OBJECT WITH ACTIVE ANTI-ADHESIVE SURFACE
20230150868 · 2023-05-18
Inventors
Cpc classification
C03C17/3441
CHEMISTRY; METALLURGY
C03C2217/94
CHEMISTRY; METALLURGY
International classification
Abstract
Substrate with transparent outer layer, wherein a transparent interdigital structure is disposed between the substrate and the outer layer.
Claims
1. A substrate (4) with transparent outer layer (6), wherein a transparent interdigital structure (1a, 1b) is disposed between the substrate (4) and the outer layer (6).
2. The substrate (4) with transparent outer layer (6) of claim 1, wherein the transparent outer layer (6) is a layer deposited from the gas phase or a sol-gel layer, preferably a layer generated by means of physical or chemical vapor deposition, more preferably a layer generated by means of plasma-enhanced physical or chemical vapor deposition, or a silicone layer.
3. The substrate (4) with transparent outer layer (6) of claim 1 or 2, wherein the transparent outer layer (6) comprises in summation ≥85 at % of Si, C, F and O, preferably ≥90 at % of Si, C, F and O, more preferably ≥95 at % of Si, C, F and O or ≥85 at % of Ti and O, preferably ≥90 at % of Ti and O, more preferably ≥95 at % of Ti and O, or in summation ≥85 at % of Ai and O, preferably ≥90 at % of Al and O, more preferably ≥90 at % of Al and O, measured by means of XPS and based on the atoms detected by means of XPS.
4. The substrate (4) with transparent outer layer (6) of any of the preceding claims, wherein the interdigital structure (1a, 1b) consists of a material based on a composition selected from the group consisting of indium tin oxide, zinc oxide, fluorine tin oxide, aluminum zinc oxide, antimony tin oxide, electrically conductive transparent varnish, and graphene, preference being given to indium tin oxide.
5. The substrate (4) with transparent outer layer (6) of any of the preceding claims, wherein the thickness of the interdigital structure (1a, 1b) is 10 nm-10 μm, preferably 20 nm-1 μm and more preferably 30 nm-500 nm and/or wherein the thickness of the outer layer (6) is 50 nm-10 μm, preferably 100 nm-5 μm and more preferably 200 nm-3 μm.
6. The substrate (4) with transparent outer layer (6) of any of the preceding claims, wherein the interstices (2) between the conductors of the interim engaging electrodes of the interdigital structure (1a, 1b) are filled at least partly with material resulting from the material of the interdigital structure (1a, 1b).
7. The substrate (4) with transparent outer layer (6) of any of the preceding claims, wherein the outer layer is completely closed in the region of the interdigital structure (1a, 1b).
8. The substrate (4) with transparent outer layer (6) of any of the preceding claims, wherein the interdigital structure (1a, 1b) is disposed exactly in one plane between substrate (4) and outer layer (6).
9. The substrate (4) with transparent outer layer (6) of any of the preceding claims, wherein the outer layer (4) has one or more of the following functions: mechanical protection for the interdigital structure (1a, 1b), chemical protection for the interdigital structure (1a, 1b), electrical insulation of the interdigital structure (1a, 1b), increasing the dielectric constant of the coating of the substrate (4), adapting the transmission or reflectivity of interdigital structure (1a, 1b) and the material (2) in the interstices of the interdigital structure (1a, 1b) for at least one wavelength, preferably for the range of visible light, reducing the reflection, reducing the adherence of microorganisms, reducing the adherence of fowling, and photocatalytic effect and/or wherein a transparent interlayer (5) is disposed between the outer layer (6) and the substrate (4), and has one or more of the following functions: mechanical protection for the interdigital structure (1a, 1b), chemical protection for the interdigital structure (1a, 1b), electrical insulation of the interdigital structure (1a, 1b), adapting the transmission or reflectivity of interdigital structure (1a, 1b) and the material (2) in the interstices of the interdigital structure (1a, 1b) for at least one wavelength, preferably for the range of visible light, reducing the reflection, increasing the dielectric constant of the coating of the substrate (4), and Improving the adhesion within the coating and/or of the coating with the substrate (4).
10. The substrate (4) with transparent outer layer (6) of any of the preceding claims, wherein the substrate (4) Is transparent or reflective on its surface.
