CONTACTING MODULE FOR HAVING A MOUNTING PLATE FOR CONTACTING OPTOELECTRONIC CHIPS

Abstract

A contacting module and to a method for assembling a contacting module. The contacting module includes: an optical module which contains an optical block made of glass, which optical block has an arrangement of optical interfaces (S.sub.opt) in an optical interface plane (E.sub.opt); and an electronic module, which has an arrangement of electrical interfaces (S.sub.ele) in an electrical interface plane (E.sub.ele). The optical module and the electronic module are arranged relative to each other such that the arrangement of optical interfaces (S.sub.opt) and the arrangement of electrical interfaces (S.sub.ele) have a defined alignment position relative to each other. The optical module contains a mounting plate which is connected to the electronic module by means of a repeatedly releasable, reproducible connection.

Claims

1. A contacting module, comprising: an optical module including an optical block made of glass, with optical signal lines in a form of waveguides, with a mirror arranged in front of each waveguide, and with an arrangement of optical interfaces (S.sub.opt) in an optical interface plane (E.sub.opt), and an electronic module, containing a carrier plate, a printed circuit board and a needle carrier with an arrangement of contacting needles with needle tips, which form an arrangement of electrical interfaces (S.sub.ele) in an electrical interface plane (E.sub.ele), wherein the optical module and the electronic module are arranged relative to one another in such a way that the arrangement of optical interfaces (S.sub.opt) and the arrangement of electrical interfaces (S.sub.ele) have a defined adjustment position relative to one another with respect to all six degrees of freedom of a Cartesian coordinate system, and wherein the optical module also includes a mounting plate to which the optical block is cohesively connected, and the mounting plate is connected to the electronic module via a repeatedly detachable connection, said detachable connection ensuring repeated production of the adjustment position of the arrangement of the optical interfaces (S.sub.opt) with respect to the arrangement of the electrical interfaces (S.sub.ele).

2. The contacting module according to claim 1, wherein, on a first end face of the mounting plate, three elevations defining a mounting plane are present, which rest against a mounting surface of the carrier plate, fixing a relative position of the mounting plate in a z-direction, about an x-direction and about a y-direction of a Cartesian coordinate system with respect to the carrier plate, and there are three stop pins on a circumferential surface of the mounting plate, which are aligned parallel to the mounting plane and are each contacted by a respective dowel pin provided on the carrier plate, thus fixing the relative position of the mounting plate in the x-direction, in the y-direction and around the z-direction to the carrier plate.

3. The contacting module according to claim 2, wherein two of the three dowel pins are arranged on an imaginary straight line oriented in the x-direction, two of the stop pins are aligned with each other in the x-direction, a third of the stop pins is aligned in the y-direction and the mounting plate is connected to the carrier plate via at least one screw connection.

4. The contacting module according to claim 1, wherein, on a first end face of the mounting plate, three elevations defining a mounting plane are present, which rest against a mounting surface of the carrier plate, whereby a relative position of the mounting plate in a z-direction, and about an x-direction and a y-direction of the Cartesian coordinate system with respect to the carrier plate is fixed, and the mounting plate has two bending structures penetrating the mounting plate, wherein in a first of the two bending structures, a first clamping pin attached to the carrier plate is clamped circumferentially via its lateral surface, thus fixing the relative position of the mounting plate in the x-direction and the y-direction to the carrier plate, and in the second of the bending structures, a second clamping pin attached to the carrier plate is clamped tangentially via its lateral surface, thus fixing the relative position of the mounting plate around the z-direction to the carrier plate.

5. The contacting module according to claim 4, wherein the first bending structure has the shape of a pipe clamp, in which the first clamping pin is clamped in a self-centered manner.

6. The contacting module according to claim 1, wherein the optical block is permanently connected to the mounting plate via at least three cylindrical pins, wherein the cylindrical pins each contact the optical block with a first end face via adhesive, and in the mounting plate, there are through holes, in which the cylindrical pins are each connected indirectly to the mounting plate via adhesive.

7. A method for mounting a contacting module with an optical module, containing an optical block made of glass, which has an arrangement of optical interfaces (S.sub.opt) in an optical interface plane (E.sub.opt) and is mounted on a mounting plate, and an electronic module, containing a carrier plate, a printed circuit board and an arrangement of contacting needles with needle tips, which form an arrangement of electrical interfaces (S.sub.ele) in an electrical interface plane (E.sub.ele), the optical module and the electronic module being arranged relative to one another in such a way that the arrangement of optical interfaces (S.sub.opt) and the arrangement of electrical interfaces (S.sub.ele) have a defined adjustment position relative to one another, comprising: before the optical block is fastened to the mounting plate, connecting the mounting plate is connected to the carrier plate by means of a detachable connection in a relative position which can be produced repeatedly, after connecting the mounting plate, adjusting the optical block relative to the mounting plate until the arrangement of the optical interfaces (S.sub.opt) has assumed a predetermined adjustment position relative to the arrangement of the electrical interfaces (S.sub.ele), and finally, permanently connecting the optical block the mounting plate, whereby after each re-establishment of the detachable connection the arrangement of the optical interfaces (S.sub.opt) is arranged in the predetermined adjustment position relative to the arrangement of the electrical interfaces (S.sub.ele).

