OPTICAL SYSTEM, LITHOGRAPHY APPARATUS AND METHOD
20230367227 · 2023-11-16
Inventors
Cpc classification
G03F7/70266
PHYSICS
G02B26/0825
PHYSICS
G03F7/70233
PHYSICS
International classification
G03F7/00
PHYSICS
Abstract
An optical system for a lithography apparatus includes an optical element. The optical element comprises a substrate, an optically effective area provided on the substrate, and a plurality of channels which run through the substrate and to which a pressure can be applied via a fluid. An initial surface profile and a target surface profile different from the initial surface profile are associated with the optically effective area. The optically effective area can be switched from the initial surface profile to the target surface profile by applying pressure and a resulting deformation of the channels.
Claims
1. An optical system, comprising: an optical element comprising a substrate and an optically effective surface supported by the substrate, wherein: a multiplicity of channels running through the substrate configured to be subjected to a pressure with the aid of a fluid; the optically effective surface is assigned an initial surface profile and a target surface profile that differs from the initial surface profile; the optically effective surface is switchable from the initial surface profile to the target surface profile by being subjected to pressure and resultant deformation of the channels; and the channels have a variable cross section.
2. The optical system of claim 1, wherein the channels comprise constrictions configured to implement the variable cross section.
3. The optical system of claim 1, wherein the channels comprise expansions configured to implement the variable cross section.
4. The optical system of claim 1, wherein the channels have a variable cross-sectional area.
5. The optical system of claim 1, wherein the optically effective surface is assigned a number of target surface profiles which differ from one another only in their deformation amplitude, and wherein each target surface profile is assigned a predetermined pressure.
6. The optical system of claim 1, wherein the channels are arranged in a common plane.
7. The optical system of claim 1, wherein the channels are distributed over a number of different planes.
8. The optical system of claim 1, wherein the channels are connected in series.
9. The optical system of claim 1, wherein the channels are divided into a multiplicity of cells connected in series.
10. The optical system of claim 9, wherein the cells differ from one another in their width and/or in their height.
11. The optical system of claim 9, further comprising cooling lines connecting the cells of each channel.
12. An apparatus, comprising: an optical system according to claim 1, wherein the apparatus is a lithography apparatus.
13. An optical system, comprising: an optical element comprising a substrate and an optically effective surface supported by the substrate, wherein: a multiplicity of channels run through the substrate and are configured to be subjected to a pressure with the aid of a fluid; the optically effective surface is assigned an initial surface profile and a target surface profile that differs from the initial surface profile; the optically effective surface is switchable from the initial surface profile to the target surface profile by being subjected to pressure and resultant deformation of the channels; the channels have a greater geometrical extent along a width direction of the substrate than along a height direction of the substrate; and the channels are spaced apart unequally from one another along the width direction.
14. The optical system of claim 13, wherein, along the height direction, the channels are closer to the optically effective surface than to a back side of the substrate.
15. The optical system of claim 13, wherein the channels run along a depth direction of the substrate and parallel to one another.
16. The optical system of claim 13, wherein the channels are connected in series.
17. The optical system of claim 13, wherein the channels are divided into a multiplicity of cells connected in series.
18. The optical system of claim 17, wherein the cells differ from one another in their width and/or in their height.
19. An apparatus, comprising: an optical system according to claim 13, wherein the apparatus is a lithography apparatus.
20. A method, comprising: providing a first substrate block and a second substrate block separate from the first substrate block; introducing a multiplicity of channels into the first substrate block; closing the channels with the aid of the second substrate block; and connecting the first and second substrate blocks.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0051] The disclosure is explained in detail hereinafter on the basis of preferred embodiments with reference to the appended figures.
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EXEMPLARY EMBODIMENTS
[0087] Unless indicated otherwise, elements that are identical or functionally identical have been provided with the same designations in the figures. It should also be noted that the illustrations in the figures are not necessarily true to scale. Hidden components are shown in the figures with dashed lines.
