1. Patent Search
  2. Details

COMPOSITION FOR USE IN THE MANUFACTURE OF AN IN-MOULD ELECTRONIC (IME) COMPONENT

20230374289 · 2023-11-23

    Inventors

    Cpc classification

    International classification

    Abstract

    A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.

    Claims

    1. (canceled)

    2. (canceled)

    3. (canceled)

    4. (canceled)

    5. (canceled)

    6. (canceled)

    7. (canceled)

    8. (canceled)

    9. (canceled)

    10. (canceled)

    11. (canceled)

    12. (canceled)

    13. (canceled)

    14. (canceled)

    15. (canceled)

    16. (canceled)

    17. (canceled)

    18. (canceled)

    19. (canceled)

    20. (canceled)

    21. (canceled)

    22. (canceled)

    23. (canceled)

    24. (canceled)

    25. (canceled)

    26. (canceled)

    27. (canceled)

    28. (canceled)

    29. (canceled)

    30. (canceled)

    31. (canceled)

    32. (canceled)

    33. (canceled)

    34. (canceled)

    35. (canceled)

    36. (canceled)

    37. (canceled)

    38. (canceled)

    39. (canceled)

    40. (canceled)

    41. (canceled)

    42. (canceled)

    43. (canceled)

    44. (canceled)

    45. A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.

    46. The composition of claim 45, wherein the melamine formaldehyde comprises hexamethoxymethyl melamine; and/or wherein the cross-linking agent further comprises isocyanate and/or polyisocyanate and/or blocked polyisocyanate; and/or wherein the thermoplastic resin comprises one or more of polyurethane resin, polyester resin, polyacrylate resin, polyvinyl ester resin, phenoxy resin and ketonic resin, preferably wherein the thermoplastic resin comprises polyurethane resin, polyester resin and phenoxy resin, more preferably wherein the thermoplastic resin comprises: from 20 to 60 wt. % polyurethane resin, preferably from 35 to 47 wt. % polyurethane resin, from 5 to 30 wt % polyester resin, preferably from 13 to 19 wt. % polyester resin, and from 20 to 60 wt % phenoxy resin, preferably from 34 to 51 wt. % phenoxy resin, based on the total weight of the thermoplastic resin.

    47. The composition of claim 45, wherein the thermoplastic resin: comprises a homo-polymer, and co-polymer and/or a ter-polymer; and/or has a glass transition temperature of less than 100° C.; and/or has a weight average molecular weight of from 1000 to 100000 g/mol; and/or has a softening point of less than 100° C.; and/or has a hydroxyl content (OH number) of greater than 20 mgKOH/g; and/or wherein the composition comprises: from 1 to 40 wt % of the cross-linking agent, preferably from 7 to 24 wt. % of the cross-linking agent, and from 60 to 99 wt % of the thermoplastic resin, preferably 76 to 93 wt. % of the thermoplastic resin, based on the total amount of cross-linking agent and thermoplastic resin; and/or wherein the solvent comprises one or more of a glycol ether acetate, a glycol ether, an ester, a ketone, an alcohol and a hydrocarbon, preferably wherein the solvent comprises: up to 95 wt % glycol ether acetate, preferably up to 85 wt. % glycol ether acetate, and/or up to 95 wt % glycol ether, preferably up to 85 wt. % glycol ether, and/or up to 15% ester, preferably up to 5 wt. % ester, and/or up to 40 wt % ketone, preferably up to 32 wt. % ketone, and/or up to 80 wt % alcohol, preferably up to 70 wt. % alcohol, and/or up to 30 wt % hydrocarbon, preferably up to 22 wt. % hydrocarbon, based on the total weight of the solvent; and/or wherein the binder further comprises: a thermosetting resin, preferably comprising one or both of acrylic resin and epoxy resin; and a curing catalyst for curing the thermosetting resin, preferably for thermally curing the thermosetting resin and/or for UV curing the thermosetting resin; and/or wherein the binder further comprises one of more functional additives, preferably selected from one or more of surfactants, rheology modifiers, dispersants, de-foamers, de-tackifiers, slip additives, anti-sag agents, levelling agents, surface active agents, surface tension reducing agents, adhesion promoters, anti-skinning agents, matting agents, coloring agents, dyes, pigments and wetting agents; and/or wherein the binder comprises: from 0.5 to 12 wt. % of the cross-linking agent, preferably from 1.5 to 7.7 wt. % of the cross-linking agent; from 10 to 40 wt. % of the thermoplastic resin, preferably from 11 to 30.4 wt. % of the thermoplastic resin; and from 40 to 85 wt. % solvent, preferably from 46.7 to 78.8 wt. % solvent; optionally: from 0.1 to 30 wt. % thermosetting resin and from 0.1 to 3 wt. % curing catalyst for curing the thermosetting resin, preferably from 1 to 10 wt. % thermosetting resin and from 0.1 to 1 wt. % curing catalyst for curing the thermosetting resin; and/or from 0.1 to 20 wt % functional additives, preferably from 1.7 to 17 wt. % functional additives.

    48. The composition of claim 45, further comprising conductive particles, preferably wherein the conductive particles: comprise one or more of metal particles, preferably selected from one or more of silver particles, copper particles, brass particles, nickel particles, gold particles, platinum particles, palladium particles, metal alloy particles, silver-coated copper particles, silver-coated brass particles, silver-nickel alloy particles and silver-copper alloy particles; and/or comprise carbon particles, preferably selected from one or more of graphite particles, graphite flakes, carbon black particles, graphene flakes, graphene particles and carbon nanotubes; and/or exhibit one or more of a mean particle size (d50) of from 1.25 to 7 μm, a tap density of from 2 to 4 g/cc, a surface area of from 0.3 to 2.1 m.sup.2/g, and an organic content of from 0.06 to 1.3 wt. %; and/or are in the form of one or more of flakes, spheres, irregularly shaped particles, nano-powders and nanowire.

    49. The composition of claim 48, comprising: from 30 to 85 wt % binder, preferably from 40.1 to 80.9 wt. % binder, and from 15 to 70 wt % conductive particles, preferably from 19.1 to 59.9 wt. % conductive particles; and/or wherein the composition comprises: from 30 to 85 wt % binder, preferably from 40.1 to 80.9 wt. % binder, and from 15 to 70 wt % conductive particles, preferably from 19.1 to 59.9 wt. % conductive particles, and wherein the binder comprises: from 0.2 to 6 wt. % cross-linking agent, preferably from 0.7 to 3.3 wt. % cross-linking agent, from 1 to 7.5 wt. % polyurethane resin, preferably from 1.7 to 4.5 wt. % polyurethane resin, from 0.1 to 5.5 wt. % polyester resin, preferably from 0.7 to 1.8 wt. % polyester resin, from 1 to 7.5 wt. % phenoxy resin, preferably from 2.5 to 6.6 wt. % phenoxy resin, from 0 to 10 wt. % thermosetting resin, preferably from 0 to 5.7 wt. % thermosetting resin, from 0 to 1 wt. % curing catalyst, preferably from 0 to 0.6 wt. % curing catalyst, from 0.2 to 10 wt % functional additives, preferably from 2.6 to 7.4 wt. % functional additives, from 0 to 60 wt % glycol ether acetate, preferably from 4.3 to 43.2 wt. % glycol ether acetate, from 0 to 40 wt % glycol ether, preferably from 0 to 24.1 wt. % glycol ether, from 0 to 5 wt. % ester, preferably from 0 to 1.7 wt. % ester, and from 0 to 30 wt % ketone, preferably from 0 to 20.5 wt. % ketone.

    50. The composition of claim 48 in the form of a conductive ink.

    51. The composition of claim 48 in the form of a conductive adhesive.

    52. The composition of any of claims 45, further comprising non-conductive particles, preferably wherein the non-conductive particles: comprise organic non-conductive particles, preferably selected from one or more of cellulose, wax, polymer microparticles, non-conductive carbon particles and graphene oxide; and/or comprise inorganic non-conductive particles, preferably selected from one or more of mica, silica (SiO.sub.2), fumed silica, talc, titanium dioxide (TiO.sub.2), alumina, barium titanate (BaTiO.sub.3), zinc oxide (ZnO) and boron nitride (BN), optionally wherein the inorganic non-conductive particles are sub-micron and micron sized; and/or exhibit a mean particle size (d50) of less than or equal to 10 μm.

