoCl.sub.2 becomes KCl and LiCl:SmCl.sub.3:CoCl.sub.2=100.0:0.5:0.7. Next, an Mo substrate having a thickness of 0.5 mm as a cathode, and a graphite plate having a thickness of 1 mm as an anode were prepared. The Mo substrate was washed with acetone in advance. The Mo substrate and the graphite plate were immersed in the molten mixture, and first electrolytic plating was performed with respect to the Mo substrate by an electrolytic plating method. Plating was performed under conditions of constant current electrolysis, a plating temperature of 650° C., a current of 0.5 A, and a plating time of 5 minutes. A stacked film in which the Sm.sub.2Cor film was formed on the Mo substrate was obtained by the first electrolytic plating process.

(Second Electrolytic Plating Process)

[0134] A mixture of KCl and LiCl was melted in a similar manner as in the first electrolytic plating process. SmCl.sub.3 and CoCl.sub.2 were added to the molten mixture as the Sm source and the Co source. Addition of the Sm source and the Co source was performed so that a molar ratio of KCl and LiCl, SmCl.sub.3, and CoCl.sub.2 becomes KCl and LiCl:SmCl.sub.3:CoCl.sub.2=100.0:0.5:0.4. Next, a graphite plate having a thickness of 1 mm was prepared as an anode. The stacked film obtained in the first electrolytic plating process was set as a cathode. The stacked film and the graphite film were immersed in the molten mixture, and second electrolytic plating was performed with respect to the stacked film by an electrolytic plating method. Plating was performed under conditions of constant current electrolysis, a plating temperature of 650° C., a current of 0.5 A, and a plating time of 5 minutes. An alloy film, in which a non-oriented SmCo.sub.5 film was formed on a main surface opposite to a main surface that is in contact with the Mo substrate 10 in the Sm.sub.2Co.sub.17 film by an electrolytic plating method, was obtained.

(Heating Process)

[0135] A temperature of the obtained alloy film was raised until reaching 900° C. Then, the alloy film was heated at a holding temperature of 900° C. for 5 seconds while applying a magnetic field of 3 T in a direction perpendicular to the alloy film. Then, the alloy film was cooled down while applying a magnetic field of 3 T in a direction perpendicular to the alloy film, thereby obtaining the SmCo-based magnet film. A temperature-rising rate was set to 100° C./second, and A temperature-dropping rate was set to 20° C./second. An atmosphere in the heating process was set to Ar. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film were formed on the Mo substrate in this order.

Example 2

[0136] An SmCo-based magnet film was obtained in a similar manner as in Example 1 except that the Sm.sub.2Co.sub.17 film was formed by setting the plating time in the first electrolytic plating process to 3 minutes, and the non-oriented SmCo.sub.5 film was formed by setting the plating time in the second plating process to 15 minutes. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film were formed on the Mo substrate in this order.

Example 3

(Electrolytic Plating Process)

[0137] KCl and LiCl were mixed in a molar ratio of KCl:LiCl=41.5:58.5, thereby obtaining a mixture. The obtained mixture was dried for dehydration. A temperature of the mixture after dehydration was raised to 700° C. in a ceramic container by an external heater, thereby melting the mixture. SmCl.sub.3 was added to the molten mixture as the Sm source. Addition of the Sm source was performed so that a molar ratio of KCl and LiCl, and SmCl.sub.3 becomes KCl and LiCl:SmCl.sub.3=100.0:0.5. Next, a Co substrate having a thickness of 0.5 mm as a cathode, and a graphite plate having a thickness of 1 mm as an anode were prepared. The Co substrate was washed with acetone in advance. The Co substrate and the graphite plate were immersed in the molten mixture, and electrolytic plating was performed with respect to the Co substrate by an electrolytic plating method. Plating was performed under conditions of constant current electrolysis, a plating temperature of 700° C., a current of 0.5 A, and a plating time of 10 minutes. A stacked film in which the SmCo.sub.2 film was formed on the Co substrate was obtained by the electrolytic plating process.

(Heating Process)

[0138] A temperature of the obtained stacked film was raised until reaching 900° C. Then, the stacked film was heated at a holding temperature of 900° C. for 21600 seconds without applying a magnet field to the stacked film. Then, the stacked film was cooled down without applying a magnetic field to the stacked film, thereby obtaining an SmCo-based magnet film. A temperature-rising rate was set to 0.15° C./second, and a temperature-dropping rate was set to 20° C./second. An atmosphere in the heating process was set to Ar. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film were formed on the Co substrate in this order.

