METHOD AND APPARATUS FOR MICROMACHINING A SAMPLE USING A FOCUSED ION BEAM

Abstract

An apparatus and a method for micromachining samples is provided. The apparatus includes an integral combination of a sample holder, a focused ion beam exposure system for projecting a FIB onto a first position on the sample, and a light optical microscope. The LM is configured for imaging or monitoring said first position. The method includes the steps of capturing LM images of the sample, determining a position and physical dimensions of a region of interest in the sample based on the LM images, establishing from the LM images settings of the sample holder and/or the FIB exposure system, for micromachining the sample to bring the region of interest more closer to the surface, and moving the sample or the trajectory of the FIB to locate the first position on the sample accordingly, and activating the FIB for micromachining the sample.

Claims

1-26. (canceled)

27. A method for micromachining a sample using an apparatus for micromachining of samples, wherein the apparatus comprises an integral combination of: a sample holder for holding the sample, a focused ion beam exposure system comprising an assembly for projecting a focused ion beam onto a first position where, in use, the focused ion beam impinges on the sample held by the sample holder, and a light optical microscope, wherein the light optical microscope is configured for imaging or monitoring the sample on the sample holder, wherein the method comprises the steps of: capturing one or more light microscopy images of the sample held by the sample holder; determining a position and physical dimensions of a region of interest in the sample based on the one or more light microscopy images; establishing from the one or more light microscopy images settings of the sample holder and/or the focused ion beam exposure system for micromachining the sample to reduce a distance between at least part of the region of interest and the surface of the sample or to produce a lamella which embodies at least part of the region of interest; and activating the focused ion beam exposure system in accordance with the settings for micromachining the sample.

28. The method according to claim 27, further comprising the step of: establishing from the one or more light microscopy images which part or parts of the sample need to be micro-machined by the focused ion beam exposure system to reduce the distance between at least part of the region of interest and the surface of the sample or to produce a lamella which embodies at least part of the region of interest.

29. The method according to claim 27, wherein the settings comprise a position on the sample where to arrange the first position, wherein the method further comprises the step of: moving the sample or at least an intended trajectory of the focused ion beam to locate the first position on the position on the sample accordingly, before activating the focused ion beam exposure system for micromachining the sample.

30. The method according to claim 29, further comprising the step of: monitoring the locating of the first position on the sample and/or monitoring the micromachining of the sample using the light optical microscope.

31. The method according to claim 27, wherein the settings comprise a spot size of the focused ion beam at the first position and/or a beam current of the focused ion beam.

32. The method according to claim 27, wherein the light optical microscope comprises a super resolution microscopy system, including types that use structured illumination, wherein the super resolution microscopy system provides position information of at least part of the region of interest with a resolution of approximately 300 nm or smaller.

33. The method according to claim 27, wherein the method further comprises the step of: providing structures around the region of interest with first fluorescent labels which can be observed by the light optical microscope.

34. The method according to claim 33, wherein the method further comprises the step of: monitoring the micromachining by observing fluorescence light from said first fluorescent labels using the light optical microscope.

35. The method according to claim 27, wherein the method further comprises the step of: providing the region of interest with second fluorescent labels which can be observed by the light optical microscope.

36. The method according to claim 35, wherein the method further comprises the step of: monitoring the micromachining by observing fluorescence light from said second fluorescent labels using the light optical microscope.

37. The method according to claim 27, wherein the method further comprises the step of: manufacturing of one or more lamella from the sample which includes at least part of the region of interest, wherein said lamella is a thin cut out for a thicker sample, with a thickness suitable for studying the lamella in a TEM.

38. The method according to claim 37, wherein the to be produced lamella is configured to comprise an observation surface, wherein method comprises the step of: orienting the sample and the FIB with respect to each other such that the FIB impinges on the sample at an oblique or grazing angle with respect to said observation surface.

39. The method according to claim 37, wherein the method further comprises the step of: monitoring the creation of the lamella using the light optical microscope.

40. The method according to claim 39, wherein the monitoring step further comprises one or more of the following: determining how close the lamella is to containing at least a part of the region of interest, determining an angle of approach between the FIB and the region of interest, determining whether at least a part of the region of interest is still enclosed within the lamella, determining and/or correcting a drift of the sample position, in particular at least a drift in a direction parallel to an optical axis of an objective lens of the light optical microscope.

