ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF

Abstract

A manufacturing method can be used to produce an electronics unit. The electronics unit contains a first component with a plurality of first electrical contacts, containing an integrated circuit, and a second component with a plurality of second electrical contacts. The first electrical contacts and the second electrical contacts are each electrically connected to each other via an electrically conductive structure containing a plurality of electrically conductive particles.

Claims

1: A method of manufacturing an electronics unit with a first component with a plurality of first electrical contacts, comprising an integrated circuit, and a second component with a plurality of second electrical contacts, the method comprising: providing capsules each containing one or more electrically conductive particles, applying the capsules to at least one of the first component and the second component, arranging the first component and the second component at a predetermined distance, with the first electrical contacts and the second electrical contacts opposing each other; and activating the capsules so that the one or more electrically conductive particles are released and arrange on at least one of the first component on the first electrical contacts and the second component on the second electrical contacts, and form an electrically conductive structure comprising the one or more electrically conductive particles.

2: The method of manufacturing an electronics unit according to claim 1, wherein the capsules are activated after the first component and the second component have been arranged with the first electrical contacts and the second electrical contacts opposing each other.

3: The method of manufacturing an electronics unit according to claim 1, wherein the one or more electrically conductive particles are contained in first capsules, and wherein the method further comprises: applying second capsules comprising an electrically insulating material to at least one of the first component and the second component.

4: The method of manufacturing an electronics unit according to claim 1, wherein the one or more electrically conductive particles are contained in first capsules, and the first capsules are each connected to at least one second capsule, which has an electrically insulating material, and wherein the first capsules and the at least one second capsule are applied to at least one of the f component and the second component.

5-6. (canceled)

7: The method of manufacturing an electronics unit according to claim 3, wherein the first capsules and the at least one second capsule are activated sequentially in time.

8: The method of manufacturing an electronics unit according to claim 3, wherein at least one of the following elements is functionalized with a functional group: the capsules, the first capsules, the one or more electrically conductive particles, the first electrical contacts, the second electrical contacts, and the second capsules comprising the electrically insulating material.

9. (canceled)

10: The method according to claim 1, further comprising: functionalizing the capsules with a functional group; functionalizing at least one of the first electrical contacts and the second electrical contacts with a functional group; and covalently bonding at least part of the capsules to at least one of the first electrical contacts and the second electrical contacts.

11: A method of manufacturing an electronics unit with a first component comprising an integrated circuit and a plurality of first electrical contacts, and a second component with a plurality of second electrical contacts, the method comprising: providing a suspension in which one or more electrically conductive particles are contained as suspended matter, applying the suspension to at least one of the first component and the second component so that an electrically conductive structure comprising the one or more electrically conductive particles is formed on at least one of the first component on the first electrical contacts and the second component on the second electrical contacts, arranging the first component and second component at a predetermined distance, with the first electrical contacts and the second electrical contacts goosing each other: and washing off the one or more electrically conductive particles from a surface of the at least one of the first component and the second component that is not covered by the first electrical contacts or the second electrical contacts.

12: The method of manufacturing an electronics unit according to claim 11, further comprising: functionalizing at least one of the following elements with a functional group: the one or more electrically conductive particles, the first electrical contacts, and the second electrical contacts.

13. (canceled)

14: The method according to claim 11, further comprising: functionalizing the one or more electrically conductive particles with a functional group; functionalizing at least one of said first electrical contacts and said second electrical contacts with a functional group; and covalently bonding at least a portion of the one or more electrically conductive particles to at least one of the first electrical contacts and the second electrical contacts.

15-16. (canceled)

17: The method of manufacturing an electronics unit according to claim 11, wherein after manufacturing the electrically conductive structure, an electrically insulating material is applied to at least one of the first component and the second component.

18. (canceled)

19: An electronics unit, comprising: a first component with a plurality of first electrical contacts and comprising an integrated circuit, and a second component with a plurality of second electrical contacts, wherein the first electrical contacts and the second electrical contacts are each electrically connected to each other via an electrically conductive structure comprising a plurality of electrically conductive particles.

