MULTILAYER ASSEMBLY WITH ELECTRICAL COMPONENT

Abstract

The invention provides a light generating device (1000) comprising (a) a first interconnect (110), (b) a second interconnect (120), (c) a solid state light source (130), and (d) a multilayer stack (200) comprising a first multilayer (210) and a second multilayer (220), wherein: each multilayer (210,220) of the multilayer stack (200) comprises (i) a flexible support layer (250), and (ii) a conductive layer (230); the first interconnect (110) connects the solid state light source (130) and the conductive layer (230) of the first multilayer (210); the first multilayer (210) comprises an opening (215), wherein at least part of the second interconnect (120) is arranged in the opening (215); the second interconnect (120) connects the solid state light source (130) and the conductive layer (230) of the second multilayer (220); and the first interconnect (110), the second interconnect (120), and the conductive layers (230) are each individually one or more of thermally conductive and electrically conductive.

Claims

1. A light generating device comprising (a) a first interconnect, (b) a second interconnect, (c) a solid state light source, and (d) a multilayer stack comprising a first multilayer and a second multilayer, wherein: each multilayer of the multilayer stack comprises (i) a flexible support layer, and (ii) a conductive layer; the first interconnect connects the solid state light source and the conductive layer of the first multilayer; the first multilayer comprises an opening, wherein at least part of the second interconnect is arranged in the opening; the second interconnect connects the solid state light source and the conductive layer of the second multilayer; and the first interconnect, the second interconnect, and the conductive layers are each individually one or more of thermally conductive and electrically conductive; and wherein the multilayer stack comprises a monolithic bent layer element, wherein the monolithic bent layer element comprises the first multilayer and the second multilayer, the monolithic bent layer element comprises a first section and a second section separated by a bent, wherein the first section corresponds to the first multilayer, and wherein the second section corresponds to the second multilayer.

2. The light generating device according to claim 1, wherein one or more of the first interconnect and the second interconnect comprises a solder material, and wherein the flexible support layer comprises polyimide.

3. The light generating device according to claim 1, comprising a thermal connector, wherein the thermal connector is thermally coupled to the solid state light source and thermally coupled to the conductive layer of the second multilayer via the second interconnect, wherein the conductive layer of the second multilayer is thermally conductive.

4. The light generating device according to claim 1, wherein the solid state light source comprises an electrical connector, wherein the electrical connector is electrically coupled to the conductive layer of the first multilayer, wherein the conductive layer of the first multilayer is electrically conductive.

5. The light generating device according to claim 4, wherein the electrical connector comprises a first connector and a second connector, and wherein the first multilayer comprises a first sectiones and a second section, wherein the first section and the second section are electrically separated, and wherein the first connector is electrically coupled to the first section, and wherein the second connector is electrically coupled to the second section.

6. The light generating device according to claim 1, wherein the multilayer stack has a multilayer stack length (L) selected from the range of 50-5000 mm, a multilayer stack width selected from the range of 50-5000 mm, and a multilayer stack thickness (H) selected from the range of 15-200 μm.

7. The light generating device according to claim 1, wherein the conductive layers are arranged at opposite sides of the flexible support layer.

8. The light generating device according to claim 1, wherein the solid state light source comprises a light emitting diode arranged on a ceramic body.

9. A lamp or a luminaire comprising the light generating device according to claim 1.

10. A method for providing the light generating device according to claim 1, wherein the method comprises: providing (a) the first interconnect, (b) the second interconnect, (c) the solid state light source, (d) the first multilayer and the second multilayer; and connecting the solid state light source (i) by the first interconnect to the conductive layer of the first multilayer and (ii) by the second interconnect via the opening to the conductive layer of the second multilayer; and wherein the method further comprises: providing a layer element comprising the flexible support layer and the conductive layer; and bending the layer element to provide a monolithic bent layer element, wherein the monolithic bent layer element comprises the first multilayer and the second multilayer; and wherein the monolithic bent layer element comprises a first section and a second section separated by a bent, wherein the first section corresponds to the first multilayer, and wherein the second section corresponds to the second multilayer.

11. The method according to claim 10, wherein one or more of the first interconnect and the second interconnect comprise a solder material.

12. The method according to claim 1, wherein the second interconnect and the conductive layer of the second multilayer are thermally conductive, and wherein the method comprises: providing a thermal connector to the solid state light source and connecting the solid state light source via the thermal connector and the second interconnect to the conductive layer of the second multilayer.

13. The method according to claim 10, wherein the solid state light source comprises an electrical connector, wherein the first interconnect and the conductive layer of the first multilayer are electrically conductive, and wherein the method comprises: connecting the electrical connector and the first interconnect.

