HEAT DISSIPATION MODULE

Abstract

A heat dissipation module is provided. The heat dissipation module includes a heat dissipating sheet and a heat conduction member. The heat dissipating sheet has a first surface and a second surface. The heat conduction member is disposed on the first surface of the heat dissipating sheet, and the second surface of the heat dissipating sheet is configured to be arranged adjacent to a periphery of a heating source. At least a part of a surface of the heat conduction member that is adjacent to the first surface has an uneven surface.

Claims

1. A heat dissipation module, comprising: a heat dissipating sheet having a first surface and a second surface; and a heat conduction member disposed on the first surface of the heat dissipating sheet; wherein the second surface of the heat dissipating sheet is configured to be arranged adjacent to a periphery of a heat generating source; wherein at least a part of one surface of the heat conduction member that is adjacent to the first surface has an uneven surface.

2. The heat dissipation module according to claim 1, wherein the heat dissipating sheet has a first state and a second state.

3. The heat dissipation module according to claim 1, wherein the uneven surface has at least one projection.

4. The heat dissipation module according to claim 3, wherein an upper surface of the uneven surface is circular, square, triangle, or polygonal.

5. The heat dissipation module according to claim 3, wherein a width of the projection is 0.3 mm to 1.5 mm.

6. The heat dissipation module according to claim 3, wherein a height of the projection is 0.02 mm to 0.12 mm.

7. The heat dissipation module according to claim 3, wherein a width of the projection is 0.3 mm to 1.5 mm, and a height of the projection is 0.02 mm to 0.12 mm.

8. The heat dissipation module according to claim 3, wherein a number of the projection is multiple, and the multiple projections are arranged in at least one row on the one surface of the heat conduction member that is adjacent to the first surface.

9. The heat dissipation module according to claim 3, wherein a number of the projection is multiple, and the multiple projections are arranged in a rectangular array or a circular array on the one surface of the heat conduction member that is adjacent to the first surface.

10. The heat dissipation module according to claim 1, wherein the uneven surface has at least one recess.

11. The heat dissipation module according to claim 10, wherein a bottom surface of the recess is circular, square, triangle, or polygonal.

12. The heat dissipation module according to claim 10, wherein a width of the recess is 0.3 mm to 1.5 mm.

13. The heat dissipation module according to claim 10, wherein a height of the recess is 0.02 mm to 0.12 mm.

14. The heat dissipation module according to claim 10, wherein a width of the recess is 0.3 mm to 1.5 mm, and a height of the recess is 0.02 mm to 0.12 mm.

15. The heat dissipation module according to claim 10, wherein a number of the recess is multiple, and the multiple recesses are arranged in at least one row on the one surface of the heat conduction member that is adjacent to the first surface.

16. The heat dissipation module according to claim 10, wherein a number of the recess is multiple, and the multiple recesses are arranged in a rectangular array or a circular array on the one surface of the heat conduction member that is adjacent to the first surface.

17. The heat dissipation module according to claim 1, further comprising: a heat dissipating assembly disposed on another surface other than the one surface of the heat conduction member that is adjacent to the first surface.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The described embodiments may be better understood by reference to the following description and the accompanying drawings, in which:

[0022] FIG. 1 is a schematic side view of a heat dissipation module according to a first embodiment of the present disclosure;

[0023] FIG. 2 is a schematic view of an uneven surface of a heat conduction member according to the first embodiment of the present disclosure;

[0024] FIG. 3 is a schematic enlarged view of part III of FIG. 2;

[0025] FIG. 4 is schematic view of an uneven surface of a heat conduction member according to a second embodiment of the present disclosure;

[0026] FIG. 5 is a schematic enlarged view of part V of FIG. 4; and

[0027] FIG. 6 is a schematic side view of a heat dissipation module according to a third embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

[0028] The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a,” “an” and “the” includes plural reference, and the meaning of “in” includes “in” and “on.” Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.

[0029] The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first,” “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.