41. The method according to claim 37, wherein the method further comprises the step of: evaluating the lamella in a TEM, and using a result of said evaluation to provide feedback to the apparatus for micromachining a sample to improve the targeting of a region of interest in a subsequent micromachining of a lamella.

42. The method according to claim 27, wherein the sample holder comprises a cooling system for cooling the sample, wherein the method further comprises the step of: cooling the sample prior to the micromachining of the sample by the FIB, cooling the sample down to a cryogenic temperature.

43. An apparatus for micromachining of samples, wherein the apparatus comprises an integral combination of: a sample holder for holding a sample, a focused ion beam exposure system comprising an assembly for projecting a focused ion beam onto a first position where, in use, the focused ion beam impinges on the sample held by the sample holder, a light optical microscope, wherein the light optical microscope is configured for imaging or monitoring said first position.

44. The apparatus according to claim 43, wherein the apparatus further comprises a controller which is configured for controlling the apparatus to perform, in use, the steps of: capturing one or more light microscopy images of the sample held by the sample holder; determining a position and physical dimensions of a region of interest in the sample based on the one or more light microscopy images; establishing from the one or more light microscopy images settings of the sample holder and/or the focused ion beam exposure system for micromachining the sample to reduce a distance between at least part of the region of interest and the surface of the sample or to produce a lamella which embodies at least part of the region of interest; and activating the focused ion beam exposure system in accordance with the settings for micromachining the sample.

45. The apparatus according to claim 43, wherein the light optical microscope comprises a cylindrical lens.

46. The apparatus according to claim 43, wherein the light optical microscope comprises an optical objective lens having an optical axis, wherein the apparatus comprises a mirror which is arranged on the optical axis at a position spaced apart from the optical objective lens, and wherein the sample holder is configured for holding a sample in between the optical objective lens and the mirror.

47. The apparatus according to claim 43, wherein light optical microscope comprises a focus tracker, wherein the focus tracker is configured to focus the light optical microscope on the sample and/or on a lamella that is being created by micromachining the sample using the focused ion beam exposure system.

48. The apparatus according to claim 43, wherein the light optical microscope is a fluorescence microscope and/or a super resolution light optical microscope.

49. The apparatus according to claim 43, wherein the sample holder comprises a cooling system for cooling the sample, wherein the cooling system is configured for cooling the sample down to a cryogenic temperature.

50. The apparatus according to claim 43, wherein the apparatus further comprises: an electron beam exposure system comprising an assembly for projecting an electron beam towards a position on the sample holder where, in use, the sample held by the sample holder, and a detector system, wherein the sample holder is configured to position the sample in between the electron beam exposure system and the detector system, wherein the detector system is configured for detecting electrons transmitted through at least a part of the sample, through a lamella.

51. The apparatus according to claim 50, wherein the detector system comprises a sheet of a scintillator material, wherein the sheet of scintillator material is arranged in between a position on the sample holder where, in use, a sample is positioned, and an objective lens of the light optical microscope, wherein the light optical microscope is configured for acquiring an image of at least a part of the sheet of the scintillator material.

52. The apparatus according to claim 51, wherein the apparatus comprises an actuator for moving the sheet of scintillator material from a first position where the scintillator material is arranged in between the position on the sample holder where, in use, a sample is positioned, and the objective lens of the light optical microscope, to a second position where the scintillator material is removed from the area in between the position on the sample holder where, in use, a sample is positioned, and the objective lens of the light optical microscope, or vice versa.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0062] The invention will be elucidated on the basis of an exemplary embodiment shown in the attached drawings, in which:

[0063] FIG. 1 schematically shows a first example of an integral LM/FIB apparatus according to the invention,

[0064] FIG. 2 schematically shows a second example of an integral LM/FIB apparatus according to the invention,

[0065] FIGS. 3-8 schematically show subsequent steps for micromachining a sample according to an example of a method according to the invention,

[0066] FIG. 9 schematically shows a sample in which the material surrounding the region of interest comprises first fluorescent labels,

[0067] FIG. 10 schematically shows a sample in which the region of interest comprises second fluorescent labels,

DETAILED DESCRIPTION OF THE INVENTION

[0068] FIG. 1 schematically shows a first exemplary embodiment of an apparatus 1 according to the present invention. The apparatus 1 contains an integral combination of a sample holder 2 for holding a sample 20, a focused ion beam exposure system 3, and a light optical microscope.