    53. The composition of claim 52, comprising: from 0 to 50 wt. % non-conductive particles, preferably from 2 to 45 wt. % non-conductive particles, and from 50 to 100 wt. % binder, preferably from 55 to 98 wt. % binder; and/or wherein the composition comprises: from 40 to 100 wt. % binder, preferably 50 to 98 wt. % binder, and from 0 to 60 wt. % non-conductive particles, preferably from 2 to 50 wt. % non-conductive particles, and wherein the binder comprises: from 0.5 to 10 wt % cross-linking agent, preferably from 1.9 to 6.1 wt. % cross-linking agent, from 2 to 12 wt % polyurethane resin, preferably from 4.8 to 8.4 wt. % polyurethane resin, from 0.5 to 10 wt. % polyester resin, preferably from 1.9 to 5.3 wt. % polyester resin, from 2 to 18 wt % phenoxy resin, preferably from 4.5 to 12.4 wt. % phenoxy resin, from 0 to 30 wt. % thermosetting resin, preferably from 0 to 19.6 wt. % thermosetting resin, from 0 to 3 wt. % curing catalyst, preferably from 0 to 2 wt. % curing catalyst, from 0.3 to 17 wt. % functional additives, preferably from 1.4 to 12.5 wt. % functional additives, from 0 to 41.7 wt. % glycol ether acetate, preferably from 4.9 to 41.7 wt. % glycol, from 0 to 60 wt. % glycol ether, preferably from 0 to 43.8 wt. % glycol ether, from 0 to 30 wt. % ketone, preferably from 0 to 19.9 wt. % ketone, from 0 to 50 wt. % alcohol, preferably from 0 to 35.5 wt. % alcohol, and from 0 to 20 wt. % hydrocarbon, preferably from 0 to 13.3 wt. % hydrocarbon.

    54. The composition of claim 45 in the form of a dielectric ink.

    55. The composition of claim 45 in the form of a non-conductive adhesive.

    56. The composition of claim 45 in the form of an encapsulant.

    57. The composition of claim 45 further comprising a colorant and/or dye and/or pigment, the composition in the form of a graphic ink.

    58. A method of manufacturing the composition of claim 45, the method comprising: providing a solvent, providing a thermoplastic resin having a hydroxyl group, dissolving the thermoplastic resin in the solvent at a temperature of from 50 to 100° C., preferably from 70 to 100° C., cooling the solution to room temperature, optionally adding to the cooled solution one or more of functional additives, thermosetting resins, curing catalysts for curing the thermosetting resins, conductive particles and non-contacting particles.

    59. A method of manufacturing an in-mould electronic (IME) component, the method comprising: preparing a blank; and thermoforming the blank, wherein preparing the blank comprises forming one or more structures on a thermoformable substrate, each structure formed by a method comprising: disposing the composition of claim 45 on a thermoformable substrate, and drying the composition at a temperature of from 20 to 150° C. for from 0.5 to 60 minutes.

    60. The method of claim 59, wherein the one or more structures are selected from a conductive layer, a conducting track layer, an adhesive attachment layer, a dielectric layer, an encapsulant layer, a graphic layer and a barrier layer; and/or wherein the one or more structures comprises a multilayer stack; and/or wherein the one or more structures comprises a printed circuit board; and/or wherein disposing the composition comprises printing the composition, preferably screen-printing the composition; and/or wherein the substrate comprises polycarbonate (PC) and/or polyethylene terephthalate (PET); and/or wherein the thermoforming is carried out at a temperature of from 140° C. to 210° C. and/or at a pressure of from 0.25 MPa to 0.4 MPa and/or at a pressure ranging from 6 MPa to 12 MPa; and/or further comprising attaching one or more electronic devices to the blank using a conductive adhesive or a non-conductive adhesive, wherein the attaching takes place before and/or after thermoforming; and/or further comprising, after thermoforming, applying a layer of resin to the substrate using injection moulding, preferably wherein the resin comprises one or more of polycarbonate (PC), polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), polypropylene (PP), polyester, poly(methyl methacrylate) (PMMA), low density polyethylene (LDPE), high-density polyethylene (HDPE), polystyrene (PS) and thermoplastic polyurethane (TPU); and/or wherein the injection moulding is carried out at a temperature of from 170 to 330° C.; and/or wherein the in-mould electronic (IME) component comprises a capacitive touch switch, a resistive touch switch or a capacitive touch sensor, or wherein the in-mould electronic (IME) component comprises one or more of a display, a light/lamp, a sensor, an indicator and a haptic/touch feedback device.

    61. An in-mould electronic (IME) component manufactured according to the method of claim 59.

    62. An in-mould electronic (IME) component comprising the composition of claim 45.

    63. The in-mould electronic (IME) component of claim 61 comprising a capacitive touch switch or a resistive touch switch.

    64. The in-mould electronic (IME) component of claim 61 comprising one or more of a display, a light/lamp, a sensor, an indicator and a hepatic/touch feedback device.

    Description

    [0379] The invention will now be described in relation to the following non-limiting drawings in which:

    [0380] FIG. 1 shows a schematic representation of generic manufacturing process steps of In-mold Electronics Structures (IME).

    [0381] FIG. 2 shows a schematic diagram of ink stacks on the thermoformable PC substrate with different materials: Stack of Screen-Printed Silver Layer//Dielectric Layer//Graphic Layer coated Thermoformable PC substrate (90) and an image of an actual sample prepared using Example 1 (Silver Ink) an Example 47 (Dielectric Ink) on a black graphic ink coated thermoformable PC substrate (100), which produced structures 110, 120 and 130 upon thermoforming.

    [0382] FIG. 3 shows (a and b) representative optical images of a typical thermoformability test sample before and after thermoforming, respectively, as per the ‘Cone Formability Test Procedure’; (c and d) variation of electrical resistance of conducting Silver circuit traces of 1000 μm line width prepared using silver inks (Example 1, Example 2, Example 10 and Example 11), before and after thermoforming, respectively, as function of strain%.

    [0383] FIG. 4 shows (a and b) variation of electrical resistance of conducting Silver circuit traces of 1000 μm line width prepared using Silver Ink (Example 10) on various PC substrates, before and after thermoforming, respectively, as function of strain % as per the ‘Cone Formability Test Procedure’. FIG. 4(c) shows microscopic images of the conducting silver circuit traces of 1000 μm line width at 0, 30, 37 and 46% strain for the test samples as shown in FIG. 4(b).

    [0384] FIG. 5 shows (a and b) representative optical images of a typical “two-stack” prepared using Dielectric and Silver Inks, thermoformability test sample before and after thermoforming, respectively, as per the ‘Cone Formability Test Procedure’; (c and d) Variation of electrical resistance of conducting Silver circuit traces of 1000 pm line width of Silver Ink (Example 1) printed on Dielectric Ink (Example 33 & 35), Silver Ink Example 10 printed on Dielectric Ink (Example 33 & 35) and Silver Ink (Example 11) printed on Dielectric Ink (Example 35), before and after thermoforming, respectively.

    [0385] FIG. 6 shows (a and b) representative optical images of a typical “three-stack” prepared using Dielectric and Silver Inks, thermoformability test sample before and after thermoforming, respectively, as per the ‘Cone Formability Test Procedure’; (c and d) Variation of electrical resistance of conducting circuit traces of 1000 μm line width of Silver Ink (Example 10), where Barrier Dielectric layer and Protection layers were selected either as Example 35 or Example 47 or their combinations.

    [0386] FIG. 7 shows representative application of a thermoformable conductive adhesive composition (Example 7) for the attachment of SMD components on formable conducting Silver circuit traces (Example 10); (a) microscopic image of the dispensed dots (wet deposit); (b & c) microscopic images of the wet assembly of SMD 1206 chip and SMD 1206 LED, respectively on formable conducting Silver circuit traces (Example 10); (d & e) thermally cured and dried formed of (b) and (c).