First Embodiment

[0030] Referring to FIG. 1, a first embodiment of the present disclosure provides a heat dissipation module, which includes a heat dissipating sheet 1 and a heat conduction member 2. The heat dissipating sheet 1 has a first surface 11 and a second surface 12. The heat conduction member 2 is disposed on the first surface 11 of the heat dissipating sheet 1, and the second surface 12 of the heat dissipating sheet 1 is configured to be arranged adjacent to a periphery of a heat generating source 3.

[0031] The heat dissipating sheet 1 can include a heat dissipating material with a high thermal dissipation coefficient, and has a first state and a second state. For example, the first state can be a solid state and the second state can be a liquid state, but the present disclosure is not limited thereto. Specifically, when the heat dissipating sheet 1 absorbs heat energy generated during an operation of the heat generating source 3, the heat dissipating sheet 1 can transform form the first state to the second state (e.g., from the solid state to the liquid state). In one particular embodiment, the heat dissipating sheet 1 can be formed of liquid metal. In addition, a size and a shape of the heat dissipating sheet 1 can be adjusted according to practical applications or a size as well as a shape of the heat generating source 3, but the present disclosure is not limited thereto.

[0032] A material of the heat conduction member 2 can be metal or non-metal with highly thermal conductivity. In one particular embodiment, the material of the heat conduction member 2 is metal with highly thermal conductivity, such as, but not limited to, copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, and silver alloy. In addition, a size and a shape of the heat conduction member 2 can be adjusted according to practical applications or a size as well as a shape of the heat dissipating sheet 1, but the present disclosure is not limited thereto.

[0033] Further, at least a part of a surface the heat conduction member 2 that is adjacent to the heat dissipating sheet 1 has an uneven surface 21. The uneven surface 21 can be arranged on the surface of the heat conduction member 2 that is adjacent to and corresponds to the heat dissipating sheet 1, and a shape and a size of the uneven surface 21 can be adjusted according the practical applications. In the present embodiment, as shown in FIG. 2 and FIG. 3, the uneven surface 21 can have at least one projection 211a. The projection 211a can protrude from the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1. Alternatively, the projection 211a can be formed by forming a depression in a direction away from the heat dissipating sheet 1 to surround the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1. In addition, a shape of the projection 211a can be, for example, but not limited to, circular, square, triangular, polygonal, etc., when viewed from above the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1. It should be noted that a height of the projection 211a can be adjusted according to the practical applications, but the present disclosure is not limited thereto. In one particular embodiment, the shape of the projection 211a is square and the projection 211a has a width. Preferably, the width of the projection 211a is 0.3 mm to 1.5 mm. In addition, the height of the projection 211a is preferably 0.02 mm to 0.12 mm.

[0034] Further, the projections 211a can be arranged on the uneven surface 21 with a predetermined pattern. For example, the predetermined pattern can be a rectangular array or a circular array, but the present disclosure is not limited thereto. In one particular embodiment, as shown in FIG. 2 and FIG. 3, a number of the projections 211a can be multiple, and the multiple projections 211a can be arranged in at least one row on the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1, with each row of the projections 211a being provided in an equally spaced manner. In addition, when the multiple projections 211a are arranged in multiple rows on the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1, each row can be arranged in parallel with each other in the equally spaced manner, resulting in a rectangular array arrangement.

[0035] The heat generating source 3 can be a central processing unit (CPU), a graphics processing unit (GPU), a microcontroller (MCU), a microprocessor (MPU), or an application specific integrated circuit (ASIC), but the present disclosure is not limited thereto. It is worth mentioning that the heat generating source 3 can have multiple cores for operation. That is, a heating location of the heat generating source 3 can be not limited to a certain part of the heat generating source 3 or the overall heat generating source 3, and a high temperature can be correspondingly generated at several specific locations of the heat generating source 3.

[0036] However, the aforementioned details are disclosed for exemplary purposes only, and are not meant to limit the scope of the present disclosure.

