Method and system for forming grooves in a board element and an associated panel
11712816 · 2023-08-01
Assignee
Inventors
Cpc classification
B27M3/04
PERFORMING OPERATIONS; TRANSPORTING
B27G21/00
PERFORMING OPERATIONS; TRANSPORTING
E04F15/105
FIXED CONSTRUCTIONS
E04F15/10
FIXED CONSTRUCTIONS
E04F2203/08
FIXED CONSTRUCTIONS
B27F1/02
PERFORMING OPERATIONS; TRANSPORTING
International classification
B27F1/02
PERFORMING OPERATIONS; TRANSPORTING
B27M3/04
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method for forming grooves in a board element. An exemplary method includes arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material, such as chips, from the board element by rotating one or more cutting devices including a plurality of tooth elements configured to rotate around a rotational axis. A method further includes counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, includes arranging at least a portion of the board element between an obstruction element and the support member.
Claims
1. A method for forming grooves in a board element, comprising: arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material from the board element by a rotating cutting device comprising a plurality of tooth elements configured to rotate around a rotational axis, the method further comprising counteracting a displacement of the board element away from the support member during forming of said at least one groove, wherein said counteracting comprises arranging at least a portion of the board element between an obstruction element and the support member.
2. The method according to claim 1, further comprising displacing the board element in a feeding direction.
3. The method according to claim 1, further comprising displacing the rotating cutting device with respect to the support member during forming of said at least one groove.
4. The method according to claim 1, wherein the rotating cutting device comprises at least two cutting elements.
5. The method according to claim 4, wherein a cutting surface of at least one tooth element is inclined.
6. The method according to claim 1, wherein a first tooth element is angularly offset with respect to a second tooth element along a rotation axis.
7. The method according to claim 1, further comprising driving the board element in a lateral direction during forming of the at least one groove.
8. The method according to claim 1, wherein a shape and/or an inclination of a cutting surface of a first tooth element and a cutting surface of a second tooth element are different.
9. The method according to claim 1, wherein the rotating cutting device is configured to operate in an up-cut direction or a down-cut direction.
10. The method according to claim 1, further comprising controlling a position of an aligning element and/or a blocking element.
11. The method according to claim 1, wherein said obstruction element has a varying profile along a longitudinal direction.
12. The method according to claim 1, wherein said portion of the board element engages with the obstruction element and the support member during forming of the at least one groove by a pressured engagement.
13. The method according to claim 1, wherein said forming at least one groove comprises arranging a portion of the rotating cutting device through at least one slot in the obstruction element.
14. The method according to claim 1, wherein the board element comprises at least one layer, wherein at least one of the at least one layer comprises a thermoplastic material and, optionally, a filler, and wherein the method comprises forming said at least one groove in the at least one of the at least one layer.
15. The method according to claim 1, further comprising: dividing said board element into at least two panels, and forming a locking system on at least one edge portion of said at least two panels.
16. The method according to claim 1, wherein the counteracting comprises preventing the displacement of the board element away from the support member during forming of the at least one groove.
17. A method for forming grooves in a board element, comprising: arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material from the board element by a processing tool, wherein the processing tool comprises: a first rotating cutting device comprising a plurality of tooth elements configured to rotate around a rotational axis, and a second rotating cutting device comprising a plurality of tooth elements configured to rotate around a rotational axis, the second rotating cutting device being located downstream of the first rotating cutting device in a feeding direction.
18. The method according to claim 17, wherein the first and second rotating cutting devices are configured to operate in opposite directions.
19. The method according to claim 17, wherein a cutting element of the second rotating cutting device is laterally offset with respect to a cutting element of the first rotating cutting device.
20. The method according to claim 17, wherein at least one cutting element of the second rotating cutting device is laterally aligned with respect to a corresponding number of cutting elements of the first rotating cutting device.
21. The method according to claim 17, the at least one groove including a plurality of grooves, wherein said forming of at least one groove comprises forming a first groove arrangement including at least one first groove of the plurality of grooves, and forming a second groove arrangement including at least one second groove of the plurality of grooves, wherein said first groove arrangement is spaced from said second groove arrangement in a first horizontal direction and/or in a second horizontal direction of the board element, the at least first groove having same first characteristics, and the at least second groove having same second characteristics.