    [0387] FIG. 8 shows representative optical images of a typical thermoformability test sample (a) before and (b) after thermoforming, respectively, as per the ‘Cone Formability Test Procedure. Thermoformable conductive adhesive (Example 7) has been used for the attachment of SMD 1206 chip and SMD 1206 LED on formable conducting Silver circuit traces (Example 10). Lightened LEDs on printed conductive tracks (a) before and (b) after thermoforming experiments, indicative of continuity of the circuit structures and corresponding stain locations.

    [0388] FIG. 9 shows a representative stack of Screen-Printed Silver Layer II Thermoformable PC substrate (140), which produced structure 150 upon injection molding.

    [0389] FIG. 10 shows representative design and construction of functional 3D electronic device; (a and b) are images of Handheld Type and (c and d) are Console types of Demonstrators capable of performing touch switching applications; produced by screen printing and drying of Example 1, followed attaching LED using Example 1 and then thermoforming the whole stack.

    [0390] FIG. 11 shows (a) a representative fully functional IME device, which can be viewed as a protype of a typical Airplane Console panel in switched off condition; (b) Demonstrate the capacitive touch switching applications of such IME demonstrator.

    [0391] The invention will now be described in relation to the following non-limiting examples.

    [0392] Key attributes of various fillers (conductive and non-conductive) used in the examples are set out in Table 1 below.

    TABLE-US-00001 TABLE 1 Mean Particle Tap Surface Organic Size Density Area Content (d50), Filler Type Filler Name (g/cc) (m.sup.2/g) (wt %) μm Conducting Silver Flake 1 3.5 1.01 0.57 4.4 Filler Silver Flake 2 3.2 1 0.42 7 Silver Flake 3 3.1 1.55 0.63 3.7 Silver Flake 4 2 2.1 1.31 1.5 Silver Flake 5 3.3 1.49 0.55 1.25 Ag Coated 4 0.47 0.07 4.5 Copper Flake Ag Coated 3.7 0.43 0.06 3.5 Brass Flake Nano Silver <1 0.03-0.1 Ag Coated <4 0.47 <0.1 4.5 Copper Flake Ag Coated <4 0.43 <0.1 3.5 Brass Flake Graphite Flake 11.25 <0.8 7.75 Graphene Powder 30-50 5 Non- Talc Powder 5.1 conducting Titanium <0.5 0.4 Filler Dioxide Powder Boron Nitride 0.35 10 Powder Barium Titanate 2.1 <0.5 1.3 Powder Silica Powder 5 Ceraflour 920 5 Ceraflour 929 8 Ceraflour 991 5

    Examples of Conductive Inks and Compositions

    [0393] Several compositions were prepared by dissolving mixture of thermoplastic polyester resins, polyurethane resins and phenoxy resins having hydroxyl functional groups in mixture of different category of solvents at 70-100° C. The reaction mixtures were cooled to room temperature followed by addition of functional additive package, containing surfactants, rheology modifier, dispersants, defoaming agents and wetting agents. Reactive cross-linkers and/or other acrylics or epoxy curing agents were then mixed well with the above polymer resin mixtures. The compositions were further mixed with several different conductive particles for the preparation of conductive inks, coatings and adhesive compositions. The conductive particles were mixed using an orbital mixer (1000 rpm for 1 min for 3 cycles). Certain compositions were also milled in a three-roll mill for a few minutes to obtain to obtain a homogeneous paste.

    [0394] Example 1 to Example 14 and Example 19 to Example 26 below are conductive compositions prepared without a thermosetting resin. Example 15 to Example 18 are conductive compositions prepared using a thermosetting resin and corresponding curing catalyst.

    Example 1

    [0395]

    TABLE-US-00002 Category of Raw Materials Chemical Name Weight % Cross-linker Maprenel MF650 1.4 (55% in isobutanol) Thermoplastic Dynapol L-411 1.4 Polyester Resin Thermoplastic Desmomelt 540/1 3.4 Polyurethane Resin Thermoplastic PKHH 5.0 Phenoxy Resin Functional Additives Functional Additives 2.7 Glycol Ether Acetate Eastman DE Acetate 22.3 Ketone C11-Ketone 10.7 Conductive Filler Silver Flake 1 53.2 Total 100.0 [0396] 53.2 weight % of Silver flake and 46.8 weight % of polymer solution of was mixed together using an orbital mixer at 1000 rpm for 1 min for 3 cycles to obtain a homogeneous paste. The viscosity of the paste was found to be in the range of 4000-7000 cP and is suitable for the screen printing.

    Examples 2-26

    [0397] Compositions having the components specified in Tables 2-6 below were prepared as per the process described in Example 1 above.

    TABLE-US-00003 TABLE 2 Chemical composition of Example 1 to Example 5. Ex- Ex- Ex- Ex- Ex- Category of Chemical ample ample ample ample ample Raw Materials Name 1 2 3 4 5 Cross-linker Maprenel 1.4 1.4 1.4 1.3 1.4 MF650 (55% in isobutanol) Thermoplastic Dynapol L-411 1.4 1.4 1.4 1.3 1.4 Polyester Resin Thermoplastic Desmomelt 3.4 3.5 3.5 3.2 3.5 Polyurethane Resin 540/1 Thermoplastic PKHH 5.0 5.1 5.1 4.7 5.1 Phenoxy Resin Functional Functional 2.7 5.7 5.7 5.3 5.7 Additives Additives Glycol Ether Eastman DE 22.3 23.0 23.0 26.8 23.0 Acetate Acetate Glycol Ether Eastman DB — 5.4 5.4 6.3 5.4 Solvent Ketone C11-Ketone 10.7 — — — — Conductive Filler Ag Flake 1 53.2 54.6 — — — Conductive Filler Ag Flake 2 — — 46.4 — — Conductive Filler Ag Flake 4 — — 8.2 51.1 — Conductive Filler Ag Flake 5 — — — — 54.6 Total 100.0 100.0 100.0 100.0 100.0

    TABLE-US-00004 TABLE 3 Chemical composition of Example 6 to Example 10. Ex- Ex- Ex- Ex- Ex- Category of Chemical ample ample ample ample ample Raw Materials Name 6 7 8 9 10 Cross-linker Maprenel 1.8 1.5 1.4 1.4 1.4 MF650 (55% in isobutanol) Thermoplastic Dynapol L-411 1.8 1.5 1.4 1.4 1.4 Polyester Resin Thermoplastic Desmomelt 4.5 3.8 3.5 3.5 3.4 Polyurethane 540/1 Resin Thermoplastic PKHH 6.6 5.5 5.1 5.1 5.0 Phenoxy Resin Functional Functional 7.4 6.2 5.7 5.7 5.6 Additives Additives Glycol Ether Eastman DE 16.5 17.4 — — 2.8 Acetate Acetate Glycol Ether Propylene — — 8.5 4.3 4.2 Acetate glycol monomethyl ether acetate Glycol Ether Downol PPH — — — 4.3 2.8 Glycol Ether Eastman DB 3.9 4.1 19.9 19.9 19.6 Solvent Conductive Filler Ag Flake 1 — — 54.6 54.6 53.9 Conductive Filler Ag Flake 3 57.4 51.0 — — — Conductive Filler Ag Flake 4 — 8.9 — — — Total 100.0 100.0 100.0 100.0 100.0

