SUBSTRATE STRIPPING METHOD FOR SEMICONDUCTOR STRUCTURE

Abstract

Provided is a method for stripping a substrate of a semiconductor structure, including: providing a substrate, a first A1N layer, a first AlGaN layer and a function layer from bottom to top; and irradiating the first AlGaN layer from the substrate with laser light to decompose the first AlGaN layer, such that the function layer is separated from the substrate and the first A1N layer. By the method, the first A1N layer and the first AlGaN layer respectively correspond to a nucleation layer and a buffer layer when the function layer is epitaxially grown, to improve the quality of the function layer.

Claims

1. A method for stripping a substrate of a semiconductor structure, comprising: providing a substrate, a first AlN layer, a first AlGaN layer and a function layer from bottom to up; and irradiating the first AlGaN layer from the substrate with laser light to decompose the first AlGaN layer, such that the function layer is separated from the substrate and the first AlN layer.

2. The method according to claim 1, further comprising: providing a second AlN layer between the first AlGaN layer and the function layer, wherein after the laser light irradiates the first AlGaN layer from the substrate, the function layer and the second AlN layer are separated from the substrate and the first AlN layer.

3. The method according to claim 1, further comprising: providing a second AlGaN layer between the first AlGaN layer and the function layer, wherein Al composition content in the second AlGaN layer is higher than Al composition content in the first AlGaN layer, and after the laser light irradiates the first AlGaN layer from the substrate, the function layer and the second AlGaN layer are separated from the substrate and the first AlN layer.

4. The method according to claim 1, wherein Al component content in the first AlGaN layer is less than 70%.

5. The method according to claim 1, wherein the first AlGaN layer is a single-layer structure or a multi-layer structure.

6. The method according to claim 5, wherein the multi-layer structure comprises first AlGaN sublayers, and Al composition content in each of the first AlGaN sublayers is different.

7. The method according to claim 5, wherein the multi-layer structure comprises: an AlGaN/AlN alternating multi-layer superlattice structure.

8. The method according to claim 1, wherein a material of the substrate is sapphire.

9. The method according to claim 1, wherein the function layer comprises: a light wave filtering structure or an LED structure.

10. The method according to claim 1, wherein the function layer comprises: an LED structure, and a light emission wavelength of the LED structure is less than 350 nm.

11. The method according to claim 1, wherein the substrate comprises a flat structure, and the first AlN layer comprises a patterned structure; or both the substrate the and the first AlN layer comprise a patterned structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG. 1 is a flowchart of a method for peeling off a substrate of a semiconductor structure according to a first embodiment of the present disclosure.

[0026] FIG. 2 and FIG. 3 are schematic diagrams of intermediate structures corresponding to processes in FIG. 1.

[0027] FIG. 4 is a schematic diagram of an intermediate structure corresponding to a method for peeling off a substrate of a semiconductor structure according to a second embodiment of the present disclosure.

[0028] FIG. 5 is a schematic diagram of an intermediate structure corresponding to a method for peeling off a substrate of a semiconductor structure according to a third embodiment of the present disclosure.

[0029] FIG. 6 is a schematic diagram of an intermediate structure corresponding to a method for peeling off a substrate of a semiconductor structure according to a fourth embodiment of the present disclosure.

[0030] To facilitate the understanding of the present disclosure, all reference signs present in the present disclosure are listed below: [0031] substrate 10 [0032] first AlN layer 11 [0033] first AlGaN layer 12 [0034] reacted first AlGaN layer 12′ [0035] function layer 13 [0036] first AlGaN sublayer 121 [0037] second AlGaN layer 14 [0038] second AlN layer 15

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] In order to make the above-mentioned objects, features and advantages of the present disclosure more obvious and understandable, embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0040] FIG. 1 is a flowchart of a method for peeling off a substrate of a semiconductor structure according to a first embodiment of the present disclosure; and FIG. 2 and FIG. 3 are schematic diagrams of intermediate structures corresponding to processes in FIG. 1.

[0041] First, referring to step S1 in FIG. 1 and as shown in FIG. 2, a substrate 10, a first AlN layer 11, a first AlGaN layer 12 and a function layer 13 are provided from bottom to top.

[0042] A material of the substrate 10 may be a material such as sapphire, silicon carbide, silicon or diamond, preferably a material with high transmittance to laser light used in the subsequent step S2.

[0043] A material of the function layer 13 may be a group III nitride-based material, such as at least one of GaN, AlGaN, InGaN, and AlInGaN. The function layer 13 may correspond to a heterojunction structure in the HMET (High Electron Mobility Transistor) device, that is, the function layer 13 may include: a barrier layer and a buffer layer; or the function layer 13 may correspond to an LED structure in an LED device, that is, the function layer 13 may include: a P-type semiconductor layer, an N-type semiconductor layer and a single quantum well layer/ a multiple quantum well layer/ quantum dots/ quantum wires between the P-type semiconductor layer and the N-type semiconductor layer.

[0044] In an embodiment, a light emission wavelength of the LED structure may be less than 350 nm.

[0045] In another embodiment, the LED structure can function with a pair of Bragg mirrors as a light wave filtering structure.

[0046] It should be noted that, in the embodiments, a material is represented by chemical elements, but a molar ratio of each chemical element in the material is not limited. For example, the GaN material contains Ga element and N element, but the molar ratio of Ga element and N element is not limited.

[0047] The first AlN layer 11 can serve as a nucleation layer when epitaxially growing the function layer 13. The nucleation layer can alleviate the problems of lattice mismatch and thermal mismatch between the epitaxially grown function layer 13 and the substrate 10.