14. (canceled)

15. The method according to claim 10, wherein the layer element comprises a single flexible support layer and two conductive layers arranged at opposite sides of the flexible support layer.

16. The method according to claim 10, wherein the method comprises bending the layer element to provide a monolithic bent layer element with alternating conductive layers and flexible support lavers along the multilayer stack thickness H.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0085] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

[0086] FIG. 1A-B schematically depict embodiments of the assembly and of the method.

[0087] FIG. 2 schematically depicts an embodiment of the light generating device.

[0088] FIG. 3 schematically depicts further embodiments of the light generating device.

[0089] The schematic drawings are not necessarily on scale.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0090] FIG. 1A schematically depicts an embodiment of the assembly 100. In the depicted embodiment, the assembly 100 comprises a first (conductive) interconnect 110, a second (conductive) interconnect 120, an electrical component 130, and a multilayer stack 200. The multilayer stack comprises a first multilayer 210 and a second multilayer 220. Each multilayer 210,220 of the multilayer stack 200, here especially the first multilayer 210, and the second multilayer 220, comprises a flexible support layer 250 and a conductive layer 230. The first interconnect 110 connects the electrical component 130 and the conductive layer 230 of the first multilayer 210. The first multilayer 210 comprises an opening 215 (see top half of FIG. 1), wherein at least part of the second interconnect 120 is arranged in the opening 215. The second interconnect 120 connects the electrical component 130 and the conductive layer 230 of the second multilayer 220. In particular, in the depicted embodiment, The second interconnect 120 connects the electrical component 130 and the conductive layer 230 of the second multilayer 220 via the opening 215. Especially, the first interconnect 110, the second interconnect 120, and the conductive layers 230 may each individually be one or more of thermally conductive and electrically conductive.

[0091] In embodiments, one or more of the first interconnect 110 and the second interconnect 120 may comprise a solder material 10, especially wherein the solder material 10 is one or more of thermally conductive and electrically conductive. In the depicted embodiment, the second interconnect 120 comprises a solder material. In further embodiments, the second interconnect may consist of the solder material. Hence, the solder material 10 may functionally couple, especially electrically coupled, or especially thermally couple, the electrical component 130 to the conductive layer 230 of the second multilayer 220.

[0092] In the depicted embodiment, the electrical component 130 comprises an electrical connector 131 wherein the electrical connector 131 is electrically coupled to the conductive layer 230 of the first multilayer 210 (via the first interconnect 110), wherein the conductive layer 230 of the first multilayer 210 is electrically conductive, and wherein the first interconnect 110 is electrically conductive.

[0093] Similarly, in the depicted embodiment, the electrical component comprises a thermal connector 132, wherein the thermal connector 132 is thermally coupled to the electrical component 130 and thermally coupled to the conductive layer 230 of the second multilayer 220 via the second interconnect 120, wherein the conductive layer 230 of the second multilayer 210 is thermally conductive, and wherein the second interconnect 120 is thermally conductive. Hence, in the depicted embodiment, the conductive layer 230 of the first multilayer 210 may be configured for providing electrical connections, especially configured as a PCB, whereas the conductive layer 230 of the second multilayer 220 may comprise a heat sink.

[0094] In the depicted embodiment, the multilayer stack 200 has a multilayer stack length L selected from the range of 50-5000 mm, a multilayer stack width W selected from the range of 50-5000 mm, and a multilayer stack thickness H selected from the range of 20-200 μm. The multilayer stack width W may especially be perpendicular to both the multilayer stack length L and the multilayer stack thickness H.

[0095] FIG. 1A further schematically depicts an embodiment of the method for providing the assembly 100. The method may comprise providing the first (conductive) interconnect 110, the second (conductive) interconnect 120, the electrical component 130, the first multilayer 210, and the second multilayer 220. The method may further comprise connecting the electrical component 130 to the conductive layer 230 of the first multilayer 210 by the first interconnect 110. The method may further comprise connecting the electrical component 130 to the conductive layer 230 of the second multilayer 220 by the second interconnect 120 via the opening 215.

[0096] Hence, the method may comprise functionally coupling the electrical component 130 to the conductive layers 230 by providing the first interconnect 110 and the second interconnect 120. The method may especially comprise an SMT process.

[0097] In embodiments, one or more of the first interconnect 110 and the second interconnect 120 comprise a solder material 10. Hence, the method may comprise one or more of (i) providing a solder material 10 to provide a first interconnect 110 connecting the electrical component 130 and the conductive layer 230 of the first multilayer 210, and (ii) providing a solder material 10 to provide a second interconnect 120 connecting the electrical component 130 and the conductive layer 230 of the second multilayer 220.