    TABLE-US-00005 TABLE 4 Chemical composition of Example 11 to Example 16. Ex- Ex- Ex- Ex- Ex- Ex- Category of Chemical ample ample ample ample ample ample Raw Materials Name 11 12 13 14 15 16 Cross-linker Maprenel 1.4 1.4 1.4 1.4 0.7 0.7 MF650 (55% in isobutanol) Thermoplastic Dynapol 1.4 1.4 1.4 1.4 0.7 0.7 Polyester Resin L-411 Thermoplastic Desmomelt 3.4 3.4 3.4 3.4 1.7 1.7 Polyurethane 540/1 Resin Thermoplastic PKHH 5.0 5.0 5.0 5.0 2.5 2.5 Phenoxy Resin Acrylate Resin Ebecryl-8413 — — — — 2.9 2.9 Acrylate Resin Ebecryl-1300 — — — — 2.9 2.9 Curing Catalyst Omnirad-73 — — — — — 0.6 for Acrylate Resin (UV Catalyst) Curing Catalyst Luperex DI — — — — 0.6 — for Acrylate Resin (Thermal Catalyst) Functional Functional 5.6 5.6 5.6 5.6 2.8 2.8 Additives Additives Glycol Ether Eastman DE 2.8 2.8 2.8 2.8 2.8 2.8 Acetate Acetate Glycol Ether Propylene 4.2 4.2 4.2 4.2 4.2 4.2 Acetate glycol monomethyl ether acetate Glycol Ether Downol PPH 2.8 2.8 2.8 2.8 2.8 2.8 Glycol Ether Eastman DB 19.6 19.6 19.6 19.6 19.6 19.6 Solvent Conductive Ag Flake 1 — 16.2 37.7 8.1 56.0 56.0 Filler Conductive Ag Flake 2 45.8 37.7 16.2 45.8 — — Filler Conductive Ag Flake 4 8.1 — — — — — Filler Total 100.0 100.0 100.0 100.0 100.0 100.0

    TABLE-US-00006 TABLE 5 Chemical composition of Example 17 to Example 21. Ex- Ex- Ex- Ex- Ex- Category of ample ample ample ample ample Raw Materials Chemical Name 17 18 19 20 21 Cross-linker Maprenel 1.4 1.4 1.2 1.4 1.4 MF650 (55% in isobutanol) Cross-linker Vestanat B — — 2.0 — — (blocked 1358A isocyanate) Thermoplastic Dynapol L-411 1.4 1.4 1.2 1.4 1.4 Polyester Resin Thermoplastic Desmomelt 540/1 3.4 3.4 3.0 3.5 3.5 Polyurethane Resin Thermoplastic PKHH 2.5 2.5 4.4 5.1 5.1 Phenoxy Resin Epoxy Resin EPON 1001F 2.5 2.5 — — — (Hexion) Curing Catalyst 2E4MZ-CN 0.3 — — — — for Epoxy Resisn Curing Diphenylio- — 0.3 — — — Catalyst for donium Epoxy Resin hexafluoro- (UV Catalyst) phosphate Functional Functional 5.7 5.7 4.9 5.7 5.7 Additives Additives Glycol Ether Eastman DE 2.8 2.8 2.5 23.0 23.0 Acetate Acetate Glycol Ether Propylene glycol 4.2 4.2 3.7 — — Acetate monomethyl ether acetate Glycol Ether Downol PPH 2.8 2.8 2.5 — — Glycol Ether Eastman DB 19.4 19.4 17.3 5.4 5.4 Solvent Conductive Ag Flake 1 53.9 53.9 57.2 — — Filler Conductive Silver Coated — — — 54.6 — Filler Copper Flake Conductive Silver Coated — — — — 54.6 Filler Brass Flake Total 100.0 100.0 100.0 100.0 100.0

    TABLE-US-00007 TABLE 6 Chemical composition of Example 22 to Example 26. Ex- Ex- Ex- Ex- Ex- Category of Chemical ample ample ample ample ample Raw Materials Name 22 23 24 25 26 Cross-linker Maprenel 1.7 1.7 1.3 1.4 1.4 MF650 (55% in isobutanol) Thermoplastic Dynapol L-411 1.7 1.7 1.3 1.4 1.4 Polyester Resin Thermoplastic Desmomelt 4.2 4.2 3.8 3.5 3.5 Polyurethane 540/1 Resin Thermoplastic PKHH 6.2 6.2 4.7 5.1 5.1 Phenoxy Resin Functional Functional 3.4 3.4 2.6 5.7 5.7 Additives Additives Glycol Ether Eastman DE 43.2 43.2 21.2 23.0 23.0 Acetate Acetate Glycol Ether Eastman DB — — — 5.4 5.4 Solvent Ester Dibasic Ester — — 1.7 — — (DBE) Ketone C11-Ketone 20.5 20.5 10.1 — — Conductive Filler Ag Flake 1 — — 53.2 51.9 46.5 Conductive Filler Graphite Flake 16.8 — — — — Conductive Filler Graphene — 16.8 0.1 — — Powder Conductive Filler Carbon Black 2.3 2.3 — — — Conductive Filler Ag MoC (Silver — — — — 2.7 neodecanoate) Conductive Filler Nano Silver — — — — 8.2 Total 100.0 100.0 100.0 100.0 100.0

    Examples Non-Conductive Inks and Compositions

    [0398] Several compositions were prepared by dissolving mixture of thermoplastic polyester resins, polyurethane resins and phenoxy resins having hydroxyl functional groups in mixture of different category of solvents at 70-100° C. The reaction mixtures were cooled to room temperature followed by addition of functional additive package, containing surfactants, rheology modifier, dispersants, defoaming agents and wetting agents. Reactive cross-linkers and/or other acrylics or epoxy curing agents were then mixed well with the above polymer resin mixtures. The compositions were further mixed with several different conductive particles for the preparation of conductive inks, coatings and adhesive compositions. The conductive particles were mixed using an orbital mixer (1000 rpm for 1 min for 3 cycles). Certain compositions were also milled in a three-roll mill for a few minutes to obtain to obtain a homogeneous paste.

    [0399] Example 27 to Example 36 and Example 41 to Example 61 below are conductive compositions prepared without a thermosetting resin. Example 37 to Example 40 are conductive compositions prepared using a thermosetting resin and corresponding curing catalyst.

    Example 27

    [0400]

    TABLE-US-00008 Raw Material Category Chemical Name Weight % Cross-linker Maprenel MF650 2.1 (55% in isobutanol) Thermoplastic Dynapol L-411 2.1 Polyester Resin Thermoplastic Desmomelt 540/1 5.2 Polyurethane Resin Thermoplastic PKHH 7.7 Phenoxy Resin Functional Additives Functional Additives 3.9 Glycol Acetate Eastman DE Acetate 34.2 Glycol Ether Downol PPH 7.3 Glycol Acetate Propylene glycol 7.3 monomethyl ether acetate Non-conductive Filler Talc Powder 28.3 Non-conductive Filler Ceraflour 920 1.8 Total 100.0

    [0401] 30.1 weight % of mixture talc and organic filler and 69.9 weight % of polymer solution of was mixed together using an orbital mixer at 1000 rpm for 1 min for 3 cycles to obtain a homogeneous paste. The viscosity of the paste was found to be in the range of 11000-15000 cP and is suitable for the screen printing.

    Examples 28 to 61

    [0402] Compositions having the components specified in Tables 7-11 below were prepared as per the process described in Example 27 above.

    TABLE-US-00009 TABLE 7 Chemical composition of Example 27 to Example 34. Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- Category of Chemical ample- ample- ample- ample- ample- ample- ample- ample- Raw Materials Name 27 28 29 30 31 32 33 34 Cross-linker Maprenel 2.1 2.2 2.2 2.2 3.1 3.2 2.2 3.2 MF650 (55% in isobutanol) Thermoplastic Dynapol 2.1 2.2 2.2 2.2 3.1 3.2 2.2 3.2 Polyester Resin L-411 Thermoplastic Desmomelt 5.2 5.5 5.5 5.5 7.8 8.1 5.6 8.1 Polyurethane 540/1 Resin Thermoplastic PKHH 7.7 8.0 8.0 8.0 11.4 11.8 8.1 11.8 Phenoxy Resin Functional Functional 3.9 4.1 4.1 4.1 5.8 1.5 1.4 2.0 Additives Additives Glycol Ether Eastman DE 34.2 — — — 39.6 32.8 26.1 33.3 Acetate Acetate Glycol Ether Butyl Carbitol — 5.1 5.1 5.1 — — — — Acetate Acetate Glycol Ether Propylene glycol 7.3 10.2 10.2 5.1 — — — — Acetate monomethyl ether acetate Ketone C11-Ketone — — — — 17.0 15.6 12.5 15.9 Glycol Ether Downol PPH 7.3 — — — — — — — Glycol Ether Butyl Carbitol — — 35.5 5.1 — — 10.6 — Glycol Ether Propylene glycol — — — — — — 3.8 12.0 monomethyl ether Hydrocarbon Aromatic 150 — — — — — 13.3 — — Fluids Alcohol Terpineol — 35.5 — 35.5 — — Non-conductive Talc 28.3 26.8 26.8 26.8 11.6 10.4 27.6 10.4 Filler Non-conductive Ceraflour 920 1.8 0.5 0.5 0.5 0.6 — — — Filler Total 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0