22. The method according to claim 21, wherein said first groove arrangement is at least partially formed by the first rotating cutting device and said second groove arrangement is at least partially formed by the second rotating cutting device.
23. The method according to claim 17, wherein the processing tool comprises a first and a second group of cutting elements, said first group and second group comprising cutting elements each having a first diameter and a second diameter, respectively, wherein the second diameter is different from the first diameter.
24. The method according to claim 17, wherein the first rotating cutting device comprises cutting elements each having the same diameter and wherein the second rotating cutting device comprises cutting elements each having the same diameter.
25. The method according to claim 17, wherein the forming of at least one of the at least one groove comprises forming a first groove profile and, thereafter, a second groove profile, said second groove profile having a larger cross-sectional area than said first groove profile.
26. The method according to claim 25, wherein the first and second groove profiles are formed by the first and the second rotating cutting device, respectively.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The disclosure will in the following be described in connection to exemplary embodiments and in greater detail with reference to the appended exemplary drawings, wherein:
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DETAILED DESCRIPTION
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(26) The system 100 comprises a frame member 110, a support member 120 for supporting the board element 200 during the forming, and a processing tool 130. The system preferably further comprises a transportation device 140 adapted to displace the board element in a feeding direction F towards the support member and/or processing tool. For example, a feeding speed may be 0.5-350 m/min, such as 20-130 m/min.
(27) In the perspective view in
(28) The support member 120 may comprise at least one roller 122. Each roller is configured to rotate and may thereby displace the board element during the forming of grooves. It is understood that other support members are equally conceivable, such as a conveyor belt, a plate, etc. Preferably, the support member is fixedly mounted in the frame member and may be fixed at least in the vertical direction Z of the frame member.
(29) Grooves 10 may be formed in a board element 200 arranged in contact with the support member 120 by the processing tool 130, e.g. by displacing a rotating cutting device 131 with respect to the support member. The displacement may be controlled by a control unit 186.
(30) The transportation device 140 may comprise a first 142 and/or a second 144 roller arrangement, and optionally parts of the support member, such as the at least one roller 122. Preferably, and as shown in e.g.
(31) Components of the transportation device 140, such as the first 142 and/or a second 144 roller arrangement(s), may be configured to position the board element 200, such as in the vertical direction Z.
(32) The support member 120 and the processing device 130 may overlap along the longitudinal direction X, as shown in e.g.
(33) The processing tool 130 is configured to remove material 80, such as chips. In
(34) A diameter d0 of each cutting element may be 50-400 mm, such as 100-200 mm. Moreover, a rotation speed may be 1000-12000 rpm, such as 2000-6000 rpm, preferably 3000-4500 rpm. For example, a cutting element having a diameter of 100-200 mm, such as 150 mm, may be rotated at a rotation speed of 2000-6000 rpm, such as 3000-4500 rpm.
(35) Generally, the rotating cutting device may operate in an up-cut direction R1 or a down-cut direction R2, but
(36) The system 100 may further comprise an aligning element 160, preferably fixedly mounted in the frame member 110. Optionally, the aligning element may comprise a chamfer 161, preferably at a longitudinal end portion 164 thereof, for laterally aligning the board element 200, cf.
(37) The system 100 may further comprise a blocking element 162, preferably fixedly mounted in the frame member 110. In operation, the board element may be provided between the aligning element 160 and the blocking element 162, such as during forming of the grooves 10. Optionally, the blocking element may comprise a chamfer 163, preferably at a longitudinal end portion 165 thereof, for laterally aligning and/or guiding the board element 200, cf.
(38) In some embodiments, a position, preferably a position in a lateral direction L, of the aligning element 160 and/or the blocking element 162 may be controlled, such as by the control unit 186.
(39) The system 100 may further comprise an obstruction element 170, preferably fixedly mounted in the frame member 110. The obstruction element is configured to counteract, such as prevent, a displacement of the board element 200 away from the support member 120, such as in the vertical direction Z. At least a portion of the board element may be arranged between the obstruction element 170 and the support member 120, such as in the vertical direction Z, and preferably during forming of the grooves 10. A portion of the rotating cutting device 131 may be configured to be arranged through at least one slot 171 in the obstruction element 170, preferably during forming of the grooves 10.