[0088]
[0089] The EUV lithography apparatus 100A has an EUV light source 106A. A plasma source (or a synchrotron), which emits radiation 108A in the EUV range (extreme ultraviolet range), that is to say for example in the wavelength range of 5 nm to 20 nm, may be provided for example as the EUV light source 106A. In the beam-shaping and illumination system 102, the EUV radiation 108A is focused and the desired operating wavelength is filtered out from the EUV radiation 108A. The EUV radiation 108A generated by the EUV light source 106A has a relatively low transmissivity through air, for which reason the beam guiding spaces in the beam-shaping and illumination system 102 and in the projection system 104 are evacuated.
[0090] The beam-shaping and illumination system 102 illustrated in
[0091] The projection system 104 (also referred to as a projection lens) has six mirrors M1 to M6 for imaging the photomask 120 onto the wafer 124. In this case, individual mirrors M1 to M6 of the projection system 104 may be arranged symmetrically in relation to an optical axis 126 of the projection system 104. It should be noted that the number of mirrors M1 to M6 of the EUV lithography apparatus 100A is not restricted to the number shown. A greater or lesser number of mirrors M1 to M6 may also be provided. Furthermore, the mirrors M1 to M6 are generally curved on their front side for beam shaping.
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[0093] The DUV lithography apparatus 100B has a DUV light source 106B. An ArF excimer laser, which emits radiation 108B in the DUV range at for example 193 nm, may be provided for example as the DUV light source 106B.
[0094] The beam-shaping and illumination system 102 shown in
[0095] The projection system 104 has a number of lens elements 128 and/or mirrors 130 for imaging the photomask 120 onto the wafer 124. In this case, individual lens elements 128 and/or mirrors 130 of the projection system 104 may be arranged symmetrically in relation to an optical axis 126 of the projection system 104. It should be noted that the number of lens elements 128 and mirrors 130 of the DUV lithography apparatus 100B is not restricted to the number shown. A greater or lesser number of lens elements 128 and/or mirrors 130 may also be provided. Furthermore, the mirrors 130 are generally curved on their front side for beam shaping.
[0096] An air gap between the last lens element 128 and the wafer 124 may be replaced by a liquid medium 132 having a refractive index>1. The liquid medium 132 may be for example high-purity water. Such a set-up is also referred to as immersion lithography and has an increased photolithographic resolution. The medium 132 may also be referred to as an immersion liquid.
[0097]
[0098] The optical system 200 may be a projection system 104 of an EUV lithography apparatus 100A, as explained above, or part of such a projection system 104. However, the optical system 200 may also be part of a beam-shaping and illumination system 102 as explained above. However, the optical system 200 may also be part of a DUV lithography apparatus 100B. In the following it is assumed however that the optical system 200 is part of an EUV lithography apparatus 100A and in particular part of a projection system 104 of an EUV lithography apparatus 100A.
[0099] The optical system 200 comprises an optical element 202. The optical element 202 may be a mirror. For example, the optical element 202 may be one of the mirrors M1 to M6. In the plan view according to
[0100] A coordinate system with an x direction or width direction x, a y direction or height direction y and a z direction or depth direction z is assigned to the optical element 202. The directions x, y, z are oriented perpendicularly to one another.
[0101] The optical element 202 comprises a front side 206 and a back side 208 facing away from the front side 206. The front side 206 and the back side 208 may be arranged parallel to one another. When viewed along the height direction y, the front side 206 and the back side 208 are placed spaced apart from one another. An optically effective surface 210 is provided on the front side 206. The optically effective surface 210 is suitable for reflecting EUV radiation 108A. The back side 208 has no reflective properties. The optically effective surface 210 is a mirror surface. As shown in
[0102] Any desired number of channels 212, 214, only two of which are provided with a designation in
[0103] As shown in
[0104] The plane of symmetry 218 runs centrally through the channels 212, 214 when viewed along the height direction y. The plane of symmetry 218 and thus the channels 212, 214 are arranged such that they are positioned spaced apart at a distance a1 from the optically effective surface 210 and at a distance a2 from the back side 208 when viewed along the height direction y. For the case where the plane of symmetry 218 or the channels 212, 214 are arranged centrally between the optically effective surface 210 and the back side 208, viewed along the height direction y, the distances a1, a2 are equal. The distances a1, a2 may however also be of different sizes. In this case, the plane of symmetry 218 and the channels 212, 214 are not arranged centrally in the optical element 202 when viewed along the height direction y.