[0069] The light optical microscope comprises an objective lens 4, a light source 5 and a detector 9. The light source 5 is configured to direct light 7 from the light source 5 towards the objective lens 4, which is configured to focus the light onto the sample 20 on the sample holder 2. In the beam path in between the light source 5 and the objective lens 4, a half transparent mirror or dichroic mirror 6 is arranged, which is configured to pass at least part of the light 7 from the light source 5 towards the objective lens 4 to illuminate the sample 20.

[0070] The objective lens 4 is furthermore configured to collect light coming from the sample 20. The light collected by the objective lens 4 is at least partially reflected by the half transparent mirror or dichroic mirror 6 to direct said collected light 8 towards the detector 9.

[0071] Accordingly, the light optical microscope is configured to observe the sample 20 on the sample holder 2, taking optical measurement and/or optical images from the sample 20. [0072] preferably, the light source 5 is configured to emit light within a certain first wavelength or first wavelength range configured for exciting particular fluorescent labels and/or fluorescent molecules in the sample 20. In addition or alternatively, the detector 9 is configured for detecting light within a certain second wavelength or second wavelength range for detecting particular fluorescent labels and/or fluorescent molecules in the sample 20. The first wavelength or first wavelength range may be different from the second wavelength or second wavelength range.

[0073] As schematically shown in FIG. 1, the focused ion beam exposure system 3 is configured to project a focused ion beam 30 onto the surface of the sample 20 on the sample holder 2. Preferably, the beam spot size and/or the beam current of the focused ion beam 30 are configured so that the focused ion beam 30 can remove material from the surface of the sample 20, and thus can micro-machine the sample 20.

[0074] The focused ion beam exposure system 3 is typically arranged inside a vacuum chamber 11 which is connected to a vacuum pump via a connector 12.

[0075] As schematically shown in FIG. 1, the sample holder 2 and the microscope objective 4 are also arranged inside the vacuum chamber 11. Also the other parts of the light optical microscope may be arranged inside the vacuum chamber 11, but preferably at least the light source 5 and the detector 9 are arranged in an illumination and detection part, outside the vacuum chamber 11. The vacuum chamber 11 is provided with an optical window 13 which is arranged in the light beam path between the half transparent mirror or dichroic mirror 6 and the microscope objective 4. Due to the illumination and detection part outside the vacuum chamber 11, the light source and the detector 9 do not have to be vacuum-proof.

[0076] Because of the integral combination of the light optical microscope and the focused ion beam exposure system 3, the optical axis OA of the light optical microscope and the focused ion beam 30 axis are at least partially linked by design. This relation between the optical axis OA of the light optical microscope and the focused ion beam 30 allows to establish from the one or more light microscopy measurements or images where (position) and how (spatial orientation) to position the sample 20 in order to machine the desired part(s) of the sample 20 with the Focused ion beam 30.

[0077] It is noted that the focused ion beam exposure system 3 is configured for projecting the focused ion beam 30 onto a first position 31. The sample 20 is positioned by the sample holder 2 so that the first position 31 at least substantially coincides with a position on the sample 20 which needs to be treated by the focused ion beam 30. Preferably, the first position 31 is arranged so that it can be imaged or monitored by the light optical microscope. In the example as shown in FIG. 1, the first position is arranged at or near the optical axis OA of the light optical microscope.

[0078] It is noted, that the apparatus 1 preferably comprises a controller (not shown) which is connected to the light optical microscope, at least the detector 9 thereof, the focused ion beam exposure system 3, and the sample holder 2. The controller is configured for controlling the apparatus 1 to perform, in use, the steps of the method or an embodiment thereof as described below.

[0079] In use, light 7 from the light source 5 is directed towards the objective lens 4, which is configured to illuminate the sample 20. Light 8 from the sample is collected by the objective lens 4 and directed to the detector 9. In particular, the objective lens 4 is furthermore configured to collect light coming from the sample 20. The light collected by the objective lens 4 is at least partially reflected by the half transparent mirror or dichroic mirror 6 to direct said collected light 8 towards the detector 9. Preferably, the light optical microscope is configured to project an image of the sample surface onto the detector 9, wherein the detector 9 comprises a camera, for example a CCD camera, in order to capturing one or more light microscopy images of the sample 20 held by the sample holder 2.