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(41) As shown in a perspective view and a side view in
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(43) Alternatively, or additionally, the cutting surface 134 may be inclined by a rake angle β, see
(44) It is clear that in some embodiments, the cutting surface 134 of the tooth elements 133 is not inclined. For example, the axial angle and/or the rake angle may be zero.
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(46) In some embodiments, and as shown in
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(48) A shape and/or an inclination of the cutting surfaces 134 of a cutting element 132 or several cutting elements may be the same. In some embodiments, however, the shape and/or an inclination of the cutting surfaces may be different.
(49) As shown in
(50) It is clear that the above embodiment is only exemplifying and that any other combination of at least one selected from the group of shapes, widths, radial depths, top surfaces and inclinations are equally conceivable.
(51)
(52) Embodiments of the support member 120 may be similar to any embodiment described elsewhere in this disclosure, for example comprising at least one roller 122. Moreover, the support member may comprise a displaceable portion 123, such as in the form of a displaceable roller 124.
(53) Hence, grooves 10 may be formed in a board element 200 arranged in contact with the support member 120 by displacing the support member with respect to the processing tool 130, e.g. a rotating cutting device 131. The displacement may be controlled by a control unit 186.
(54) Other features and functionalities of the embodiment in
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(56) It is emphasized that embodiments of any or each of the frame member 110, support member 120, components of the processing tool 130, transportation device 140, aligning element 160, blocking element 162 and obstruction element 170 may be the same as the embodiments described elsewhere in this disclosure, e.g. in relation to
(57) The first and second rotating cutting devices 131a, 131b may comprise the same number of cutting elements 132a, 132b.
(58) In the embodiments in
(59) In the embodiments in
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(62) In any of the embodiments herein, the first and second rotating cutting devices 131a, 131b may both be configured to operate in the same direction, such as in an up-cut direction R1 as shown in e.g.
(63) Furthermore, in any of the embodiments herein, the first and second rotating cutting devices 131a, 131b may be configured to operate in opposite directions. As shown in the embodiment in
(64)
(65) A first cutting element 132a of a first rotating cutting device 131a may form a first groove profile 11, and, thereafter, a second cutting element 132b of a second rotating cutting device 131b may form a second groove profile 12. The second groove profile 12 has a larger cross-sectional area C2 than a cross-sectional area C1 of the first groove profile 11. The cross-sectional area may be an area defined by the rear side 220 of the board element and the respective groove profile 11, 12, such as at a specific longitudinal position of the groove which is to be formed. The first 11 and second 12 groove profiles extend along a longitudinal portion of the groove to be formed, which here is parallel to the first horizontal direction x.
(66) The first 11 and second 12 groove profiles may have different shapes. For example, the width and/or the depth of the groove profiles 11, 12 may be different. As illustrated in the cross-sectional side view in
(67) The second groove profile 12 may correspond to a final groove profile 13 of a groove 10. Alternatively, however, there may be additional removal of material before forming the final groove profile 13.
(68) As shown in
(69) In some embodiments (not shown), the processing device 130 may comprise a plurality of rotating cutting devices 131. Each rotating cutting device, such as a third and, optionally a fourth, rotating cutting device consecutively arranged along the feeding direction F may be laterally aligned or offset with respect to the first and/or the second rotating cutting device(s).
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(71) Embodiments of any or each rotating cutting device 131, 131a, 131b, support member 120, and obstruction element 170 in
(72) In
(73) As shown in the side view in the embodiment in
(74) The obstruction element 170 comprises a slot portion 17 comprising at least one slot 171, cf.
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(76) The first segment 172 of the embodiments in
(77) In
(78) At least a portion of any, some or each of the chamfers 175, 176, 177 or 178 may be planar.
(79) The obstruction element 170 may comprise a slot portion 17 comprising at least one open slot 171. The perspective view in
(80) In some embodiments, and as shown e.g. in
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(82) In any of the embodiments of this disclosure, at least a portion of the surface 179 of the obstruction element 170 and/or a surface of the support member 120 configured to face the board element 200 may comprise a friction-reducing material or mechanism, such as a coating, for example comprising a lubricant or a physical vapour deposition (PVD) coating. Moreover, a friction-reducing mechanism may comprise the provision of an air cushion, such as between the support member 120 and the board element. This may be useful when the support member is a displaceable conveyor belt or a stationary plate. In some embodiments, the friction-reducing mechanism may comprise wheels, rollers or balls, which may be provided on the obstruction element and/or the support member.