[0105] The channels 212, 214 are arranged such that they are spaced apart from one another by a distance c when viewed along the width direction x. The distance c is defined as a distance between two points positioned centrally in the channels 212, 214 along the width direction x. The distance c may also be referred to as a pitch. The distance c is constant along the width direction x. That is to say that adjacent channels 212, 214 are always positioned spaced apart from one another by the distance c. The distance c may however also be varied along the width direction x. In this case, the channels 212, 214 are placed spaced apart unequally from one another when viewed along the width direction x.
[0106] The channel 212 has a height h212, viewed along the height direction y. Accordingly, the channel 214 has a height h214, viewed along the height direction y. The heights h212, h214 are identical. When viewed along the width direction x, the channel 212 has a width b212. Accordingly, the channel 214 has a width b214, viewed along the width direction x. The widths b212, b214 differ from one another. The width b212 is greater than the width b214.
[0107] The widths b212, b24 are greater than the heights h212, h214. That is to say that the width b212 is greater than the height h212, and the width b214 is greater than the height h214. An aspect ratio of the channel 212 is defined as the ratio of the height h212 to the width b212 (h212/b212). Accordingly, an aspect ratio of channel 214 is defined as the ratio of the height h214 to the width b214 (h214/b214). An aspect ratio of less than 1 applies to the respective channels 212, 214. This means that the channels 212, 214 each have a greater extent when viewed along the width direction x than when viewed along the height direction y.
[0108] The aspect ratio may however also be equal to 1. In this case, the channels 212, 214 are rectangular in cross section. Furthermore, the aspect ratio may also be greater than 1. In this case, the channels 212, 214 each have a smaller extent when viewed along the width direction x than when viewed along the height direction y. The channels 212, 214 are arranged horizontally in the substrate 204. “Horizontally” means that the channels 212, 214 have a greater extent along the width direction x than along the height direction y.
[0109] Each channel 212, 214 has a top 220, assigned to the optically effective surface 210, a bottom 222, assigned to the back side 208, and two side walls 224, 226. That the top 220 is “assigned” to the optically effective surface 210 means in the present case that the top 220 is arranged closer to the optically effective surface 210 than to the back side 208 when viewed in the height direction y. The same applies correspondingly to the bottom 222. The channels 212, 214 may be implemented by being introduced into a glass block, in particular into a glass-ceramic block, either by machining or by using an etching process. In order to close the channels 212, 214 in the height direction y, another glass block is placed on the aforementioned glass block and optically bonded to it.
[0110] The channels 212, 214 are filled with a fluid F. The fluid F may be a gas or a liquid. For example, the fluid F may be air. The fluid F may also be water, in particular high-purity water. In the following it is assumed that the fluid F is water. The use of water means that the fluid F is relatively incompressible. With the aid of the fluid F, the channels 212, 214 can be subjected to pressure p in such a way that the channels 212, 214 are brought from an undeformed state Z1, shown with dashed lines in
[0111] When the channels 212, 214 are brought from the undeformed state Z1 into the deformed state Z2, the substrate 204 is deformed elastically, in particular resiliently. This means that, as soon as the pressure p falls below a predetermined value, the substrate 204 is automatically deformed back, so that the channels 212, 214 are brought back from the deformed state Z2 into the undeformed state Z1.
