Component carrier and method of manufacturing the same

Abstract

A component carrier includes a glass core having a first main surface and a second main surface; a first electrically insulating layer structure applied on the first main surface of the glass core; a first electrically conductive layer structure applied on the first electrically insulating layer structure; and at least one inner hole extending through the glass core and the first electrically insulating layer structure.

Claims

1. A component carrier, comprising: a glass core having a first main surface and a second main surface; a first electrically insulating layer structure applied on the first main surface of the glass core; a first electrically conductive layer structure applied on the first electrically insulating layer structure; at least one inner hole, a surface thereof being defined by the glass core and the first electrically insulating layer structure, the at least one inner hole extending into the first electrically conductive layer structure; and a first further electrically insulating layer structure applied or laminated on the first electrically insulating layer structure and/or the first electrically conductive layer structure, and applied on the surface of the at least one inner hole; a first further electrically conductive layer structure on the first further electrically insulating layer structure within the at least one inner hole, wherein the glass core is a central layer of the component carrier.

2. The component carrier according to claim 1, wherein the glass core has at least one lateral side connecting the first and second main surfaces, wherein the lateral side is at least partly covered by the first electrically insulating layer structure.

3. The component carrier according to claim 1, wherein the first electrically insulating layer structure and the first electrically conductive layer structure together are formed by a first resin coated copper foil.

4. The component carrier according to claim 1, further comprising: a second electrically insulating layer structure applied on the second main surface of the glass core; and a second electrically conductive layer structure applied on the second electrically insulating layer structure.

5. The component carrier according to claim 1, wherein the at least one inner hole is, along its axis, partly covered by an electrically insulating plugging material or a magnetic paste.

6. The component carrier according to claim 1, further comprising: a support layer or a temporary carrier; a cavity within the glass core, the first electrically insulating layer structure and the first electrically conductive layer structure, wherein a bottom of the cavity is defined by the support layer or the temporary carrier; and a component arranged on the bottom within the cavity.

7. The component carrier according to claim 1, wherein the glass core comprises at least two glass panels which are connected to each other by an intermediate electrically insulating layer structure therebetween.

8. The component carrier according to claim 1, wherein the component carrier has a symmetric layer stackup with respect to the glass core, wherein the symmetric layer stackup includes a symmetric arrangement of at least one of the first electrically insulating layer structure, the first electrically conductive layer structure, the at least one inner hole, the first further electrically insulating layer structure and the first further electrically conductive layer structure.

9. The component carrier according to claim 1, further comprising at least one of the following features: the component carrier comprises at least one component being surface mounted on and/or embedded in the component carrier, wherein the at least one component is in particular selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, a light guiding element, an optical element, a bridge, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier, and a logic chip; wherein at least one of the electrically conductive layer structures of the component carrier comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, magnesium and tungsten; wherein at least one of the electrically insulating layer structure comprises at least one of the group consisting of reinforced or non-reinforced resin, epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester resin, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide; wherein the component carrier is shaped as a plate; wherein the component carrier is configured as one of the group consisting of a printed circuit board, a substrate, and an interposer; wherein the component carrier is configured as a laminate-type component carrier.

10. A method for manufacturing a component carrier, comprising: providing a resin-free glass core having a first main surface and a second main surface; applying a first electrically insulating layer structure on the first main surface of the resin-free glass core; applying a first electrically conductive layer structure on the first electrically insulating layer structure; providing at least one inner hole, a surface thereof being defined by the resin-free glass core and the first electrically insulating layer structure, the at least one inner hole extending into the first electrically conductive layer structure by laser drilling or mechanical drilling or by wet and/or dry etching; applying or laminating a first further electrically insulating layer structure on the first electrically insulating layer structure and/or the first electrically conductive layer structure, and on the surface of the at least one inner hole; and applying a first further electrically conductive layer structure on the first further electrically insulating layer structure within the at least one inner hole.

11. The method according to claim 10, wherein the resin-free glass core has at least one lateral side connecting the first and second main surfaces, wherein the lateral side is at least partly covered by the first electrically insulating layer structure.

12. The method according to claim 10, wherein the first electrically insulating layer structure and the first electrically conductive layer structure together are formed by a first resin coated copper foil.

13. The method according to claim 10, wherein a second electrically insulating layer structure is applied on the second main surface of the resin-free glass core and a second electrically conductive layer structure is applied on the second electrically insulating layer structure; or a release layer is applied on the second main surface of the resin-free glass core or on another surface of the component carrier.

14. The method according to claim 10, further comprising: applying or laminating a first further electrically insulating layer structure on the first electrically conductive layer structure and the at least one inner hole; and forming an outer hole through the first further electrically insulating layer structure corresponding to the at least one inner hole by laser drilling or mechanical drilling or by wet and/or dry etching.

15. The method according to claim 10, wherein covering the at least one inner hole, along its axis, partly by an electrically insulating plugging material or a magnetic paste.

16. The method according to claim 10, further comprising: forming a component hole in the resin-free glass core, the first electrically insulating layer structure and the first electrically conductive layer structure; connecting a support layer or a temporary carrier to a stack comprising the resin-free glass core, the first electrically insulating layer structure and the first electrically conductive layer structure so that a cavity is formed, wherein a bottom of the cavity is defined by the support layer or the temporary carrier; and arranging a component on the bottom within the cavity.

