Resin Composition
20230340256 · 2023-10-26
Assignee
Inventors
- Young Jo Yang (Daejeon, KR)
- Do Yeon Kim (Daejeon, KR)
- Jeong Hyun Lee (Daejeon, KR)
- Yang Gu Kang (Daejeon, KR)
Cpc classification
C08G18/4277
CHEMISTRY; METALLURGY
H01M50/24
ELECTRICITY
Y02E60/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01M50/213
ELECTRICITY
H01M50/20
ELECTRICITY
H01M50/131
ELECTRICITY
C08L67/04
CHEMISTRY; METALLURGY
H01M50/249
ELECTRICITY
H01M10/653
ELECTRICITY
H01M2220/20
ELECTRICITY
H01M50/247
ELECTRICITY
C08L67/04
CHEMISTRY; METALLURGY
H01M50/204
ELECTRICITY
H01M50/229
ELECTRICITY
H01M50/284
ELECTRICITY
International classification
C08L67/04
CHEMISTRY; METALLURGY
H01M50/229
ELECTRICITY
H01M50/204
ELECTRICITY
Abstract
The present application relates to a resin composition comprising a polymer compound having an organic acid anhydride functional group, a two-component resin composition, and a battery module comprising the same. In the present application, it is possible to provide a resin composition in which a uniform mixing state can be maintained without any oil separation phenomenon and the like even in the composition in which a filler is blended, and there is no viscosity increase even when stored for a long period of time. In addition, the present application can provide a two-component resin composition comprising the resin composition, and a battery module comprising the resin composition or the two-component resin composition.
Claims
1. A resin composition, comprising: a polymer compound having an organic acid anhydride functional group and a first filler.
2. The resin composition according to claim 1, wherein the organic acid anhydride functional group is a functional group derived from benzoic anhydride, a functional group derived from phthalic anhydride or a functional group derived from maleic anhydride.
3. The resin composition according to claim 1, wherein the polymer compound has an organic acid anhydride functional group substituted in a polybutadiene skeleton, a polyester skeleton or a polyether skeleton.
4. The resin composition according to claim 1, wherein the polymer compound has a number average molecular weight (Mn) of 500 g/mol to 4,000 g/mol.
5. The resin composition according to claim 1, wherein the polymer compound has a glass transition temperature (Tg) of −150° C. to 0° C.
6. The resin composition according to claim 1, wherein the polymer compound has an acid value according to DIN EN ISO 2114 in a range of 50 mgKOH/g to 120 mgKOH/g.
7. The resin composition according to claim 1, wherein the polymer compound comprises a polymerization unit represented by the following formula 1: ##STR00004## wherein, L.sub.1 is a single bond or an alkenylene group with 2 to 4 carbon atoms, L.sub.2 is a single bond or an alkylene group with 1 to 4 carbon atoms, and L.sub.3 and L.sub.4 are each independently a single bond or an alkylene group with 1 to 4 carbon atoms.
8. The resin composition according to claim 1, wherein the polymer compound further comprises a polymerization unit represented by the following formula 2: ##STR00005## wherein, L.sub.5 is an alkenylene group with 2 to 4 carbon atoms or an alkylene group with 1 to 4 carbon atoms substituted with an alkenyl group with 2 to 4 carbon atoms.
9. The resin composition according to claim 1, wherein the first filler is included in a range of 75 weight % to 92 weight % relative to 100 weight % of the resin composition.
10. The resin composition according to claim 1, wherein the first filler has a moisture content in a range of 10 ppm to 3,000 ppm.
11. The resin composition according to claim 1, wherein the first filler is fumed silica, clay, calcium carbonate (CaCO.sub.3), aluminum oxide (Al.sub.2O.sub.3), aluminum nitride (AlN), boron nitride (BN), silicon nitride (Si.sub.3N.sub.4), silicon carbide (SiC), beryllium oxide (BeO), zinc oxide (ZnO), aluminum hydroxide (Al(OH).sub.3), boehmite or a carbon filler.
12. The resin composition according to claim 1, wherein the resin composition does not comprise an amine catalyst and an isocyanate compound.