[0112] All the channels 212, 214 are subjected to the same pressure p. For this purpose, the channels 212, 214 may be connected in series. The pressure p acts uniformly on the top 220, the bottom 222 and the side walls 224, 226. A pressure generating device 228 (
[0113] As
[0114] Due to the fact that the channels 212, 214 are deformed from the undeformed state Z1 into the deformed state Z2 when they are subjected to pressure, the optically effective surface 210 and the back side 208 are also deformed. In
[0115] By bringing the channels 212, 214 from the undeformed state Z1 into the deformed state Z2, it is possible to set different surface profiles P1, P2 of the optically effective surface 210. An initial surface profile P1 of the optically effective surface 210, which is obtained in the undeformed state Z1 of the channels 212, 214, may be for example a flat surface. A target surface profile P2 of the optically effective surface 210 that differs from the initial surface profile P1 may be any desired three-dimensionally curved surface.
[0116] A surface profile P1, P2 of the optically effective surface 210 is assigned to each state Z1, Z2 of the channels 212, 214. That is to say that the number of surface profiles P1, P2 corresponds to the number of states Z1, Z2. In general, the number of states Z1, Z2 and the number of surface profiles P1, P2 is not limited. In particular, a number of, for example two or three, target surface profiles P2 are provided.
[0117] In order to be able to influence the target surface profile P2, it is possible to vary the following parameters. The target surface profile P2 may be influenced by varying the geometries of the channels 212, 214, that is to say changing the widths b212, b214 and the heights h212, h214, the distance c, the distances a1, a2 and the aspect ratios of the channels 212, 214. For example, an increase in the respective width b212, b214 with the same pressure p leads to greater deformation of the optically effective surface 210.
[0118] It is desirable for some optical applications that the target surface profile P2 is smooth. This means that the channels 212, 214 should not be perceptible on the respective target surface profile P2, that is to say that they should not “press through” to the optically effective surface 210.
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[0121] With the above values, a value of 2.6% is obtained for the print through pt.
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[0125] As can be seen from
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[0127] In this embodiment of the optical element 202, it comprises first channels 212A, 214A, second channels 212B, 214B, third channels 212C, 214C and fourth channels 212D, 214D, each of which has a separate pressure supply. That is to say that the channels 212A, 214A have a common pressure supply. Accordingly, the channels 212B, 214B, 212C, 214C, 212D, 214D each have their own pressure supply. As a result, the channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D can be subjected to four different pressures p. It is also possible for only individual groups of the channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D to be subjected to pressure. For example, only the channels 212A, 214A are subjected to the pressure p and the channels 212B, 214B, 212C, 214C, 212D, 214D are not.
[0128] The channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D are divided into two planes 236, 238 placed spaced apart from one another in the height direction y. In this case, the channels 212A, 214A, 212B, 214B are placed in a first plane 236 and the channels 212C, 214C, 212D, 214D are placed in a second plane 238. The first plane 236 is placed closer to the optically effective surface 210 than the second plane 238 when viewed along the height direction y.
[0129] The channels 212A, 214A, 212B, 214B are arranged such that the channels 212A, 214A and the channels 212B, 214B are arranged alternately side by side. Correspondingly, the channels 212C, 214C and the channels 212D, 214D are also placed alternately. The distance c is 50 mm within a group of channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D. That is to say that the distance c between channels 212A, 214A, 212B, 214B, 212C, 214C, 212D that do not belong to a common group is 25 mm. This means for example that the distance c between the channels 212A, 214A is 50 mm and the distance c between the channels 212A, 212B is 25 mm.
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[0134] By providing a number of groups of channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D it is possible to achieve a number of degrees of freedom when deforming the optically effective surface 210. The deformations d according to
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[0139] When the channels 212, 214 are subjected to pressure, they apply forces to the substrate 204 which act substantially along the width direction x. The curvature of the optical element 202 can thus be influenced locally. Since the bending always takes place in one direction, as the channels 212, 214 are actuated, the curvature of the optical element 202 continues to increase. It is possible to compensate for this by for example moving the optical element 202.
