METHOD, DEVICE AND COMPUTER PROGRAM FOR PRODUCING A WEAKENING LINE IN A SURFACE OF A COMPONENT

Abstract

A method for producing a weakening line in a surface of a component. The method comprises a guiding step and a skipping step. In the guiding step, a removal apparatus for removing a material of the surface is guided over a plurality of segments of a predefined line-shaped contour by means of an activated laser beam in order to produce a desired wall thickness for at least one of the segments so as to produce the weakening line. In the skipping step, the segment is skipped if the segment has the desired wall thickness.

Claims

1-12. (canceled)

13. A method for producing a weakening line in a surface of a component, the method comprising: guiding a removal apparatus for removing a material of the surface over a plurality of portions of a predefined line-shaped contour using an activated laser beam in order to produce a target wall thickness for at least one of the portions in order to produce the weakening line; skipping the portion if the portion has the target wall thickness; and generating, in which a lead-in section is generated fora downstream portion of the contour that follows the portion, wherein in the step of skipping, the removal apparatus jumps to the lead-in section in order to move over the lead-in section, and/or in which a lead-out section is generated for an upstream portion of the contour that is arranged upstream of the portion, and wherein the removal apparatus is moved over the lead-out section before the step of skipping.

14. The method as claimed in claim 13, wherein in the step of skipping, an output of the laser beam is deactivated.

15. The method as claimed in claim 13, wherein in the step of generating, the lead-in section is generated which is directly connected to the downstream portion and/or the lead-out section is generated which is directly connected to the upstream portion.

16. The method as claimed in claim 13, wherein in the step of generating, the lead-in section is generated, the lead-in length of which is shorter than a length of the downstream portion, and/or the lead-out section is generated, the lead-out length of which is shorter than a length of the upstream portion.

17. The method as claimed in claim 13, wherein in the step of skipping, the removal apparatus is moved on a direct path from an upstream portion of the contour that is arranged upstream of the portion to a downstream portion of the contour that follows the portion.

18. The method as claimed in claim 13, wherein in the step of skipping, a speed of movement of the removal apparatus is higher than in the step of guiding.

19. The method as claimed in claim 13, further comprising a step of further skipping, in which a further portion of the contour is skipped if the further portion has the or a further target wall thickness.

20. The method as claimed in claim 13, wherein the steps of the method are repeated until all portions of the contour each have a dedicated target wall thickness.

21. A device comprising: a user interface; an evaluation apparatus; a circulation activation apparatus; a calculation apparatus; a checking apparatus; and/or a transmitting apparatus, which are configured to carry out and/or to control the steps of the method as claimed in claim 13.

22. A computer program product comprising program code configured to carry out the method as claimed in claim 13.

23. A machine-readable storage medium on which the computer program product as claimed in claim 22 is stored.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The approach is explained in greater detail by way of example below with reference to the accompanying drawings, in which:

[0021] FIG. 1 shows a schematic illustration of a contour for a weakening line;

[0022] FIG. 2 shows a comparison of schematically illustrated contours 100 for processing by means of a device in accordance with one exemplary embodiment for producing a weakening line in a surface of a component;

[0023] FIG. 3 shows a schematic illustration of a device in accordance with one exemplary embodiment for producing a weakening line in a surface of a component;

[0024] FIG. 4 shows a schematic illustration of a device in accordance with one exemplary embodiment for producing a weakening line in a surface of a component; and

[0025] FIG. 5 shows a flow diagram of a method in accordance with one exemplary embodiment for producing a weakening line in a surface of a component.

DETAILED DESCRIPTION

[0026] In the following description of expedient exemplary embodiments of the present approach, identical or similar reference signs are used for the elements having a similar effect that are illustrated in the various figures, a repeated description of these elements being dispensed with.

[0027] FIG. 1 shows a schematic illustration of a contour 100 for a weakening line.

[0028] FIG. 1 describes a conventional processing process for producing the weakening line using a laser beam along the contour 100. The contour 100 is subdivided into three segments ID0, ID1, ID2 here by way of example. A controlled movement of the laser beam is usually effected by way of a galvanometer scanner. The segments ID0, ID1, ID2 indicating the weakening lines to be produced are represented by continuously drawn contours/lines in FIG. 1. The dashed contours/lines J show a respective jump of the laser beam to a next removal point. During the jumps J, the laser beam is switched off here by way of example.