8. The method according to claim 7, wherein permanently connecting the optical block to the mounting plate includes making at least three through holes in the mounting plate parallel to each other, guiding at least three cylindrical pins through the through holes from a first end face of the mounting plate facing away from the optical block, until the at least three cylindrical pins each come into contact with the optical block, adhesive having previously been applied to a first end face of the cylindrical pins which faces the optical block, such that the cylindrical pins are glued in the through holes either during guiding or as a final step.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The invention will be explained in more detail below with reference to exemplary embodiments and drawings. In the drawings:

[0030] FIGS. 1a and 1 b show a simplified representation of a contacting module in a top view and a lateral view,

[0031] FIGS. 2a and 2b show a first embodiment example of a contacting module having a first detachable connection between the optical module and the electronic module, in a top view and a lateral view,

[0032] FIGS. 3a and 3b show a second embodiment example of a contacting module having a second detachable connection between the optical module and the electronic module, in a top view and a sectional view,

[0033] FIGS. 4a and 4b show an adhesive connection between the optical block and the mounting plate of the optical module, in a top view and a sectional view,

[0034] FIG. 5a shows a first embodiment of the adhesive connection, and

[0035] FIG. 5b shows a second embodiment of the adhesive connection.

DETAILED DESCRIPTION OF THE DRAWINGS

[0036] A contacting module according to the invention, as shown in FIGS. 1a and 1b, has an optical module 1 and an electronic module 2 like prior art contacting modules of the same generic type.

[0037] The optical module 1 includes an optical block 1.1 made of glass, which has an arrangement of optical interfaces S.sub.opt in an optical interface plane E.sub.opt which are arranged facing an optoelectronic chip under test. In addition, the optical module 1 has means for inputting and outputting optical signals into and out of the optical block 1.1, e.g., a fiber array, which are associated with a test device, which is important for the function but not essential for the explanation of the invention (not shown). It is also not essential for the invention how the optical interfaces S.sub.opt are designed.

[0038] The electronic module 2 contains a carrier plate 2.1, a printed circuit board 2.2 and a needle carrier 2.3 with an arrangement of contacting needles 2.3.1, in particular vertical needles or cantilever needles. The contacting needles 2.3.1 form an arrangement of electrical interfaces S.sub.ele with their needle tips in an electrical interface plane E.sub.ele. The carrier plate 2.1 and the needle carrier 2.3 are firmly connected to each other or form a monolithic unit.

[0039] The optical module 1 and the electronic module 2 are arranged relative to one another in such a way that the arrangement of optical interfaces S.sub.opt and the arrangement of electrical interfaces S.sub.ele have a defined adjustment position relative to one another with respect to all six degrees of freedom of a Cartesian coordinate system.

[0040] It is essential to the invention that the optical module 1 contains a mounting plate 1.2 to which the optical block 1.1 is cohesively connected by an adhesive connection. Via this mounting plate 1.2, the optical module 1 is connected to the electronic module 2, preferably to the carrier plate 2.1, by means of a detachable connection, said detachable connection ensuring repeated production of the adjustment position of the arrangement of the optical interfaces S.sub.opt to the arrangement of the electrical interfaces S.sub.ele. This adjustment position reflects the relative position of the arrangement of optical interfaces S.sub.opt and electrical interfaces S.sub.ele of an optoelectronic chip under test. The possibility of temporarily separating the optical module 1 and the electronic module 2 makes it possible to replace or clean, e.g. in the course of service or repair, the contacting needles 2.3.1 without the risk of soiling or damaging the optical block 1.1 made of glass.

[0041] The optical module 1 can be connected to the carrier plate 2.1 directly via the mounting plate 1.2 or indirectly, e.g. via the needle carrier 2.3. The direct connection has the advantage of a shorter tolerance chain.

[0042] Two advantageous embodiments for the detachable connection are shown below on the basis of embodiment examples. Also disclosed is a particularly advantageous way of providing the cohesive connection between the optical block 1.1 and the mounting plate 1.2.

