FOAMABLE RESIN COMPOSITION, MOLDED RESIN FOAM, AND PRODUCTION METHOD THEREFOR

Abstract

A foamable resin composition includes a styrenic thermoplastic elastomer and a dynamically crosslinked thermoplastic elastomer in a total amount of 100 parts by mass. An amount of the dynamically crosslinked thermoplastic elastomer is 10 to 40 parts by mass. The composition further includes high-temperature expandable microcapsules and low-temperature expandable microcapsules in a total amount of 25 to 50 parts by mass relative to 100 parts by mass of the elastomers, and an amount of the low-temperature expandable microcapsules is 17 to 67% by mass relative to the total amount of the two types of microcapsules.

Claims

1. A foamable resin composition comprising a styrenic thermoplastic elastomer and a dynamically crosslinked thermoplastic elastomer in a total amount of 100 parts by mass, wherein an amount of the dynamically crosslinked thermoplastic elastomer is 10 to 40 parts by mass, the composition further comprises high-temperature expandable microcapsules and low-temperature expandable microcapsules in a total amount of 25 to 50 parts by mass relative to 100 parts by mass of the elastomers, and an amount of the low-temperature expandable microcapsules is 17 to 67% by mass relative to the total amount of the two types of microcapsules.

2. A method for producing a molded resin foam, the method comprising molding a foamable resin composition containing a styrenic thermoplastic elastomer, a dynamically crosslinked thermoplastic elastomer, high-temperature expandable microcapsules, and low-temperature expandable microcapsules at a temperature at which the high-temperature expandable microcapsules do not burst, but the low-temperature expandable microcapsules burst at least partially.

3. A molded resin foam comprising a styrenic thermoplastic elastomer, a dynamically crosslinked thermoplastic elastomer, high-temperature expandable microcapsules, and low-temperature expandable microcapsules, wherein the high-temperature expandable microcapsules expand but do not burst; the low-temperature expandable microcapsules expand and burst at least partially; and the resin foam has a specific gravity of 0.3 or less, an Asker C hardness of 45 or less, and a compression set (JIS K 6400-4, method A, compressibility: 50%) of 35% or less.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0023] FIG. 1 is a micrograph of a cross-section of the molded resin foam of Example 3; and

[0024] FIG. 2 is a micrograph of a cross-section of the molded resin foam of Comparative Example 5.

DESCRIPTION OF EMBODIMENTS

[0025] 1. Styrenic Thermoplastic Elastomer (TPS: Thermoplastic Styrenic Elastomer)

[0026] No particular limitation is imposed on the type of TPS. Examples thereof include a TPS wherein the hard segment is polystyrene or polypropylene, and the soft segment is a styrene-butadiene-styrene block copolymer (SBS), a styrene-isoprene-styrene block copolymer (SIS), a styrene-ethylene-butylene-styrene block copolymer (SEBS) prepared by hydrogenation thereof, or a styrene-ethylene-propylene-styrene block copolymer (SEPS).

[0027] 2. Dynamically Crosslinked Thermoplastic Elastomer (TPV: thermoplastic vulcanizate)

[0028] No particular limitation is imposed on the type of TPV. Examples thereof include a TPV wherein the hard segment is a polyolefin (e.g., polypropylene), and the soft segment is an olefinic crosslinked rubber (e.g., EPDM). Dynamic crosslinking is a process wherein a thermoplastic resin and a rubber are melt-kneaded in parallel with crosslinking of the rubber under shearing, and is in contrast to a common process wherein a rubber is statically crosslinked.

[0029] 3. High-Temperature Expandable Microcapsule and Low-Temperature Expandable Microcapsule

[0030] Each of high-temperature expandable microcapsules and low-temperature expandable microcapsules, which serve as a foaming agent, is formed by enclosing a foaming component in a shell. No particular limitation is imposed on the material of the shell, and examples thereof include a thermoplastic resin (e.g., an acrylic resin). No particular limitation is imposed on the foaming component, and examples thereof include a liquid hydrocarbon.

[0031] 4. Additional Component

[0032] Each of the foamable resin composition and molded resin foam of the present invention may further contain an additional component. Examples of the additional component include a filler, a colorant, and an antioxidant.

[0033] 5. Formation of Molded Resin Foam

[0034] No particular limitation is imposed on the method of molding (foam molding), and examples of the method include injection foaming, press foaming, extrusion foaming, and blow foaming.

[0035] 6. Application of Molded Resin Foam

[0036] No particular limitation is imposed on the application of the molded resin foam. Examples of suitable applications of the molded resin foam include cushioning materials for automobile interior parts (e.g., a console lid, an armrest, and a seat), and cushioning materials for furniture (e.g., a chair).

Examples

[0037] [Preparation of Foamable Resin Composition]

[0038] Materials were formulated in amounts shown in Tables 1 and 2 below (the value of each amount is represented by parts by mass), to thereby prepare foamable resin compositions (samples 1 to 31).

[0039] Samples 1 to 7 correspond to a group wherein a selected foaming agent was mixed with TPS.