[0029] In the example shown here, the processing by means of the laser beam starts at point S of the segment ID0 and is guided via the point U as far as the point T of the segment ID0. At the point T, a jump J to the point U takes place. The laser beam is then guided over the segment ID1 to the point V. At the point V, a jump J to the point W of the segment ID2 takes place. The laser beam is then guided from the point W via the point V as far as the point X of the segment ID2. At the point X, a jump J to the point S of the segment ID0 takes place. At point S, the sequence just described is repeated until all segments ID0, ID1, ID2 have a target wall thickness respectively provided for them.

[0030] In the example described here, the segment ID0 attains its target wall thickness after 11 processing cycles, the segment ID1 attains its target wall thickness after 16 cycles, and the segment ID2 attains its target wall thickness after 14 cycles. In the example described here, the maximum number of cycles is 16. That means that the laser beam will go over the complete contour 100 16 times, irrespective of whether or not a segment ID0, ID1, ID2 is already assessed as “OK”, i.e. having the desired target wall thickness, on account of the settings. According to the prior art, there is merely the possibility of switching off the laser at individual removal points if the previously defined value of the remaining wall thickness has already been attained at this point.

[0031] The jump J between ID0 and ID1, and between ID1 and ID2, would usually precede in a straight line along the processing line. This is shown as a curve in FIG. 1 merely for the sake of better illustration.

[0032] In the example described here, long cycle times ensue as a result of the scanning movement being continuously repeated and the laser being frequently switched on and off.

[0033] FIG. 2 shows a comparison of schematically illustrated contours 100 for processing by means of a device in accordance with one exemplary embodiment for producing a weakening line in a surface of a component. The device is shown in FIGS. 3 and 4.

[0034] At least one of the contours 100 is applicable in accordance with one exemplary embodiment for producing the weakening line in the surface of a covering element of an airbag cover of a vehicle airbag, and is marked there for example. The contour 100 in section a) of the figure has in accordance with this exemplary embodiment, merely by way of example, seven successive portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 provided for the same or arbitrary different target wall thicknesses.

[0035] The device for producing the weakening line in the surface is designed to guide a removal apparatus for removing a material of the surface over the plurality of portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 of the predefined line-shaped contour 100 using an activated laser beam in order to produce a target wall thickness for at least one of the portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7, in order to produce the weakening line. The device is furthermore designed to skip the portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 if the portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 has the target wall thickness.

[0036] The portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 are shaped arbitrarily differently in accordance with this exemplary embodiment; by way of example, the second portion M.sub.2 is shaped in straight fashion and/or the fourth portion M.sub.4 is shaped in V-shaped fashion and/or the sixth portion M.sub.6 is shaped as a curved line. In accordance with one exemplary embodiment, the portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 are arranged in a manner merging directly into one another at least in part in order to produce a continuous weakening line, or are arranged in a manner separated from one another at least in part in order to produce a weakening line that is interrupted/perforated with arbitrary distances among the portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7. In this case, the distances are the same or different from one another. In accordance with this exemplary embodiment, each of the portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 has a target wall thickness, and these are each the same or different from one another. In accordance with this exemplary embodiment, the portions M.sub.1, M.sub.3, M.sub.5, M.sub.7 already have their desired target wall thicknesses, for which reason the device skips these portions M.sub.1, M.sub.3, M.sub.5, M.sub.7 in order to shorten the processing process for producing the weakening line. During skipping, the portions M.sub.1, M.sub.3, M.sub.5, M.sub.7 are each omitted, that is to say that the removal apparatus is not guided over the portions M.sub.1, M.sub.3, M.sub.5, M.sub.7. During skipping, the removal apparatus, in each case with omission of the skipped portion M.sub.1, M.sub.3, M.sub.5, M.sub.7, is guided to a downstream portion that follows the skipped portion M.sub.1, M.sub.3, M.sub.5, M.sub.7. In this case, the contour 100 is actively changed, here shortened. The skipped portions M.sub.1, M.sub.3, M.sub.5, M.sub.7 are not illustrated in FIG. 2; the dashed arrows denote jumps J during the skipping of the portions M.sub.1, M.sub.3, M.sub.5, M.sub.7.