    TABLE-US-00010 TABLE 8 Chemical composition of Example 35 to Example 40. Ex- Ex- Ex- Ex- Ex- Ex- Category of Chemical ample- ample- ample- ample- ample- ample- Raw Materials Name 35 36 37 38 39 40 Cross-linker Maprenel 2.5 2.7 1.9 1.9 2.5 2.5 MF650 (55% in isobutanol) Thermoplastic Dynapol 2.5 2.7 1.9 1.9 2.5 2.5 Polyester Resin L-411 Thermoplastic CAB 381-2 — 2.7 — — — — Polyester Resin Thermoplastic Desmomelt 6.2 6.7 4.8 4.8 6.1 6.1 Polyurethane 540/1 Resin Thermoplastic PKHH 9.0 7.4 7.1 7.1 4.5 4.5 Phenoxy Resin Epoxy Resin EPON 1001F — — — — 4.5 4.5 (Hexion) (Bisphenol A based) Acrylate Resin Ebecryl 8413 — — 9.8 9.8 — — Acrylate Resin Ebecryl 1300 — — 9.8 9.8 — — Curing Catalyst 2E4MZ-CN — — — — 0.4 — for Epoxy Resin Curing Catalyst Diphenyl- — — — — — 0.4 for Epoxy Resin iodonium (UV Catalyst) hexafluoro- phosphate Curing Catalyst ACHN — — 2.0 — — — for Acrylate Resin Curing Catalyst Omnirad- — — — 2.0 — — for Acrylate 1173 Resin Functional Functional 10.1 9.0 7.9 7.9 10.0 10.0 Additives Additives Glycol Ether Butyl Carbitol 4.9 Acetate Acetate Glycol Ether Propylene 15.2 11.9 11.9 15.1 15.1 Acetate glycol monomethyl ether acetate Ketone C11-Ketone — 4.9 — — — — Glycol Ether Butyl Carbitol 35.5 27.8 27.8 35.2 35.2 Hydrocarbon Aromatic — 4.8 — — — — 150 Fluids Alcohol Terpineol — 33.9 — — — — Non-conductive Talc 19.0 19.9 14.9 14.9 19.3 19.3 Filler Non-conductive Ceraflour 920 — 0.6 — — — — Filler Total 100.0 100.0 100.0 100.0 100.0 100.0

    TABLE-US-00011 TABLE 9 Chemical composition of Example 41 to Example 48. Category Ex- Ex- Ex- Ex- Ex- Ex- Ex- Ex- of Raw Chemical ample- ample- ample- ample- ample- ample- ample- amtext missing or illegible when filed Materials Name 41 42 43 44 45 46 47 48 Cross-linker Maprenel 2.3 2.4 3.4 3.4 3.4 2.5 2.9 3.2 MF650 (55% in isobutanol) Curing Vestanat B 3.8 — — — — — — — Catalyst for 1358A from polyol Evonik Thermoplastic Dynapol 2.3 2.4 3.4 3.4 3.4 2.5 2.9 3.2 Polyester L-411 Resin Thermoplastic Desmomelt 5.7 5.9 8.4 8.4 8.4 6.2 7.3 7.9 Polyurethane 540/1 Resin Thermoplastic PKHH 8.4 8.6 12.4 12.4 12.4 9.0 10.6 11.7 Phenoxy Resin Functional Functional 9.4 9.6 6.8 6.8 6.8 10.1 11.9 6.5 Additives Additives Glycol Ether Eastman DE — — 41.2 41.2 41.2 — — 38.8 Acetate Acetate Glycol Ether Propylene 14.1 14.5 — — — 15.2 17.9 — Acetate glycol monomethyl ether acetate Ketone C11-Ketone — — 19.5 19.5 19.5 — — 18.4 Glycol Ether Butyl Carbitol 32.9 33.7 — — — 35.5 41.7 Non- Talc 21.1 23.1 — — — 4.8 10.4 conductive Filler Non- Silica — — — — — 19.0 — — conductive Filler Non- Ceraflour 991 — — — — 5.0 — — — conductive Filler Non- Ceraflour 929 — — — 5.0 — — — — conductive Filler Non- Ceraflour 920 — — 5.0 — — — — conductive Filler Total 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 text missing or illegible when filed indicates data missing or illegible when filed

    TABLE-US-00012 TABLE 10 Chemical composition of Example 49 to Example 55. Ex- Ex- Ex- Ex- Ex- Ex- Ex- Category of Chemical ample- ample- ample- ample- ample- ample- ample- Raw Materials Name 49 50 51 52 53 54 55 Cross-linker Maprenel 3.2 2.1 3.1 3.2 2.2 2.2 2.1 MF650 (55% in isobutanol) Thermoplastic Dynapol 3.2 2.1 3.1 3.2 2.2 2.2 2.1 Polyester Resin L-411 Thermoplastic Desmomelt 8.1 5.1 7.6 8.0 5.4 5.4 5.1 Polyurethane 540/1 Resin Thermoplastic PKHH 11.8 7.4 11.1 11.7 7.9 7.8 7.5 Phenoxy Resin Functional Functional 1.5 2.6 12.5 2.3 2.8 2.8 2.6 Additives Additives Glycol Ether Eastman DE 41.7 — — 41.4 — — — Acetate Acetate Glycol Ether Dipropylene — 8.5 — — 8.0 8.1 8.6 Glycol Acetate Methyl Ether Acetate Glycol Ether Propylene — 0.0 18.8 — — — — Acetate glycol monomethyl ether acetate Ketone C11-Ketone 19.9 — — 19.7 — — — Glycol Ether Dipropylene — 17.1 — — 15.9 16.2 17.2 Glycol Methyl Ether Glycol Ether Butyl Carbitol — 17.1 43.8 0.0 15.9 16.2 17.2 Non-conductive Talc 10.4 1.1 — 10.4 — — 1.1 Filler Non-conductive Titanium — 36.1 — 0.0 39.6 39.3 36.4 Filler Dioxide Non-conductive Silica — 0.8 — — — — — Filler Total 100.0 100.0 100.0 100.0 100.0 100.0 100.0

    TABLE-US-00013 TABLE 11 Chemical composition of Example 56 to Example 61. Ex- Ex- Ex- Ex- Ex- Ex- Category of Chemical ample- ample- ample- ample- ample- ample- Raw Materials Name 56 57 58 59 60 61 Cross-linker Maprenel 2.1 2.3 2.2 2.5 2.1 2.1 MF650 (55% in isobutanol) Thermoplastic Dynapol 2.1 2.3 2.2 2.5 2.1 2.1 Polyester Resin L-411 Thermoplastic Desmomelt 5.1 5.7 5.4 6.2 5.2 5.1 Polyurethane 540/1 Resin Thermoplastic PKHH 7.5 8.3 7.8 9.0 7.6 7.5 Phenoxy Resin Functional Functional 2.6 3.0 2.8 10.5 2.7 2.6 Additives Additives Glycol Ether Eastman DE — — — 4.8 — — Acetate Acetate Glycol Ether Dipropylene 8.6 25.5 8.1 — 8.3 8.6 Acetate Glycol Methyl Ether Acetate Glycol Ether Propylene — — — 14.8 — — Acetate glycol monomethyl ether acetate Glycol Ether Dipropylene 17.1 — 16.2 — 16.5 17.2 Glycol Methyl Ether Glycol Ether Butyl 17.1 28.1 16.2 30.5 16.5 17.2 Carbitol Non-conductive Talc 1.1 — — 19.2 1.2 1.1 Filler Non-conductive Titanium 36.2 — 39.3 — 37.1 Filler Dioxide Non-conductive BN — — — — — 36.4 Filler Non-conductive Barium — 24.8 — — — — Filler Titanate Non-conductive Fumed 0.5 — — — — Filler Silica Non-conductive Ceraflour — — — — 0.7 — Filler 991 Total 100.0 100.0 100.0 100.0 100.0 100.0

    Thermoforming and Injection Molding Performances: Construction of 3D Electronics:

    [0403] Conductive and Dielectric compositions disclosed above are characterized thoroughly and tested for screen printing, electrical performances, compatibility among different inks and substrates (PC and PET), tested for adhesion and stability under different accelerated environmental testing conditions. These inks further tested for thermal stability, thermoforming, and injection molding stability.