[0040] Samples 8 to 13 correspond to a group wherein the proportions of TPS and TPV were varied, and the proportions of high-temperature expandable microcapsules and low-temperature expandable microcapsules were maintained constant.

[0041] Sample 14 corresponds to a group wherein high-temperature expandable microcapsules were mixed with TPV.

[0042] Samples 15 to 31 correspond to a group wherein the proportions of TPS and TPV were maintained constant, and the proportions of high-temperature expandable microcapsules and low-temperature expandable microcapsules were varied.

TABLE-US-00001 TABLE 1 Sample No. 1 2 3 Comparative Comparative Comparative Example 1 Example 2 Example 3 Formu- TPS 100 100 100 lation TPV (parts by Chemical Foaming 3 3 mass) Agent Low-temperature Expandable Microcapsules (a) High-temperature 10 10 Expandable Microcapsules (b) Note a + b 10 10 a/(a + b)  0%  0% Property Specific Gravity 0.54 0.30 0.32 Asker C Hardness 48 55 50 Compression Set 47% 46% 37% (CS) Sample No. 4 5 6 Comparative Comparative Comparative Example 4 Example 5 Example 6 Formu- TPS 100 100 100 lation TPV (parts by Chemical Foaming mass) Agent Low-temperature 5 Expandable Microcapsules (a) High-temperature 20 30 10 Expandable Microcapsules (b) Note a + b 20 30 15 a/(a + b)  0%  0% 33% Property Specific Gravity 0.20 0.19 0.26 Asker C Hardness 48 47 46 Compression Set 38% 37% 38% (CS) Sample No. 7 Comparative 8 9 Example 7 Example 1 Example 2 Formu- TPS 100 90 85 lation TPV 10 15 (parts by Chemical Foaming mass) Agent Low-temperature 10 10 10 Expandable Microcapsules (a) High-temperature 20 20 20 Expandable Microcapsules (b) Note a + b 30 30 30 a/(a + b) 33% 33% 33% Property Specific Gravity 0.22 0.18 0.20 Asker C Hardness 44 41 39 Compression Set 40% 34% 34% (CS) Sample No. 10 11 12 Example 3 Example 4 Example 5 Formu- TPS 80 70 60 lation TPV 20 30 40 (parts by Chemical Foaming mass) Agent Low-temperature 10 10 10 Expandable Microcapsules (a) High-temperature 20 20 20 Expandable Microcapsules (b) Note a + b 30 30 30 a/(a + b) 33% 33% 33% Property Specific Gravity 0.20 0.25 0.26 Asker C Hardness 38 42 44 Compression Set 31% 30% 29% (CS) Sample No. 13 14 Comparative Comparative Example 8 Example 9 Formu- TPS 50 0 lation TPV 50 100 (parts by Chemical Foaming mass) Agent Low-temperature 10 0 Expandable Microcapsules (a) High-temperature 20 10 Expandable Microcapsules (b) Note a + b 30 10 a/(a + b) 33%  0% Property Specific Gravity 0.34 0.54 Asker C Hardness 53 66 Compression Set 27% 18% (CS)

TABLE-US-00002 TABLE 2 Sample No. 15 16 17 Comparative Comparative Comparative Example 10 Example 11 Example 12 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 5 7.5 mass) Expandable Microcapsules (a) High-temperature 10 15 Expandable Microcapsules (b) Note a + b 15 22.5 a/(a + b) 33% 33% Property Specific Gravity 0.91 0.26 0.18 Asker C Hardness 98 52 48 Compression Set 29% 30% 32% (CS) Sample No. 18 19 20 Example 6 Example 7 Example 8 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 7.5 10 15 mass) Expandable Microcapsules (a) High-temperature 17.5 15 10 Expandable Microcapsules (b) Note a + b 25 25 25 a/(a + b) 30% 40% 60% Property Specific Gravity 0.20 0.18 0.29 Asker C Hardness 44 38 45 Compression Set 31% 31% 31% (CS) Sample No. 21 Comparative 22 23 Example 13 Example 9 Example 10 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 2.5 5 10 mass) Expandable Microcapsules (a) High-temperature 27.5 25 20 Expandable Microcapsules (b) Note a + b 30 30 30 a/(a + b)  8% 17% 33% Property Specific Gravity 0.19 0.20 0.20 Asker C Hardness 49 45 38 Compression Set 30% 32% 31% (CS) Sample No. 26 24 25 Comparative Example 11 Example 12 Example 14 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 15 20 22.5 mass) Expandable Microcapsules (a) High-temperature 15 10 7.5 Expandable Microcapsules (b) Note a + b 30 30 30 a/(a + b) 50% 67% 75% Property Specific Gravity 0.22 0.26 0.41 Asker C Hardness 42 43 51 Compression Set 31% 31% 31% (CS) Sample No. 27 Comparative 28 29 Example 15 Example 13 Example 14 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 25 13 17 mass) Expandable Microcapsules (a) High-temperature 5 27 33 Expandable Microcapsules (b) Note a + b 30 40 50 a/(a + b) 83% 33% 34% Property Specific Gravity 0.61 0.17 0.18 Asker C Hardness 58 38 40 Compression Set 31% 32% 32% (CS) Sample No. 31 30 Comparative Example 15 Example 16 Formu- TPS 80 80 lation TPV 20 20 (parts by Low-temperature 33 20 mass) Expandable Microcapsules (a) High-temperature 17 40 Expandable Microcapsules (b) Note a + b 50 60 a/(a + b) 66% 33% Property Specific Gravity 0.23 0.21 Asker C Hardness 43 47 Compression Set 31% 36% (CS)

[0043] Details of the materials used in the Examples are as follows.

