Injection molding apparatus and injection molding method
11654603 · 2023-05-23
Assignee
Inventors
- Shia-Chung Chen (Taoyuan, TW)
- Yung-Hsiang Chang (Taoyuan, TW)
- Tzu-Hsiang Wei (Taoyuan, TW)
- Pi-Lin Tsai (Taoyuan, TW)
Cpc classification
B29C45/2669
PERFORMING OPERATIONS; TRANSPORTING
B29C45/37
PERFORMING OPERATIONS; TRANSPORTING
B29C45/77
PERFORMING OPERATIONS; TRANSPORTING
B29C45/0025
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C45/77
PERFORMING OPERATIONS; TRANSPORTING
Abstract
An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.
Claims
1. An injection molding apparatus, comprising: a mold comprising a mold cavity, wherein inner surfaces of the mold cavity comprises a plurality of concave portions; an injection device adapted to inject a material into the mold cavity such that the material is formed into a forming article; and a plurality of sensors disposed on the mold and adapted to sense a plurality of temperatures and a plurality of pressures in the mold cavity, wherein at least two of the plurality of sensors are located at one of the inner surfaces of the mold cavity and corresponds to a surface of the forming article, at least another two of the plurality of sensors are located at another one of the inner surfaces of the mold cavity and correspond to another surface of the forming article, the plurality of concave portions correspond to a plurality of protruding portions of the forming article respectively, and the plurality of sensors are located in the plurality of concave portions respectively, wherein each of the plurality of concave portions corresponds to only one of the plurality of sensors.
2. The injection molding apparatus according to claim 1, wherein each of the plurality of sensors comprises a temperature sensor and a pressure sensor.
3. The injection molding apparatus according to claim 2, wherein the temperature sensor and the pressure sensor are integrated into a single sensing element.
4. The injection molding apparatus according to claim 1, wherein each of the plurality of concave portions is a material injection area of the mold cavity or an overflow area of the mold cavity.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
(5)
DESCRIPTION OF THE EMBODIMENTS
(6)
(7) The sensors 130 are disposed in the mold 110 and adapted to sense the temperature and the pressure in the mold cavity 110a, so that the injection molding apparatus 100 is capable of calculating the specific volume according to the temperature and the pressure of the material in the mold cavity 110a, and accordingly adjusts injection molding parameters. The injection molding parameters may include the injection pressure of the injection device 120, the temperature of the mold 110, and the pressure holding time performed by the injection device 120. The holding pressure refers to that the injection device 120 continues to apply an appropriate injection pressure after injecting the material into the mold 110 to provide a proper quantity of the material into the mold 110 until the material in the mold 110 is solidified. In this way, the shrinkage of the material in the mold 110 during the solidification process is prevented so that the dimensions of the injection molding product will meet expectations.
(8) The sensors 130 are, for example, electrically connected to a computer device and adapted to transmit sensing signals to the computer device to calculate the specific volume and adjust the parameters. The computer device is, for example, integrated in the injection molding apparatus 100 or externally connected to the injection molding apparatus 100, but the disclosure is not limited thereto.
(9) As shown in
(10)
(11) In the embodiment in
(12)
(13) Since the portions to-be-cut C are not part of the injection molding product and are to be cut off in the subsequent process, the portions to-be-cut C may be regarded as non-appearance surfaces of the forming article F′. Even if the portion to-be-cut C has an uneven surface due to the arrangement of the sensor 130′, the uneven surface is not present in the injection molding product after the portions to-be-cut C are cut off. In other embodiments, the sensor 130′ may be merely disposed in the concave portion N2 but not be disposed in the concave portion N1, or the sensor 130′ is merely disposed in the concave portion N1 but not in the concave portion N2. The disclosure is not limited thereto. In addition, the temperature sensor 132 and the pressure sensor 134 may be integrated into the sensor 130′ to be a single sensing element same as the sensor 130 shown in
(14) The injection molding method according to an embodiment of the disclosure is illustrated below.
(15) Based on the above, in the injection molding apparatus of the disclosure, the sensor corresponds to the non-appearance surface of the forming article, so the appearance surface of the forming article will not become uneven due to the arrangement of the sensor, thereby improving the quality of the injection molding product. In addition, the integration of the temperature sensor and the pressure sensor into a single sensing element makes it possible to sense the temperature and the pressure at the same position, so as to accurately obtain the temperature and the pressure of a specific position in the mold cavity, and accurately calculate the specific volume of the specific position. Accordingly, the injection molding parameters are adjusted in an effective manner, thereby further improving the quality of the injection molding product.
(16) Although the disclosure has been described with reference to the above embodiments, it will be apparent to one of ordinary skill in the art that modifications to the described embodiments may be made without departing from the spirit and the scope of the disclosure. Accordingly, the scope of the disclosure will be defined by the attached claims and their equivalents and not by the above detailed descriptions.