Electronic-component carrier board and a wiring method for the same

Abstract

An electronic-component carrier board includes carrier plates formed in a stack, and insulating layers each disposed between two adjacent ones of the carrier plates. Multiple conductive pins extend through the insulating layers and the carrier plates. Multiple conductive wires equal in length and width are provided. Each conductive wire is connected to one of the conductive pins, covered by one of the insulating layers, disposed between two adjacent ones of the carrier plates, and extends outwardly from the stack of the carrier plates. A wiring method for the electronic-component carrier board is also disclosed.

Claims

1. An electronic-component carrier board, comprising: a plurality of carrier plates disposed one on the other to form a stack, each of said carrier plates having a top surface, a bottom surface, and a plurality of plated through holes extending through said top and bottom surfaces, said plated through holes of said carrier plates being respectively aligned and communicated with each other to form a plurality of insertion passages; a plurality of insulating layers each of which is disposed between two adjacent ones of said carrier plates; a plurality of conductive pins extending through said insulating layers and respectively inserted through said insertion passages of said carrier plates in such a manner that each of said conductive pins is exposed from one of said insertion passages, said conductive pins being equal in diameter, each of said conductive pins being cylindrical in shape, and having an equal diameter along an entire length thereof, each of said conductive pin in whole being electrically conductive; and a plurality of conductive wires equal in length and width, each of said conductive wires being laid on and extending along at least one of said top and bottom surfaces of one of said carrier plates, being directly connected to an outer peripheral surface of one of said conductive pins on said at least one of said top and bottom surfaces of said one of said carrier plates, being covered by one of said insulating layers, being disposed between two adjacent ones of said carrier plates, and extending outwardly from the stack of said carrier plates.

2. The electronic-component carrier board as claimed in claim 1, wherein each of said conductive wires is soldered to said one of said conductive pins.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Other features and advantages of the disclosure will become apparent in the following detailed description of the embodiments with reference to the accompanying drawings, of which:

(2) FIG. 1 is a flow chart of a wiring method for an electronic-component carrier board according to an embodiment of the disclosure;

(3) FIG. 2 is a perspective view of the embodiment illustrating a carrier plate prepared by the wiring method;

(4) FIG. 3 is a perspective view of the embodiment illustrating conductive pins inserted through the carrier plate;

(5) FIG. 4 is a perspective view of the embodiment illustrating conductive wires laid on the carrier plate and connected to the conductive pins;

(6) FIG. 5 is a perspective view of the embodiment illustrating an insulating layer covering the conductive wires on the carrier plate; and

(7) FIG. 6 is a perspective view of an electronic-component carrier board made according to the embodiment of the disclosure.

DETAILED DESCRIPTION

(8) FIGS. 1 and 2 illustrate a wiring method for an electronic-component carrier board according to an embodiment of the disclosure. The wiring method of the disclosure includes the following steps (a) to (g).

(9) In step (a), a first carrier plate 2 is prepared. The carrier plate 2 has a top surface, a bottom surface, and a plurality of plated through holes 21 extending through the top and bottom surfaces. The carrier plate 2 is a plastic plate or a chipboard. In this embodiment the plated through holes 21 are arranged, but not limited, in a matrix configuration.

(10) Referring FIG. 3 in combination with FIG. 1, in step (b), a plurality of conductive pins 3 are provided. Each of the conductive pins 3 is inserted through one of the plated through holes 21 of the first carrier plate 2 in such a manner that each of the conductive pins 3 extends out of the respective one of the plated through holes 21. In this embodiment, the number of the conductive pins is equal to that of the plated through holes 21. However, in other embodiments, the number of the conductive pins 3 may be smaller than that of the plated through holes 21.

(11) As shown in FIGS. 1 and 4, in step (c), a set of conductive wires 4 made of copper are provided. One end of each conductive wire 4 is soldered to a peripheral surface of one of the conductive pins 3. The conductive wires 4 are equal in length and width. Each of the conductive wires 4 are laid on and extend along one of top and bottom surfaces of the first carrier plate 2. While the wiring paths shown in FIG. 4 are linear, they should not be limited only thereto. The wiring paths may be nonlinear paths such as curve, or winding paths. Further, the number of the conductive wires 4 may not be equal to that of the conductive pins 3.

(12) As shown in FIGS. 1 and 5, in step (d), an insulating layer 5 is provided on the first carrier plate 2 to cover the conductive wires 4.

(13) Referring to FIGS. 1 and 6, in step (e), an additional carrier plate 2 is stacked on the first carrier plate 2. The additional carrier plate 2 has plated through holes 21 as same as the plates through holes 21 of the first carrier plate 2. Subsequently, steps (b), (c) and (d) are repeated so that each of the conductive pins 3 is inserted through one of the plated through holes 21 of the additional carrier plate 2, so that an additional set of conductive wires 4 are provided, each of which is connected to one of the conductive pins 3 and laid on and extends outwardly from the additional carrier plate 2, and so that an additional insulating layer 5 covers the additional carrier plate 2 and the additional set of conductive wires 4.

(14) In step (f), step (e) is repeated until multiple additional carrier plates 2 are stacked on the first carrier plate 2.

(15) Lastly, in step (g), the first and additional carrier plates 2 and the insulating layers 5 are pressed together to form a stack so that an electronic-component carrier board 6 is made. As shown in FIG. 6, in the electronic-component carrier board 6, the plated through holes 21 of the additional and first carrier plates 2 are respectively aligned and communicated with each other to form a plurality of insertion passages 210, and the conductive pins 3 extend through the insulating layers 5 each disposed between two adjacent ones of the carrier plates 2 and are respectively inserted through the insertion passages 210.

(16) In this embodiment, because the conductive wires 4 are equal in length and width and are respectively connected to the outer peripheral surfaces of the conductive pins 3, and because the conductive pins 3 are equal in diameter, it is ensured that transmission along the conductive pins 3 and wires 4 can have equal impedance values, thereby solving the problem of the prior art. As shown in FIG. 6, by virtue of the conductive wires 4 extending outwardly from the stack of the additional and first plates 2 and the layers 5, the terminal portions of the conductive wires 4 can be placed at the same level for coupling with the connectors 7. Further, as the conductive pins 3 are of rigid structure, the durability of the electronic-component carrier plate 6 is enhanced.

(17) In the description above, for the purposes of explanation, numerous specific details have been set forth in order to provide a thorough understanding of the embodiment. It will be apparent, however, to one skilled in the art, that one or more other embodiments may be practiced without some of these specific details. It should also be appreciated that reference throughout this specification to “one embodiment,” “an embodiment,” an embodiment with an indication of an ordinal number and so forth means that a particular feature, structure, or characteristic may be included in the practice of the disclosure. It should be further appreciated that in the description, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of various inventive aspects, and that one or more features or specific details from one embodiment may be practiced together with one or more features or specific details from another embodiment, where appropriate, in the practice of the disclosure.

(18) While the disclosure has been described in connection with what is considered the exemplary embodiment, it is understood that this disclosure is not limited to the disclosed embodiment(s) but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.