Method for Contacting Components in Electric Systems in a Bonded Manner, Energy Storage Unit, and Use of the Energy of an Energy Storage Unit

20230378618 ยท 2023-11-23

    Inventors

    Cpc classification

    International classification

    Abstract

    A method for contacting components in electric systems in a bonded manner, including providing a plurality of components having contact elements for making electric contact, contacting the components via the contact elements in order to generate a current path, and generating a flow of current in the current path in order to bond the contact elements via the thermal energy produced in the current path.

    Claims

    1-13. (canceled)

    14. A method for contacting components in electric systems in a bonded manner, comprising: providing a plurality of components, wherein the plurality of components comprise contact elements configured for making electric contact; contacting the plurality of components via the contact elements to generate a current path; and generating a flow of current in the current path to bond the contact elements via the thermal energy produced in the current path.

    15. The method according to claim 14, wherein at least one component is an electric energy store, the method further comprising: introducing a resistance into the current path and using the electric energy store to generate the flow of current.

    16. The method according to claim 14, further comprising: providing a plurality of battery modules; contacting the plurality of battery modules via power cables to form a high-voltage store, wherein the high-voltage store forms the current path; generating the flow of current in the current path by the high-voltage store in such a way that the power cables are soldered.

    17. The method according to claim 14, further comprising: contacting the contact elements in a form-fitting and/or frictionally engaged manner.

    18. The method according to claim 17, further comprising: applying a clamping force via a clamping device for contacting at least two contact elements.

    19. The method according to claim 14, further comprising: applying a prestress to at least one contact element by shaping the at least one contact element to make contact in a frictionally engaged manner.

    20. The method according to claim 14, further comprising: providing solder material at the contact elements.

    21. The method according to claim 14, further comprising: contacting the plurality of components in a bonded manner by an adhesive.

    22. The method according to claim 21, further comprising: embedding a solder material into the adhesive.

    23. The method according to claim 14, further comprising: increasing a contact resistance at a contact point of at least two contact elements by introducing an material that increases the contact resistance into or at the contact point.

    24. The method according to claim 14, further comprising: using energy of an energy storage unit in the current path to bond contact points of the contact elements in the current path.

    25. The method according to claim 14, further comprising: using energy of an energy storage unit in the current path to resolder contact points of the contact elements in the current path.

    26. An energy storage unit produced by the method according to claim 14.

    Description

    BRIEF DESCRIPTION OF THE DRAWINGS

    [0054] FIG. 1 shows a plurality of contact elements which form contact points, contacted via a clamping device;

    [0055] FIG. 2 shows a further embodiment of a contact point;

    [0056] FIG. 3 shows two embodiments of components together with contact elements; and

    [0057] FIG. 4 shows a further embodiment of a contact point.

    DETAILED DESCRIPTION

    [0058] FIG. 1 shows a schematic view of a clamping device 22, which comprises two tabs which are connected via fastener 30, sketched in the present case as dashed lines. The fastener 30 can include screw connections. Two components 10 can be seen in each case, which have contact elements 20 at an end. Solder material 24 is arranged on one of the contact elements 20 in each case. The corresponding contact elements 20 are compressed by the clamping device 22, wherein the solder material 24 is arranged in between. If a sufficiently high current now flows via the components 10 or contact elements 20, soldering occurs automatically at the contact elements 21. The clamping device 22 can then be removed.

    [0059] FIG. 2 shows a further schematically illustrated embodiment of a contact point 21 in a schematic depiction, wherein one component 10 in the present case is formed for example as a power cable or module connector 44, which at the end has a contact element 20, on which there is arranged an insulation material 26. The insulation material preferably serves to increase the contact resistance, or in particular to increase the contact resistance selectively and in some regions, in order to generate heat additionally. The insulation material 26 can act simultaneously as adhesive. A further component 10 is sketched in the present case as an electric energy store or battery module which comprises a voltage tap 42, which in the present case represents a second contact element 20. Solder material 24 is provided on this. It is schematically indicated that the power cable 44 is deformed. As a result of this deformation a voltage can be introduced into this component and can be used in order for the two contact elements 20 to be contacted with one another, in particular contacted in a frictionally engaged manner, so that a current path is formed.

    [0060] FIG. 3 shows two schematically illustrated embodiments of components 10, wherein a component 10 is sketched in the left image half, for example as a conductor element, which at an end has a contact element 20, wherein this comprises an adhesive 26, in which there is embedded solder material 24. A component 10 is illustrated schematically in the right image half, for example a conductor element, which at an end has a contact element 20, which comprises a solder pocket 28. Solder material for the later soldering can be held ready or arranged in a solder pocket 28 of this kind. In addition, a solder pocket of this kind can be used to arrange a congruently formed (not shown here) contact element in a form-fitting and/or frictionally engaged manner for pre-positioning or pre-contacting.

    [0061] FIG. 4 shows a further schematically illustrated embodiment of a contact point 21, wherein two components 10, which at an end have contact elements 20, can rest against one another at the contact point 21. The right contact element 20 comprises a solder pocket 28 and an engagement region 32, which is designed to cooperate with a fastener 30. The two components 20 are pre-contacted relative to one another via the fastener 30. The actual bond is achieved indirectly via the solder, which is held ready in the solder pocket 28.

    LIST OF REFERENCE SIGNS

    [0062] 10 component [0063] 20 contact element [0064] 21 contact point [0065] 22 clamping device [0066] 24 solder material [0067] 26 adhesive, insulation material [0068] 28 solder pocket [0069] 30 fastener [0070] 32 engagement region [0071] 40 electric energy store, battery module [0072] 42 voltage tap [0073] 44 power cable, module connector