[0037] In accordance with this exemplary embodiment, the device is furthermore designed to deactivate an output of the laser beam during skipping.

[0038] In accordance with this exemplary embodiment, the device is designed to move the removal apparatus during skipping on a direct path from an upstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 of the contour 100 that is arranged upstream of the portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 to a downstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 of the contour 100 that follows the portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7. In accordance with this exemplary embodiment, the device is furthermore designed, during skipping, to increase a speed of movement of the removal apparatus by comparison with a speed of movement during guiding over the portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 during processing. In accordance with this exemplary embodiment, the device is designed to skip all portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 of the contour 100 as soon as they each have their target wall thickness.

[0039] In accordance with this exemplary embodiment, the device is designed to repeat the guiding of the removal apparatus for the purpose of removing the material of the surface over the plurality of portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 of the contour 100 using the activated laser beam and also the skipping of the portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 having the attained target wall thickness until all portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 of the contour 100 each have a dedicated target wall thickness. In accordance with one exemplary embodiment, the device in this case makes possible repeated guiding over the same portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 at the earliest after a defined period of time after processing.

[0040] Section b) of the figure describes the generation of a lead-in section VLS and/or lead-out section NLS. Upon a jump J of the switched-off laser beam to the next processing portion M.sub.2, M.sub.4, M.sub.6, it is necessary to synchronize the mechanical movement with the point in time of “laser switch-on”. The laser beam is intended to impinge on each removal point at the same position with the same focus during each repeated scanning movement. Only that ensures that the material in each hole is removed continuously to the defined value. The skipping of completed portions requires flexible synchronization between laser operation and beam position. Time for the synchronization can be created by the lead-in section VLS and/or lead-out section NLS. In accordance with one exemplary embodiment, the device comprises for this purpose a generating apparatus designed to generate the lead-in section VLS for a downstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 of the contour 100 that follows the portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7, wherein the device is designed to move the removal apparatus during skipping to the lead-in section VLS in order to move the removal apparatus over the lead-in section VLS and/or wherein the generating apparatus is designed to generate the lead-out section NLS for an upstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 of the contour 100 that is arranged upstream of the portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7, wherein the device is designed to move the removal apparatus over the lead-out section NLS before skipping.

[0041] In accordance with this exemplary embodiment, the lead-in section VLS is generated in each case as a section between the portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 and the downstream portions M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 with respect thereto. In accordance with this exemplary embodiment, the device is designed to move the removal apparatus during skipping to a start of the lead-in section VLS facing the skipped portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7, in order then to move over the lead-in section VLS to an end of the lead-in section VLS facing the downstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7. Correspondingly, in accordance with this exemplary embodiment, the generating apparatus is designed to generate the lead-out section NLS between the upstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 and the skipped portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7. In accordance with this exemplary embodiment, the device is designed to move the removal apparatus before skipping over a start of the lead-out section NLS facing the upstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 as far as an end of the lead-out section NLS facing the portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7. During movement of the removal apparatus over the lead-in section VLS and/or over the lead-out section NLS, the device in accordance with this exemplary embodiment deactivates an output of the laser beam. In accordance with this exemplary embodiment, the generating apparatus is designed to generate the lead-in section VLS which is directly connected to the downstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 and/or to generate the lead-out section NLS which is directly connected to the upstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7. By way of example, in accordance with one exemplary embodiment, the generating apparatus generates the lead-in section VLS which is connected to the downstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 directly as an extension thereof and/or the lead-out section NLS which is connected to the upstream portion M.sub.1, M.sub.2, M.sub.3, M.sub.4, M.sub.5, M.sub.6, M.sub.7 directly as an extension thereof. In this regard, the lead-in section VLS and/or lead-out section NLS for a portion running straight, here the portions M.sub.1, M.sub.4, are/is likewise generated as running straight in accordance with one exemplary embodiment. Correspondingly, the lead-in section VLS and/or lead-out section NLS for a curved portion, here the portion M.sub.6, are/is likewise generated as correspondingly curved in accordance with one exemplary embodiment.