Examples 4, 6, 7, and 9

[0139] A stacked film was obtained in a similar manner as in Example 3 except that the amount of SmCl.sub.3 added to totally 100 parts by mole of KCl and LiCl, a temperature for melting KCl and LiCl, a plating temperature, a current, and a plating time in the electrolytic plating process were set to values shown in Table 1. An SmCo-based magnet film was obtained in a similar manner as in Example 3 except that the temperature-rising rate, the holding temperature, the holding time, and the temperature-dropping rate in the heating process were set to values shown in Table 3. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film were formed on the Co substrate in this order.

Examples 5 and 8

[0140] A stacked film in which an Sm.sub.2Co.sub.17 film was formed on an Mo substrate was obtained in a similar manner as in Example 1 except that the plating time in the first electrolytic plating process was set to a value shown in Table 1. An alloy film in which a non-oriented SmCo.sub.5 film was formed on a main surface opposite to a main surface that is in contact with the Mo substrate in the Sm.sub.2Co.sub.17 film was obtained in a similar manner as in Example 1 except that the amount of SmCl.sub.3 and CoCl.sub.2 added to totally 100 parts by mole of KCl and LiCl, a temperature for melting KCl and LiCl, a plating temperature, a current, and a plating time in the second electrolytic plating process were set to values shown in Table 2. An SmCo-based magnet film was obtained in a similar manner as in Example 1 except that the holding time in the heating process was set to a value shown in Table 3. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film were formed on the Mo substrate in this order.

Comparative Example 1

(Electrolytic Plating Process)

[0141] KCl and LiCl were mixed in a molar ratio of KCl:LiCl=41.5:58.5, thereby obtaining a mixture. The obtained mixture was dried for dehydration. A temperature of the mixture after dehydration was raised to 650° C. in a ceramic container by an external heater, thereby melting the mixture. SmCl.sub.3 and CoCl.sub.2 were added to the molten mixture as the Sm source and the Co source. Addition of the Sm source and the Co source was performed so that a molar ratio of KCl and LiCl, SmCl.sub.3, and CoCl.sub.2 becomes KCl and LiCl:SmCl.sub.3:CoCl.sub.2=100.0:0.5:0.4. Next, an Mo substrate having a thickness of 0.5 mm as a cathode, and a graphite plate having a thickness of 1 mm as an anode were prepared. The Mo substrate was washed with acetone in advance. The Mo substrate and the graphite plate were immersed in the molten mixture, and electrolytic plating was performed with respect to the Mo substrate by an electrolytic plating method. Plating was performed under conditions of constant current electrolysis, a plating temperature of 650° C., a current of 0.5 A, and a plating time of 5 minutes. A stacked film in which a non-oriented SmCo.sub.5 film was formed on the Mo substrate was obtained by the electrolytic plating process.

(Heating Process)

[0142] A temperature of the obtained stacked film was raised until reaching 700° C. Then, the stacked film was heated at a holding temperature of 700° C. for 5 seconds without applying a magnet field to the stacked film. Then, the stacked film was cooled down without applying a magnetic field to the stacked film, thereby obtaining an SmCo-based magnet film. A temperature-rising rate was set to 0.1° C./second, and a temperature-dropping rate was set to 0.5° C./second. An atmosphere in the heating process was set to Ar. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which the non-oriented SmCo.sub.5 film was formed on the Mo substrate.

Comparative Example 2

[0143] An SmCo-based magnet film was obtained in a similar manner as in Comparative Example 1 except that the plating time in the electrolytic plating process was set to 15 minutes. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which the non-oriented SmCo.sub.5 film was formed on the Mo substrate.

Comparative Example 3

[0144] A stacked film was obtained in a similar manner as in Example 1 except that the plating time in the first electrolytic plating process was set to a value shown in Table 1. A temperature of the obtained stacked film was raised until reaching 700° C. Next, an alloy film was heated at a holding temperature of 700° C. for 5 seconds without applying a magnet field to the alloy film. Then, the alloy film was cooled down without applying a magnetic field to the alloy film, thereby obtaining an SmCo-based magnet film. A temperature rising rate was set to 0.1° C./second and a temperature-dropping rate was set to 0.5° C./second. An atmosphere in the heating process was set to Ar. It is confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which Sm.sub.2Co.sub.17 was formed on the Mo substrate.