13. A two-component resin composition, comprising: a main part including a main resin and a second filler; and a curing agent part, wherein the curing agent part is the resin composition of claim 1.
14. The two-component resin composition according to claim 13, wherein the main resin is a polyol resin.
15. The two-component resin composition according to claim 13, wherein the main part further comprises an amine catalyst.
16. The two-component resin composition according to claim 13, wherein at least one of the main part or the curing agent part further comprises a dispersant.
17. A battery module, comprising: a module case; a plurality of battery cells accommodated in an inner space of the module case; and a resin layer in contact with the plurality of battery cells and the module case, wherein the resin layer is a cured layer of the resin composition of claim 1.
18. The two-component resin composition according to claim 14, wherein the polyol resin is a carboxylic acid polyol or a caprolactone polyol.
19. The two-component resin composition according to claim 15, wherein the amine catalyst is included in the main part in a range of about 0.01 weight % to 5 weight % relative to 100 weight % of the two-component resin composition.
Description
MODE FOR INVENTION
[0071] Hereinafter, the present application will be described in detail through Examples, but the scope of the present application is not limited by the Examples below.
Storage Stability Evaluation
[0072] Storage stability evaluation was performed using the curing agent part (resin composition) prepared in Examples and Comparative Examples. When the value of the following general formula 1 was 1.2 or more, it was assumed that there was no storage stability.
V=V.sub.2/V.sub.1<1.2 [General Formula 1]
[0073] In General Formula 1, V is a viscosity change rate of a resin composition, V.sub.1 is an initial viscosity measured at room temperature and a shear rate of 2.4/s using Wells/Brookfield Cone & Plate's viscometer within 3 minutes from the time of preparing a resin composition comprising a polymer compound having an organic acid anhydride functional group and a filler, and V.sub.2 is a viscosity measured at room temperature and a shear rate of 2.4/s using Wells/Brookfield Cone & Plate's viscometer at the time of curing for 30 days from the time of preparing the resin composition.
[0074] In addition, it was determined that there was no storage stability even when white crystals were formed due to salt generation or oil separation was observed within 3 days from the time the resin composition was prepared.
[0075] [Evaluation Criteria] [0076] O: The value of General Formula 1 above is less than 1.2, no salt generation, no oil separation phenomenon is observed within 3 days (if all are applicable) [0077] X: The value of General Formula 1 above is 1.2 or more, salt generation presence, oil separation phenomenon is observed within 3 days (if any of these is applicable)
Thermal Conductivity
[0078] It was measured by a hot disk method according to ISO22007-2 standard using a cured product of a two-component resin composition prepared from the main part and the curing agent part prepared in Examples and Comparative Examples by means of a static mixer. At this time, the two-component resin composition was prepared so that the volume ratio of the main part and the curing agent part was 1:1 or so.
[0079] Specifically, regarding the thermal conductivity measurement, the thermal conductivity can be measured in the through plane direction by placing the cured product of the two-component resin composition in a mold having a thickness of about 5 mm or so and using a hot disk device. As stipulated in the above standard (ISO 22007-2), the hot disk device is a device that can identify the thermal conductivity by measuring the temperature change (electrical resistance change) as a sensor with a nickel wire of a double spiral structure is heated, and such a thermal conductivity was measured according to the standard.
Example
[0080] Main Part:
[0081] As the main resin, a caprolactone polyol represented by the following formula 3 was used.
##STR00003##
[0082] In Formula 3, m is a number within a range of 1 to 3, R.sub.1 and R.sub.2 are each alkylene with 4 carbon atoms, and Y is a unit derived from 1,4-butanediol unit.
[0083] As a filler, alumina was used, and one without any treatment on the particle surface was used as it was.
[0084] Daejungchem's DMP-30 (2,4,6-tris(dimethylaminomethyl)phenol) was used as a catalyst, and BYK's BKY-111 was used as a dispersant.
[0085] The main part was prepared by mixing the caprolactone polyol, the filler, the catalyst and the dispersant in a weight ratio of 10.36:89:0.34:0.3 (polyol: filler: catalyst: dispersant).