17. The method according to claim 10, wherein the resin-free glass core is formed by at least two glass panels which are connected to each other by an intermediate electrically insulating layer structure therebetween.

18. The method according to claim 10, wherein the component carrier is formed to have a symmetric layer stackup with respect to the resin-free glass core, wherein the symmetric layer stackup includes a symmetric provision of at least one of the first electrically insulating layer structure, the first electrically conductive layer structure, the at least one inner hole, the first further electrically insulating layer structure and the first further electrically conductive layer structure.

19. The method according to claim 10, comprising the following substeps: arranging the resin-free glass core in an insulating frame; arranging the first resin coated copper foil on the first main surface of the resin-free glass core and the insulating frame; arranging a second resin coated copper foil on the second main surface of the resin-free glass core and the insulating frame; laminating the first and second resin coated copper foils to obtain an intermediate stack; and trimming the intermediate stack at its circumference.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 illustrates a cross-sectional view of a component carrier according to an exemplary embodiment of the invention.

(2) FIG. 2 illustrates a method of manufacturing a component carrier of FIG. 1 according to an exemplary embodiment of the invention.

(3) FIG. 3 illustrates a cross-sectional view of a component carrier according to an exemplary embodiment of the invention.

(4) FIG. 4 illustrates a method of manufacturing a component carrier of FIG. 3 according to an exemplary embodiment of the invention.

(5) FIG. 5 illustrates a cross-sectional view of a component carrier according to an exemplary embodiment of the invention.

(6) FIG. 6 illustrates a method of manufacturing a component carrier of FIG. 5 according to an exemplary embodiment of the invention.

(7) FIG. 7 illustrates a method of manufacturing a component carrier according to an exemplary embodiment of the invention.

(8) FIG. 8 illustrates a method of manufacturing a component carrier according to an exemplary embodiment of the invention.

(9) FIG. 9A, FIG. 9B and FIG. 9C illustrate a method of manufacturing a component carrier according to an exemplary embodiment of the invention.

(10) FIG. 10A and FIG. 10B illustrate comparisons between a component carrier of the prior art to a component carrier according to the present invention.

(11) FIG. 11 illustrates a cross-sectional view of a component carrier according to an exemplary embodiment of the invention.

(12) FIG. 12 illustrates a cross-sectional view of a component carrier according to an exemplary embodiment of the invention.

(13) FIG. 13 illustrates a cross-sectional view of a component carrier according to an exemplary embodiment of the invention.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

(14) The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.

(15) FIG. 1 illustrates a cross-sectional view of a component carrier 1 according to an exemplary embodiment of the invention. The component carrier 1 comprises a glass core 2 having a first main surface 31 and a second main surface 32; a first electrically insulating layer structure 3 applied on the first main surface 31 of the glass core 2; and a patterned first electrically conductive layer structure 4 applied on the first electrically insulating layer structure 3. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 together can be formed by a first resin coated copper foil (RCC).

(16) Two inner holes 5 extend through the glass core 2, the first electrically insulating layer structure 3, and the first electrically conductive layer structure 4.

(17) The component carrier 1 further comprises a second electrically insulating layer structure 6 applied on the second main surface 32 of the glass core 2; and a patterned second electrically conductive layer structure 7 applied on the second electrically insulating layer structure 6. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 together can be formed by a second resin coated copper foil (RCC). The inner holes 5 also extend through the second electrically insulating layer structure 6 and the second electrically conductive layer structure 7.

(18) The glass core 2 has lateral sides 33, 34 connecting the first and second main surfaces 31, 32, where the lateral sides 33, 34 are covered by the first and second electrically insulating layer structures 3, 6.

(19) A first further electrically insulating layer structure 8 is applied or laminated on the first electrically conductive layer structure 4 and the inner holes 5. A second further electrically insulating layer structure 17 is laminated on the second electrically conductive layer structure 7 and the inner holes 5. Outer holes 15 corresponding to the inner holes 5 extend through the first further electrically insulating layer structure 8 and the second further electrically insulating layer structure 17. A patterned first further electrically conductive layer structure 9 is applied on the first further electrically insulating layer structure 8, and a patterned second further electrically conductive layer structure 18 is applied on the second further electrically insulating layer structure 17. The material of the first further electrically insulating layer structure 8 and the second further electrically conductive layer structure 18 also fills the outer holes 15.

(20) FIG. 2 illustrates a method of manufacturing the component carrier 1 of FIG. 1 according to an exemplary embodiment of the invention.

(21) In a step S11, a glass core 2 having a first main surface 31 and a second main surface 32 is provided. The glass core 2 has lateral sides 33, 34 connecting the first and second main surfaces 31, 32.

(22) In a step S12, a first electrically insulating layer structure 3 is applied on the first main surface 31 of the glass core 2, and a first electrically conductive layer structure 4 is applied on the first electrically insulating layer structure 3. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 together can be formed by a first resin coated copper foil (RCC). The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 can be laminated onto the glass core 2. The lateral sides 33, 34 are at least partly covered by the first electrically insulating layer structure 3.

(23) A second electrically insulating layer structure 6 is applied on the second main surface 32 of the glass core 2, and a second electrically conductive layer structure 7 is applied on the second electrically insulating layer structure 6. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 together can be formed by a second resin coated copper foil (RCC). The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 can be laminated onto the glass core 2. The lateral sides 33, 34 are at least partly covered by the second electrically insulating layer structure 6.