(83) Generally herein, the obstruction element may comprise a pressure member 180 configured to exert pressure on the board element 200. Thereby, a distance, such a vertical distance Z1, between the obstruction element 170 and the support member 120 may be adjusted. The pressure member may comprise at least portions of the obstruction element 170 and/or at least portions of the support member 120.
(84) The pressure member 180 may be controlled by a control unit 186. In a first example, a pressure exerted by the pressure member may be dependent on a thickness Tz along the vertical direction z, such as a maximal thickness, of a portion of the board element 200. In a second example, the exerted pressure may be determined by a predetermined pressure cycle, such as a constant predetermined pressure. In a third example, the exerted pressure may be determined by a predetermined force cycle, such as a constant predetermined force. In operation, said portion of the board element may be a portion along the longitudinal direction X and/or the feeding direction F.
(85) For example, during operation of the pressure member, the distance Z1, such as the minimum distance, between the support member 120 and the obstruction element 170 may be smaller than the thickness Tz along the vertical direction z, such as the maximal thickness, of a portion of the board element 200.
(86)
(87) As shown in the embodiments in
(88) In
(89) Alternatively, or additionally, the resilient member 183 may be configured to pretension the support member 120 towards the board element 200.
(90) The resilient member 183 may comprise at least one resilient covering 185, for example comprising a rubber material, as illustrated in
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(92) The system 100 may further comprise a material collecting device 190, such as a suction device and/or a blowing device, for collecting the removed material.
(93) Preferably, the enclosure element 191 comprises at least one orifice 195. The orifices may be air inlets and/or air outlets. In this embodiment, the enclosure element comprises a housing 194 and the obstruction element 170, and the orifices 195 correspond to the slots 171 of the obstruction element. It is clear, however, that other types of enclosure elements are equally conceivable.
(94) Next, an embodiment of a method for forming grooves in a board element 200 (Box S10) will be described with reference to the flow chart in
(95) As illustrated in a cross-sectional side view in an embodiment in
(96) In some embodiments of the board element or panel, at least the lowermost layers, such as a first 243′ and/or a second 243″ core layer, and optionally the backing layer 244, comprise a thermoplastic material and, optionally, a filler.
(97) Optionally, the board element may further comprise at least one reinforcement layer 250, such as at least one glass fibre layer.
(98) First, a receiving surface 201 of the board element is arranged in contact with or on the transportation device 140 (Box S11). The receiving surface may be a front side 210 or rear side 220 of the board element, preferably facing downwards as shown in e.g.
(99) Thereafter, as shown e.g. in
(100) The board element is then, again as shown e.g. in
(101) A first groove arrangement 41 and a second groove arrangement 42 spaced from the first groove arrangement 41 in a first x and/or a second y horizontal direction of the board element may thereby be formed, e.g. as shown in embodiment of a panel in
(102) Any or both of the steps S13 and S15 may comprise the act of counteracting, such as preventing, a displacement of the board element 200 away from the support member 120 during displacement of the respective rotating cutting device 131a, 131b as described elsewhere in this disclosure.
(103) In a non-limiting example, the at least one slot 171 may be formed by the rotating cutting device, such as during a first repetition of the method S10. During subsequent repetitions of the method S10, the at least one slot may thereby already be formed. In these examples, the obstruction element 170 may comprise a processable material, such as rubber, polymer-based material, solid wood or wood fibres.
(104) The grooves are preferably formed in an interior of the rear side 220 and are preferably spaced from a first pair of opposite edge portions 231, more preferably spaced from all edge portions 230 of the board element. Moreover, at least two grooves may have different lengths LE along the first x and/or second y horizontal direction(s) of the board element 200, cf.