20. (canceled)

21: The electronics unit according to claim 19, wherein the electrically conductive particles are rod-shaped nanoparticles aligned in parallel in a predetermined direction and in direct contact with each other.

22: The electronics unit according to claim 19, wherein the second component is a housing, chip, circuit board, or other substrate.

23: The electronics unit according to claim 19, wherein the first component is an unhoused chip.

24: The electronics unit according to claim 19, wherein at least one of the following is functionalized by bonding with a functional group: the electrically conductive particles, the first electrical contacts, and the second electrical contacts.

25. (canceled)

26: The electronics unit according to claim 24, wherein only the electrically conductive particles are functionalized with a functional group; and/or wherein the first electrical contacts and the second electrical contacts each have no functionalization, such that the electrically conductive particles are bonded via weak interaction with at least one of the first electrical contact and the second electrical contacts.

27: The electronics unit according to claim 24, wherein the electrically conductive particles are functionalized with a functional group; and wherein at least one of said first electrical contacts and said second electrical contacts is functionalized with a functional group such that said electrically conductive particles are covalently bonded to at least one of said first electrical contacts and said second electrical contacts.

28: The electronics unit according to claim 24, wherein the functional group comprises at least one thiol group and/or carboxyl group.

29: The electronics unit according to a claim 19, wherein at least one of the first component and the second component comprises spacers dimensioned such that opposing contact areas of the first electrical contacts and the second electrical contacts are spaced apart when both the first component and the second component are assembled.

30. (canceled)

Description

BRIEF DESCRIPTION OF THE FIGURES

[0090] The present disclosure is explained in more detail below by way of example with reference to the accompanying drawings. Showing:

[0091] FIG. 1 an electronics unit with two components that are electrically connected to each other via an electrically conductive structure consisting of a plurality of electrically conductive particles;

[0092] FIG. 2 the electronics unit of FIG. 1 with an additional underfill;

[0093] FIG. 3 an electronics unit with two components and additional spacers;

[0094] FIG. 4-10 different states of a method of manufacturing an electronics unit with two electronic components, in which a suspension containing electrically conductive particles as suspended matter is applied to one of the components before the two components are assembled together;

[0095] FIG. 11-15 different states of a method of manufacturing an electronics unit with two electronic components, hi which a suspension containing electrically conductive particles as suspended matter is applied to both components of the electronics unit after the components have been assembled;

[0096] FIG. 16-21 different states of a method of manufacturing an electronics unit with two electronic components, in which a suspension containing the particles in capsules is applied to one of the components before the two components are assembled.

DETAILED DESCRIPTION OF EMBODIMENT EXAMPLES

[0097] FIG. 1 shows an electronics unit 1 with two components 2, 4 which are electrically connected to each other via an electrically conductive structure 8 consisting of a plurality of electrically conductive particles 9.

[0098] The first component 2 comprises, for example, an integrated circuit 8 and can be, for example, a die or an housed (packaged) chip that has several electrical contacts 3 arranged next to each other on one surface. The second component 4 can be, for example, a chip housing, another chip, a printed circuit board or any other substrate 7, which also has several electrical contacts 5 arranged at a distance from one another.

[0099] The electrically conductive particles 9 are preferably micro- or nanoparticles, which may be, for example, gold, silver or copper, tin, zinc or various alloys; or a base metal with a contact surface to the surface made of another metal. In the illustrated embodiment, the particles are rod-shaped nanoparticles aligned parallel, side-by-side in a predetermined direction, while in contact with each other.

[0100] Due to the small size of the particles 9, the distance between the opposing contacts 3, 5 of a contact pair is particularly small and can be, for example, 500 nm or less.

[0101] The electrically conductive particles 9 and/or the contacts 3 or 5 are preferably functionalized, so that the particles 9 preferably bind to the electrical contacts 3, 5.

[0102] FIG. 2 shows the arrangement of FIG. 1, with an additional electrically insulating material 11—the so-called underfill—being present in an interspace 10 between neighboring contact pairs 3, 5. The underfill can be, for example, an epoxy resin, a PU adhesive or an acrylate adhesive, plastic, polymer.