(24) In a modification, a release layer (not shown) can be applied on the second main surface 32 of the glass core 2 instead of the second electrically insulating layer structure 6 and the second electrically conductive layer structure 7. The release layer is usually peeled off in a later method step.

(25) In a step S13, registration holes 16 (or reference holes 16), which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by mechanical drilling, for example. Alternatively, the registration holes 16 can be made by laser drilling.

(26) In a step S14, the first and second electrically conductive layer structures 4, 7 are patterned, for example by conventional lithography methods combined with wet and/or dry etching methods. Alternatively, the first and second electrically conductive layer structures 4, 7 can also be patterned, for example, by physical vapor deposition (PVD) as for instance sputtering or by chemical vapor deposition (CVD).

(27) In a step S15, at least one inner hole 5, for example two inner holes 5, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by laser drilling or mechanical drilling or by wet and/or dry etching, for example.

(28) In a step S16, a first further electrically insulating layer structure 8 is laminated on the first electrically conductive layer structure 4 and the inner holes 5; and a second further electrically insulating layer structure 17 is laminated on the second electrically conductive layer structure 7 and the inner holes 5. Because the first electrically conductive layer structure 4 and the second electrically conductive layer structure 7 have been patterned in step S14, the first further electrically insulating layer structure 8 contacts the first electrically insulating layer structure 3, and the second further electrically insulating layer structure 17 contacts the second electrically insulating layer structure 6. The first further electrically insulating layer structure 8 and the second further electrically insulating layer structure 17 can be an ABF® material (Ajinomoto Build-up Film), respectively. ABF® is a registered mark of Ajinomoto Co. Inc. of Tokyo, Japan.

(29) In a step S17, outer holes 15 are formed through the first further electrically insulating layer structure 8 corresponding to the inner holes 5 and through the second further electrically insulating layer structure 17 corresponding to the inner holes 5, for example by laser drilling or mechanical drilling. Two laser drilling processes can be carried out to form each outer hole 15, i.e., one laser drilling process at the first main surface and another concentric laser drilling process at the second surface.

(30) In a step S18, a first further electrically conductive layer structure 9 is applied on the first further electrically insulating layer structure 8, and a second further electrically conductive layer structure 18 is applied on the second further electrically insulating layer structure 17. The outer holes 15 are filled by the first and second further electrically conductive layer structures 9, 18. The first further electrically conductive layer structure 9 and the second further electrically conductive layer structure 18 are patterned, for example by conventional lithography methods combined with dry and/or wet etching methods. Alternatively, the first further electrically conductive layer structure 9 and the second further electrically conductive layer structure 18 can be patterned, for example, by physical vapor deposition (PVD) as for instance sputtering or by chemical vapor deposition (CVD).

(31) FIG. 3 illustrates a cross-sectional view of a component carrier 1 according to an exemplary embodiment of the invention. The component carrier 1 comprises a glass core 2 having a first main surface 31 and a second main surface 32; a first electrically insulating layer structure 3 applied on the first main surface 31 of the glass core 2; and a patterned first electrically conductive layer structure 4 applied on the first electrically insulating layer structure 3.

(32) Five inner holes 5 extend through the glass core 2 and the first electrically insulating layer structure 3.

(33) The first electrically insulating layer structure 3 is a double-layer structure formed by an insulating layer structure 3a which is applied on the glass core 2 and an insulating layer structure 3b which is applied on the insulating layer structure 3a and the inner holes 5.

(34) The component carrier 1 further comprises a second electrically insulating layer structure 6 applied on the second main surface 32 of the glass core 2; and a patterned second electrically conductive layer structure 7 applied on the second electrically insulating layer structure 6. The second electrically insulating layer structure 6 is a double-layer structure formed by an insulating layer structure 6a which is applied on the glass core 2 and an insulating layer structure 6b which is applied on the insulating layer structure 6a and the inner holes 5.

(35) Outer holes 15 corresponding to the inner holes 5 extend through the first and second electrically insulating layer structures 3, 6.

(36) The glass core 2 has lateral sides 33, 34 connecting the first and second main surfaces 31, 32, where the lateral sides 33, 34 are covered by the first and second electrically insulating layer structures 3, 6.

(37) The inner holes 5 are, along their axes, partly covered by an electrically insulating plugging material 10. The insulating plugging material 10 defines the outer holes 15. The insulating plugging material 10 could be either any insulating resin, such as for instance epoxy, or it could be a magnetic paste, serving as inductive material. The magnetic paste can have functions which would not allow to use normal epoxy resin plugging material. In addition to this, the magnetic paste can serve as an inductive material.

(38) FIG. 4 illustrates a method of manufacturing the component carrier of FIG. 3 according to an exemplary embodiment of the invention.

(39) In a step S21, a glass core 2 having a first main surface 31 and a second main surface 32 is provided. The glass core 2 has lateral sides 33, 34 connecting the first and second main surfaces 31, 32.

(40) In a step S22, a first electrically insulating layer structure 3 is applied on the first main surface 31 of the glass core 2, and a first electrically conductive layer structure 4 is applied on the first electrically insulating layer structure 3. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 together can be formed by a first resin coated copper foil. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 can be laminated onto the glass core 2. The lateral sides 33, 34 are at least partly covered by the first electrically insulating layer structure 3.