[0042] In accordance with one exemplary embodiment, the generating apparatus is furthermore designed to generate the lead-in section VLS, the lead-in length of which is shorter than a length of the downstream portion, and/or to generate the lead-out section NLS, the lead-out length of which is shorter than a length of the upstream portion.

[0043] Section c) of the figure corresponds visually to section a) of the figure, but section c) of the figure has an eighth portion M.sub.8 in accordance with this exemplary embodiment. The portion M.sub.4 shaped in V-shaped fashion in section a) of the figure is subdivided into two interconnected portions M.sub.4, M.sub.8, each of which is straight and which jointly produce the V-shape. In accordance with this exemplary embodiment, the eighth portion M.sub.8 is arranged between the fourth portion M.sub.4 and the fifth portion M.sub.5.

[0044] Section d) of the figure, in line with the description in section b) of the figure, illustrates the generation of a lead-out section NLS for the now straight fourth portion M.sub.4 and the generation of a lead-in section VLS for the eighth portion M.sub.8. In the case of the two directly interconnected portions M.sub.4, M.sub.8, in accordance with this exemplary embodiment, the removal apparatus, after moving over an end of the lead-out section NLS of the preceding portion M.sub.4, jumps to a start of the lead-in section VLS of the downstream portion M.sub.8 that follows the portion M.sub.4.

[0045] Sections b) and d) of the figure involve producing the lead-in sections VLS and lead-out sections NLS for the portions M.sub.2, M.sub.4, M.sub.6, M.sub.8 to be processed, which serve for accelerating and respectively decelerating the movement of the laser beam. By virtue of these lead-in sections VLS and lead-out sections NLS with the laser switched off, time is gained for synchronizing the laser operation and the beam position. It is thus possible to ensure that the laser impinges on the first removal point at exactly the same location, regardless of the direction from which the arriving beam “jumped”.

[0046] Furthermore, in accordance with one exemplary embodiment, the time period/time window of the lead-in section VLS is used to make a preliminary evaluation of the process already in a microcontroller and to decide whether or not subsequent portions ought to be directly skipped. For this purpose, in accordance with one exemplary embodiment, the result from the preceding scanning movement is retrieved and processed, and the further movement sequence is controlled.

[0047] At the end of the process, the number of remaining portions M.sub.2, M.sub.4, M.sub.6, M.sub.8 to be processed is smaller and a time between the repetitions of the scanning movements becomes shorter. This can lead to increased unwanted action of heat on the material. In order to avoid this, in accordance with one exemplary embodiment, a time delay is realized for the next scanning movement.

[0048] The device presented here advantageously makes possible a method for introducing a weakening line into a covering element by material removal by means of a laser. For the reliable deployment of an airbag, it is important for covering elements in the region of the airbag flaps to be provided with target breaking locations; the latter are realized by the introduction of weakening lines. For visual reasons, said weakening lines are generally introduced from a non-visible rear side of the covering element. Besides an accurately settable remaining tear strength of the weakening line, the highest quality demands in respect of the surfaces are satisfied only if the weakening line is visually and haptically imperceptible on the viewing side of the covering element facing the passenger.

[0049] Covering elements are understood here in the broadest sense to mean interior elements in vehicles, in particular instrument panels. These covering elements are of single-layer or multilayer design in accordance with various exemplary embodiments. As materials, in accordance with one exemplary embodiment, the covering element comprises plastics such as polypropylene (PP), thermoplastic polyolefin (TPO), polyurethane (PU) and/or polyvinyl chloride. For the viewing side of the covering element facing the passenger, high-quality decorative layers, e.g. composed of textile material or leather, are processed in accordance with one exemplary embodiment.

[0050] FIG. 3 shows a schematic illustration of a device 300 in accordance with one exemplary embodiment for producing a weakening line in a surface of a component. This can involve the device 300 described in FIG. 2.

[0051] In accordance with this exemplary embodiment, the device 300 is implemented in a controller 305 of the removal apparatus 310. In accordance with this exemplary embodiment, the controller 305 furthermore comprises a laser control 315 and a scanner control 320, wherein the device 300 in accordance with this exemplary embodiment is connected to the scanner control 320 and the laser control 315 in a manner capable of signal transmission.