[0103] FIG. 3 shows an alternative embodiment of the electronics unit 1 in which each component 2, 4 comprises a spacer 12 which is dimensioned such that the opposing contact surfaces of the contacts 3, 5, when the two components 2, 4 are assembled together, are separated by a predetermined distance. In the illustrated embodiment, the spacers are realized as projections projecting outwardly from the components 2, 4 and are made of a non-conductive material. In all other respects, the electronics unit 1 shown in FIG. 2 has an identical structure to the electronics unit 1 of FIG. 1, so that reference is made to the description there.

[0104] FIGS. 4 to 10 show different states of a method of manufacturing an electronics unit 1, in which a suspension 13 containing electrically conductive particles 9 as suspended matter is applied to one of the components 2, 4 before the two components 2, 4 are assembled together.

[0105] Here, the particles 9 are functionalized with a thiol group and therefore selectively bind with the metal surfaces of the electrical contacts 5. In addition, the electrical contacts 5 may also be functionalized and have one or more functional groups.

[0106] FIG. 4 shows how a suspension 13 containing the electrically conductive particles 9 is poured from a vessel 14 onto the second component 4.

[0107] FIG. 5 shows a state in the method of manufacturing in which the electrically conductive particles 9 accumulate on the metal surfaces of the second electrical contacts 5 due to their functionalization. In the interspaces 10 between neighboring electrical contacts 5, on the other hand, the bonding effect is less strong or non-existent, so that fewer conductive particles 9 are present there.

[0108] FIG. 6 shows an exemplary further embodiment in which both the electrically conductive particles 9 and the second electrical contacts 5 are functionalized. Here, the electrically conductive particles 9 comprise a first functional group R1, such as a carboxyl group, and the electrical contacts 5 comprise a second functional group R2, such as primary amines. The two functional groups R1, R2 in turn selectively bind particularly strongly to each other, so that the desired agglomeration of electrically conductive particles 9 on the electrical contacts 5 occurs.

[0109] FIG. 7 shows a further method step in which the electrically conductive particles 9 that do not adhere to the surface of the second component 4 are washed off using a washing liquid 15. The washing liquid 15 can be, for example, water, ethanol or a mixture thereof. Alternatively, compressed air or another fluid could be used for the washing process. The washing off of the non-bonded conductive particles 9 preferably takes place in a fluid flow. With regard to the flow rate of the fluid, care must be taken to ensure that it is not too high so as not to unintentionally detach the particles 9 arranged on the electrical contacts 5.

[0110] In FIG. 8, the two electronic components 2, 4 are assembled together opposite contacts 3, 5 so that they are electrically connected via the agglomerate of electrically conductive particles 19.

[0111] FIG. 9 shows the application of an underfill 11 into the interspaces 10 between neighboring contact pairs 3, 5 of the electronics unit 1. The underfill can be applied, as known from electronics manufacturing, e.g. by means of a metering device at the edge area of the electronics unit 1 and then flows into the interspaces 10 of the electronics unit 1 due to capillary effects until these are filled with the underfill 11. The underfill can be, for example, an adhesive, such as an epoxy resin, or another electrically insulating material. The result is a very compact electronics unit 1 as shown in FIG. 10.

[0112] FIGS. 11 to 15 show different states of a method of manufacturing an electronics unit 1, in which electrically conductive particles 9 are applied in the form of a suspension 13 after the two components 2, 4 have been assembled together.

[0113] FIG. 11 shows an electronics unit 1 with two electrical components 2, 4, each with a plurality of area-like contacts 3, 5. The components 2, 4 are arranged with opposing electrical contacts 3, 5, whereby the first electrical contacts 3 and the second electrical contacts 5 are in contact. In the illustrated embodiment, the first and second electrical contacts 3, 5 each have a portion projecting beyond the remaining contact area, which serves as a spacer 12. The remaining contact surfaces are spaced apart.

[0114] After the components 2, 4 have been assembled together, a suspension 13 is applied in which the electrically conductive particles 9 are contained as suspended matter. This is shown in FIG. 12.