(41) A second electrically insulating layer structure 6 is applied on the second main surface 32 of the glass core 2, and a second electrically conductive layer structure 7 is applied on the second electrically insulating layer structure 6. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 together can be formed by a second resin coated copper foil. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 can be laminated onto the glass core 2. The lateral sides 33, 34 of the glass core 2 are at least partly covered by the second electrically insulating layer structure 6.

(42) In a modification, a release layer (not shown) can be applied on the second main surface 32 of the glass core 2 instead of the second electrically insulating layer structure 6 and the second electrically conductive layer structure 7. The release layer is usually peeled off in a later method step.

(43) In a step S23, registration holes 16, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by mechanical drilling or laser drilling, for example.

(44) In a step S24, the first and second electrically conductive layer structures 4, 7 are patterned, for example by conventional lithography methods combined with dry and/or wet etching methods. Alternatively, the first and second electrically conductive layer structures 4, 7 can be patterned, for example, by physical vapor deposition (PVD) as for instance sputtering or by chemical vapor deposition (CVD).

(45) In a step S25, at least one inner hole 5, for example, five inner holes 5, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by laser drilling or mechanical drilling or by wet and/or dry etching, for example.

(46) In a step S26, some of the inner holes 5 are, along their axes, covered by an electrically insulating plugging material 10. Also, the registration holes 16 can be filled by the same or another electrically insulating plugging material/magnetic paste. Optionally, a grinding step can be performed to grind down the surface of the electrically insulating plugging material 10.

(47) The insulating plugging material 10 can be an epoxy resin plugging material. The insulating plugging material 10 can also be a magnetic paste having functions which would not allow a use of normal epoxy resin plugging material. In addition to this, the magnetic paste can serve as an inductive material. In this embodiment, the plugging material 10 can be a magnetic paste, which is not entirely insulating. However, the magnetic paste may have a very low electrical conductivity.

(48) In a step S27, the first and second electrically conductive layer structures 4, 7 are etched-off. It is possible that the electrically insulating plugging material 10 protrudes from the first and second electrically insulating layer structures 3, 6.

(49) In a step S28, a first further electrically insulating layer structure 8 is laminated on the first electrically insulating layer structure 3; and a second further electrically insulating layer structure 17 is laminated on the second electrically insulating layer structure 6. The first further electrically insulating layer structure 8 and the second further electrically insulating layer structure 17 can be an ABF® material (Ajinomoto Build-up Film), respectively. Outer holes 15 are formed through the first further electrically insulating layer structure 8 corresponding to the inner holes 5 and through the second further electrically insulating layer structure 17 corresponding to the inner holes 5, for example by laser drilling or mechanical drilling. At this time, the outer holes 15 are also formed through the electrically insulating plugging material 10, by which some of the inner holes 5 are covered.

(50) In a step S29, a first further electrically conductive layer structure 9 is applied on the first further electrically insulating layer structure 8, and a second further electrically conductive layer structure 18 is applied on the second further electrically insulating layer structure 17. The outer holes 15 are filled by the first and second further electrically conductive layer structures 9, 18. The first further electrically conductive layer structure 9 and the second further electrically conductive layer structure 18 are patterned, for example by conventional lithography methods combined with dry and/or wet etching methods. Alternatively, the first further electrically conductive layer structure 9 and the second further electrically conductive layer structure 18 can be patterned, for example, by physical vapor deposition (PVD) as for instance sputtering or by chemical vapor deposition (CVD).

(51) FIG. 5 illustrates a cross-sectional view of a component carrier 1 according to an exemplary embodiment of the invention. The component carrier 1 comprises a glass core 2 having a first main surface 31 and a second main surface 32; a first electrically insulating layer structure 3 applied on the first main surface 31 of the glass core 2; and a first electrically conductive layer structure 4 applied on the first electrically insulating layer structure 3. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 together can be formed by a first resin coated copper foil.

(52) Two inner holes 5 extend through the glass core 2, the first electrically insulating layer structure 3, and the first electrically conductive layer structure 4.

(53) The component carrier 1 further comprises a second electrically insulating layer structure 6 applied on the second main surface 32 of the glass core 2; and a second electrically conductive layer structure 7 applied on the second electrically insulating layer structure 6. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 together can be formed by a second resin coated copper foil. The inner holes 5 also extend through the second electrically insulating layer structure 6 and the second electrically conductive layer structure 7.

(54) The glass core 2 has lateral sides 33, 34 connecting the first and second main surfaces 31, 32, where the lateral sides 33, 34 are covered by the first and second electrically insulating layer structures 3, 6.

(55) A first further electrically insulating layer structure 8 is laminated on the first electrically conductive layer structure 4 and the inner holes 5, and a second further electrically insulating layer structure 17 is laminated on the second electrically conductive layer structure 7 and the inner holes 5. Outer holes 15 corresponding to the inner holes 5 extend through the first further electrically insulating layer structure 8 and the second further electrically insulating layer structure 17. A patterned first further electrically conductive layer structure 9 is applied on the first further electrically insulating layer structure 8, and a patterned second further electrically conductive layer structure 18 is applied on the second further electrically insulating layer structure 17. The material of the first further electrically insulating layer structure 8 and the second further electrically conductive layer structure 18 also fills the outer holes 15.