[0044] The TPS used is trade name “Tefabloc T3779B” available from Mitsubishi Chemical Corporation. This product is an elastomer containing a styrenic rubber (styrene-butadiene copolymer (SBC)) as a base polymer.

[0045] The TPV used is trade name “Santoprene 8211-45” available from Exxon Mobil Corporation. This product is an elastomer containing vulcanized EPDM as a polyolefin base.

[0046] The chemical foaming agent used (in only samples 1 and 2) is trade name “Polythlene EV306G” available from EIWA CHEMICAL IND. CO., LTD. This product is an azodicarbonamide (ADCA)-based chemical foaming agent, and is in the form of a master batch composed of ethylene-vinyl acetate (EVA).

[0047] The low-temperature expandable microcapsules used are trade name “Microsphere F185EVA” available from Matsumoto Yushi-Seiyaku Co., Ltd. This product contains a shell formed of an acrylic resin, a hydrocarbon as a foaming component, and EVA as a master batch (foaming initiation temperature: 145 to 155° C., maximum expansion temperature: 190 to 200° C.)

[0048] The high-temperature expandable microcapsules used are trade name “Microsphere F190EVA” available from Matsumoto Yushi-Seiyaku Co., Ltd. This product contains a shell formed of an acrylic resin, a hydrocarbon (different from the aforementioned one) as a foaming component, and EVA as a master batch (foaming initiation temperature: 160 to 170° C., maximum expansion temperature: 210 to 220° C.)

[0049] Tables 1 and 2 include the total amount (parts by mass) of two foaming agents: low-temperature expandable microcapsules (a) and high-temperature expandable microcapsules (b); i.e., a+b, and the ratio of the amount of low-temperature expandable microcapsules to the total amount of the two foaming agents; i.e., a/(a+b) (% by mass) (see “Note” in the tables).

[0050] [Formation of Molded Resin Foam]

[0051] Subsequently, each of the above-prepared foamable resin compositions (samples 1 to 31) (composition temperature: 230° C.) was injected into a mold (temperature: 60° C.) at an injection speed of 120 mm/second (mold condition: short shot method), to thereby form (foam-mold) a molded resin foam (test piece) having a size of 60 mm×200 mm and a thickness of 6 mm.

[0052] Thus, the foam molding of the foamable resin compositions (samples 6 to 14 and 16 to 31) each containing the low-temperature expandable microcapsules and the high-temperature expandable microcapsules was performed at a temperature at which the high-temperature expandable microcapsules do not burst, but the low-temperature expandable microcapsules burst at least partially.

[0053] [Properties of Molded Resin Foam]

[0054] Subsequently, each of the resultant molded resin foams (samples 1 to 31) was analyzed for the following properties.

[0055] (1) Specific gravity

[0056] The specific gravity was measured according to JIS K 7222.

[0057] (2) Asker C hardness.

[0058] The hardness was measured with an Asker C hardness meter according to JIS K 7312.

[0059] (3) Compression set

[0060] According to JIS K 6400-4, the sample was compressed to 50% of its original thickness by method A (compression at 70° C.) and allowed to stand for 22 hours, and then decompressed and restored for 30 minutes, followed by measurement of the thickness and calculation of the compression set (CS).

[0061] The molded resin foams (samples 8 to 12, 18 to 20, 22 to 25, and 28 to 30), which exhibited a specific gravity of 0.3 or less, an Asker C hardness of 45 or less, and a compression set of 35% or less, and the foamable resin compositions used for these samples were regarded as Examples. Meanwhile, the molded resin foams (the samples other than the aforementioned ones) and the foamable resin compositions used for these samples were regarded as Comparative Examples.

[0062] The molded resin foam (sample 5) of Comparative Example 5 had only closed cells (about 0.2 to 0.4 mm) formed of high-temperature expandable microcapsules, as shown in FIG. 2 (cross-section micrograph).

[0063] In contrast, the molded resin foam of each Example (e.g., sample 10 of Example 3) had both closed cells (about 0.2 to 0.4 mm) formed of high-temperature expandable microcapsules and open cells (about 0.6 to 1.0 mm) formed of burst low-temperature expandable microcapsules, as shown in FIG. 1 (cross-section micrograph).

[0064] The present invention is not limited to the aforementioned Examples, and may be appropriately modified and embodied without departing from the spirit of the invention.