11. The use of a transparent outer layer (6) In combination with a transparent interdigital structure (1a, 1b) as defined in any of the preceding claims for improving the cleanability and/or for reducing the adherence of contaminants, more particularly microorganisms, and/or for removing snow and ice and/or for inparting antifog properties.
12. A process for producing a coated substrate (4) as defined in any of claims 1 to 10, comprising the steps of: a) providing a substrate (4), preferably as defined in claim 10, b) generating a transparent interdigital structure (1a, 1b), preferably as defined in either of claims 3 and 8, and c) coating the substrate (4) and the interdigital structure (1a, 1b) with a transparent outer layer (6), preferably as defined in either of claims 2 and 9.
13. The process of claim 12, wherein step b) takes place at least partly by means of an ablation process, and/or material conversion, preferably by means of a laser process, preference being given to using an NdYAG laser.
14. The process of claim 12 or 13, wherein after step a) and before step c) an interlayer (5) is applied, preferably as defined in claim 9.
15. The process of any of claims 12 to 14, wherein step c) takes place by a spraying, immersion, PVD, CVD or PE-CVD process, preferably by a PVD, CVD or PE-CVD process.
Description
EXAMPLE
[0135] Use of a glass substrate (25×25×1.1 mm; float glass) with a 120 to 160 mm ITO layer, supplier Sigma Aldrich, product number 703192. The sheet resistance R.sub.S=8-12 ohms, the transmission T is 84% (at 550 nm).
[0136] Laser treatment took place with an Nd:YAG laser as follows:
[0137] Operating parameters: type: 300 W Nd:YAG laser (type CL300 from CleanLaser, Herzogenrath, Germany with Stamp Optic f(100) f-theta lens) and flat-top profile; repetition frequency f=40 kHz; power P=120 W; velocity v=4590 mm/s, spot size 459 μm.
[0138] Traversal of the meandering track in analogy to
[0139] The width of the individual conductors of the two electrodes results as being 375±18 μm.
[0140] The spacing between the conductors of the individual electrodes is likewise 375+−18 μm.
[0141] The surface thus obtained shows the following elemental compositions, measured by means of XPS:
TABLE-US-00001 C O Si In Sn (at %) (at %) (at %) (at %) (at %) ITO-coated glass 41.6 37.1 — 18.8 2.5 in relations without laser treatment ITO-coated glass 12.6 56.5 12.6 16.5 1.7 in relations with laser treatment
[0142] The laser treatment results in a partial laser ablation with a depletion of the tin with the simultaneous presence of the elements from the substrate.
[0143] Coating of the resultant structure with a TiO.sub.2 layer as per patent application DE 10 2013 215 835 A1 with a layer thickness of 250 nm, with the following parameters: [0144] coating construction: treatment under atmospheric conditions without encapsulated system; only one feed was used for the titanium-containing precursor; the residual moisture in the atmosphere served as a coreactant [0145] titanium precursor: titanium isopropoxide (CAS: 546-68-9; manufacturer: ABCR; purity: 97%) [0146] carrier gas for titanium precursor: nitrogen 5.0, 5 l/min [0147] amount of titanium precursor: 10 μl/min [0148] precursor nozzle: steel tube with 4 mm internal diameter [0149] sample patterning: meandering (movement of the sample beneath the stationary nozzle) [0150] line spacing for sample patterning: 4 mm [0151] sample velocity: 1.7 m/min [0152] number of coating cycles: 10 [0153] sample temperature during coating: 40° C. (heat treatment via hotplate) [0154] coating nozzle spacing: 30 mm; [0155] coating nozzle angle: 0° (perpendicular to sample):
[0156] The substrate with coating was transparent for visible light.
[0157] The structure produced was tested in an aquarium (T=18° C.) with magnetic stirring+stirrer bar.
[0158] The generated structure was operated with a voltage of 30 V.sub.RMS and a frequency of 1 kHz to 1000 kHz with linear increase in a cycle of 1 hour. After 10 days, the surfaces according to the invention exhibited 50% lower adherence of algae relative to an uncoated substrate, and 20% lower adherence of algae relative to a substrate with coated interdigital structures without voltage supply.