    [0404] For example, Table 12 below summarizes various characteristics and testing performance attributes of conducting compositions as described in Example 1 to Example 26.

    TABLE-US-00014 TABLE 12 Characterization and testing performance testing results of various conducting compositions (Example 1 to Example 26) Surface Resis- tance; Change of Resistance after Viscosity Before Thermoforming as per ‘Cone @ 5 Ad- Thermo- Formability Test Procedure’ Injection rpm, cP Solid hesion forming for 1000 μm line width of PC Molding (Cone content, (PC/ (mΩ/ @30% @37% @46% Wash out Examples and Plate) (Wt %) PET) Sq/mil) Strain Strain Strain Stability Example 1 4000-7000 62-68 5B 40-45 2 3 6 Good Example 2  9000-13000 62-68 5B 40-45 3 3 5 Good Example 3  8000-12000 62-68 5B 30-35 2 3 7 NM Example 4 5000-8000 60-64 5B 20-25 2 3 4 NM Example 5  8000-11000 62-68 5B 40-45 1 2 3 NM Example 6 40000-60000 62-68 NM NM NM NM NM NM Example 7 45000-55000 70-74 5B 40-50 1 2 3 NM Example 8  9000-12000 62-68 5B 30-35 2 2 3 NM Example 9 13000-17000 62-68 5B 30-35 2 3 3 NM Example 10  8000-12000 62-68 5B 30-35 1.5 2 3 Excellent Example 11 13000-16000 62-68 5B 20-25 1 2 3 Excellent Example 12  8000-12000 62-68 5B 20-25 2 3 4 NM Example 13  8000-12000 62-68 5B 20-25 2 3 5 NM Example 14  8000-12000 62-68 5B 20-25 2 3 NM Example 15 13000-17000 62-68 NM NM NM NM NM NM Example 16 10000-15000 62-68 NM NM NM NM NN NM Example 17 3000-5000 62-68 5B 30-35 2 3 5 NM Example 18 13000-17000 62-68 NM NM NM NM NM NM Example 19 15000-20000 62-68 NM NM NM NM NM NM Example 20  8000-12000 62-68 NM NM NM NM NM NM Example 21  8000-12000 62-68 NM NM NM NM NM NM Example 22  7000-11000 30-40 NN 26000 22 NM NM NM Example 23  7000-11000 30-40 NM 22000 20 NM NM NM Example 24  6000-10000 62-68 5B 45 1.5 2.5 4 NM Example 25 15000-20000 50-65 NM NM NM NM NM NM Example 26 20000-25000 50-65 NM NM NM NM NM NM

    [0405] Further, Table 13 below summarizes various characteristics and testing performance attributes of non-conducting compositions as described in Example 27 to Example 61.

    TABLE-US-00015 TABLE 13 Characterization and testing performance testing results of various non-conducting compositions (Example 27 to Example 61) Injection Viscosity @ Molding Examples 5 rpm, cP Solid Adhesion Wash out Number (Cone and Plate) content, % (PC/PET) Stability Example 27 11000-15000 45-50% 3B-4B NA Example 28 16000-20000 45-50% 3B NA Example 29 14000-17000 45-50% 4B NA Example 30 16000-20000 45-50% 4B NA Example 31 14000-17000 35-40% 4B NA Example 32 16000-20000 35-40% 5B Excellent Example 33 16000-20000 45-50% 5B Excellent Example 34 11000-14000 35-40% 5B Excellent Example 35 11000-15000 35-40% 5B Excellent Example 36 14000-17000 43-48% 3B NA Example 37 11000-14000 45-50% 4B NM Example 38 11000-14000 45-50% 4B NM Example 39 10000-14000 45-50% NM NM Example 40 10000-14000 45-50% NM NM Example 41  9000-14000 45-50% NM NM Example 42 11000-14000 45-50% 5B Excellent Example 43 16000-19000 30-35% NM NA Example 44 11000-14000 30-35% 4B NA Example 45 11000-14000 30-35% NM NA Example 46 10000-14000 45-50% NM NM Example 47 10000-16000 35-45% 5B NA Example 48 12000-18000 35-40% NM NA Example 49 14000-17000 35-40% NM NA Example 50  9000-14000 55-58% 5B NA Example 51 4000-7000 23-28% 5B NA Example 52 16000-19000 35-40% 5B NA Example 53 40000-44000 57-62% 5B NA Example 54 36000-41000 57-62% 5B NA Example 55 25000-30000 57-62% 5B NA Example 56 25000-30000 57-62% 5B NA Example 57  70000-130000 57-62% 5B NA Example 58 50000-70000 57-62% 5B NA Example 59  8000-14000 38-42% 5B Excellent Example 60 15000-18000 55-59% 5B NA Example 61 20000-27000 57-62% NM NA

    [0406] Intercompatibility of conductive and nonconductive materials along with compatibility with different flexible polymer substrates, decorative inks, adhesives, encapsulants and injection molding resins are important aspects for the manufacturing of IME and similar structures.

    Compatibility of Wet Silver Ink Compositions with Various PC Substrates

    [0407] The wet silver ink compositions are highly compatible with various PC substrates. The compatibility of wet silver inks (Example 1, 17, 23 and 25) with PC film substrates (Makrafol DE1.4) was investigated, with microscopic images of screen printed patterns (1000 μm line) of wet silver inks being captured at different time intervals (immediately, i.e., 0 min, 1, 2, 3, 5 and 15 min) before drying using a jet dryer. These results depict very good compatibility of silver inks with PC substrates.

    Inter-Compatibility of Silver Ink and Dielectric Ink Compositions, and Compatibility with Various Nascent and Graphic Coated PET and PC Substrates

    [0408] The disclosed silver ink and dielectric ink compositions are highly intercompatible and compatible with various nascent and graphic coated PET and PC substrates.

    [0409] Adhesion tests (tested as per ASTM F1842-09) to demonstrate the compatibility of dried Silver and Dielectric Inks with various polymer film substrates (PC, PET and graphic coated PC film substrates) were carried out. Table 14 below summarizes the representative adhesion test results of silver ink (Example 2) and dielectric ink (Example 33 and 34) on various nascent PET (MacDermid Autotype AHU5, CT5 and HT5), nascent PC (Makrafol DE1.4) and graphic ink printed on PC (MacDermid Autotype XFG2502L-HTR952) film substrates. Table 4 also summarizes representative adhesion test results of silver ink (Example 2) on dielectric ink (Example 33 and 34) coated on various nascent PET (MacDermid Autotype AhU5, CT5 and HT5), nascent PC (Makrafol DE1.4) and graphic ink printed on PC (MacDermid Autotype XFG2502L-HTR952) film substrates.

    TABLE-US-00016 TABLE 14 Silver Dielectric Dielectric Substrate Substrate Ink Ink Ink Type Coating Example 2 Example 34 Example 33 PET (AHU5) Nascent 5B 5B 5B Example 33 5B — — Example 34 5B — — PET (HT5) Nascent 5B 5B 56 Example 33 5B — — Example 34 5B — — PET (CT5) Nascent 58 58 5B Example 33 5B — — Example 34 5B — — PC (Makrafol Nascent 56 58 5B DE1.4) Example 33 58 — — Example 34 5B — — Graphic Printed Nascent 5B 5B 5B PC (XFG2502L- Example 33 5B — — HTR952) Example 34 5B — —

    [0410] Adhesion tests were also carried out on the following: [0411] silver Ink (Example 1) printed on nascent PC (Makrafol DE1.4), [0412] silver ink (Example 1) printed on dielectric Ink (Example 32) coated on nascent PC (Makrafol DE1.4), [0413] silver ink (Example 1) printed on graphic ink printed PC (MacDermid Autotype XFG2502L-HTR952), [0414] silver ink (Example 1) printed on dielectric Ink (Example 32) coated on graphic ink printed PC (MacDermid Autotype XFG2502L-HTR952), [0415] dielectric Ink (Example 32) on nascent PC (Makrafol DE1.4), graphic ink (Example 32) printed on PC (MacDermid Autotype XFG2502L-HTR952), [0416] multilayer stack of silver ink (Example 10)/dielectric ink (Example 53)/silver ink (Example 10) on nascent PC (Makrafol DE1.4), [0417] multilayer stack of silver ink (Example 10)/dielectric ink (Example 54)/silver ink (Example 10) on nascent PC (Makrafol DE1.4).