[0115] The electrically conductive particles 9 are functionalized by means of a thiol group and therefore preferentially attach to the metal surface of the electrical contacts 3, 5. The free space remaining between the opposing contact surfaces of the electrical contacts 3, 5 fills with electrically conductive particles 9, as shown in FIG. 13.

[0116] FIG. 14 shows a method step in which electrically conductive particles 9 that are not bonded to a metal surface are washed off by means of a washing liquid 15. As previously described, the wash solution may contain water, ethanol or another fluid.

[0117] Finally, in FIG. 15, an underfill 11 is added as described above with respect to FIG. 10.

[0118] Furthermore, FIGS. 16 to 21 show various states of a method of manufacturing an electronics unit 1, in which the electrically conductive particles 9 are applied in the form of capsules K. The method is described in detail below.

[0119] In the embodiment shown, double-capsules are used, comprising a first capsule K1 and a second capsule K2, which are connected to each other. The first capsules K1 contain the electrically conductive particles 9; the second capsules K2 contain an electrically Insulating material 11 or the underfill. The capsules K can be manufactured in a known method as described hereinabove. A connection between two capsules K1, K2 to form a double-capsule can be achieved, for example, by functionalization, as also described in the general part of the description.

[0120] Firstly, FIG. 16 shows the application of a suspension 13 with a plurality of double-capsules 17 contained in the suspension 13 as suspended matter. In this case, the suspension 13 is simply poured onto the surface of the second electronic component 4, whereby the double-capsules 17 are evenly distributed on the surface. The first capsules K1 containing the nanoparticles are functionalized with a thiol group and therefore bind particularly strongly to the metal surfaces of the second contacts 5.

[0121] The size of the first capsules K1 corresponds approximately to the size of the contact area of the electrical contacts 5, while the size of the second capsules K2 corresponds approximately to the distance 10 between two neighboring electrical contacts 5. The second capsules K2 are not functionalized. After applying the suspension 13 to the surface of the second component 4, the double-capsules 17 are arranged as shown in FIGS. 17 and 18. A first capsule K1 lies on each contact surface of an electrical contact 5; the second capsules K2 essentially fill the space between neighboring electrical contacts 5.

[0122] In a next method step, the first electronic component 2 is placed on the second component 4 so that the contact surfaces of the first and second components 2, 4 lie opposite each other at a predetermined distance (see FIG. 19, arrow B). The desired distance between the components 2, 4 is again achieved by spacers 12 (not shown).

[0123] Thereafter, the first capsules K1 are first activated by increasing the temperature so that they release the nanoparticles 9 contained therein. The nanoparticles 9 are functionalized by means of a thiol group so that they bind selectively with the metal surface of the first and second contacts 3, 5. Optionally or additionally, the electrical contacts 3, 5 can also be functionalized.

[0124] In a next step, the second capsules K2 are activated (see FIG. 20) so that they release the underfill 11 contained therein. The delayed activation of the second capsules K2 can be achieved, for example, by the second capsules K2 having a thicker shell and/or a different shell material compared to the first capsules. Alternatively, this could be done by further increasing the temperature or the pressure or by other means. The underfill 11 then spreads into the spaces between the electrical contacts 3, 5 and firmly bonds the two components 2, 4 together, as shown in FIG. 20. The finished electronics unit Hs shown in FIG. 21.

[0125] The shells of the first capsules and the shells of the second capsules can have at least partially crosslinked (co)polymer. Sequential or subsequent activation of the first and second capsules can be achieved by different degrees of crosslinking of the (co)polymers of the shells of the first and second capsules. Alternatively or additionally, different activation mechanisms can be used to activate the first and second capsules.

[0126] The contacting of the first and second contacts 3, 5 by means of microparticles or nanoparticles 9 used here makes it possible to produce a very low packing density and a correspondingly small and compact electronics unit 1. In addition, this method is particularly simple and inexpensive.

[0127] It should be noted in addition that “comprising” and “having” do not exclude other elements or steps, and the indefinite articles “one” or “a” do not exclude a plurality.

[0128] Furthermore, it should be noted that features or steps that have been described with reference to one of the above embodiments may also be used in combination with other features or steps of other embodiments described above. Reference signs in the claims are not to be regarded as limitations.