Spring

Abstract

This spring used for a suspension device for a vehicle is provided with: a metal wire material which constitutes a spring section and which has a cover layer provided on the surface thereof; and a seat section which is subjected to a load acting on the spring section, is formed from an elastically deformable material, has a groove section into which the wire material fits, and is bonded to the wire material by an adhesive. The minimum thickness of the portion of the adhesive, which protrudes from the groove section, is greater than or equal to the thickness of an adhesion layer formed in the groove section.

Claims

1. A spring for a suspension device, for use in a suspension device for a vehicle, comprising: a wire made of metal, constituting a spring section, and provided with a coating layer on a surface of the wire; and a seat section made of an elastically deformable material, bearing load acting on the spring section, having a groove section into which the wire is fitted, and adhered to the wire by an adhesive, wherein a minimum thickness dimension of the adhesive overflowing from the groove section is greater than or equal to a thickness dimension of an adhesion layer formed in the groove section, wherein an adhesive accumulation portion is provided at an end portion of the groove section in a width direction, wherein the adhesive accumulation portion is constituted by a protruding strip, wherein the protruding strip extends along the groove section in a state where the protruding strip protrudes from the end portion of the groove section in the width direction, and a plane extending along the width direction is provided between the protruding strip and the end portion of the groove section in the width direction.

2. The spring for a suspension device according to claim 1, wherein the thickness dimension of the adhesion layer formed in the groove section increases along a direction toward the end portion of the groove section in the width direction.

3. The spring for a suspension device according to claim 1, wherein the elastically deformable material is rubber.

4. The spring for a suspension device according to claim 1, wherein the elastically deformable material is resin.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a diagram showing a spring according to a first embodiment of the invention.

(2) FIG. 2 is a diagram showing a seat section in the first embodiment.

(3) FIG. 3 is a diagram showing an adhesion layer and its vicinity in the first embodiment.

(4) FIG. 4 is a diagram showing a part A of FIG. 3, which is a characteristic part of the first embodiment.

(5) FIG. 5 is a diagram for illustrating a comparative example.

(6) FIG. 6 is a diagram showing a characteristic part of a second embodiment of the invention, which corresponds to the part A of FIG. 3.

(7) FIG. 7 is a diagram showing a characteristic part of a third embodiment of the invention, which corresponds to the part A of FIG. 3.

(8) FIG. 8 is a diagram showing the characteristic part of the third embodiment, which corresponds to the part A of FIG. 3.

DETAILED DESCRIPTION OF THE INVENTION

(9) The following “embodiment of the invention” shows an example of an embodiment falling within the technical scope of the present disclosure. In other words, the invention-specifying matters recited in the claims are not limited by specific structures, configurations, or the like shown in the following embodiments.

(10) Arrows or the like indicating directions marked in the drawings are described to provide easy understanding of the relationships between the drawings. The invention described in this specification is not limited by the directions marked in the drawings.

(11) A member or portion described at least with a reference numeral is provided at least one in number unless specified with the term “one” or the like. In other words, two or more such members may be provided when not specified with the term “one” or the like.

(12) This embodiment is an example in which the spring of the present disclosure is applicable as a spring for a suspension device, such as a spring for a suspension device for a vehicle.

First Embodiment

(13) 1. Structure of Spring for Suspension Device

(14) A spring 1 for a suspension device shown in FIG. 1 (hereinafter referred to as a spring 1) comprises at least a spring section 2 and a seat section 3. The spring section 2 is a spring constituted by a wire 2A made of metal.

(15) A coating layer 2B covering the entire wire 2A is provided on the surface of the wire 2A. The spring section 2 of this embodiment is a coil spring formed in a coil shape. The coating layer 2B is a thin film formed from a resin such as a thermosetting resin by stoving varnish.

(16) The seat section 3 is a seat bearing load acting on the spring section 2, and is, for example, a rubber seat. The seat section 3 is made of an elastically deformable material. The material of the seat section 3 may exemplarily include at least one of rubber and resin. As shown in FIG. 2, the seat section 3 is provided with a groove section 3A into which a part of the wire 2A is fitted.

(17) The groove section 3A is a groove into which a part of the wire 2A constituting an end turn section is fitted. In other words, the seat section 3 is arranged at an end of the spring section 2 configured in a coil shape in the coil axial direction, and is in contact with the part of the wire 2A constituting the end turn section (see FIG. 1). The wire 2A described below is the part of the wire 2A constituting the end turn section.

(18) The wire 2A is adhered to the inner wall surface of the seat section 3, i.e., the groove section 3A, by an adhesive. Therefore, as shown in FIG. 3, an adhesion layer AD of the adhesive is formed between the wire 2A and the inner wall surface of the groove section 3A.