Comparative Example 4

[0145] An SmCo-based magnet film was obtained in a similar manner as in Comparative Example 1 except that the plating time in the electrolytic plating process was set to a value shown in Table 2. It is confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet film has a structure in which the non-oriented SmCo.sub.5 film was formed on the Mo substrate.

TABLE-US-00001 TABLE 1 Addition amount with respect to totally 100 parts by mole of KCl and LiCl Melting Plating Plating [parts by mole] temperature Kind of temperature Current time SmCl.sub.3 CoCl.sub.2 [° C.] Cathode [° C.] [A] [minute] Example 1 0.5 0.7 650 Mo 650 0.5 5 Example 2 0.5 0.7 650 Mo 650 0.5 3 Example 3 0.5 — 700 Co 700 0.5 10 Example 4 0.75 — 700 Co 700 0.75 30 Example 5 0.5 0.7 650 Mo 650 0.5 10 Example 6 1.5 — 700 Co 700 1 55 Example 7 1.5 — 700 Co 700 1 80 Example 8 0.5 0.7 650 Mo 650 0.5 3 Example 9 1.5 — 700 Co 700 1 100 Comparative 0.5 0.7 650 Mo 650 0.5 2 Example 3

TABLE-US-00002 TABLE 2 Addition amount with respect to totally 100 parts by mole of KCl and LiCl Melting Plating Plating [parts by mole] temperature temperature Current time SmCl.sub.3 CoCl.sub.2 [° C.] [° C.] [A] [minute] Example 1 0.5 0.4 650 650 0.5 5 Example 2 0.5 0.4 650 650 0.5 15 Example 5 0.75 0.6 700 700 0.75 40 Example 8 1.0 0.8 700 700 1.0 90 Comparative 0.5 0.4 650 650 0.5 5 Example 1 Comparative 0.5 0.4 650 650 0.5 15 Example 2 Comparative 0.5 0.4 650 650 0.5 2 Example 4

TABLE-US-00003 TABLE 3 Temperature- Holding Holding Application Temperature- rising rate temperature time magnetic field dropping rate [° C./second] [° C.] [second] [T] [° C./second] Example 1 100 900 5 3 20 Example 2 100 900 5 3 20 Example 3 0.15 900 21600 — 20 Example 4 0.15 1000 21600 — 20 Example 5 100 900 10 3 20 Example 6 0.15 1000 43200 — 20 Example 7 0.15 1000 86400 — 20 Example 8 100 900 10 3 20 Example 9 0.15 1050 86400 — 20 Comparative 0.1 700 5 — 0.5 Example 1 Comparative 0.1 700 5 — 0.5 Example 2 Comparative 0.1 700 5 — 0.5 Example 3 Comparative 0.1 700 5 — 0.5 Example 4

<Manufacturing of Cylindrical SmCo-based Magnet>

Example 10

(Reaction Diffusion Process)

[0146] LiCl was prepared and was dried for dehydration. A temperature of LiCl after dehydration was raised to 700° C. in an Mo container by an external heater to melt LiCl. An Sm metal powder was added to the molten LiCl as an Sm source. Addition of the Sm source was performed so that a molar ratio between LiCl and Sm becomes LiCl: Sm=100.0:2.5. Then, a cylindrical Co base material (diameter: 0.5 mm) was immersed in the molten LiCl. The Co base material was washed with acetone in advance. A reaction diffusion temperature was set to 700° C. and a reaction diffusion time was set to 9 hours. A stacked body in which an SmCo.sub.2 film was formed on the Co base material was obtained by the reaction diffusion process.

(Heating Process)

[0147] A temperature of the obtained stacked body was raised until reaching 1050° C. Next, the stacked body was heated at a holding temperature of 1050° C. for 24 hours without applying a magnetic field to the stacked body. Then, the stacked body was cooled down without applying a magnetic field to the stacked body, thereby obtaining a cylindrical SmCo-based magnet. A temperature-rising rate was set to 0.15° C./second, and a temperature-dropping rate was set to 20° C./second. An atmosphere in the heating process was set to Ar. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet has a structure in which the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film were formed on the Co base material in this order.