[0080] Using the one or more light microscopy images as captured by the detector 9, a position and physical dimensions of a region of interest in the sample 20 can be determined. This determination can be performed by a user, for example by displaying said one or more light microscopy images on a display screen, wherein the user may select a part or a position in said one or more light microscopy images as a regions of interest. In addition or alternatively, this determination may be performed by a computing device or image analyzer, preferably using a predetermined contrast feature which enables the computing device or image analyzer to distinguish between the region of interest from the surrounding sample material.

[0081] Subsequently, the user and/or the computing device or image analyzer establishes from the one or more light microscopy images settings of the sample holder and/or the focused ion beam exposure system for micromachining the sample 20 to remove material form the surface of the sample 20 in order to reduce a distance between at least part of the region of interest and the surface of the sample 20 or to produce a lamella which embodies at least part of the region of interest, as will be explained in more detail below with reference to FIGS. 3 to 8.

[0082] Optionally, the light optical microscope is provided with a cylinder lens arrangement 10 arranged in the light optical path 8 towards the detector 9 of the light optical microscope, to improve the resolution of the light optical microscope along the optical axis OA. The cylinder lens arrangement 10 comprises a first cylindrical lens 101 and a second cylindrical lens 103 which is preferably arranged adjacent to the first cylindrical lens 101 in a direction parallel to the light optical path 8. The first cylindrical lens 101 comprises a cylinder axis 102 and the second cylindrical lens 103 comprises a cylinder axis 104. As schematically shown in the front view detail in FIG. 1, the cylinder axis 104 of the second cylindrical lens 103 is arranged at an angle θ with respect to the cylinder axis 102 of the first cylindrical lens 101. The angle θ is defined in a plane perpendicular to the optical axis of the light optical path 8 towards the detector 9. Preferably, the angle θ is larger than 0 degrees and smaller than 360 degrees. Preferably the angle θ is adjustable.

[0083] Optionally, the sample holder 2 is provided with a mirror 22 which is arranged on the optical axis OA at a position spaced apart from the optical objective lens 4, and wherein the sample holder 2 is configured for holding a sample 20 in between the optical objective lens 4 and the mirror 22. Preferably, said mirror 22 comprises a flat mirror. By providing the apparatus with a mirror 22 in the orientation as shown in FIG. 1, the resolution in a direction along the optical axis OA of an objective lens 4 of the light optical microscope can be improved.

[0084] FIG. 2 schematically shows a second exemplary embodiment of an apparatus 101 according to the present invention. The apparatus 101 contains an integral combination of a sample holder 102 for holding a sample 120, a focused ion beam exposure system 103, and a light optical microscope.

[0085] Again, the light optical microscope comprises an objective lens 104, a light source 105 and a detector 109, in a same configuration as in the first exemplary embodiment as described above with reference to FIG. 1. Accordingly, the light optical microscope is configured to observe the sample 120 on the sample holder 102, taking optical measurement and/or optical images from the sample 120.

[0086] As schematically shown in FIG. 2, the light optical microscope comprises a second dichroic mirror 114 and a focus tracker 115. The dichroic mirror 114 is configured to reflect Infra-red light and to transmit visible light. Accordingly, Infra-red light 116 from the focus tracker 115 is reflected by the dichroic mirror 114 into the optical path of the light optical microscope and is projected onto the sample 120 by the objective lens 104. The reflected Infra-red light is picked up by the objective lens 104 and is directed along the optical path of the light optical microscope up to the dichroic mirror 114, which again reflects said Infra-red light and projects the Infra-red light 116 to the focus tracker 115. The focus tracker 115 is configured to determine whether or not the sample 120 is arranged in the focus position of the light optical microscope. When the sample 120 is not in the focus position of the light optical microscope, the focus tracker 115 can provide a signal to the sample holder 102 or a controller which controls the sample holder 102, in order to enable an adjustment of relative position of the sample 120 with respect to the objective lens 104.

[0087] Optionally, the light optical microscope comprises a blocking filter 117 which is configured for at least substantially blocking the Infra-red light used by the focus tracker 115. The blocking filter 117 can at least substantially prevent that the Infra-red light used by the focus tracker 115, interferes with the light optical measurements by the light optical microscope.