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[0142] The channels 212A, 214A, which are positioned near the optically effective surface 210, induce a downward bending of the optical element 202. Conversely, the channels 212B, 214B, which are positioned near the back side 208, induce an upward bending of the optical element 202. By modifying the geometry of the channels 212A, 214A, 212B, 214B, the optically effective surface 210 can be modified under pressure.
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[0145] As shown in
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[0151] The channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D are each connected in parallel at their assigned inlet 248A, 248B, 248C, 248D. All the channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D lie in a common plane and engage in one another in a comb-like manner. The inlets 248A, 248B, 248C, 248D are arranged in a common plane, in particular in a supply plane, which differs from the plane in which the channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D are arranged. From the inlets 248A, 248B, 248C, 248D, lines 252A, 252B, 252C, 252D lead along the height direction y to the channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D.
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[0153] Each pair of channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D, 212E, 214E, 212F, 214F, 212G, 214G, 212H, 214H, 212I, 2141, 212J, 214J is assigned its own inlet 248A, 248B, 248C, 248D, 248E, 248F, 248G, 248H, 248I, 248J. All of the inlets 248A, 248B, 248C, 248D, 248E, 248F, 248G, 248H, 248I, 248J lie in a common plane which is arranged spaced apart from the plane in which the channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D, 212E, 214E, 212F, 214F, 212G, 214G, 212H, 214H, 212I, 2141, 212J, 214J are positioned. Each pair of channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D, 212E, 214E, 212F, 214F, 212G, 214G, 212H, 214H, 212I, 2141, 212J, 214J is assigned a line 252A, 252B, 252C, 252D, 252E, 252F, 252G, 252H, 252I, 252J, which runs along the height direction y and which connects the inlets 248A, 248B, 248C, 248D, 248E, 248F, 248G, 248H, 248I, 248J to the respective associated pair of channels 212A, 214A, 212B, 214B, 212C, 214C, 212D, 214D, 212E, 214E, 212F, 214F, 212G, 214G, 212H, 214H, 212I, 2141, 212J, 214J.
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[0155] Each channel 212A, 212B, 212C, 212D, 212E, 212F, 212G is assigned an inlet 248A, 248B, 248C, 248D, 248E, 248F, 248G. The inlets 248A, 248B, 248C, 248D, 248E, 248F, 248G are arranged in a common plane which differs from the plane in which the channels 212A, 212B, 212C, 212D, 212E, 212F, 212G are placed. The inlets 248A, 248B, 248C, 248D, 248E, 248F, 248G are connected to the channels 212A, 212B, 212C, 212D, 212E, 212F, 212G in fluid communication via lines 252A, 252B, 252C, 252D, 252E, 252F, 252G running along the height direction y.
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[0157] A recess 262 for a temperature sensor (not shown) is provided in the substrate 204. A sensor target 264 is also attached to the optical element 202. The sensor target 264 is used for referencing with the aid of a position sensor (not shown) to detect a position of the optical element 202. Further recesses, bores, material weakenings or the like may also be provided. This leads to an asymmetrical structure of the optical element 202 and to a locally changed stiffness of the optical element 202.
[0158] The optical element 202 comprises a local change in stiffness. This may be implemented for example by recesses or channels 266 provided in the substrate 204. The channels 266 are placed between the back side 208 of the optical element 202 and the channels 212, 214. The channels 266 may be irregular or regular. The channels 266 do not necessarily require a connection to an environment of the optical system 200.
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[0160] In the method, a first substrate block 268 and a second substrate block 270 separated from the first substrate block 268 are provided in a step S1. That is to say that the substrate blocks 268, 270 are two separate components. In a step S2, a multiplicity of channels 212, 214 are introduced into the first substrate block 268. This may be carried out for example by using a machining process or an etching process. Alternatively, the channels 212, 214 may also be introduced into the second substrate block 270.