(56) The component carrier 1 further comprises a support layer 11 and a cavity 12 within the glass core 2, the first and second electrically insulating layer structures 3, 6, the first and second electrically conductive layer structures 4, 7, and the first and second further electrically insulating layer structures 8, 17. A bottom of the cavity 12 is defined by the support layer 11. A circumference of the cavity 12 is defined by a component hole 19. A component 13 is arranged on the bottom within the cavity 12.

(57) FIG. 6 illustrates a method of manufacturing the component carrier 1 of FIG. 5 according to an exemplary embodiment of the invention.

(58) In a step S31, a glass core 2 having a first main surface 31 and a second main surface 32 is provided. The glass core 2 has lateral sides 33, 34 connecting the first and second main surfaces 31, 32.

(59) In a step S32, a first electrically insulating layer structure 3 is applied on the first main surface 31 of the glass core 2, and a first electrically conductive layer structure 4 is applied on the first electrically insulating layer structure 3. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 together can be formed by a first resin coated copper foil. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 can be laminated onto the glass core 2. The lateral sides 33, 34 are at least partly covered by the first electrically insulating layer structure 3.

(60) A second electrically insulating layer structure 6 is applied on the second main surface 32 of the glass core 2, and a second electrically conductive layer structure 7 is applied on the second electrically insulating layer structure 6. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 together can be formed by a second resin coated copper foil. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 can be laminated onto the glass core 2. The lateral sides 33, 34 are at least partly covered by the second electrically insulating layer structure 6.

(61) In a modification, a release layer (not shown) can be applied on the second main surface 32 of the glass core 2 instead of the second electrically insulating layer structure 6 and the second electrically conductive layer structure 7. The release layer is usually peeled off in a later method step.

(62) In a step S33, registration holes 16, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by mechanical drilling or laser drilling, for example.

(63) In a step S34, the first and second electrically conductive layer structures 4, 7 are patterned, for example by conventional lithography methods combined with dry and/or wet etching methods. The patterning can be performed by use of a conformal mask, that means before a formation of inner holes 5 for example by laser drilling or mechanical drilling. Alternatively, the first and second electrically conductive layer structures 4, 7 can be patterned, for example, by physical vapor deposition (PVD) as for instance sputtering or by chemical vapor deposition (CVD). In the next step S35, openings are formed in the first and second electrically conductive layer structures 4, 7 for example by lithography (photolithography) methods combined with dry and/or wet etching methods. After this, laser drilling or mechanical drilling of the first and second electrically conductive layer structures 4, 7 can be carried out through these openings in the later step S35.

(64) In the step S35, at least one inner hole 5, for example three inner holes 5, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by laser drilling or mechanical drilling or also by wet and/or dry etching, for example.

(65) In a step S36, a first further electrically insulating layer structure 8 is laminated on the first electrically conductive layer structure 4 and the inner holes 5; and a second further electrically insulating layer structure 17 is laminated on the second electrically conductive layer structure 7 and the inner holes 5. The first further electrically insulating layer structure 8 and the second further electrically insulating layer structure 17 can be an ABF® material (Ajinomoto Build-up Film), respectively.

(66) In a step S37, outer holes 15 are formed through the first further electrically insulating layer structure 8 corresponding to the inner holes 5 and through the second further electrically insulating layer structure 17 corresponding to the inner holes 5, for example by laser drilling or mechanical drilling. A central and larger outer hole 15 can also be referred as a component hole 19.

(67) In a step S38, a patterned first further electrically conductive layer structure 9 is applied on the first further electrically insulating layer structure 8, and a patterned second further electrically conductive layer structure 18 is applied on the second further electrically insulating layer structure 17. The material of the first further electrically insulating layer structure 8 and the second further electrically conductive layer structure 18 also fills some of the outer holes 15, but not the central component hole 19. Instead, the component hole 19 is left open.

(68) In a step S39, a support layer 11 is connected to a stack comprising the glass core 2, the first and second electrically insulating layer structures 3, 6, the first and second electrically conductive layer structures 4, 7, the first and second further electrically insulating layer structures 8, 17 and the first and second further electrically conductive layer structures 9, 18 so that a cavity 12 is formed, wherein a bottom of the cavity 12 is defined by the support layer 11 and a circumference of the cavity 12 is defined by the component hole 19. A component 13 is arranged on the bottom within the cavity 12.

(69) In a modification, instead of the support layer 11, a temporary carrier (not shown) can be connected to the stack. Other than the support layer 11, the temporary carrier is removed from the stack in a later method step.

(70) FIG. 7 illustrates a method of manufacturing a component carrier 1 according to an exemplary embodiment of the invention. The component carrier of FIG. 7 differs from the component carrier of FIG. 1 in that the glass core 2 is formed by at least two glass panels 2a, 2b which are connected to each other by an intermediate electrically insulating layer structure 14 which is, for example, a laminated prepreg layer.