    [0418] All these samples show 5B adhesion test results as per ASTM F1842-09.

    Accelerated Environmental Testing

    [0419] The disclosed silver ink and dielectric ink compositions are highly robust and stable when tested at different accelerated environmental test conditions as per JEDEC 22-A101 (Environmental Testing, 85° C/85 RH) and IEC 60068-2-2 (Thermal Aging Test/Dry Heat Test). A typical test structure consisted of 500 μm lines of conducting silver circuit traces prepared by screen printing on nascent PC and drying by jet drying. Electrical resistances of these lines are measured before and after exposing to either 85° C/85 RH or 110° C. for 100-1000 h. Also, a stack of Dielectric Ink//Silver Ink//Dielectric Ink samples were also prepared and electrical resistances conducting silver circuit traces were measured. Further, adhesion of these inks was tested as per as per ASTM F1842-09 after exposing these samples to either 85° C./85 RH or 110° C. for 100 -1000 h.

    [0420] Table 5 summarizes percentage of change of electrical resistance (% AR, calculated as per Equation 1) of the representative test structures prepared using Silver Ink (Example 10) and a stack of Dielectric Ink (Example 47)//Silver Ink (Example 10)//Dielectric Ink (Example 47) on nascent PC (Makrafol DE1.4) after exposing to 85° C/85 RH or 110° C. for 100h.


    Percentage of change of electrical resistance (%JR)=[Resistance after−Resistance before/Resistance before]  (Equation 1)

    [0421] Adhesion testing of the above reliability test structures after exposure to environmental testing conditions were conducted as per ASTM F1842-09 and results are summarized in Table 15.

    TABLE-US-00017 TABLE 15 Percentage of change of electrical resistance (% ΔR, calculated as per Equation 1) of various representative test structures after exposing to 85° C./85 RH or 110° C. for 100 h. 85° C./85 RH for 100 h 110° C. for 100 h Drying Adhesion Adhesion Test Structure Condition (% ΔR) Results (% ΔR) Results A test pattern 120° C. for −6.1 5B −6.7 5B consists of 500 μm 6 min. lines of Silver 120° C. for −3.4 5B −6.1 5B Ink (Example 10) 6 min followed printed on nascent PC by 80° C. (Makrafol DE1.4). stoving for 5 h. A stack prepared Silver Ink dried −1.9 5B −1.1 5B on nascent PC for 120° C. substrate for 6 min and two (Makrafol DE1.4) layers of consist of: Dielectric Ink rectangle pattern dried for of Dielectric Ink 120° C. 4 min (Example 47, two- (1.sup.st layer) and 8 min layers) // test (2.sup.nd layer). traces of Silver Ink Silver Ink dried −0.6 5B −0.2 5B (Example 10, for 120° C. for 500 μm line width), 6 min and printed on the first Dielectric Ink Dielectric Ink dried for layer) // rectangle 120° C. 4 min pattern of (1.sup.st layer) and Dielectric Ink 8 min (2.sup.nd (Example 47, two- layer). Overall layers) to cover stack stoved the silver test at 80° C. for traces. 5 h.
    Stack of Screen-Printed Silver Layer//Dielectric Layer//Graphic Layer coated Thermoformable PC Substrate

    [0422] FIG. 2 shows a representative stack of screen-printed silver layer//dielectric layer//graphic layer coated thermoformable PC substrate (MacDermid Autotype Xtraform PC) (90) and an image sample prepared using Example 1 (silver ink) an Example 47 (dielectric ink) on a black graphic ink coated thermoformable PC substrate, which produced structures 110, 120 and 130 upon thermoforming. The interconnect lines printed in these structures are electrically connecting and do not show significant change of resistance after thermoforming. For the thermoforming process, screen printed samples as shown in FIG. 2, 100 as well as component mounted samples were expose to the temperature 170 ±2° C. for 30-35 seconds. The printed traces were faced to the heater during the thermoforming process. On exposure to heat, printed substrates get soften and placed over the forming tool under vacuum pressure of 4 Bar for 10-15 secs to get 3D thermoformed substrates as shown in FIGS. 2 as 110, 120 and 130. The images shown in FIGS. 2, 100, 110, 120 and 130 are correspond to Example 1. Similarly, Example 2, Example 4, Example 33, Example 34, Example 35 and Example 42 printed structures were also tested for thermoforming performances with different combinations on PC and PET substrates and found to be thermoformable.

    [0423] One of the key attribute of the conductive and non-conductive compositions is the thermoformability. This is particularly important for IME and similar applications. To assess thermoformability of the 2D circuit traces, formed into 3D circuits/devices, a cone structure test vehicle was employed. To determine the thermoforming attribute of the traces an in-house developed procedure referred to as ‘Cone Formability Test Procedure’ was used. In this procedure, conductivity of a series of circuit traces is measure on a flat polymeric substrate. After forming, change in electrical resistance along with other failure mechanisms is used to assess the degree of thermoformability. This test structure has straight line traces with 150 μm, 300 μm, 500 μm and 1000 μm line widths. These flat line structures are thermoformed into a cylindrical conical shape that can be positive or negative. During thermoforming, various traces experience stretching that can vary from 0 to 58%. Key performance metric that determines thermoformability to be stretched without breaking or delaminating from the substrate and preferably with a low change in electrical resistance.

    Thermoforming Attribute of Silver Inks

    [0424] Thermoforming attributes of silver inks were evaluated as per the ‘Cone Formability Test Procedure’ as described previously. In a typical process, silver ink was printed on a thermoformable polymer substrate (eg. PC or PET) and electrical resistances of the conducting test circuits were measured before and after thermoforming process to record the change of resistance at various % strain. FIG. 3a and FIG. 3b show representative images of a typical test sample of before and after thermoforming, respectively on a thermoformable PC substrate (Makrafol DE1.4). After forming, change in electrical resistance along with other failure mechanisms is used to assess the degree of thermoformability. For example, FIG. 3c and FIG. 3d, show the variation of electrical resistance of conducting Silver circuit traces of 1000 μm line width of Silver Inks (Example 1, Example 2, Example 10 and Example 11), before and after thermoforming, respectively. The resistance before (FIG. 3c) and after (FIG. 3d) thermoforming are plotted as a function of % strain location and strain %, respectively. During thermoforming, the circuit lines/traces are formed into a shape of cone. As a result, the circuit line traces undergo stretching.

    Compatibility and Thermoforming Attribute of Silver Inks with Various PC Substrates

    [0425] Compatibility and thermoforming attribute of silver inks with various PC substrates were evaluated as per the ‘Cone Formability Test Procedure’ as described previously. In a typical process, silver ink was printed on different types of thermoformable PC substrate (DE as Makrafol DE1.4, V3 as MacDermid Autotype XFG250 M HCL V3, and 2L as MacDermid Autotype XFG250 2L substrates) as well as graphic Ink coated PC substrate (GCPC as MacDermid Autotype XFG2502L-HTR952). Since, graphic ink coated PC substrate (GCPC) was found mildly conducting, to avoid shorting, a layer of Dielectric Ink (Example 33) was printed before printing of Silver inks. Electrical resistances of the Silver conducting test circuits were measured before and after thermoforming process to record change of resistance at various % strain. After forming, change in electrical resistance along with other failure mechanisms is used to assess the degree of thermoformability. For example, FIG. 4a and FIG. 4b, show the variation of electrical resistance of conducting Silver circuit traces of 1000 μm line width of Silver Inks (Example 10) on various PC substrates, before and after thermoforming, respectively. The resistance before (FIG. 4a) and after (FIG. 4b) thermoforming are plotted as a function of % strain location and strain %, respectively. During thermoforming, the circuit lines/traces are formed into a shape of cone. As a result, the circuit line traces undergo stretching. FIG. 4c shows the microscopic images of the conducting Silver circuit traces of 1000 μm line width at 30, 37 and 46% strain of Silver Inks (Example 10) on various PC substrates, revealed very minimum distortion below 40% strain.

