Abstract
The invention relates to method for applying a protective coating material to a structural layer to form a protective coating.
Claims
1. A method for forming a protective layer on a structural layer, the method comprising: imprinting a protective layer material on the structural layer, the imprinting comprising applying the protective layer material at a temperature less than 200° C.
2. The method according to claim 1, wherein the application of the protective layer material takes place with a sol-gel method.
3. The method according to claim 1, wherein the protective layer material is cured with an ammonia gas for the formation of the protective layer at room temperature, after the application of the protective layer material.
4. The method according to claim 1, wherein the protective layer material is liquid wherein the liquid protective layer material is converted into the protective layer, and wherein the protective layer is glass-like.
5. The method according to claim 1, wherein the structural layer comprises structures constituted as optical systems.
6. The method according to claim 1, wherein the formed protective layer is an oxide layer.
7. The method according the claim 6, wherein the oxide layer is a silicon dioxide layer.
8. The method according to claim 1, wherein the protective layer material is applied at a temperature less than 100° C.
9. The method according to claim 1, wherein the protective layer material is applied at a temperature less than 75° C.
10. The method according to claim 1, wherein the protective layer material is applied at a temperature less than 50° C.
11. The method according to claim 1, wherein the protective layer material is applied at a room temperature.
Description
[0131] Further advantages, features and details of the invention emerge from the following description of preferred examples of embodiment and with the aid of the drawings. In the figures:
[0132] FIG. 1a shows a first process step for the production of a structural layer,
[0133] FIG. 1b shows a second process step for the production of a structural layer,
[0134] FIG. 1c shows a third process step for the production of a structural layer,
[0135] FIG. 1d shows a fourth process step for the production of a structural layer,
[0136] FIG. 2a shows a first process step for the production of a protective layer,
[0137] FIG. 2b shows a second process step for the production of a protective layer,
[0138] FIG. 2c shows a third optional process step for the production of a protective layer,
[0139] FIG. 2d shows an alternative second process step for the production of a protective layer.
[0140] FIG. 2e shows an alternative third process step for the production of a protective layer,
[0141] FIG. 2f shows fourth process step for the production of a protective layer,
[0142] FIG. 3a shows the first process step for the modification of a protective layer,
[0143] FIG. 3b shows the second process step for the modification of a protective layer,
[0144] FIG. 3c shows the third process step for the modification of a protective layer,
[0145] FIG. 3d shows the fourth process step for the modification of a protective layer and
[0146] FIG. 4 shows a component with an applied structural and protective layer.
[0147] In the figures, identical components or components with the same function are denoted by the same reference numbers.
[0148] In particular, the structures of the imprinted polymer layer are greatly enlarged and not reproduced true to scale, in order to clarify the representation.
[0149] FIG. 1a shows the first process step for the production of a structural layer 7 (see FIG. 1d) on a substrate 1. A structural layer material 2 is deposited by a deposition system 3 on substrate 1. The deposition system is represented symbolically by an outlet opening. Deposition system 3 is preferably a simple hose system, via which protective layer material 2 is deposited on substrate 1. Deposition system 3, however, can for example also be a CVD/PVD system. The distribution of structural layer material 2 is carried out in a further process step not represented, for example by rotation of substrate 1.
[0150] FIG. 1b shows a second process step for the production of a structural layer (see FIG. 1d) on a substrate 1. With the aid of a stamp 4, the imprinting takes place and thus the structuring of structural layer material 2. By means of the imprinting, structures 5 are produced in structural layer material 2, which in particular should comprise optical properties. Preferably, it is a diffraction grating.
[0151] FIG. 1c shows as a third process step for the production of a structural layer 7 (see FIG. 1d) on a substrate 1. The third process step comprises a curing process of the structural layer material 2. The curing preferably takes place by an influence 6. Influence 6 is preferably electromagnetic radiation, in particular UV light, or heat. Most preferably, the curing takes place, as represented graphically, by means of stamp 4.
[0152] FIG. 1d shows a fourth process step for the production of a structural layer 7 on a substrate 1. In this process step, the demoulding of stamp 4 from cured structural layer material 2′ takes place. The detail represents an enlarged part of structural layer 7, in which particles 8 can be detected. Particles 8 can have been mixed in with structural layer material 2, 2′, in order to change its, in particular, optical and/or mechanical properties.
[0153] FIG. 2a shows a first process step according to the invention for the deposition of a protective layer material 9 with an average thickness t1 on produced structural layer 7. The deposition takes place by a deposition system 3. Deposition system 3 is preferably the same deposition system 3 with which structural layer material 2 was also deposited.
[0154] FIG. 2b shows the most important step according to the invention for room-temperature curing of protective layer material 9 with the aid of an ammonia-containing atmosphere.