[0086] Curing Agent Part (Resin Composition):
[0087] As a polymer compound having an organic acid anhydride functional group, EVONIK's POLYVEST MA 75 was used (number average molecular weight: 3,000 g/mol, glass transition temperature: −95° C., acid value: 70-90 mgKOH/g).
[0088] As a filler, alumina was used, and one without any treatment on the particle surface was used as it was.
[0089] As a dispersant, BYK's BKY-118 was used.
[0090] The curing agent part was prepared by mixing the polymer compound having the organic acid anhydride functional group, the filler and the dispersant in a weight ratio of 10.85:89:0.15 (polymer compound: filler: dispersant).
[0091] The mixing during the preparation of the main part and the curing agent part was performed with a planetary mixer.
Comparative Example 1
[0092] Main part: It was prepared by mixing the same components in the same ratios as in Example, except that a tin catalyst (Sigma-Aldrich's DBTDL) was used instead of the amine catalyst.
[0093] Curing agent part: It was prepared by mixing the same components in the same ratios as in Example, except that a polyisocyanate (HDI, hexamethylene diisocyanate) was used instead of the polymer compound of Example and as the dispersant, BYK's BKY-111 was used.
Comparative Example 2
[0094] Main part: It was prepared by mixing the same components in the same ratios as in Example, except that an epoxy resin (Kukdo Chemical's YH-300) was used instead of the polyol resin as the main resin and as the dispersant, BYK's BKY-102 was used.
[0095] Curing agent part: It was prepared by mixing the same components in the same ratios as in Example, except that an amide (Kukdo Chemical's G-A0432) was used instead of the polymer compound of Example and as the dispersant, BYK's BKY-102 was used.
Comparative Example 3
[0096] Main part: It was prepared by mixing the same components in the same ratios as in Comparative Example 2.
[0097] Curing agent part: It was prepared by mixing the same components in the same ratios as in Example, except that an aliphatic amine (Kukdo Chemical' KH-8108) was used instead of the polymer compound of Example and as the dispersant, BYK's BKY-102 was used.
Comparative Example 4
[0098] Main part: It was prepared by mixing the same components in the same ratios as in Example, except that as the main resin, siloxane (KCC's SF3000E, SF6003P, Modifier715 and Inhibitor600) was used and as the dispersant, BYK's BYK-1799 was used.
[0099] Curing agent part: It was prepared by mixing the same components in the same ratios as in Example, except that siloxane (KCC's SF3000E) was used instead of the polymer compound of Example and as the dispersant, BYK's BYK-1799 was used.
[0100] The storage stability evaluation and thermal conductivities measured for Example and Comparative Examples were summarized and described in Table 1 below.
TABLE-US-00001 TABLE 1 Thermal conductivity Storage stability (W/mK) Example ◯ 2.6 Comparative X (viscosity increase more than twice for 2.8 Example 1 1 month) Comparative X (viscosity increase 1.5 times or more for 3.0 Example 2 1 month) Comparative X (white crystal generation due to salt 3.0 Example 3 generation) Comparative X (oil separation after 3 days) 2.6 Example 4
[0101] From the results in Table 1, in the case of Example comprising the polymer compound having an organic acid anhydride functional group in the resin composition, it can be seen that it has excellent storage stability even without performing the moisture content control of the filler or the surface treatment of the filler. In addition, the cured product of the two-component resin composition comprising the resin composition in the curing agent part had an excellent thermal conductivity of 2.0 W/mK or more.
[0102] In comparison, in the case of Comparative Example 1 comprising the isocyanate instead of the polymer compound having an organic acid anhydride functional group in the resin composition or in the case of Comparative Example 2 comprising the amide instead of the polymer compound having an organic acid anhydride functional group in the resin composition, it can be seen that the viscosity change rate exceeds 1.2, whereby the storage stability is deteriorated. Also, in the case of Comparative Example 3 comprising the aliphatic amine instead of the polymer compound having an organic acid anhydride functional group in the resin composition, white crystals were produced due to salt generation. In addition, in the case of Comparative Example 4 comprising the siloxane instead of the polymer compound having an organic acid anhydride functional group in the resin composition, it can be seen that the oil separation phenomenon is observed within 3 days from the time the resin composition is prepared, whereby the storage stability is deteriorated.