[0088] As schematically shown in FIG. 2, the focused ion beam exposure system 103 is configured to project a focused ion beam 130 onto the surface of the sample 120 on the sample holder 102. Preferably, the beam spot size and/or the beam current of the focused ion beam 130 are configured so that the focused ion beam 130 can remove material from the surface of the sample 120, and thus can micro-machine the sample 120.

[0089] The focused ion beam exposure system 103 is typically arranged inside a vacuum chamber 111 which is connected to a vacuum pump via a connector 112.

[0090] As schematically shown in FIG. 2, the sample holder 102 and the microscope objective 104 are also arranged inside the vacuum chamber 111. Also the other parts of the light optical microscope may be arranged inside the vacuum chamber 111, but preferably at least the light source 105, the detector 109, and the focus tracker 115 are arranged in an illumination and detection part, outside the vacuum chamber 111. The vacuum chamber 111 is provided with an optical window 113 which is arranged in the light beam path between the dichroic mirror 114 and the microscope objective 104.

[0091] Because of the integral combination of the light optical microscope and the focused ion beam exposure system 103, the optical axis OA of the light optical microscope and the focused ion beam 130 axis are at least partially linked by design. This relation between the optical axis OA of the light optical microscope and the focused ion beam 130 allows to establish from the one or more light microscopy measurements or images where (position) and how (spatial orientation) to position the sample 120 in order to machine the desired part(s) of the sample 120 with the Focused ion beam 130.

[0092] Just as in the previous example, the focused ion beam exposure system 103 is configured for projecting the focused ion beam 130 onto a first position 131. The sample 120 is positioned by the sample holder 102 so that the first position 131 at least substantially coincides with a position on the sample 120 which needs to be treated by the focused ion beam 130. Preferably, the first position 131 is arranged so that it can be imaged or monitored by the light optical microscope. In the example as shown in FIG. 2, the first position is arranged at or near the optical axis OA of the light optical microscope.

[0093] In use, light 107 from the light source 105 is directed towards the objective lens 104, which is configured to illuminate the sample 120. The objective lens 104 is furthermore configured to collect light coming from the sample 120. The light collected by the objective lens 104 is at least partially reflected by the half transparent mirror or dichroic mirror 106 to direct said collected light 108 towards the detector 109. In particular, the light optical microscope is configured to project an image of the sample surface onto the detector 109, wherein the detector 109 comprises a camera, for example a CCD camera, in order to capturing one or more light microscopy images of the sample 120 held by the sample holder 102. The focus tracker 115 can be used to position and hold the sample 120 on the sample holder 102 in focus, before or during the imaging.

[0094] Using the one or more light microscopy images as captured by the detector 109, a position and physical dimensions of a region of interest in the sample 120 can be determined. This determination can be performed by a user, for example by displaying said one or more light microscopy images on a display screen, wherein the user may select a part or a position in said one or more light microscopy images as a regions of interest. In addition or alternatively, this determination may be performed by a computing device or image analyzer, preferably using a predetermined contrast feature which enables the computing device or image analyzer to distinguish between the region of interest from the surrounding sample material.

[0095] Subsequently, the user and/or the computing device or image analyzer establishes from the one or more light microscopy images settings of the sample holder and/or the focused ion beam exposure system for micromachining the sample 120 to remove material form the surface of the sample 120 in order to reduce a distance between at least part of the region of interest and the surface of the sample 120 or to produce a lamella which embodies at least part of the region of interest, as will be explained in more detail below with reference to FIGS. 3 to 8.

[0096] FIG. 3 schematically shows an example of a sample 20 which comprises a region of interest 21 as identified by a used and/or by a computing device or image analyzer. FIG. 4 schematically shows a cross-section along the line III-III of FIG. 3. As indicated, the region of interest 21 in this example is arranged inside the sample 20. At this position, the region of interest 21 cannot be studied using an electron microscope because of the limited penetration depth of electrons into the sample 20.

[0097] From the one or more light microscopy images as obtained by the light optical microscope from the sample 20, the position of the region of interest 21 in the sample 20 can be established.