[0098] In embodiments, the second interconnect 120 and the conductive layer 230 of the second multilayer 220 are thermally conductive, and the method may comprise providing a thermal connector 132 to the electrical component 130 and connecting the electrical component 130 via the thermal connector 132 and the second interconnect 120 to the conductive layer 230 of the second multilayer 220, especially such that the thermal connector 132 is thermally coupled to the second multilayer 210. In such embodiments, the second multilayer may especially be thermally conductive.

[0099] In further embodiments, the electrical component 130 may comprise an electrical connector 131, and the method may comprise connecting the electrical connector 131 and the first interconnect 110, especially such that the electrical connector 131 is electrically coupled to the conductive layer 230 of the first multilayer 210. In such embodiments, the first interconnect 110 and the conductive layer 230 of the first multilayer 210 may be electrically conductive.

[0100] In embodiments, the method may comprise providing the first multilayer 210 by arranging the (respective) conductive layer 230 on the (respective) flexible support layer 250.

[0101] In further embodiments, the method may comprise providing the second multilayer 220 by arranging the (respective) conductive layer 230 on the (respective) flexible support layer 250.

[0102] In further embodiments, the method may comprise providing the opening 215 in the flexible support layer 250 of the first multilayer 210.

[0103] FIG. 1B schematically depicts an embodiment of the method, wherein the method comprises providing a layer element 106 comprising the flexible support layer 250 and the conductive layer 230, and bending the layer element 106 to provide a monolithic bent layer element 206, wherein the monolithic bent layer element 206 comprises the first multilayer 210 and the second multilayer 220. In addition, in the depicted embodiment, the method further comprises providing the opening 215 in the flexible support layer 250 of the first multilayer 210. In particular, in embodiments, the method may comprise punching an opening 215 in the flexible support layer 250 of the first multilayer 210.

[0104] In the depicted embodiment, the layer element 106 comprises a single flexible support layer 250 and two conductive layers 230 arranged at opposite sides of the flexible support layer 250. In particular, in the depicted embodiment, the method comprises bending the layer element 106 to provide a monolithic bent layer element 206 with alternating conductive layers 230 and flexible support layers 250 (along the multilayer stack thickness H).

[0105] FIG. 1B further schematically depicts an embodiment of the assembly 100, wherein the multilayer stack 200 comprises a monolithic bent layer element 206, wherein the monolithic bent layer element 206 comprises the first multilayer 210 and the second multilayer 220.

[0106] FIG. 2 schematically depicts an embodiment of the assembly 100, wherein the first multilayer 210 comprises a first section 211 and a second section 212, wherein the first section 211 and the second section 212 are electrically separated, i.e., the first section 211 and the second section 212 are not directly electrically coupled. In particular, the first section 211 and the second section 212 may be physically separated. In further embodiments, the electrical connector 131 may comprise a first connector 131a and a second connector 131b, wherein the first connector 131a is electrically coupled to the first section 211, and wherein the second connector 131b is electrically coupled to the second section 212. Hence, the electrical component 230 may be electrically coupled to both the first section 211 and to the second section 212 via the first connector 131a and the second connector 131b, respectively.

[0107] In embodiments, the electrical component 130 may comprise one or more of a light source, and a driver. In the depicted embodiment, the electrical component 130 comprises a light source.

[0108] Hence, FIG. 2 further schematically depicts an embodiment of a light generating device 1000, wherein the light generating device 1000 comprises the assembly 100, wherein the electrical component 130 comprises a light source.

[0109] In particular, in embodiments, the electrical component 130 may comprises a solid state light source. Especially, in the depicted embodiment, the electrical component 130 may comprise a light emitting diode 135 arranged on a ceramic body 136.

[0110] Referring to FIG. 2, such assembly may be intended to reduce the drawbacks of FPC while keeping the advantage of better switching reliability. For instance, it may allow to have larger heat spreader surfaces in a Cu layer on the second PI film which may improve the thermal performance of the assembly. Further, the punched hole may have lower tolerances compared to e.g. the screen printed Cu gaps allowing for the finer LED footprints such as used for high power ceramic LEDs. If needed, the hole can be kept smaller to increase the creepage and the layer on the second PI film can have additional creepage towards the other Cu heat spreaders.

[0111] FIG. 3 schematically depicts another embodiment of the assembly 100, wherein the assembly is integrated in light generating devices 1000. In particular, FIG. 3 schematically depicts light generating devices 1000, such as a lamp 1001, and a luminaire 1002, and a lighting control element 1003, such as a user interface, like a graphical user interface. Reference 1010 indicates the light that is generated by a light generating device 1000. Especially, this light is visible light, such as white light. The lighting control element 1003 may also be a portable device, such as an I-phone or Smartphone.