[0155] FIG. 2c shows a further optional process step for the production of a protective layer 10 for a structural layer 7. The process step comprises primarily a planarisation and/or removal of the already cured protective layer material 9′ to a layer thickness t2. Such a process is necessary particularly when it is intended to functionalise protective layer surface 9o′ in further process steps (see FIGS. 3a-3d). The detail represents an enlarged part of protective layer 10, in which particles 8′ can be detected. Particles 8′ can have been mixed in with protective layer material 9, 9′, in order to change its, in particular, optical and/or mechanical properties. The use of different particles 8, 8′ in structural layer 7 and protective layer 10 can be modified chiefly when structural layer material 2′ and protective layer material 9′ are chemically and physically identical. In most cases, however, this is not the case. In order to highlight the difference between particles 8, 8′, an elliptical geometry was in part selected for particles 8′.
[0156] FIG. 2d shows an alternative second process step, which is distinguished by imprinting of the protective layer material 9 by means of a stamp 4′. In protective layer material 9, structures 5′ are produced which have an effect on the optical properties of structural layer 7. Structures 5′ can for example be a diffraction grating, which deflects photons with a certain wavelength or a transmission grating in order to convey the photons in a targeted manner onto structural layer 7. In the present example, structures 5′ are parts of an echelle diffraction grating, whereas structures 5 are parts of a standard diffraction grating. It thus concerns here only one of many possible embodiments which is represented as an example. Structures 5 could just as well have been formed as échelle diffraction gratings.
[0157] FIG. 2e shows the most important step according to the invention for the room-temperature curing of the imprinted protective layer material 9′ with the aid of an ammonia-containing atmosphere. This process step is essentially identical to the process step from FIG. 2b.
[0158] FIG. 2f shows an alternative end product according to the invention with a structured structural layer 10′. The detail represents an enlarged part of protective layer 10, in which particles 8′ can be detected. Particles 8′ can have been mixed in with protective layer material 9, 9′, in order to change its, in particular, optical and/or mechanical properties.
[0159] The following four figures describe a process, which on account of the complexity will probably be difficult to implement. Nonetheless, the corresponding possibility should be disclosed here.
[0160] FIG. 3a shows a first process step of a possible surface modification of protective layer surface 9o′. The production of a functional unit 11 in the surface (again by a plurality of process steps which are not represented here) would be conceivable. For this purpose, either protective layer material 9 itself must be suitable for being able to produce corresponding functional units 11, or a corresponding material must be introduced into protective layer material 9. For example, the use of an atomic layer deposition would be conceivable, in order to deposit a monocrystalline material. A corresponding IC could then be produced in a monocrystalline material. It is also conceivable and more preferable for the functional unit to be a prefabricated microchip or nanochip, which has been positioned by a pick-and-place operation on protective layer material 9.
[0161] FIG. 3b shows a second process step of a possible surface modification of protective layer surface 9o′ to form protective layer surface 9o″. Functional unit 11 can be covered by a further deposition of a protective layer material 9.
[0162] FIG. 3c shows a third process step of a possible surface modification of protective layer surface 9″. By means of further process steps, so-called vias 12 can be produced, which can connect functional units 11 with one another.
[0163] FIG. 3d shows the end state of a possible surface modification of protective layer surface 9′″. A plurality of, in particular, fully operational functional units 11 have been produced in protective layer surface 9′″. The density, the spacing and the size of functional units 11 must lie in an order of magnitude range well below the transmitted electromagnetic radiation, which is intended to reach structures 5 of structural layer 7. Otherwise, functional units 11 and/or the vias would act as undesired scatter centres and ruin the functionality of the entire product.
[0164] FIG. 4 shows an exemplary macroscopic component 13 formed geometrically complicated, consisting of a substrate 1′, on substrate surface 1o′ of which a structural layer 7 is applied, which in turn is coated with a protective layer 10 according to the invention. The figure is intended to show that structural layers 7 produced and coated according to the invention can be produced very well on surfaces 1o of arbitrary geometry and can be deposited at least by a transfer process. The gas introduced at room temperature, which is used for the curing of protective layer 10, can also flow around complicated component geometries. Furthermore, component 13, which can generally already consist of a plurality of temperature-sensitive components, is not subjected to any temperature load.
[0165] In the case of the transfer of a structural layer 7 onto a substrate 1′, the small layer thickness of protective layer 10 also contributes positively to adapting to an arbitrary geometry.
LIST OF REFERENCE NUMBERS
[0166] 1, 1′ substrate [0167] 1o, 1o′ substrate surface [0168] 2, 2′ structural layer material [0169] 3 deposition system [0170] 4, 4′ stamp [0171] 5, 5′ structure [0172] 6 influence [0173] 7 structural layer [0174] 8, 8′ particles [0175] 9, 9′ protective layer material [0176] 90, 90′ protective layer surface [0177] 10, 10′ protective layer [0178] 11 functional unit [0179] 12 vias [0180] 13 component [0181] t1, t2 layer thickness