(105) During or after each step S13 and S15, the removed material may be collected from the board element and/or the support member and separated into a respective first 81 and a second 82 group of material elements (Box S18 and S19). For example, the material collecting device 190 and material separating device 192 in
(106) In some embodiments, and as illustrated in a cross-sectional side view in an embodiment in
(107) In some embodiments, the first and/or the second rotating cutting device(s) 131a, 131b may remove material 80, such as chips, from a first and a second layer of the board element. When the first and second layers comprise different material compositions, the material elements may thereby be separated, e.g. as described in relation to
(108) In a first example, and as shown in
(109) In some embodiments, the board element may comprise at least one reinforcement layer 250. In a first example, the step(s) S13 and/or S15 may then comprise the act of removing at least a portion of the at least one reinforcement layer 250 by penetrating it with the first and/or second rotating cutting device 131a, 131b. In a second example, the step(s) S13 and/or S15 may then comprise the act of controlling a penetration depth of first and/or second rotating cutting device such that the at least one reinforcement layer 250 is left unprocessed. The controlling may be implemented by the control unit 186.
(110) Lastly, the board element 200 may be further processed, in this case post-processed, or treated. In a first example, a format of the board panel may correspond to a desired format of a panel 300. In a second example, it may be desired to change a format of the board element by dividing it into at least two panels 300 (Box S21). In either scenario, a locking system 360 may be formed on at least one edge portion 330 of the panel or at least two panels (Boxes S22 and S23), preferably on a first pair 331 and a second pair 332 of opposite edge portions. Preferably, the locking system 360 is formed after the dividing of the board element, but it is equally conceivable to form at least a part of the locking system before the dividing. For example, the locking system on one pair 331, 332 of opposite edge portions may be formed before dividing and the locking system on the other pair 332, 331 of opposite edge portions may be formed after dividing. In some embodiments, at least a part of the locking system is formed at least partially simultaneously with the dividing.
(111) It is clear that in some embodiments, the board element 200 is a panel 300 per se and therefore do not need to be divided. Nevertheless, a locking system may be formed in analogy with the discussion above.
(112) Embodiments of the dividing of the board element 200 into panels 300 are shown in perspective views in
(113) In some embodiments, the panel substrates 202 formed in
(114) In
(115) In some embodiments, the notches 203 may be formed after forming the grooves 10. Preferably, however, and as shown in
(116) The board element 200 or panel substrate 202 may then be divided into panel substrates 202 or panels 300, respectively, as shown in
(117) The board element 200 may comprise at least one functional groove 70 in the rear side 220. In the embodiment shown in
(118) The functional groove(s) 70 may be positioned at a predetermined distance PD from an edge portion 230, which is shown as an edge portion of the first pair 231 in
(119) The functional groove(s) 70 may be a guiding groove. As illustrated in
(120) In some embodiments (not shown), the functional groove(s) 70 may be provided in an interior of the rear side 220, thereby being spaced from each edge portions of a pair of opposite edge portions, such as the first pair 231, preferably all edge portions 230 of the board element.
(121) In some embodiments, the functional groove(s) 70 may be formed in the board element 200 before or after the forming of the grooves 10 therein. In some embodiments, the functional groove(s) 70 may be formed in the board element 200 during the forming of the grooves 10 therein. The functional groove(s) may be formed by a rotating cutting unit. In a first example, the rotating cutting unit is a rotating cutting device 131 of any of the embodiments described herein. In a second example, the rotating cutting unit is separately formed from the rotating cutting device.