(19) 2. Configuration of an Adhesion Part

(20) As shown in FIG. 4, in the adhesion part A, the minimum thickness dimension Tb of the adhesive overflowing from the groove section 3A (hereinafter referred to as the overflow part Bo) is greater than or equal to the thickness dimension Td of the adhesion layer AD formed in the groove section 3A.

(21) Specifically, an adhesive accumulation portion 4 on which the adhesive is accumulated to restrict the flow of the adhesive is provided at an end portion of the groove section 3A in the width direction. The adhesive accumulation portion 4 of this embodiment is constituted by a planar section 4A provided at an end portion of the groove section 3A in the width direction and configured in a substantially planar shape. As shown in FIG. 4, the planar section 4A constituting the adhesive accumulation portion 4 of this embodiment spreads from the upper end of the end portion of the groove section 3A in the width direction in a substantially horizontal direction.

(22) The minimum thickness dimension Tb of the overflow part Bo is, for example, a dimension substantially equal to the distance between positions of the planar section 4A and the wire 2A that are closest to each other in the structure shown in FIG. 4. The thickness dimension Td of the adhesion layer AD refers to, for example, a minimum thickness dimension of the adhesion layer AD, or a thickness dimension of the adhesion layer AD at a position close to the minimum thickness dimension Tb.

(23) In this embodiment, the size of the adhesive accumulation portion 4, i.e., the width dimension Wo of the planar section 4A is determined in such a manner that the minimum thickness dimension Tb of the overflow part Bo is greater than the thickness dimension Td of the adhesion layer AD.

(24) 3. Characteristics of the Spring of this Embodiment

(25) As shown in the comparative example of FIG. 5, in the case where the adhesive accumulation portion 4 are not provided at the end portion of the groove section 3A in the width direction, the adhesive overflowing to end of the groove section 3A in the width direction flows along the upper surface 3B of the seat section 3, therefore there is an extremely high possibility that the minimum thickness dimension Tb of the overflow part Bo becomes too small.

(26) In contrast, in this embodiment, since the adhesive overflowing to end of the groove section 3A in the width direction is accumulated on the adhesive accumulation portion 4, the minimum thickness dimension Tb of the overflow part Bo can be suppressed from becoming too small. Therefore, the breakage of the overflow part Bo is suppressed, so that early damage of the spring section 2 can be suppressed.

Second Embodiment

(27) As shown in FIG. 6, the adhesive accumulation portion 4 of this embodiment is constituted by a weir 4B provided at an end portion of the groove section 3A in the width direction. The weir 4B is constituted by a protruding strip extending along the groove section 3A in a state where it protrudes upward from the end portion of the groove section 3A in the width direction.

(28) Thus, the adhesive overflowing to end of the groove section 3A in the width direction is blocked by the weir 4B, and hence the adhesive overflowing to the end of the groove section 3A in the width direction is accumulated in the adhesive accumulation portion 4. Therefore, the minimum thickness dimension Tb of the overflow part Bo can be suppressed from becoming too small.

(29) The same constituent elements and the like as those in the above embodiment are marked with the same reference numerals as in the above embodiment. Therefore, a repeated description is omitted in this embodiment.

Third Embodiment

(30) The adhesive accumulation portion 4 of the first embodiment is constituted by a planar section 4A spreading from the upper end of an end portion of the groove section 3A in the width direction in a substantially horizontal direction (see FIG. 4). In contrast, in this embodiment, as shown in FIGS. 7 and 8, the planar section 4A or the upper surface 3B is connected to the inner wall surface of the groove section 3A by a curved surface 4C or a flat surface 4D.

(31) Thus, the adhesion layer AD has a thickness increasing as it approaches the end portion of the groove section 3A in the width direction, and hence the minimum thickness dimension Tb of the overflow part Bo can be suppressed from becoming too small.

(32) The same constituent elements and the like as those in the above embodiments are marked with the same reference numerals as in the above embodiments. Therefore, a repeated description is omitted in this embodiment.

Other Embodiments

(33) In the above embodiments, the adhesive accumulation portion 4 is used so that the minimum thickness dimension Tb of the overflow part Bo is greater than or equal to the thickness dimension Td of the adhesion layer AD. However, the invention disclosed in the specification of the present disclosure is not limited thereto. In other words, structures other than the adhesive accumulation portion 4 may be used, provided that the minimum thickness dimension Tb is greater than or equal to the thickness dimension Td of the adhesion layer AD.

(34) The weir 4B of the second embodiment is a protruding strip extending continuously along the groove section 3A. However, the structure of the weir 4B is not limited to a protruding strip extending continuously along the groove section 3A. In other words, for example, it may be constituted by a plurality of protrusions or the like dispersed along the groove section 3A, or may be constituted by one protrusion or protruding strip.

(35) Furthermore, the present disclosure is not limited to the above embodiments, without departing from the gist of the invention recited in the claims. Therefore, at least two of the above multiple embodiments may be combined.