[0098] In addition, from the information from these light microscopy images, and preferably from this information alone, a preferred way to machine the sample 20 can be established in order to bring at least part of the region of interest 21 more closely to the surface of the sample 20 or to produce a lamella 22 which embodies at least part of the region of interest 21. In order to establish the preferred way to machine the sample 20, the apparatus of the present invention or a controller thereof is preferably configured to also take account of the topography of the surface(s) of the sample 20 and/or the relative orientation of the sample on the sample holder 2 with respect to the focused ion beam exposure system 3, in particular with respect to the focused ion beam 30 and/or the position of the focus of the focused ion beam 30, which focus is preferably arranged at or near said first position.

[0099] Furthermore, the apparatus of the invention or a controller thereof is preferably configured to arrange the sample 20 and the focused ion beam 30 with respect to each other such that the focused ion beam 30 impinges on the sample 20 at an oblique or grazing angle with respect to an intended observation surface 25, 25′, in order to at least substantially prevent that ions from the focused ion beam are implanted in said observation surface 25, 25′.

[0100] When the position of the region of interest 21 and a position and/or orientation of an intended observation surface 25 has been established, a preferred way to machine the sample 20 to remove the material 23 of the sample which is arranged at a side of the intended observation surface 25 facing away from the region of interest 21, is established as schematically shown in FIG. 4.

[0101] Subsequently, the sample holder 2 is controlled to position the sample 20 with respect to the focused ion beam 30 such that the material 23 of the sample which is arranged at a side of the intended observation surface 25 facing away from the region of interest 21 can be removed as schematically shown in FIG. 5. As also schematically shown in FIG. 5, the focused ion beam 30 impinges on the sample 20 at an oblique or grazing angle with respect to an intended observation surface 25. The sample holder and/or the focused ion beam exposure system are configured to remove said material 23 layer by layer 24 in order to expose the intended observation surface 25 and make the intended observation surface 25 the new surface of the sample, as schematically shown in FIG. 6.

[0102] The sample 20 as shown in FIG. 6, where the region of interest 21 is at or just below the observation surface 25, can be used to study the sample in a Scanning Electron Microscope (SEM).

[0103] However, in order to study the region of interest 21 in great detail, the use of a Transmission Electron Microscope (TEM) is commonly preferred. In order to make the sample 20 suitable for studying the region of interest 21 with a TEM, the sample 20 must be further machined in order to obtain a lamella 22. Such a lamella uses the observation surface 25 as a first observation surface. In order to from a thin lamella 2, an intended second observation surface needs to be defined, which second observation surface is at least substantially parallel to the first observation surface, and preferably in such a way that at least part of the region of interest 21 is arranged in between the first and second observation surface. The intended second observation surface 25′ can be obtained by removing the material 23′ of the sample 20 which is arranged at a side of an intended second observation surface 25′ facing away from the region of interest 21, as schematically shown in FIG. 6.

[0104] Accordingly, the sample holder 2 is controlled to position the sample 20 with respect to the focused ion beam 30 such that the material 23′ of the sample 20 which is arranged at a side of the intended second observation surface 25′ facing away from the region of interest 21 can be removed, preferably layer by layer 24′, as schematically shown in FIG. 7.

[0105] It is noted, that instead of first machining the sample at the first side to expose the intended first observation surface and subsequently machining the sample at the second side to expose the intended second observation surface, the method of the present invention may also comprise the steps of: [0106] removing a thin layer of material from the first and second side of the sample by the focused ion beam exposure system; [0107] optionally capturing one or more light microscopy images of the sample held by the sample holder, determining anew a position and physical dimensions of a region of interest in the sample based on the one or more light microscopy images, and establish from the one or more light microscopy images settings of the sample holder and/or the focused ion beam exposure system for micromachining the sample to bring at least part of the region of interest more closely to the surface of the sample or to produce a lamella which embodies at least part of the region of interest, and [0108] activate the focused ion beam exposure system in accordance with the settings for micromachining the sample and removing a further thin layer of material from the first and second side of the sample in order to bring the surfaces of the sample more close to the region of interest, optionally, repeating the above steps until the desired thickness of the lamella has been reached.

[0109] The result of the micro-machining is a lamella 22 as schematically shown in FIG. 8, which represent a thin lamella 22 with a first observation surface 25 and a second observation surface 25′, and at least part of the region of interest 21 in between said first and second observation surfaces, with a thickness suitable for studying the lamella 22 in transmission by a TEM.