(71) In a step S40, a glass core 2 having a first main surface 31 and a second main surface 32 is provided. The glass core 2 comprises two glass panels 2a, 2b which are connected to each other by the intermediate electrically insulating layer structure 14 therebetween, which is, for example a prepreg layer. A first electrically insulating layer structure 3 is applied on the first main surface 31 of the glass core 2, and a first electrically conductive layer structure 4 is applied on the first electrically insulating layer structure 3. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 together can be formed by a first resin coated copper foil. A second electrically insulating layer structure 6 is applied on the second main surface 32 of the glass core 2, and a second electrically conductive layer structure 7 is applied on the second electrically insulating layer structure 6. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 together can be formed by a second resin coated copper foil. For example, the two glass panels 2a, 2b, the intermediate electrically insulating layer structure 14 therebetween, and the first and second resin coated copper foils can be laid one upon the other, and a lamination process of these layers is carried out at the same time. The glass core 2 has lateral sides 33, 34 connecting the first and second main surfaces 31, 32, wherein the lateral sides 33, 34 are covered by the first and second electrically insulating layer structures 3, 7.

(72) In a modification, a release layer (not shown) can be applied on the second main surface 32 of the glass core 2 instead of the second electrically insulating layer structure 6 and the second electrically conductive layer structure 7. The release layer can be peeled off in a later method step.

(73) In a step S41, registration holes 16, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by mechanical drilling or laser drilling, for example.

(74) In a step S42, the first and second electrically conductive layer structures 4, 7 are patterned, for example by conventional lithography methods combined with dry and/or wet etching methods. Alternatively, the first and second electrically conductive layer structures 4, 7 can be patterned, for example, by physical vapor deposition (PVD) as for instance sputtering or by chemical vapor deposition (CVD).

(75) In a step S43, at least one inner hole 5, for example two inner holes 5, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by laser drilling or mechanical drilling or by wet and/or dry etching, for example.

(76) In a step S44, a first further electrically insulating layer structure 8 is laminated on the first electrically conductive layer structure 4 and the inner holes 5; and a second further electrically insulating layer structure 17 is laminated on the second electrically conductive layer structure 7 and the inner holes 5. Because the first electrically conductive layer structure 4 and the second electrically conductive layer structure 7 have been patterned in step S42, the first further electrically insulating layer structure 8 contacts the first electrically insulating layer structure 3, and the second further electrically insulating layer structure 17 contacts the second electrically insulating layer structure 6. The first further electrically insulating layer structure 8 and the second further electrically insulating layer structure 17 can be an ABF® material (Ajinomoto Build-up Film), respectively.

(77) Outer holes 15 are formed through the first further electrically insulating layer structure 8 corresponding to the inner holes 5 and through the second further electrically insulating layer structure 17 corresponding to the inner holes 5, for example by laser drilling or mechanical drilling.

(78) A first further electrically conductive layer structure 9 is applied on the first further electrically insulating layer structure 8, and a second further electrically conductive layer structure 18 is applied on the second further electrically insulating layer structure 17. The outer holes 15 are at least partly filled or plated by the first and second further electrically conductive layer structures 9, 18. The first further electrically conductive layer structure 9 and the second further electrically conductive layer structure 18 are patterned, for example by conventional lithography methods combined with dry and/or wet etching methods. Alternatively, the first further electrically conductive layer structure 9 and the second further electrically conductive layer structure 18 can be patterned, for example, by physical vapor deposition (PVD) as for instance sputtering or by chemical vapor deposition (CVD).

(79) FIG. 8 illustrates a method of manufacturing a component carrier 1 according to an exemplary embodiment of the invention. The component carrier of FIG. 8 differs from the component carrier of FIG. 3 in that the glass core 2 is formed by at least two glass panels 2a, 2b which are connected to each other by an intermediate electrically insulating layer structure 14 which is, for example, a laminated prepreg layer.

(80) In a step S51, a glass core 2 having a first main surface 31 and a second main surface 32 is provided. The glass core 2 comprises two glass panels 2a, 2b which are connected to each other by the intermediate electrically insulating layer structure 14 therebetween, which is, for example a prepreg layer.

(81) A first electrically insulating layer structure 3 is applied on the first main surface 31 of the glass core 2, and a first electrically conductive layer structure 4 is applied on the first electrically insulating layer structure 3. The first electrically insulating layer structure 3 and the first electrically conductive layer structure 4 together can be formed by a first resin coated copper foil. A second electrically insulating layer structure 6 is applied on the second main surface 32 of the glass core 2, and a second electrically conductive layer structure 7 is applied on the second electrically insulating layer structure 6. The second electrically insulating layer structure 6 and the second electrically conductive layer structure 7 together can be formed by a second resin coated copper foil. For example, the two glass panels 2a, 2b, the intermediate electrically insulating layer structure 14 therebetween, and the first and second resin coated copper foils are laid one upon the other, and a lamination process of these layers is carried out at the same time. The glass core 2 has lateral sides 33, 34 connecting the first and second main surfaces 31, 32, wherein the lateral sides 33, 34 are covered by the first and second electrically insulating layer structures 3, 7.

(82) In a modification, a release layer (not shown) can be applied on the second main surface 32 of the glass core 2 instead of the second electrically insulating layer structure 6 and the second electrically conductive layer structure 7. The release layer can be peeled off in a later method step.

(83) In a step S52, registration holes 16, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by mechanical drilling or laser drilling, for example.