[0052] In accordance with this exemplary embodiment, the contour 100, which may also be referred to as “figure”, is designed on a PC 325 and received by the controller 305. A workpiece 330, here in the form of the surface of the covering element, is processed depending on the laser control 315 and scanner control 320. A sensor system 335 senses values such as the wall thicknesses of the covering element at the individual portions of the contour 100. The laser control 315 is regulated depending on the sensor values 340 of the sensor system 335. Courtesy of the device 300 presented here, the scanner control 320 is also regulated depending on the sensor values 340 of the sensor system 335.

[0053] In one application example, using the removal apparatus 310, a pulsed laser beam is directed onto the rear side of the covering element and guided in the shape of a line. In this case, the parameters of the laser pulse are chosen such that the latter brings about an energy input which, at the respective impingement location, leads to heating of the material to a temperature above an ablation threshold, but the temperature in regions of the material that adjoin the respective impingement location is kept below a limit temperature. This scanning movement along the weakening line to be produced is repeated multiple times until a defined residual wall thickness is attained on the viewing side. The residual wall thickness attained is monitored by means of the sensor system 335, which has a spatial resolution corresponding to the size of the impingement locations. Upon the defined residual wall thickness/target wall thickness being attained at an individual impingement location, the device 300 is used to skip this portion with the laser beam being switched off. The scanning movements are repeated (N cycles) until all impingement points have attained a defined residual wall thickness. In this case, in accordance with this exemplary embodiment, the weakening line is formed by a continuous groove or a juxtaposition of grooves or holes for example in the form of blind holes or microperforation holes, or combinations thereof. In accordance with one exemplary embodiment, a removal depth is constant or varies over the length of the weakening line in a manner following a specific regime.

[0054] In accordance with this exemplary embodiment, five repeated processing cycles 345 of the contour 100 are carried out for producing the weakening line. In the first three processing cycles 345, the laser control/scanner control is implemented in a manner completely matching the contour 100. In the fourth and fifth processing cycles 345, the laser control/scanner control is implemented in a manner matching the contour 100 to a decreasing extent; consequently, in the fourth and fifth processing cycles 345, an active change 350 of the contour 100 is effected in each case since, in accordance with one exemplary embodiment, portions that have already been completed are skipped.

[0055] In the approach presented here, the figure/contour 100 consists of individual partial figures in the form of portions which are skipped by the laser beam after weakening has occurred. Each portion is characterized by a defined residual wall thickness that is attained by means of a specific weakening regime. In accordance with one exemplary embodiment, these weakening regimes are defined and supported by parameters. Possible parameters of this type are, in accordance with one exemplary embodiment: [0056] type of laser radiation [0057] laser power [0058] pulse width [0059] focusing [0060] geometry of the weakening line [0061] size and spacings of grooves and holes [0062] number of cycles of the scanning movement [0063] speed of the scanning movement

[0064] Courtesy of the device 300, individual portions of the figure are skipped after they have been completed, i.e. when all scanning points/holes have attained the defined residual wall thickness and have been assessed as “OK”. In the subsequent repeated scanning movement, the switched-off laser beam skips these portions at maximum speed in accordance with one exemplary embodiment. The cycle time for the production of the entire weakening line is reduced as a result.