[0043] In a first embodiment example, shown in FIGS. 2a and 2b, on a first end face 1.2.1 of the mounting plate 1.2, three elevations 1.2.1.1 defining a mounting plane are present, which form a three-point support and which, by resting against a mounting surface 2.1.1 of the carrier plate 2.1, define the relative position of the mounting plate 1.2 in a z-direction about an x-direction and about a y-direction, i.e. in a rotational position R.sub.x and in a rotational position Ry, of a Cartesian coordinate system with respect to the carrier plate 2.1. Three stop pins 1.2.2.1 aligned parallel to the mounting plane are provided on a circumferential surface of the mounting plate 1.2, against each of which a dowel pin 2.1.2 provided on the carrier plate 2.1 rests, so that the relative position of the mounting plate 1.2 in the x-direction, in the y-direction and about the z-direction, i.e. in a rotational position R.sub.z, with respect to the carrier plate 2.1 is fixed. In the first embodiment example specifically shown, two of the three dowel pins 2.1.2 are arranged on an imaginary straight line oriented in the x-direction. Two of the stop pins 1.2.2.1 are aligned with each other in the x-direction and rest against the two dowel pins 2.1.2, and a third of the stop pins 1.2.2.1 is aligned in the y-direction and rests against the third of the dowel pins 2.1.2. Even if the mounting plate 1.2 is repeatedly removed from and mounted on the carrier plate 2.1, the mounting plate 1.2 assumes the same relative position to the carrier plate 2.1 in a tolerance-free manner. To place the stop pins 1.2.2.1 against the dowel pins 2.1.2, a contact pressure unit 8 can be temporarily placed on the carrier plate 2.1, for example. To fix the relative position, the mounting plate 1.2 is connected to the carrier plate 2.1 via at least one screw connection 2.1.3.

[0044] In a second embodiment example, shown in FIGS. 3a and 3b, the relative position of the mounting plate 1.2 in the x-direction, in the y-direction and about the z-direction to the carrier plate 2.1 is determined by a three-point support, analogous to the first embodiment example. The mounting plate 1.2 has two bending structures 4 penetrating the mounting plate 1.2 and formed, for example, by electroerosion. Two clamping pins 3 are provided on the carrier plate 2.1, aligned perpendicular to the mounting surface 2.1.1 and firmly connected to the carrier plate 2.1. They can be connected to the carrier plate 2.1 directly or indirectly, e.g. at the needle carrier 2.3, which is advantageously made of ceramic. For a detachable connection of the mounting plate 1.2 to the carrier plate 2.1, the two clamping pins 3 are each clamped in one of the bending structures 4. In the first of the two bending structures 4, the first of the two clamping pins 3 is clamped circumferentially via its lateral surface, thus fixing the relative position of the mounting plate 1.2 in the x-direction and the y-direction to the carrier plate 2.1. Advantageously, the first of the two bending structures 4 has the shape of a pipe clamp. In the second of the two bending structures 4, the second of the two clamping pins 3 is clamped tangentially via its lateral surface, thus fixing the relative position of the mounting plate 1.2 around the z-direction to the carrier plate 2.1.

[0045] To clamp the bending structures 4 on one of the clamping pins 3 in each case, the latter can be dimensioned in such a way that, in the stress-free state, they have an opening that is smaller than the cross-section of the clamping pins 3, so that they are clamped before or with the insertion of the clamping pins 3 and clamp the clamping pin 3.

[0046] Advantageously, the bending structures 4 are dimensioned so that they each have an opening that is larger than the cross-section of the clamping pins 3. Only after the clamping pins 3 have been inserted are the bending structures 4 tensioned to clamp the clamping pins 3. This can advantageously be done via a set screw 6, as shown.

[0047] The optical block 1.1 made of glass is glued to the mounting plate 1.2. Advantageously, the adhesive connection between the optical block 1.1 and the mounting plate 1.2, as shown in FIGS. 4a and 4b, is an indirect adhesive connection via cylindrical pins 5 which are glued on the one hand to the optical block 1.1 and on the other hand to the mounting plate 1.2 and thus permanently connected. There are at least three cylindrical pins 5. They each contact the optical block 1.1 with a first end face 5.1 via adhesive. In the mounting plate 1.2, there is a corresponding number of through holes 7, in which the cylindrical pins 5 are each connected to the mounting plate 1.2 via adhesive 9. This type of connection has a particular advantage during assembly. The optical block 1.1 can be adjusted in all six degrees of freedom and glued to the mounting plate 1.2 in the adjustment position without adhesive 9 already being present on the optical block 1.1 or the mounting plate 1.2 during adjustment.

[0048] The connection of the cylindrical pins 5 in the through holes 7 can advantageously be established by the cylindrical pins 5 projecting beyond the mounting plate 1.2 and being enclosed by adhesive 9, as shown in FIG. 5a. Even more advantageously, the cylindrical pins 5 are dimensioned in such a way that a free volume remains above their second end face 5.2 in the through hole 7, which is filled with adhesive 9, as shown in FIG. 5b.