Example 11

[0148] A cylindrical SmCo-based magnet was obtained in a similar manner as in Example 10 except that the molar ratio between LiCl and Sm in the reaction diffusion process was set to a value shown in Table 4. It is confirmed that by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet has a structure in which the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film were formed on the Co base material in this order.

Examples 12 and 13

[0149] A stacked body was obtained in a similar manner as in Example except that the reaction diffusion time and the diameter of the Co base material in the reaction diffusion process were set to values shown in Table 4. A cylindrical SmCo-based magnet was obtained in a similar manner as in Example 10 except that the holding time in the heating process was set to 25 hours. It was confirmed by an X-ray diffraction measuring device and an energy dispersive X-ray analyzing device that the obtained SmCo-based magnet has a structure in which the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film were formed on the Co base material in this order.

TABLE-US-00004 TABLE 4 Amount of Sm added to Diameter of Co Reaction 100 parts by mole of base material diffusion time LiCl [part by mole] [mm] [hour] Example 10 2.5 0.5 9 Example 11 4.5 0.5 9 Example 12 2.5 0.7 12.5 Example 13 2.5 0.85 12.5

<Evaluation of SmCo-Based Magnet Film>

Examples 1 to 9, and Comparative Examples 1 to 4

[0150] The following evaluation was performed with respect to the SmCo-based magnet films obtained in the respective examples.

(Film Thickness Measurement of Sm.sub.2Co.sub.17 Film and SmCo.sub.5 Film)

[0151] Each of the obtained SmCo-based magnet films was embedded in a resin. Apart of the resin was polished to expose a cross-section of the SmCo-based magnet film from the resin. The exposed cross-section was observed with a scanning electron microscope (product name: SU5000, manufactured by Hitachi High-Tech Corporation) to measure a film thickness of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film. At this time, an observation magnification was adjusted so that the entirety of the film to be observed is placed within a field of view. Results are shown in Table 5.

(Measurement of Degree of Orientation of Crystal Orientation of SmCo.SUB.5.)

[0152] X-ray diffraction measurement was performed with respect to the SmCo.sub.5 film in the obtained SmCo-based magnet film by using X-ray diffraction measuring device (product name: RINT-2000, manufactured by Rigaku Corporation). The measurement was performed at room temperature by using CuKα. The degree of orientation of a crystal orientation [002] of SmCo.sub.5 was calculated by Expression (1) from peaks in a range of 2θ=30° to 60° in an obtained X-ray profile. Note that, in the range of 2θ=30° to 60°, peaks derived from a (101) plane, a (110) plane, a (200) plane, a (111) plane, a (002) plane, a (201) plane, and a (112) plane were measured. Angles θ made between the (002) plane and the respective crystal planes, and a vector correction coefficient β were set to values shown in Table 6. The degree of orientation calculated is shown in Table 5. In addition, an X-ray diffraction profile obtained from the SmCo-based magnet film in Example 2 is illustrated in FIG. 9.

(Measurement of Surface Magnetic Flux Density of SmCo-Based Magnet Film)

[0153] A probe of a hall element ((product name: HG0712, manufactured by Asahi Kasei Microdevices Corporation) was brought into contact with a film surface of the SmCo.sub.5 film in the obtained SmCo-based magnet film, and an output voltage was converted into a magnetic flux density, thereby measuring a surface magnetic flux density of the SmCo-based magnet film. Results are shown in Table 5.

(Measurement of Degree of Unevenness of SmCo-Based Magnet Film)