(84) In a step S53, the first and second electrically conductive layer structures 4, 7 are patterned, for example by conventional lithography methods combined with dry and/or wet etching methods. The patterning can be performed by use of a conformal mask, that means before the formation of inner holes, for example by laser drilling or mechanical drilling in the next step S54, openings are formed in the first and second electrically conductive layer structures 4, 7 for example by lithography (photolithography) methods combined with dry and/or wet etching methods. After this, laser drilling or mechanical drilling of the first and second electrically conductive layer structures 4, 7 can be carried out through these openings in the later step S54.

(85) In the step S54, at least one inner hole 5, for example five inner holes 5, which extend through the glass core 2, the first and second electrically insulating layer structures 3, 6 and the first and second electrically conductive layer structures 4, 7, are made by laser drilling or mechanical drilling or by wet and/or dry etching, for example.

(86) In a step S55, some of the inner holes 5 are, along their axes, at least partly covered by an electrically insulating plugging material or magnetic paste 10. Also, the registration holes 16 are filled by the same or another electrically insulating plugging material or magnetic paste. Alternatively, at least one of the inner holes 5 can completely be filled with the magnetic paste 10.

(87) The first and second electrically conductive layer structures 4, 7 are etched-off. Optionally, the electrically insulating plugging material or magnetic paste 10 can be ground-off.

(88) A first further electrically insulating layer structure 8 is laminated on the first electrically insulating layer structure 3; and a second further electrically insulating layer structure 17 is laminated on the second electrically insulating layer structure 6. The first further electrically insulating layer structure 8 and the second further electrically insulating layer structure 17 can be an ABF® material (Ajinomoto Build-up Film), respectively. Outer holes 15 are formed through the first further electrically insulating layer structure 8 corresponding to the inner holes 5 and through the second further electrically insulating layer structure 17 corresponding to the inner holes 5, for example, by laser drilling or mechanical drilling. At this time, the outer holes 15 are also formed through the electrically insulating plugging material or magnetic paste 10, by which some of the inner holes 5 are at least partly covered.

(89) A first further electrically conductive layer structure 9 is applied on the first further electrically insulating layer structure 8, and a second further electrically conductive layer structure 18 is applied on the second further electrically insulating layer structure 17. The outer holes 15 are at least partly filled or plated by the first and second further electrically conductive layer structures 9, 18. The first further electrically conductive layer structure 9 and the second further electrically conductive layer structure 18 are patterned, for example by conventional lithography methods combined with dry and/or etching methods.

(90) Alternatively, the first further electrically conductive layer structure 9 and the second further electrically conductive layer structure 18 can also be patterned, for example, by physical vapor deposition (PVD) as for instance sputtering or by chemical vapor deposition (CVD).

(91) FIGS. 9A to 9C illustrate a method of manufacturing a component carrier 1 according to an exemplary embodiment of the invention.

(92) In a step S61, a glass core 2 is arranged into an electrically insulating frame 21 which is, for example, a frame made of an FR-4 material or another prepreg material provided with a cavity. The electrically insulating frame 21 could be any material which is substantially not deformed under the influence of mechanically applied pressure and/or thermal energy. A first resin coated copper foil 3, 4 is laid on the first main surface 31 of the glass core 2 and the insulating frame 21, and a second resin coated copper foil 6, 7 is laid on the second main surface 32 of the glass core 2 and the insulating frame 21.

(93) In a step S62, the first and second resin coated copper foils 3, 4; 6, 7 are laminated by pressure and/or heat on the glass core 2 and the frame 21 to obtain an intermediate stack 22.

(94) In a step S63, the intermediate stack 22 is trimmed at its circumference to obtain the desired dimensions.

(95) In all of the above-described embodiments, the component carrier 1 is formed to have a symmetric layer stackup with respect to the glass core 2, i.e., the component carrier 1 is mirrored with respect to the glass core 2, wherein the symmetric layer stackup includes a symmetric provision of at least one of the first electrically insulating layer structure 3, the first electrically conductive layer structure 4, the at least one inner hole 5, the corresponding outer holes 15, the first further electrically insulating layer structure 8 and the first further electrically conductive layer structure 9. The symmetric layer stackup allows that patterns, for example those of the patterned first and second electrically conductive layer structures 4, 7, may be different from each other. In the same manner, the symmetric layer stackup allows that patterns, for example those of the first and second further electrically conductive layer structures 9, 18, may be different from each other.

(96) In modified embodiments, the component carriers 1 can be formed to have an asymmetric layer stackup with respect to the glass core 2.

(97) In all of the above-described embodiments, the component carrier 1 can comprise at least one of the following features: the component carrier 1 comprises at least one component 13 being surface mounted on and/or embedded in the component carrier, wherein the at least one component is in particular selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, a light guiding element, an optical element, a bridge, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier, and a logic chip; wherein at least one of the electrically conductive layer structures of the component carrier comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene; wherein at least one of the electrically insulating layer structure comprises at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for instance epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester resin, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide; wherein the component carrier is shaped as a plate; wherein the component carrier is configured as one of the group consisting of a printed circuit board, a substrate, and an interposer; wherein the component carrier is configured as a laminate-type component carrier.

(98) FIGS. 10A and 10B illustrate comparisons between a component carrier of the prior art to a component carrier 1 according to the present invention.

