Micro control device for simulating electric thermal field change of plate/strip
11801542 · 2023-10-31
Assignee
Inventors
- Lipo Yang (Qinhuangdao, CN)
- Gengliang Liu (Qinhuangdao, CN)
- Hailong Zhang (Qinhuangdao, CN)
- Jiaxuan Yang (Qinhuangdao, CN)
- Lei Pan (Qinhuangdao, CN)
- Yunpeng Liu (Qinhuangdao, CN)
Cpc classification
B21B37/74
PERFORMING OPERATIONS; TRANSPORTING
C21D11/00
CHEMISTRY; METALLURGY
B21B2263/02
PERFORMING OPERATIONS; TRANSPORTING
International classification
C21D1/04
CHEMISTRY; METALLURGY
B21B3/00
PERFORMING OPERATIONS; TRANSPORTING
B21B37/74
PERFORMING OPERATIONS; TRANSPORTING
B21B9/00
PERFORMING OPERATIONS; TRANSPORTING
C21D11/00
CHEMISTRY; METALLURGY
Abstract
The disclosure provides a micro control device for simulating the electric thermal field change of a plate/strip, comprising a plate shape simulating test platform, a high current regulating power supply, a current regulating device, a thermal imager, a thermocouple, a non-contact type full field strain gauge, a high-power current control device and an electro-plastic control system; for a plate/strip with large width to thickness ratio and high hardness and brittleness alloy, different numbers of electrodes are arranged laterally along the movable supporting beam. A high-power current control device is used to realize the sub-regional control of the electric field, thermal field and stress field of the plate/strip; at the same time, the movable supporting beam and tension sensor are used to test the working conditions of the plate/strips with different lengths and widths, to simulate the instantaneous synchronous entanglement process between different fields. An electro-plastic control system is used to realize the intelligent closed-loop control of specific working conditions. The device provides a high-precision physical test platform for studying the non-uniform electro-plastic effect of a high width to thickness ratio and high hardness brittle strip during an actual rolling process, and adds a new and high-efficiency adjustment method to the traditional rolling mill system.
Claims
1. A micro control device for simulating electric thermal field change of a plate/strip, wherein the micro control device comprising a plate shape simulating test platform, a high current regulating power supply, a current regulating device, a thermal imager, a thermocouple, a non-contact type full field strain gauge, a high-power current control device and an electro-plastic control system; the plate shape simulating test platform comprising a test platform steel plate, a movable supporting beam, a plate/strip specimen, a conductive clamp, a slipknot screw, a tension sensor and a servo electric cylinder; the test platform steel plate is used to provide support for the movable supporting beam, the plate/strip specimen, the conductive clamp, the slipknot screw, the tension sensor and the servo electric cylinder; the movable supporting beam is fixedly connected to two ends of the test platform steel plate, which is a force bearing device; the movable supporting beam is fixed on the test platform steel plate according to size specification of a specimen, and is drilled along a lateral direction; a longitudinal distance of the movable supporting beam is stepless or multistage adjustable; a first end of the conductive clamp is clamped at a lateral punching position of the plate/strip specimen, a first end of the tension sensor is connected to a second end of the conductive clamp through the slipknot screw, and a second end of the tension sensor is connected to the servo electric cylinder; the servo electric cylinder and the tension sensor can be adjusted or measured separately to change lateral local field distribution of the plate/strip; the high current regulating power supply provides a current for the plate/strip specimen, and the current is a DC pulse; the current regulating device comprising a plurality of high-power current control devices which is installed between the high current regulating power supply and the conductive clamp to realize the respective regulation of current flowing through the two ends of the specimen; and the parameters of the current are synchronously transmitted to the electro-plastic control system; the high-power current control device comprising a servo motor, an insulating push rod, a conductive clamp connecting end, a high current copper pole slider, a copper wire, an insulating bracket and a power supply connecting end; the copper wire is wound on the insulating bracket; the surface of the copper wire is insulated; the power supply connecting end is connected to a positive electrode of the high current regulating power supply, and the conductive clamp connecting end is connected to the conductive clamp; and the servo motor controlled by the electro-plastic control system drives the high current copper pole slider to change length of the copper wire connected to a circuit to change resistance and gradually change a current value in the circuit; the electro-plastic control system sets off-line and fine-tunes the electrical pulse parameters and the currents of each path according to the initial temperature and tension distribution conditions of the plate/strip, and obtains temperature and tension distribution conditions close to the control target; the thermal imager is arranged above the test platform for measuring a thermal field of the tested plate/strip, meanwhile the thermal imager is calibrated by a thermocouple embedded on a surface of the plate/strip specimen; the non-contact type full field strain gauge is arranged above the test platform steel plate with a lens direction of which is perpendicular to an upper surface of the plate/strip specimen, for carrying out a full field strain measurement of the plate/strip specimen; data of current field, thermal field and stress field obtained in real time by the thermal imager, the non-contact type full field strain gauge and the tension sensor are transmitted to the electro-plastic control system.
