METHOD OF MANUFACTURING A THREE-DIMENSIONAL ELECTRONIC MODULE HAVING HIGH COMPONENT DENSITY, AND DEVICE

Abstract

The invention relates to the field of techniques for manufacturing electronic devices having surface-mounted components, and can be used in avionics, telecommunication, lighting technology, and other fields, and can be configured as a power source, a converter, sensors, etc. The technical result consists in improved weight and dimension characteristics, improved heat dispersion, and increased electromagnetic screening. The present electronic module comprises a printed circuit board in the form of a three-dimensional structure, faces of which are formed by flat sections of the printed circuit board, and edges of which are formed by fold lines between the sections of the printed circuit board, wherein the mounting surface of the printed circuit board faces the inside of the three-dimensional structure, and electronic components and assemblies are grouped on the mounting surface of at least two sections of the printed circuit board such that the electronic components and assemblies of one section are disposed in the empty space between the components and assemblies of another section of the printed circuit board.

Claims

1. A method of manufacturing of a three-dimensional electronics package of compactly accommodated components including: making of a workpiece of a metal-based printed-circuit board; bending of the metal-based printed-circuit board; and installation of electronic components on a surface of the metal-based printed-circuit wherein: a workpiece of the metal printed-circuit board comprises a fold-up unit, the flat surface areas of which form an n-angle, where n≥2, and suitable for forming edges of a spatial structure; surface-mount, through-hole components and electronic units are installed on the fold-up unit, therein the surface-mount, through-hole components and electronic components are grouped on a surface of at least two sections of the metal-based printed-circuit board so that their spatial areas will be kept unchanged during consecutive bending of the metal-based printed-circuit board; and the fold-up unit is bent so that the parts of the workpiece are consecutively turned around a bend line until electronic components of one section are brought into a free space between electronic components of another or of several other sections of the metal-based printed-circuit board.

2. The method of manufacturing of the printed-circuit board of claim 1, wherein the bend line between the sections of the metal-based printed-circuit board is followed by through holes at ends of the bend line.

3. A three-dimensional electronics package of compactly accommodated components comprising: a metal-based printed-circuit board; and electronic components installed on a mounting surface of the metal-based printed-circuit board, wherein the metal-based printed-circuit board is designed as a spatial structure in which multiple faces are produced by flat sections of the metal-based printed-circuit board, each of which has a shape of an n-gon, where n>2, with ribs on a surface of the spatial structure, and a fold line between the flat sections of the printed circuit board, wherein a mounting surface of the metal-based printed-circuit board faces inwards to the spatial structure; and wherein electronic components and units are grouped on the mounting surface of at least two sections of the metal-based printed-circuit board so that the electronic components and units of one section are located inside a free space between the electronic components and units of a printed-circuit section.

4. The three-dimensional electronics package of claim 3, wherein the spatial structure of the metal-based printed-circuit board has N-faces, where N is a natural number as taken from the expression: N≥3.

5. The three-dimensional electronics package of claim 3, wherein the spatial structure is shaped as a right-angle tetrahedral prism every face of which comprises a rectangular shape.

6. The three-dimensional electronics package of claim 3, wherein at least one section of the metal-based printed-circuit board is fitted with a connector for installing at least one through-hole component or electronic unit.

Description

[0029] Various phases of the manufacturing process are shown in the following drawings for illustrative purpose wherein a secondary power supply three-dimensional unit is demonstrated as that having a spatial parallelepiped-shaped structure.

[0030] FIG. 1—a fold-up printed-circuit board with fold-up component-mount sections and with marked bend lines.

[0031] FIG. 2—a 3D image of an intermediate stage during which a spatial structure of the three-dimensional electronic unit is fabricated which fold-up is shown in FIG. 1.

[0032] FIG. 3—a 3D image of a final stage during which a spatial structure of the three-dimensional electronic unit is fabricated is shown in FIG. 2.

[0033] FIG. 4—a 3D image of an option of the three-dimensional electronic unit optionally combined with surface-mount and through-hole components.

[0034] There are elements in the drawings having the items as follows: [0035] 1—a fold-up hex workpiece of the printed-circuit board, [0036] 2, 3, 4, 5, 6, 7—fold-up board sections shown in FIG. 1, [0037] 8—printed-circuit board bend lines, [0038] 9—surface-mount components (SMT) [0039] 10—through-hole components (TNT) [0040] 11—through-hole component connector [0041] 12—electronic functional unit, [0042] 13—electronic functional unit board

Exemplary Embodiment

[0043] Workpiece 1 of the printed-circuit board is made as a fold-up with six rectangular sections 2, 3, 4, 5, 6, 7 separated by lines 8 at the printed-circuit board bend. Surface-mount 9 and through-hole components 10 are grouped at sections 2, 3, and 4 of board 1. Other section surfaces of printed-circuit board 1 can be used for accommodating components.

[0044] On installing components, printed-circuit board 1 is bent along lines 8 between the sections of the board so that sections 2-7 take up the position of lateral and end hexagonal faces and electronic components 9, 10 mounted at sections 2 and 4 of the board are brought to the hexagonal cavities and placed in free space between the components of section 3 of the board. The fold-up sections 6, 7 close the hexagonal end faces and section 5 closes the hexagonal cavity. Such grouped structure makes it possible to significantly improve compact layout of components while metal base of the board can be effective in removing heat from the package.

[0045] It should be noted again that the spatial structure faces can be designed open. Open design, where necessary, is suitable for creating channels in order to provide convective cooling air to the electronics package fabricated by the above-mentioned technique.

[0046] The claimed solution can be implemented using universal mounting and bending fixtures.