(122) The board element 200 in
(123) The method described may produce a panel 300 comprising at least one groove 10 in a rear side 320 of the panel as illustrated in any of the embodiments in
(124) The panel 300 may comprise a first pair of opposite edge portions 331, which may be long edge portions, and a second pair of opposite edge portions 332, which may be short edge portions. Preferably, the grooves 10 are formed in an interior of the rear side 320 and are spaced from the first 331 and/or second 332 pair(s) of opposite edge portions, preferably both of them. The shape of end portions 16 may be curved along the longitudinal extension of the groove, e.g. obtained when the grooves are formed by a rotating cutting device 131. In some embodiments, however, and as shown in the side view in
(125)
(126) Generally, a bottom of the at least one groove 10 may be rounded, as e.g. in
(127) As shown in
(128) Moreover, the panel, such as a floor panel, may comprise a locking system 360 on the second pair 332 of opposite edge portions. The locking system may comprise a tongue 366 and a tongue groove 367 on the respective edge portion for vertical locking. For example, and as shown in
(129) As shown in
(130) In some embodiments, the at least one functional groove 70 may be a calibration groove 70′ preferably being provided at an edge portion 330 of the panel. The calibration groove 70′, illustrated by a broken line in
(131) The panel 300 may comprise at least two groove arrangements 40, such as a plurality of them. A longitudinal extension of the grooves 10 in each groove arrangement may be parallel to each other. Preferably, a longitudinal extension of each groove arrangement, such as along the first horizontal direction x, may be parallel to each other and preferably extends in parallel with an edge portion of the panel, preferably a long edge portion, which may be an edge portion of the first pair 331. Grooves of the each groove arrangement may have the same characteristics, such as groove depths and/or groove widths. The groove depths GD and/or groove widths of at least two of the groove arrangements may be different from each other. In non-limiting examples, any groove depth GD may be at least 0.2, such as at least 0.3, preferably at least 0.4, times a thickness of the board element. For example, when the thickness is 2-40 mm, a groove depth of any of the grooves may be at least 0.5-10 mm. For example, a floor panel having a thickness of 2-10 mm may have groove depth which is at least 0.5-5 mm.
(132) As noted under steps S13 and S15 above, the panel 300 in
(133)
(134) More generally, as shown in a bottom view in
(135) By means of any of the embodiments in
(136) In the cross-sectional side view in
(137)
(138) A groove arrangement may be at least partly, such as completely, spaced in the first x and/or second y horizontal direction(s) from another groove arrangement. As shown in
(139) Any groove 10, or preferably all of them, may comprise one bevel 14 or two bevels 14, 15. As shown in the embodiments cross-sectional side views in
(140) The groove arrangements 40 in any of the embodiments in
(141) In some embodiments, at least the first 41 and second 42 groove arrangements may be formed by the same component of the processing tool 130, such as a single rotating cutting device 131, as shown e.g. in
(142) A penetration depth of the rotating cutting device 31 may be controlled for intermittently forming different groove depths of the first 41 and second 42 groove arrangements, which preferably are formed consecutively along the feeding direction F during operation, see e.g.
(143) Alternatively, however, and as shown in in the embodiment in
(144) Generally, the processing tool 130 may comprise a first 93 and a second 94 group of cutting elements 132, 132a, 132b comprising cutting elements each having a first diameter d1 and a second, different, diameter d2, respectively. The first 93 and second 94 groups of cutting elements may be configured to rotate around the same rotational axis A1, as shown e.g. in
(145) In some embodiments, the first 41 and second 42 groove arrangements may be formed by different components of the processing tool 130, such as a first and a second rotating cutting device 131a, 131b, as shown e.g. in
(146) A penetration depth of the first and second rotating cutting devices may be controlled for forming different groove depths of the groove arrangements 40, at least some of which preferably are formed consecutively along the feeding direction F during operation, see
(147) As noted above, at least one rotating cutting device 131 may comprise cutting elements 132 having at least two diameters, cf.
(148) Generally herein, the first and second rotating cutting devices may operate consecutively, but an at least partially simultaneous operation by them is equally conceivable.
(149) It is clear that in any of the embodiments above regarding the forming of the groove arrangements, the penetration depth may be controlled by displacing the processing device 130 and/or the support member 120. Moreover, the components of the system, such as the processing device and/or the support member, may be controlled by the control unit 186.
(150) End portions 16 of the grooves, preferably longitudinal end portions of the grooves, may be disposed along a joining curve 51, which generally may be a non-linear curve. A portion of such joining curves 51 are shown in
(151)
(152) In some embodiments, and as shown in
(153) The grooves 10 in
(154) In some embodiments, and as schematically shown in
(155) Other features of the processing tool 130 may be the same as described elsewhere herein, whereby reference is made thereto. For example, the processing tool may be displaceably mounted in a frame member 110, such as being displaceable at least in a direction B1 perpendicular to a feeding direction F and preferably being parallel with the vertical direction z in operation. The milling tool 152, such as the cutting elements 132, may also be displaceable along and/or perpendicularly to the feeding direction F, preferably being parallel with the first x and/or the second y horizontal direction(s) in operation. The support member 120 (not shown) may be fixedly mounted in the frame member. Clearly, the roles may be reversed as detailed elsewhere herein, so that the processing tool and the support member may be fixedly and displaceably mounted in the frame member, respectively.