[0110] As schematically shown in FIG. 1, the position 31 where the focused ion beam 30 is focused on the sample 20 can be observed by the light optical microscope. Such observation may be carried out using the light optical contrast as provided by the illumination of the sample 20 by the light source 5.

[0111] However, the sensitivity of observing a progress of the removal of material from the sample 40 can be increased by providing the material around the region of interest 41 with first fluorescent labels 46 which can be observed by the light optical microscope, as schematically shown in FIG. 9. Accordingly, the micromachining of the sample 40 can be monitored by using fluorescence light from said first fluorescent labels 46. As such, when the fluorescence of the first fluorescent labels 46 as detected with the light optical microscope goes down in intensity, this is a sign that the focused ion beam is approaching the region of interest 41. Accordingly, micromachining of the sample 40, preferably for manufacturing a lamella 42 comprising the region of interest 41, can be accurately controlled by monitoring changes in the fluorescence intensity of the first fluorescent labels 46. For this, the light source is configured to illuminate the sample 40 with light of a wavelength suitable for excitation of the first fluorescent labels 46, and the detector is configured to detect the light emitted by the first fluorescent labels 46, preferably in a selective manner.

[0112] In addition or alternatively, the region of interest 51 can be provided with second fluorescent labels 56 as schematically shown in FIG. 10. Observing the fluorescence light from said second fluorescent labels 56, and in particular changed is the intensity of said fluorescence light, allows to monitor whether or not the region of interest 51 is being micromachined. As long as the fluorescence of the second fluorescent labels 56 as detected with the light optical microscope does not at least substantially go down in intensity, this is a sign that the region of interest 51 is still enclosed in the sample 50 and/or lamella 52. Accordingly, micromachining of the sample 50, preferably for manufacturing a lamella 52 comprising the region of interest 51, can be accurately controlled by monitoring changes in the fluorescence intensity of the second fluorescent labels 56. For this, the light source is configured to illuminate the sample 50 with light of a wavelength suitable for excitation of the second fluorescent labels 56, and the detector is configured to detect the light emitted by the second fluorescent labels 56, preferably in a selective manner.

[0113] It is noted, that the interaction between the focused ion beam 30 and the sample material may result in an emission of secondary electrons. These secondary electrons may travel over tens of nanometers from the first position where the focused ion beam 30 impinges on the sample, which secondary electrons may then interact with any fluorescent labels 56 present, to induce changes in the fluorescence intensity. Accordingly, when using fluorescent labels 56 which interact with secondary electrons, a change in fluorescence intensity can be observed while the focused ion beam 30 is still tens of nanometers away from the region of interest 56, which may be used to further safeguard that the region of interest 56 is not machined by the focused ion beam 30.

[0114] It is further noted, that in case the sample is provided with both the first fluorescent labels 46 and the second fluorescent labels 56, it is preferable that the first fluorescent labels 46 are different from the second fluorescent labels 56, preferable such that the fluorescent light from the first fluorescent labels 46 has a different wavelength or wavelength range in comparison to the fluorescent light from the second fluorescent labels 56, and that the detector is configured to be able to distinguish between the fluorescent light from the first fluorescent labels 46 and the fluorescent light from the second fluorescent labels 56.

[0115] It is to be understood that the above description is included to illustrate the operation of the preferred embodiments and is not meant to limit the scope of the invention. From the above discussion, many variations will be apparent to one skilled in the art that would yet be encompassed by the scope of the present invention.

[0116] In summary, the invention relates to an apparatus and a method for micromachining samples. The apparatus comprises an integral combination of: a sample holder, a focused ion beam (FIB) exposure system for projecting a FIB onto a first position on the sample, and a light optical microscope (LM), wherein the LM is configured for imaging or monitoring said first position. The method comprises the steps of: [0117] capturing LM images of the sample; [0118] determining a position and physical dimensions of a region of interest in the sample based on the LM images; [0119] establish from the LM images settings of the sample holder and/or the FIB exposure system, for micromachining the sample to bring the region of interest more closer to the surface, and move the sample or the trajectory of the FIB to locate the first position on the sample accordingly, and [0120] activate the FIB for micromachining the sample.