2. The micro control device for simulating electric thermal field change of the plate/strip of claim 1, wherein a distance between two paths of the conductive clamp along the plate/strip specimen is 26 mm.
3. The micro control device for simulating electric thermal field change of the plate/strip of claim 1, wherein the thermocouple is embedded in the middle and/or the edge of the plate/strip specimen in sequence.
4. The micro control device for simulating electric thermal field change of the plate/strip of claim 1, wherein further comprising a Hall current sensor; the Hall current sensor is installed on a wire connecting the high-power current control device and the conductive clamp, for collecting in real time and feeding each path current back to the electro-plastic control system to form a closed loop so as to obtain a target current field, a target thermal field and a target stress field.
5. The micro control device for simulating electric thermal field change of the plate/strip of claim 1, wherein the current regulating device comprising a positive current regulating device and a negative current regulating device; the positive current regulating device is connected between a positive electrode of the high current regulating power supply and the conductive clamp; the negative current regulating device is connected between a negative electrode of the high current regulating power supply and the conductive clamp.
6. The micro control device for simulating electric thermal field change of the plate/strip of claim 1, wherein the movable supporting beam is bolted at two ends of the test platform steel plate through a rib plate.
7. The micro control device for simulating electric thermal field change of the plate/strip of claim 1, wherein a current provided by the high current regulating power supply is DC pulse, and peak current, pulse width and frequency of the DC pulse can be adjusted online.
8. The micro control device for simulating electric thermal field change of the plate/strip of claim 1, wherein the synchronous current parameters transmitted to the electro-plastic control system comprising the high current regulating power supply parameters and a conductive sequence; the conductive sequence is a current value of the pulse current passing through each path, and the high current regulating power supply parameters include effective current, frequency and pulse width.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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MAIN REFERENCE NUMBERS
(10) 1—test platform steel plate, 2—movable supporting beam, 3—rib plate, 4—positive current regulating device, 5—high current regulating power supply, 6—thermal imager, 7—non-contact type full field strain gauge, 8—negative current regulating device, 9—plate/strip specimen, 10—conductive clamp, 11—slipknot screw, 12—tension sensor, 13—servo electric cylinder, 14—high-power current control device, 15—servo motor, 16—insulating push rod, 17—conductive clamp connecting end, 18—high current copper pole slider, 19—copper wire, 20—insulating bracket, 21—power supply connecting end.
DETAILED DESCRIPTION
(11) Embodiments of the disclosure are described below with reference to the attached drawings.
(12) As shown in
(13) A movable supporting beams 2 set at both ends of the plate shape simulating test platform are force carrying devices. The movable supporting beams 2 are bolted at both ends of the plate shape simulating test platform by rib plates 3. The movable supporting beam 2 is drilled along a lateral direction. As shown in
(14) The positive current regulating device 4 and the negative current regulating device 8 are respectively arranged at both ends of the large current regulating power supply 5 to realize the respective regulation of the current flowing through the two ends of a specimen. Current supply parameters are synchronously transmitted to an electro-plastic control system, wherein the current supply parameters include high current regulating power source parameters (effective current, frequency, and pulse width) and a conductive sequence. The conductive sequence is current value of a pulse electric current passing through each path. A high-power current control device used by a negative current regulating device 8 has the same structure as a high-power current control device 14 used by a positive current regulating device 4, and it is only necessary to connect its power connection end to the negative electrode of the high current regulating power supply 5.
(15) A real-time change condition of a current field, a thermal field and a strain field on a micro control simulation of high current distribution can be obtained by a signal collecting and processing of the test platform through thermal imager 6, non-contact type full field strain gauge 7 and tension sensor 12. Data of a current field, a thermal field and a strain field obtained in real time by a thermal imager 6, a non-contact type full field strain gauge 7 and a tension sensor 12 is transmitted to an electro-plastic control system. And then, the electro-plastic control system regulates and controls parameters of a high current regulating power supply 5 and resistance value of a high-power current control device 14, such that automatic control of an electric thermal field of a plate/strip is realized;
(16) The principle of a high energy electric pulse current distribution control circuit of an embodiment of the disclosure is shown in
(17) A high-power current control device 14 used by the positive current regulating device 4 in the embodiment of the disclosure is shown in
(18) A magnesium alloy strip is preset with a tension of 20 MPa by the plate shape simulation experiment platform, and parameters of a high current regulating power supply are preset with an effective current of 197.7 A, frequency of 500 Hz and pulse width of 45 μs. The method of measuring and controlling the high current of the disclosure is adopted, namely, the high-power current control device is used to apply different amplitude currents in different regions, so as to change internal current field of a plate/strip, and then adjust different thermal field and strain field.
(19) The schematic diagram of the conductive sequence mode of an embodiment of the disclosure is shown in
(20) In this embodiment, current loading paths shown in
(21) The above-mentioned embodiments only describe the preferred embodiments of the present disclosure, and do not limit the scope of the present disclosure. Without departing from the design spirit of the present disclosure, those of ordinary skill in the art have made various contributions to the technical solutions of the present disclosure. Such modifications and improvements shall fall within the scope of protection determined by the claims of the present disclosure.