[0154] The obtained SmCo-based magnet film was embedded in a resin. A part of the resin was polished to expose a cross-section of the SmCo-based magnet film from the resin. The exposed cross-section was observed with a scanning electron microscope (product name: SU5000, manufactured by Hitachi High-Tech Corporation) to obtain a backscattered electron image. An acceleration voltage was set to 10 to 15 kV and a working distance (WD) was set to 10 to 15 mm at the time of obtaining the backscattered electron image. A portion (rectangle) to be provided for analysis was cut out from the obtained backscattered electron image. Cutting-out of the backscattered electron image was performed so that any one side of an image cut out as illustrated in FIG. 2 and a side opposite to the side, and an interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film intersect each other, and the interface is placed between the remaining two sides. In addition, cutting-out of the backscattered electron image was performed so that a length of a straight line connecting both ends of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film to be described later becomes 100 μm or more. The cut-out image was subjected to image quality adjustment, binarization processing, and edge (contour) extraction processing. In addition, a length of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.17 film in the cut-out image was measured. In addition, a length of the straight line connecting both ends of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film in the cut-out image was measured. As a reference of the length, a length displayed in a scale bar was used. The degree of unevenness was calculated by dividing the length of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film by the length of the straight line connecting both ends of the interface of the SmCo.sub.5 film in the cut-out image. A measurement magnification was 1000 times. The number of sites for observation by the SEM was set to two or more so as not to analyze only a part. The degree of unevenness is set to an average value of the degree of unevenness obtained from each of images of two or more sites. Results are shown in Table 5.

TABLE-US-00005 TABLE 5 Surface Degree of magnetic Film thickness [μm] orientation flux SmCo.sub.5 Sm.sub.2Co.sub.17 Degree of of SmCo.sub.5 density film film unevenness [%] [mT] Example 1 2.8 6.7 1.07 79 7.6 Example 2 9.5 4.7 1.21 70 15.1 Example 3 11.4 4.2 1.24 87 16.2 Example 4 51.0 10.3  1.30 96 30.5 Example 5 49.5 12.1  1.18 95 24.7 Example 6 105.6 6.8 1.46 95 59.1 Example 7 152.3 4.2 1.51 97 86.0 Example 8 150.5 4.4 1.35 94 69.2 Example 9 198.2 3.9 1.94 96 118.5 Comparative 2.6 — — 49 1.7 Example 1 Comparative 9.4 — — 47 5.6 Example 2 Comparative — 2.9 — — 0.1 Example 3 Comparative 0.8 — — 50 0.3 Example 4

TABLE-US-00006 TABLE 6 Crystal plane θ (°) β = cos θ (101) plane 42.4 0.74 (110) plane 90 0 (200) plane 90 0 (111) plane 57.7 0.53 (002) plane (reference plane) 0 1.00 (201) plane 61.3 0.48 (112) plane 38.4 0.78

[0155] The SmCo-based magnet film obtained in each of the examples included the Sm.sub.2Co.sub.17 film and the degree of orientation of SmCo.sub.5 was 70% or more, and thus the surface magnetic flux density was 7.6 mT or more.

<Evaluation of Cylindrical SmCo-Based Magnet>

Examples 10 to 13

[0156] The following evaluation was performed with respect to a cylindrical SmCo-based magnet obtained in each of the examples.

(Film Thickness Measurement of Sm.sub.2Co.sub.17 Film and SmCo.sub.5 Film)

[0157] The obtained cylindrical SmCo-based magnet was embedded in a resin. A part of the resin was polished to expose a cross-section of the cylindrical SmCo-based magnet in a direction perpendicular to an axial direction from the resin. The exposed cross-section was observed with a scanning electron microscope (product name: SU5000, manufactured by Hitachi High-Tech Corporation) to measure a film thickness of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film. At this time, an observation magnification was adjusted so that the entirety of the film to be observed is placed within a field of view. Results are shown in Table 7.

(Measurement of Orientation of Crystal Orientation of SmCo.SUB.5.)