[0049] A method according to the invention for assembling a contacting module according to the invention will be explained in more detail below. As in the prior art, at the end of the adjustment and assembly, the optical module 1 and the electronic module 2 are arranged relative to one another in such a way that the arrangement of optical interfaces S.sub.opt and the arrangement of electrical interfaces Soto have a defined adjustment position relative to one another in all six degrees of freedom.

[0050] In contrast to the prior art, assembly according to the invention takes place in two steps.

[0051] Before the optical block 1.1 is attached to the mounting plate 1.2, the latter is connected to the carrier plate 2.1 via a repeatedly detachable connection, with the mounting plate 1.2 assuming a reproducible relative position to the carrier plate 2.1. No adjustment is made here, since what is important is not a defined relative position but a reproducible relative position which the mounting plate 1.2 assumes exactly again in relation to the carrier plate 2.1 each time the connection is re-established. This established connection can be secured by an additional screw connection 2.1.3.

[0052] After this detachable connection has been made for the first time, the optical block 1.1 is aligned and adjusted with respect to the mounting plate 1.2 until the arrangement of the optical interfaces S.sub.opt has assumed a predetermined adjustment position with respect to the arrangement of the electrical interfaces S.sub.ele. Only then is the optical block 1.1 permanently connected to the mounting plate 1.2 without their adjustment position to each other being cancelled. After each re-establishment of the detachable connection, the arrangement of the optical interfaces S.sub.opt will thus be arranged in the predetermined adjustment position with respect to the arrangement of the electrical interfaces S.sub.ele.

[0053] Advantageously, the permanent connection of the optical block 1.1 to the mounting plate 1.2 is established by making at least three through holes 7 in the mounting plate 1.2 parallel to each other, through which at least three cylindrical pins 5 are guided from a first end face of the mounting plate 1.2 facing away from the optical block 1.1, until they each come into contact with the adjusted optical block 1.1. Beforehand, adhesive 9 was applied to at least one end face of the cylindrical pins 5 facing the optical block 1.1 in each case. The adhesive 9 joining the cylindrical pins 5 to the mounting plate 1.2 can either also be applied to the circumferential surface of the cylindrical pins 5 prior to insertion of the cylindrical pins 5 into the through holes 7 or dispensed into the through holes 7. Advantageously, it can also be dispensed after the cylindrical pins 5 have been inserted and placed in the through holes 7, which are dimensioned for such a procedure such that the end faces of the cylindrical pins 5 facing away from the optical block 1.1 lie below a surface of the mounting plate 1.2, whereby the adhesive 9 fills a volume with a diameter of the through holes 7.

[0054] A defined adhesive surface for the cylindrical pins 5 is obtained by advantageously dimensioning the cylindrical pins 5 and the through holes 7 so that a second end face 5.1 of the cylindrical pins 5 lies within the through hole 7. The remaining free volume in the through hole 7 is then filled with adhesive 9.

[0055] If the optical block 1.1 and the mounting plate 1.2 are aligned parallel to each other in the adjusted relative position, all cylindrical pins 5 are glued equally deep in the through holes 7. This does not change for relative positions which differ in the x-direction, in the y-direction, in the z-direction or around the z-direction. A tilt around the x-direction or around the y-direction is compensated for by placing the cylindrical pins 5, arranged more or less deep in the through holes 7, in contact with the optical block 1.1. Unlike many adhesive connections known from the prior art, tilting does not have to be compensated for by the amount of adhesive 9. An equal amount of adhesive at all points where the connection is formed has the advantage that the behavior of the adhesive 9, e.g. shrinkage during solidification, has a similar effect everywhere, thus fixing the adjusted relative position with high precision.

LIST OF REFERENCE NUMERALS

[0056] 1 optical module [0057] 1.1 optical block [0058] 1.2 mounting plate [0059] 1.2.1 first end face of the mounting plate [0060] 1.2.1.1 elevation [0061] 1.2.2 circumference of the mounting plate [0062] 1.2.2.1 stop pin [0063] 2 electronic module [0064] 2.1 carrier plate [0065] 2.1.1 mounting surface [0066] 2.1.2 dowel pin [0067] 2.1.3 screw connection [0068] 2.2 printed circuit board [0069] 2.3 needle carrier [0070] 2.3.1 contacting needle [0071] 3 clamping pin [0072] 4 bending structure [0073] 5 cylindrical pin [0074] 5.1 first end face of the cylindrical pin [0075] 5.2 second end face of the cylindrical pin [0076] 6 set screw [0077] 7 through hole [0078] 8 contact pressure unit [0079] 9 adhesive [0080] S.sub.opt optical interface [0081] S.sub.ele electrical interface [0082] E.sub.opt optical interface plane (of the contacting module) [0083] E.sub.ele electrical interface plane (of the contacting module)