Second Embodiment

[0037] Referring to FIG. 4 and FIG. 5, FIG. 4 is a schematic view of an uneven surface according to a second embodiment of the present disclosure. The main difference between the second embodiment and the first embodiment is that the uneven surface 21 of the second embodiment has at least one recess. In addition, it should be noted that other configurations of the second embodiment are similar to those of the first embodiment, and will not be reiterated herein.

[0038] Specifically, in the present embodiment, as shown in FIG. 4 and FIG. 5, the uneven surface 21 can have at least one recess 211b. The surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1 can be recessed to form the recess 211b. Alternatively, the recess 211b can be formed by forming a protrusion in a direction away toward the heat dissipating sheet 1 to surround the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1. In addition, a shape of the recess 211b can be, for example, but not limited to, circular, square, triangular, polygonal, etc., when viewed from above the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1. It should be noted that a depth of the recess 211b can be adjusted according to the practical applications, but the present disclosure is not limited thereto. In one particular embodiment, the shape of the recess 211b is square and the recess 211b has a width. Preferably, the width of the recess 211b is 0.3 mm to 1.5 mm. In addition, the depth of the recess 211b is preferably 0.02 mm to 0.12 mm.

[0039] Further, the recesses 211b can be arranged on the uneven surface 21 with a predetermined pattern. For example, the predetermined pattern can be a rectangular array or a circular array, but the present disclosure is not limited thereto. In one particular embodiment, as shown in FIG. 4 and FIG. 5, a number of the recesses 211b can be multiple, and the multiple recesses 211b can be arranged in at least one row on the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1, with each row of the recesses 211b being provided in an equally spaced manner. In addition, when the multiple recesses 211b are arranged in multiple rows on the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1, each row can be arranged in parallel with each other in the equally spaced manner, resulting in a rectangular array arrangement.

[0040] However, the aforementioned details are disclosed for exemplary purposes only, and are not meant to limit the scope of the present disclosure.

Third Embodiment

[0041] Referring to FIG. 6, FIG. 6 is a schematic side view of a heat dissipation module according to a third embodiment of the present disclosure. The main difference between the third embodiment and the first embodiment is that the heat dissipation module of the third embodiment also includes a heat dissipating assembly. In addition, it should be noted that other configurations of the third embodiment are similar to those of the first embodiment and the second embodiment, and will not be reiterated herein.

[0042] As shown in FIG. 6, the heat dissipation module also includes a heat dissipating assembly 4. The heat dissipating assembly 4 can be disposed on other surfaces of the heat conduction member 2 than the surface of the heat conduction member 2 that is adjacent to the heat dissipating sheet 1. In one particular embodiment, the heat dissipating assembly 4 is disposed on another surface of the heat dissipation member 2 that is away form the heat dissipating sheet 1, that is, the heat dissipating assembly 4 and the heat dissipating sheet 1 are respectively disposed on opposite surfaces of the heat dissipation member 2.

[0043] Further, the heat energy generated by the heat generating source 3 can be transferred through the heat dissipating assembly 4. The heat dissipating assembly 4 can be a heat dissipation fin, a heat sink, or a water cooling module, as long as the heat dissipation effect can be achieved in the heat dissipation module, but the present disclosure is not limited thereto.

[0044] [Beneficial Effects of the Embodiments]

[0045] In conclusion, in the heat dissipation module provided by the present disclosure, by virtue of “the heat dissipating sheet having the first surface and the second surface, the heat conduction member being disposed on the first surface of the heat dissipating sheet, and the second surface of the heat dissipating sheet being configured to be arranged adjacent to the periphery of the heat generating source” and “at least a part of the surface of the heat conduction member that is adjacent to the first surface having the uneven surface,” a problem of underclocking of high-power chips during operation can be avoided and a stability of heat dissipation during repetitive testing can be improved. Furthermore, the heat dissipation module provided by the present disclosure can also reduce a breakage of metal heat sink due to uneven heating position of the heat generating sources and rapid temperature change.

[0046] The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.

[0047] The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.