[0065] FIG. 4 shows a schematic illustration of a device 300 in accordance with one exemplary embodiment for producing a weakening line in a surface of a component. This can involve the device 300 described in FIG. 2 or 3. As described in FIG. 3, the device 300 in accordance with this exemplary embodiment is implemented in the controller 305, here in the form of a technological processor. The laser control 315 and scanner control 320 may also be referred to as a “communication processor”, which is designed for communication with the device 300, the laser 400 for generating the laser beam 407, the scanner 405 and a user interface/operator control software 410. In accordance with this exemplary embodiment, the user interface/operator control software 410 comprises a prescription/predefinitions 415 with the target wall thicknesses in the form of target values 420 for a required weakening for each portion M.sub.1, M.sub.2, M.sub.3 of the contour 100, which comprises three portions M.sub.1, M.sub.2, M.sub.3 in accordance with this exemplary embodiment. In accordance with this exemplary embodiment, the target value 420 for the required weakening of the first portion M.sub.1 is 95%, the target value 420 for the required weakening of the second portion M.sub.2 is 90%, and the target value 420 for the required weakening of the third portion M.sub.3 is 98%. Furthermore, in accordance with this exemplary embodiment, the prescription/predefinitions 415 comprises further predefinitions 425 such as hole type, dimensions, energy input, speeds for each of the portions M.sub.1, M.sub.2, M.sub.3. In accordance with this exemplary embodiment, the user interface/operator control software 410 furthermore comprises an evaluation apparatus/control system 430 designed to compare the target values 420 with actual values and/or to evaluate all further evaluation parameters. On account of the predefinitions 415 being successfully satisfied, individual portions M.sub.1, M.sub.2, M.sub.3 are skipped with a jump speed which is faster than a marking speed during the processing of a portion M.sub.1, M.sub.2, M.sub.3 that is not yet finished. In accordance with this exemplary embodiment, the portions M.sub.1, M.sub.2 satisfy their predefinitions 415 and the third portion M.sub.3 does not satisfy its predefinitions. Therefore, in accordance with this exemplary embodiment, the finished portions M.sub.1, M.sub.2 are skipped and the third portion M.sub.3 is processed.

[0066] In accordance with this exemplary embodiment, the device 300 comprises a circulation activation apparatus 435, a calculation apparatus 440, a checking apparatus 445 and/or a transmitting apparatus 450. In accordance with one exemplary embodiment, the circulation activation apparatus 435 activates a circulation n of the removal apparatus 310 along the contour 100. The calculation apparatus 440 calculates contour production/figure production of the contour 100 for the current circulation. In accordance with this exemplary embodiment, the checking apparatus 445 checks the predefinitions 415 with actual values from sensor evaluation electronics 455 of the sensor system 335. For this purpose, the sensor evaluation electronics 455 provide sensed sensor values from a sensor array 460. If as yet not all portions M.sub.1, M.sub.2, M.sub.3 satisfy their predefinitions, i.e. they do not yet have their target wall thicknesses, the checking apparatus 445 outputs an activation signal 465 to the circulation activation apparatus 435 for activating a further circulation, wherein finished portions M.sub.1, M.sub.2 are skipped during the further circulation. If all portions M.sub.1, M.sub.2, M.sub.3 satisfy their predefinitions, i.e. have their target wall thicknesses, the checking apparatus 445 outputs a transmission signal 470 to the transmitting apparatus 450 for transmitting a result to the user interface/operator control software 410.

[0067] In accordance with one exemplary embodiment, the user interface/operator control software 410 is part of the device 300.

[0068] FIG. 5 shows a flow diagram of a method 500 in accordance with one exemplary embodiment for producing a weakening line in a surface of a component. This can involve a method 500 which is controllable and/or implementable by the device described in either of FIGS. 2 and 3.

[0069] The method 500 comprises a step 505 of guiding and a step 510 of skipping. In the step 505 of guiding, a removal apparatus for removing a material of the surface is guided over a plurality of portions of a predefined line-shaped contour using an activated laser beam in order to produce a target wall thickness for at least one of the portions, in order to produce the weakening line. In the step 510 of skipping, the portion is skipped if the portion has the target wall thickness.

[0070] Optionally, the method 500 in accordance with this exemplary embodiment furthermore comprises a step 515 of generating, in which a lead-in section is generated for a downstream portion of the contour that follows the portion, wherein in the step 510 of skipping, the removal apparatus jumps to the lead-in section in order to move over the lead-in section, and/or in which a lead-out section is generated for an upstream portion of the contour that is arranged upstream of the portion, wherein the removal apparatus is moved over the lead-out section before the step 510 of skipping.

[0071] The exemplary embodiments described and shown in the figures have been chosen only by way of example. Different exemplary embodiments can be combined with one another in their entirety or with regard to individual features. Moreover, an exemplary embodiment can be supplemented by features of a further exemplary embodiment.

[0072] Furthermore, method steps of the approach can be performed repeatedly and also in a different order than that described.

[0073] If an exemplary embodiment comprises an “and/or” linkage between a first feature and a second feature, then this should be interpreted such that the exemplary embodiment has both the first feature and the second feature in accordance with one embodiment, and has either only the first feature or only the second feature in accordance with a further embodiment.

[0074] The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are to be included within the scope of the following claims.