[0048] The first AlGaN layer 12 can serve as a buffer layer when epitaxially growing the function layer 13. The buffer layer can reduce the dislocation density and defect density of the epitaxially grown function layer 13 and improve the crystal quality.

[0049] In this embodiment, the first AlGaN layer 12 includes a single-layer structure, and a material of the single-layer structure may be represented as AlGaN.

[0050] Next, referring to step S2 in FIG. 1 and as shown in FIG. 2 and FIG. 3, the first AlGaN layer 12 is irradiated from the substrate 10 with laser light to decompose the first AlGaN layer 12, such that the function layer 13 is separated from the substrate 10 and the first AlN layer 11.

[0051] When the substrate 10 is irradiated by laser light in certain wavelength bands, the first AlN layer 11 is transparent to the laser light in the wavelength bands, but the first AlGaN layer 12 will decompose into nitrogen gas after absorbing the laser light in the wavelength bands, and the reacted first AlGaN layer 12′ is loose, porous and easy to be separated, such that the substrate 10 can be easily peeled off without damaging the function layer 13.

[0052] Research shows that, in the first AlGaN layer 12, the Al composition content is less than 70%, that is, when the percentage of the content of Al element in the first AlGaN layer 12 to the sum of the contents of Al element and Ga element is less than 70%, correspondingly the wavelength range of the laser light with better decomposition degree is from 200 nm to 300 nm. Further, when the percentage of the content of Al composition in the first AlGaN layer 12 is less than 40%, the wavelength range of the laser light being from 250 nm to 280 nm has better the decomposition degree.

[0053] Sapphire has a high transmittance in the above-mentioned 200 nm-300 nm wavelength band, and can be used as a preferred material for the substrate 10.

[0054] It should be noted that, in this embodiment, the range includes endpoint values.

[0055] FIG. 4 is a schematic diagram of an intermediate structure corresponding to a method for peeling off a substrate of a semiconductor structure according to a second embodiment of the present disclosure.

[0056] Referring to FIG. 4, the method for peeling off the substrate according to the second embodiment is substantially the same as the method for peeling off the substrate according to the first embodiment, the difference is that the first AlGaN layer 12 is a multi-layer structure, the multi-layer structure includes multiple first AlGaN sublayers 121, and the Al composition content in each of the first AlGaN sublayers 121 is different.

[0057] Compared with the solution in which the first AlGaN layer 12 is a single-layer structure and the Al composition content is fixed, the advantage of the solution for multi-layer structure is that the applicable laser light wavelength range for peeling is large, or when the laser light wavelength drifts, there is still a good peeling effect. In addition, the multi-layer structure of the first AlGaN layer can also protect the upper function layer 13.

[0058] In some embodiments, the multi-layer structure may further include: AlGaN/AlN alternating multi-layer superlattice structure. In the superlattice structure, the Al composition content in each of the AlGaN layers is different or the same.

[0059] FIG. 5 is a schematic diagram of an intermediate structure corresponding to a method for peeling off a substrate of a semiconductor structure according to a third embodiment of the present disclosure.

[0060] Referring to FIG. 5, the method for peeling off a substrate according to the third embodiment is substantially the same as the method for peeling off a substrate according to the first and second embodiments, and the difference is that a second AlGaN layer 14 is provided between the first AlGaN layer 12 and the function layer 13, where the Al composition content in the second AlGaN layer 14 is higher than the Al composition content in the first AlGaN layer 12; and after the laser light irradiates the first AlGaN layer 12 from the substrate 10, the function layer 13 and the second AlGaN layer 14 are separated from the substrate 10 and the first AlN layer 11.

[0061] The laser light can pass through the first AlN layer 11 and cannot pass through the first AlGaN layer 12. In some embodiments, the laser light can pass through both the first AlN layer 11 and the second AlGaN layer 14, and cannot pass through the first AlGaN layer 12, such that the damage of the second AlGaN layer 14 by the laser light can be avoided.

[0062] The higher the Al content in the AlGaN layer, the better the quality of the function layer 13, so the solution of this embodiment can improve the quality of the function layer 13.

[0063] FIG. 6 is a schematic diagram of an intermediate structure corresponding to a method for peeling off a substrate of a semiconductor structure according to a fourth embodiment of the present disclosure.

[0064] Referring to FIG. 6, the method for peeling off a substrate according to the fourth embodiment is substantially the same as the method for peeling off a substrate according to the third embodiment, and the difference is that a second AlN layer 15 is provided between the first AlGaN layer 12 and the function layer 13; and after the laser light irradiates the first AlGaN layer 12 from the substrate 10, the function layer 13 and the second AlN layer 15 are separated from the substrate 10 and the first AlN layer 11. In other words, the second AlN layer 15 replaces the second AlGaN layer 14.

[0065] Compared with the solution in the third embodiment, in this solution the thickness of the AlGaN layer is reduced, so under the same laser power, the decomposition degree of the first AlGaN layer 12 can be improved, and the peeling effect is better.

[0066] In some embodiments, the methods for peeling off a substrate according to embodiments 1 to 4 can also be applied to a patterned substrate.

[0067] For example, in an embodiment, the substrate 10 includes a flat structure, and the first AlN layer 11 includes a patterned structure.

[0068] In another embodiment, both the substrate 10 and the first AlN layer 11 include a patterned structure. For example, the substrate 10 and the first AlN layer 11 are patterned in the same process; or the substrate 10 is patterned first, the first AlN layer 11 is epitaxially grown on the patterned substrate 10, and the size of the opening in the substrate 10 is slightly different from the size of the opening in the substrate 10.

[0069] Although the present disclosure discloses the above contents, the present disclosure is not limited thereto. One of ordinary skill in the art can make various variants and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure should be set forth by the appended claims.