[0112] The term “plurality” refers to two or more. Furthermore, the terms “a plurality of” and “a number of” may be used interchangeably.

[0113] The terms “substantially” or “essentially” herein, and similar terms, will be understood by the person skilled in the art. The terms “substantially” or “essentially” may also include embodiments with “entirely”, “completely”, “all”, etc. Hence, in embodiments the adjective substantially or essentially may also be removed. Where applicable, the term “substantially” or the term “essentially” may also relate to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, including 100%. Moreover, the terms “about” and “approximately” may also relate to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, including 100%. For numerical values it is to be understood that the terms “substantially”, “essentially”, “about”, and “approximately” may also relate to the range of 90%-110%, such as 95%-105%, especially 99%-101% of the values(s) it refers to.

[0114] The term “comprise” also includes embodiments wherein the term “comprises” means “consists of”.

[0115] The term “and/or” especially relates to one or more of the items mentioned before and after “and/or”. For instance, a phrase “item 1 and/or item 2” and similar phrases may relate to one or more of item 1 and item 2. The term “comprising” may in an embodiment refer to “consisting of” but may in another embodiment also refer to “containing at least the defined species and optionally one or more other species”.

[0116] Furthermore, the terms first, second, third and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.

[0117] The term “functionally coupled” may in embodiments refer to a physical connection or mechanical connection between at least two elements, such as via one or more of a screw, a solder, an adhesive, a melt connection, etc. Alternatively or additionally, the term “functionally coupled” may in embodiments refer to an electrically conductive connection between at least two elements. When two (or more) elements have an electrical conductive connection, then there may be a conductivity (at room temperature) between the two (or more) elements of at least 1.Math.10.sup.5 S/m, such as at least 1.Math.10.sup.6 S/m. In general, an electrically conductive connection will be between two (or more) elements each comprising an electrically conductive material, which may be in physical contact with each other or between which an electrically conductive material is configured. Herein a conductivity of an insulated material may especially be equal to or smaller than 1.Math.10.sup.−10 S/m, especially equal to or smaller than 1.Math.10.sup.−13 S/m. Herein a ratio of an electrical conductivity of an isolating material (insulator) and an electrical conductivity of an electrically conductive material (conductor) may especially be selected smaller than 1.Math.10.sup.−15.

[0118] The devices, apparatus, or systems may herein amongst others be described during operation. As will be clear to the person skilled in the art, the invention is not limited to methods of operation, or devices, apparatus, or systems in operation.

[0119] The term “further embodiment” and similar terms may refer to an embodiment comprising the features of the previously discussed embodiment, but may also refer to an alternative embodiment.

[0120] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims.

[0121] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.

[0122] Use of the verb “to comprise” and its conjugations does not exclude the presence of elements or steps other than those stated in a claim. Unless the context clearly requires otherwise, throughout the description and the claims, the words “comprise”, “comprising”, “include”, “including”, “contain”, “containing” and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to”.

[0123] The article “a” or “an” preceding an element does not exclude the presence of a plurality of such elements.

[0124] The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a device claim, or an apparatus claim, or a system claim, enumerating several means, several of these means may be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

[0125] The invention also provides a control system that may control the device, apparatus, or system, or that may execute the herein described method or process. Yet further, the invention also provides a computer program product, when running on a computer which is functionally coupled to or comprised by the device, apparatus, or system, controls one or more controllable elements of such device, apparatus, or system.

[0126] The invention further applies to a device, apparatus, or system comprising one or more of the characterizing features described in the description and/or shown in the attached drawings. The invention further pertains to a method or process comprising one or more of the characterizing features described in the description and/or shown in the attached drawings. Moreover, if a method or an embodiment of the method is described being executed in a device, apparatus, or system, it will be understood that the device, apparatus, or system is suitable for or configured for (executing) the method or the embodiment of the method, respectively.

[0127] The various aspects discussed in this patent can be combined in order to provide additional advantages. Further, the person skilled in the art will understand that embodiments can be combined, and that also more than two embodiments can be combined. Furthermore, some of the features can form the basis for one or more divisional applications.

[0128] Hence, amongst others the invention provides a way to make a multilayered PCB assembly out of one or more thin flexible film substrates. In particular, the invention may provide an embodiment for a module assembly with ceramic high power LEDs.

[0129] In embodiments, an assembly may be provided by two or more multi-layers, which are based on a single multi-layer that is folded into a stack of the two or more multi-layers. Such assembly is herein also indicated as a monolithic bent layer element. An assembly of two or more multi-layers may also be provided by stacking the multi-layers, where two or more of the multi-layer are not based on a single multi-layer that is folded into a stack of the two or more multi-layers. For instance, in embodiments two or more multi-layers are provided as such, and may be stacked to provide the assembly.