[0161] In a step S3, the channels 212, 214 are closed with the aid of the second substrate block 270. For this purpose, the second substrate block 270 is placed on the first substrate block 268, as a result of which the channels 212, 214 are closed in the height direction y. In a step S4, the first substrate block 268 and the second substrate block 270 are connected to one another. This may take place by using an optical bonding process.
[0162] Although the present disclosure has been described with reference to exemplary embodiments, it is modifiable in various ways.
LIST OF DESIGNATIONS
[0163] 100A EUV lithography apparatus [0164] 100B DUV lithography apparatus [0165] 102 Beam-shaping and illumination system [0166] 104 Projection system [0167] 106A EUV light source [0168] 106B DUV light source [0169] 108A EUV radiation [0170] 108B DUV radiation [0171] 110 Mirror [0172] 112 Mirror [0173] 114 Mirror [0174] 116 Mirror [0175] 118 Mirror [0176] 120 Photomask [0177] 122 Mirror [0178] 124 Wafer [0179] 126 Optical axis [0180] 128 Lens element [0181] 130 Mirror [0182] 132 Medium [0183] 200 Optical system [0184] 202 Optical element [0185] 204 Substrate [0186] 206 Front side [0187] 208 Back side [0188] 208′ Back side [0189] 210 Optically effective surface [0190] 210′ Optically effective surface [0191] 212 Channel [0192] 212A Channel [0193] 212B Channel [0194] 212C Channel [0195] 212D Channel [0196] 212E Channel [0197] 212F Channel [0198] 212G Channel [0199] 212H Channel [0200] 212I Channel [0201] 212J Channel [0202] 212′ Channel [0203] 214 Channel [0204] 214A Channel [0205] 214B Channel [0206] 214C Channel [0207] 214D Channel [0208] 214E Channel [0209] 214F Channel [0210] 214G Channel [0211] 214H Channel [0212] 2141 Channel [0213] 214J Channel [0214] 214′ Channel [0215] 216 Plane of symmetry [0216] 218 Plane of symmetry [0217] 220 Top [0218] 222 Bottom [0219] 224 Side wall [0220] 226 Side wall [0221] 228 Pressure generating device [0222] 230A Peak [0223] 230B Trough [0224] 232 Trough [0225] 234 Peak [0226] 236 Plane [0227] 238 Plane [0228] 240 Curve [0229] 242 Cells [0230] 244 Cells [0231] 246 Connecting line [0232] 248 Inlet [0233] 248A Inlet [0234] 248B Inlet [0235] 248C Inlet [0236] 248D Inlet [0237] 248E Inlet [0238] 248F Inlet [0239] 248G Inlet [0240] 248H Inlet [0241] 248J Inlet [0242] 248I Inlet [0243] 250 Outlet [0244] 252A Line [0245] 252B Line [0246] 252C Line [0247] 252D Line [0248] 252E Line [0249] 252F Line [0250] 252G Line [0251] 252H Line [0252] 252I Line [0253] 252J Line [0254] 254 Line [0255] 256 Supporting frame [0256] 258 Actuator [0257] 260 Actuator [0258] 262 Recess [0259] 264 Sensor target [0260] 266 Channel [0261] 268 Substrate block [0262] 270 Substrate block [0263] a1 Distance [0264] a2 Distance [0265] b212 Width [0266] b214 Width [0267] c Distance [0268] d Deformation [0269] e Deformation amplitude [0270] F Fluid [0271] h212 Height [0272] h214 Height [0273] l Length [0274] md Mean deformation [0275] M1 Mirror [0276] M2 Mirror [0277] M3 Mirror [0278] M4 Mirror [0279] M5 Mirror [0280] M6 Mirror [0281] p Pressure [0282] pt Print through [0283] PV Distance [0284] P1 Initial surface profile [0285] P2 Target surface profile [0286] P2′ Desired surface profile [0287] S1 Step [0288] S2 Step [0289] S3 Step [0290] S4 Step [0291] x Width direction [0292] y Height direction [0293] z depth direction [0294] Z1 State [0295] Z2 State