[0158] The obtained cylindrical SmCo-based magnet was embedded in a resin. A part of the resin was polished to expose a cross-section of the cylindrical SmCo-based magnet in a direction perpendicular to an axial direction. In SmCo.sub.5 on the exposed cross-section, the orientation of the crystal orientation of SmCo.sub.5 was measured by an electron back scatter diffraction patterns (EBSD) method. As a measurement device of EBSD, Versa3D (product name, manufactured by EFI) was used. As illustrated in FIG. 5, a measurement site was set to totally four sites including a site Y1 that is spaced apart in a Y direction perpendicular to a normal direction at the center of gravity of the cross-section, a site Y2 that is spaced apart in a −Y direction opposite to the Y direction, a site X1 that is spaced apart in an X direction perpendicular to the Y direction, and a site X2 that is spaced apart in a −X direction opposite to the X direction. Measurement results in Example 10 are illustrated in FIGS. 10(a) to 10(d). FIG. 10(a) is a pole diagram of the crystal orientation [00L] of SmCo.sub.5 in a case of observing the Y1 in the −Y direction with an XZ plane set as the front. FIG. 10(b) is a pole diagram of the crystal orientation [00L] of SmCo.sub.5 in a case of observing the Y2 in the Y direction with the XZ plane set as the front. FIG. 10(c) is a pole diagram of the crystal orientation [00L] of SmCo.sub.5 in a case of observing the X1 in the −X direction with a YZ plane set as the front. FIG. 10(d) is a pole diagram of the crystal orientation [00L] of SmCo.sub.5 in a case of observing the X2 in the X direction with the YZ plane set as the front. The pole diagrams are diagrams showing a crystal orientation with a stereo projection method. In Each of the pole diagrams in FIG. 10, the center is the crystal orientation [00L]. That is, when the crystal orientation [00L] faces the front, a dot is placed at the center of the pole diagram. As can be seen from FIGS. 10(a) to 10(d), since dots are placed at the center of the pole diagram, it was confirmed that the crystal orientation [00L] of SmCo.sub.5 is radially oriented in the cylindrical SmCo-based magnet. Since a similar measurement result as in Example 10 was also obtained in Examples 11 to 13, it was confirmed that the crystal orientation [00L] of SmCo.sub.5 is radially oriented in the cylindrical SmCo-based magnet.

(Measurement of Surface Magnetic Flux Density of SmCo-Based Magnet)

[0159] The surface magnetic flux density of the cylindrical SmCo-based magnet was measured in a similar manner as in the measurement of the surface magnetic flux density of the SmCo-based magnet film. Results are shown in Table 7.

(Measurement of Degree of Unevenness of SmCo-Based Magnet Film)

[0160] The obtained cylindrical SmCo-based magnet was embedded in a resin. A part of the resin was polished to expose a cross-section perpendicular to an axis of the SmCo-based magnet from the resin. The exposed cross-section was observed with a scanning electron microscope (product name: SU5000, manufactured by Hitachi High-Tech Corporation.) to obtain a backscattered electron image. An acceleration voltage was set to 10 to 15 kV and a working distance (WD) was set to 10 to 15 mm at the time of obtaining the backscattered electron image. A portion (rectangle) to be provided for analysis was cut out from the obtained backscattered electron image. Cutting-out of the backscattered electron image was performed so that any one side of an image cut out as illustrated in FIG. 2 and a side opposite to the side, and an interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film intersect each other, and the interface is placed between the remaining two sides. In addition, cutting-out of the backscattered electron image was performed so that a length of a straight line connecting both ends of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film to be described later becomes 100 μm or more. The cut-out image was subjected to image quality adjustment, binarization processing, and edge (contour) extraction processing. In addition, a length of the straight line connecting both ends of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film in the cut-out image was measured. In addition, a length of the straight line connecting both ends of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film in the cut-out image was measured. As a reference of the length, a length displayed in a scale bar was used. The degree of unevenness was calculated by dividing the length of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film by the length of the straight line connecting both ends of the interface of the Sm.sub.2Co.sub.17 film and the SmCo.sub.5 film in the cut-out image. A measurement magnification was 1000 times. The number of sites for observation by the SEM was set to two or more so as not to analyze only a part. The degree of unevenness is set to an average value of the degree of unevenness obtained from each of images of two or more sites. Results are shown in Table 7.

TABLE-US-00007 TABLE 7 Film thickness [μm] Surface magnetic SmCo.sub.5 Sm.sub.2Co.sub.17 Degree of Orientation state flux density film film unevenness of SmCo.sub.5 [mT] Example 10 117.1 10.2 1.18 Radial orientation 36.1 Example 11 123.5 8.9 1.21 Radial orientation 42.3 Example 12 125.4 5.4 1.27 Radial orientation 118.0 Example 13 107.1 5.4 1.32 Radial orientation 121.2

REFERENCE SIGNS LIST

[0161] 10: Mo substrate, 12: Co substrate (Co base material), 15: yoke portion, 17: magnet portion, 20: Sm.sub.2Cor film, 25: SmCo.sub.2 film, 30: SmCo.sub.5 film, 40: non-oriented SmCo.sub.5 film, 50, 51: stacked film, 52: stacked body, 70: alloy film, 100: SmCo-based magnet film, 200: magnet, 300: SmCo-based magnet.