    Compatibility and Thermoforming Attribute of a Two-Stack, Dielectric and Silver Inks

    [0426] Compatibility and thermoforming attribute of a two-stack, Dielectric and Silver Inks were evaluated as per the ‘Cone Formability Test Procedure’ as described previously. A typical two-stack circuit assembly was prepared by first printing of a Dielectric ink layer (Barrier Dielectric layer) on a thermoformable polymer substrate (eg. PC or PET) followed by printing of conducting silver circuit traces. The electrical resistances of the Silver conducting test circuits were measured before and after thermoforming process to record the change of resistance at various % strain. FIG. 5a and FIG. 5b show representative images of a typical test sample of before and after thermoforming, respectively. After forming, change in electrical resistance along with other failure mechanisms is used to assess the degree of thermoformability. For example, FIG. 5c and FIG. 5d, show the variation of electrical resistance of conducting Silver circuit traces of 1000 μm line width of Silver Ink (Example 1) printed on Dielectric Ink (Examples 33 & 35), Silver Ink Example 10 printed on Dielectric Ink (Example 33 & 35) and

    [0427] Silver Ink (Example 11) printed on Dielectric Ink (Example 35), before and after thermoforming, respectively. The resistance before (FIG. 5c) and after (FIG. 5d) thermoforming are plotted as a function of % strain location and strain %, respectively. During thermoforming, the circuit lines/traces are formed into a shape of cone. As a result, the circuit line traces undergo stretching.

    Compatibility and Thermoforming Attribute of A Three-Stack Dielectric and Silver Inks

    [0428] Compatibility and thermoforming attribute of a three-stack dielectric and silver inks were evaluated as per the ‘Cone Formability Test Procedure’ as described previously. A typical three-stack circuit assembly was prepared by first printing of a dielectric ink layer (barrier dielectric layer) on a thermoformable polymer substrate (eg. PC or PET), next printing of conducting silver circuit traces and followed by printing of another Dielectric ink layer (Protection layer). The electrical resistances of the conducting Silver test circuits were measured before and after thermoforming process to record the change of resistance at various % strain. FIG. 6a and FIG. 6b show representative images of a typical test sample of before and after thermoforming, respectively. After forming, change in electrical resistance along with other failure mechanisms is used to assess the degree of thermoformability. For example, FIG. 6c and FIG. 6d, show the variation of electrical resistance of conducting circuit traces of 1000 μm line width of Silver Ink (Example 10), where Barrier Dielectric layer and Protection layers were selected either as Example 35 or Example 47 or their combinations. The resistance before (FIG. 6c) and after (FIG. 6d) thermoforming are plotted as a function of %strain location and strain%, respectively. During thermoforming, the circuit lines/traces are formed into a shape of cone. As a result, the circuit line traces undergo stretching.

    Thermoformable Conductive Compositions used as Conductive Adhesive to Attach Various SMD Components

    [0429] Thermoformable conductive compositions disclosed in Example 1 to Example 26 can also be used as conductive adhesive to attach various SMD components, LED etc. to thermoformable conductive silver ink circuit traces. Viscosities of these formulations can be optimized to either dispose these conductive adhesives by dispensing or stencil printing. Compatibility of the thermoformable conductive adhesives with Silver Ink and substrates are very crucial to fabricate IME structures. FIG. 7 depicts a representative application of a thermoformable conductive adhesive composition (Example 7) for the attachment of SMD components on formable conducting Silver circuit traces (Example 10). For example, FIG. 7a shows the microscopic image of the dispensed dots of 650-700 μm diameter (wet deposit) of Example 7. FIGS. 7b and 7c shows the microscopic images of the wet assembly of SMD 1206 chip and SMD 1206 LED, respectively on formable conducting Silver circuit traces (Example 10). FIGS. 7d and 7e respectively shows thermally cured and dried formed of FIGS. 7b and FIG. 7c.

    Thermoforming Attribute of a Representative Conductive Circuit Structure

    [0430] Thermoforming attribute of a representative conductive circuit structure, where components (such as, SMD 1206 Chip or SMD 1206 LED) are attached using conductive adhesive (Example 7) on Silver Ink (Example 10) on a thermoformable PC substrate (DE as Makrafol DE1.4), were evaluated as per the ‘Cone Formability Test Procedure’ as described previously. A typical assembly was prepared by first printing of a Silver ink (Example 10) conducting circuit traces on a thermoformable polymer substrate (DE), next dispensing of Example 7 and followed by component attachments of SMD 1206 Chip and SMD 1206 LED). Electrical continuity of these conducting circuit structure was checked by supplying electric current before and after thermoforming. For example, FIG. 8a and FIG. 8b show LEDs on printed conductive tracks before and after applying electrical current. In particular, lighted LEDs indicative of continuity of the circuit structures and corresponding stain locations are also indicated in FIGS. 8a and FIG. 8b. These results indicate the suitability of the use of Example 7 as conductive adhesive for the construction of thermoformable circuit assembly.

    Representative Stack of Screen-Printed Silver Layer/Thermoformable PC Substrate

    [0431] FIG. 9 shows a representative stack of screen-printed silver layer//Thermoformable PC substrate (140), which produced structure 150 upon injection molding. Injection Molding was performed on the injection molding machine using center gate. The cavity dimension was 100mm×80mm. Injection molding was carried out in flat shape of thickness 2-3 mm and maximum weight of the part was around. Example 10 was used as silver ink and nascent PC substrate (Makrofol DE1.4) to prepare Structure 140, while this structure undergoes injection molding with PC resin to produce structure 150. Similarly, Example 1, Example 2, Example 4, Example 33, Example 34, Example 35 and Example 42 printed structures were also tested for injection molding performances with different combinations with various injection molded resins, such as PC, ABS etc. and are found to be stable during injection molding.

    Representative Functional 3D Electronic Device

    [0432] FIG. 10 shows a design and construction of representative functional 3D electronic device. This device was produced by screen printing and drying of Example 1, followed attaching LED using Example 1 and then thermoforming the whole stack. FIG. 10 (a and b) are images of Handheld Type and (c and d) are Console types of Demonstrators capable of performing touch switching applications. The process involved first printing of Example 1 followed by drying. In second step involved stencil printing of Example 7 and LED placement followed by drying. LED was lightened by providing power though button cell.

    Representative Fully Functional IME Device

    [0433] FIG. 11 shows a construction of representative fully functional IME device, which can be viewed as a protype of a typical Airplane Console panel. FIG. 11a and FIG. 11b are the optical images IME device in witched off and switch on condition, respectively. FIG. 11b, demonstrate the capacitive touch switching applications of such IME demonstrator. These device were produced by a multistep process, such as screen printing, thermal drying, dispensing, SMT component assembly, high-pressure thermoforming, laser cutting, injection molding (PC resin) and used various commercial graphic inks (such as, Proell) and Silver ink (Example 10), Dielectric Ink (Example 47), Conductive Adhesive (Example 7) and various MacDermid Autotype Xtraform PC substrates. These IME devices were constructed as a single film structure, where first several layers of decorative graphic inks (black and white) were printed and dried. This was followed by printing and drying of conducting electronic circuit layer using silver and dielectric inks and assembly of LEDs using conductive adhesive. This whole stack was further thermoformed, laser cut to trim as per the desired shape and back injection molded with PC resin. In FIG. 11b LEDs were lightened by providing power though button cell.

    [0434] The foregoing detailed description has been provided by way of explanation and illustration, and is not intended to limit the scope of the appended claims. Many variations in the presently preferred embodiments illustrated herein will be apparent to one of ordinary skill in the art and remain within the scope of the appended claims and their equivalents.