(99) As shown in FIG. 10A, glass cracks can be avoided or reduced in the component carrier 1 of the present invention, for example by the provision of the first electrically insulating layer structure 3 and the first electrically conductive layer structure 4, which can be a first resin coated copper foil (RCC). The effect can be strengthened by providing the second electrically insulating layer structure 6 and the second electrically conductive layer structure 7, which can be a second resin coated copper foil (RCC).

(100) As shown in FIG. 10B, the glass core 2 of the present invention can easier be handled in manufacturing processes because the lateral sides 33, 34 of the glass core 2 of the component carrier 1 are covered and protected by an insulating material, for example by a prepreg material of the first and second electrically insulating layer structures 3, 6 (which can be included in the first and second resin coated copper foils (RCC)). Furthermore, the lateral sides 33, 34 of the glass core 2 of the component carrier 1 can also be strengthened by a copper material of the first and second resin coated copper foils near the lateral sides 33, 34 of the glass core 2.

(101) FIG. 11 illustrates a cross-sectional view of a component carrier 1 according to an exemplary embodiment of the invention. The embodiment of FIG. 11 is similar to the embodiment of FIG. 3 and is manufactured according to the embodiment of FIG. 4 except for the following differences. The component carrier 1 comprises an insert 40 made of the electrically insulating plugging material or magnetic paste 10. The insert 40 is manufactured by a modified step S28 of FIG. 4 where the outer holes 15 are formed through the first further electrically insulating layer structure 8 corresponding to the inner holes 5 and through the second further electrically insulating layer structure 17 corresponding to the inner holes 5, for example by laser drilling or mechanical drilling, except for that inner hole 5 where the insert 40 is to be formed. At this position, where the insert 40 is to be formed, the electrically insulating plugging material or magnetic paste 10 is kept as it is. Compared with the embodiment of FIG. 3, not every inner hole 5 which is filled with the plugging material 10, must be further drilled and filled with the second further electrically conductive layer structures 9, 18 such as copper. In other words, it is possible that not every hole has a hole-in-hole design. At least one single inner hole 5 filled with magnetic paste 10 enables a subsequent production of e.g., inductors.

(102) FIG. 12 illustrates a cross-sectional view of a component carrier 1 according to an exemplary embodiment of the invention. The embodiment of FIG. 12 is similar to the embodiment of FIG. 5 and is manufactured according to the embodiment of FIG. 6 except for the following differences. Compared with the component carrier 1 of FIG. 5, the component carrier 1 in FIG. 12 does not comprise the support layer 11.

(103) Instead a support layer 11, a temporary carrier (not shown) is connected in a modified step S39 to a stack comprising the glass core 2, the first and second electrically insulating layer structures 3, 6, the first and second electrically conductive layer structures 4, 7, the first and second further electrically insulating layer structures 8, 17 and the first and second further electrically conductive layer structures 9, 18 so that a cavity 12 is formed, wherein a bottom of the cavity 12 is defined by the temporary carrier, and a circumference of the cavity 12 is defined by the component hole 19. A component 13 is arranged on the bottom (i.e., the temporary carrier) within the cavity 12.

(104) Then, the cavity 12 is filled with a resin, and the temporary carrier is removed. Another RCC foil can be applied on the same side. Afterwards, the copper layer of the RCC foil can be patterned, for example by conventional lithography and wet or dry etching methods. The process-steps are repeated until a desired number of layers 41 is achieved. Finally, solder bumps 43 are provided at the bottom side of the component carrier 1.

(105) The component carrier 1 of FIG. 12 is thus manufactured by a modified manufacturing method of FIG. 6 and uses a temporary carrier. The temporary carrier is particularly useful when an asymmetrical build-up stack should be realized.

(106) FIG. 13 illustrates a cross-sectional view of a component carrier 1 according to an exemplary embodiment of the invention. The component carrier 1 of FIG. 13 is similar to the component carrier 1 of FIG. 12 except for the provision of vias 42 which are provided at a side of the component carrier 1, which is opposed to that side where the solder bumps 43 are provided.

(107) The component carrier 1 of the present invention is particularly suitable as a package substrate for mobile phones and related electronic devices.

(108) It should be noted that the term “comprising” does not exclude other elements or steps and the article “a” or “an” does not exclude a plurality. Also, elements described in association with different embodiments may be combined.

(109) Implementation of the invention is not limited to the preferred embodiments shown in the figures and described above. Instead, a multiplicity of variants is possible which variants use the solutions shown and the principle according to the invention even in the case of fundamentally different embodiments.

LIST OF REFERENCE SIGNS

(110) TABLE-US-00001 List of reference signs  1 component carrier  2 glass core  2a glass panel  2b glass panel  3 first electrically insulating layer structure  4 first electrically conductive layer structure  5 inner hole  6 second electrically insulating layer structure  6a insulating layer structure  6b insulating layer structure  7 second electrically conductive layer structure  8 first further electrically insulating layer structure  9 first further electrically conductive layer structure 10 electrically insulating plugging material, magnetic paste 11 support layer 12 cavity 13 component 14 intermediate electrically insulating layer structure 15 outer hole 16 registration hole 17 second further electrically insulating layer structure 18 second further electrically conductive layer structure 19 component hole 21 frame 22 intermediate stack 31 first main surface 32 second main surface 33 lateral side 34 lateral side 40 insert 41 layer 42 via 43 solder bumps