(156) The processing tool 130 comprising a drilling 151 or milling 152 tool may be configured to form grooves intermittently. The transportation of the board element 200 may be interrupted when the grooves are formed so that the board element is temporarily stationary with respect to the processing tool. Optionally, the processing tool 130 comprising a milling tool 152 may be configured to form grooves during feeding of the board element, such as when the milling tool is displaced horizontally, at least in the lateral direction L.
(157) The processing tool comprising a drilling 151 or a milling 152 tool may form grooves 10 having substantially vertical groove walls 18. For example, the grooves, preferably their cross-sections, may have substantially circular shapes or non-linear shapes as illustrated in the embodiments in
(158) Optionally, as shown in
(159) In some embodiments, and as schematically shown in
(160) In some embodiments, the tooth holder 154 comprises at least two tooth units 156, out of which one is shown in
(161) As shown in the embodiments in
(162) As shown in the embodiment in
(163) The embodiment in
(164) Aspects of the inventive concept has mainly been described above with reference to a few embodiments. However, as is readily appreciated by a person skilled in the art, other embodiments than the ones disclosed above are equally possible within the scope of aspects of the inventive concept, as defined by the appended patent claims and items in an embodiment section below. For instance, the embodiments disclosed in relation to a single rotating cutting device are equally applicable to embodiments wherein at least two rotating cutting device are utilized. For example, the embodiments in
EMBODIMENTS
(165) Further aspects of the inventive concept are provided below. Embodiments, examples etc. of these aspects are largely analogous to the embodiments, examples, etc. as described above, whereby reference is made to the above for a detailed description.
(166) 1. A method for forming grooves (10) in a board element (200; 300), comprising:
(167) arranging the board element in contact with a support member (120), and forming at least one groove in a rear side (220; 320) of the board element by removing material (80), such as chips, from the board element by a processing tool (130).
2. The method according to item 1, further comprising displacing the board element in a feeding direction (F), such as during said forming.
3. The method according to item 1 or 2, comprising arranging a receiving surface (201) of the board element in contact with the support member.
4. The method according to any of the preceding items, wherein said receiving surface is a front side (210; 310) of the board element, preferably facing downwards during said forming of the at least one groove.
5. The method according to any of the preceding items, further comprising displacing the processing tool with respect to the support member during forming of said at least one groove, such as at least in a direction perpendicular to a feeding direction (F) of the board element, said support member preferably being fixedly mounted in a frame member (110), and said direction preferably being parallel to a vertical direction of the frame member.
6. The method according to any of the preceding items, further comprising displacing the support member with respect to the processing tool during forming of said at least one groove, such as at least in a direction perpendicular to a feeding direction (F) of the board element, said processing tool preferably being fixedly mounted in a frame member (110), and said direction preferably being parallel to a vertical direction of the frame member.
7. The method according to any of the preceding items, wherein the processing tool comprises or is a rotating cutting device (131) comprising a plurality of tooth elements (133) configured to rotate around a rotational axis (A1).
8. The method according to item 7, wherein the rotating cutting device comprises at least two cutting elements (132), preferably a plurality of cutting elements.
9. The method according to item 7 or 8, wherein a first tooth element is angularly offset with respect to a second tooth element, such as along the rotation axis (A1).
10. The method according to any of the preceding items 7-9, wherein a cutting surface (134) of at least one tooth element is inclined.
11. The method according to any of the preceding items 7-10, wherein a shape and/or an inclination of a cutting surface (134) of a first tooth element and a cutting surface (134) of a second tooth element are different.
12. The method according to any of the preceding items 7-11, wherein the rotating cutting device is configured to operate in an up-cut direction or a down-cut direction.
13. The method according to any of the preceding items 7-12, wherein said rotating cutting device is a first rotating cutting device (131a) and wherein processing tool further comprises a second rotating cutting device (131b) comprising a plurality of tooth elements (133) configured to rotate around a rotational axis (A2), the second rotating cutting device preferably being located downstream of the first rotating cutting device in a feeding direction (F).
14. The method according to item 13, wherein the first and second rotating cutting devices are configured to operate in opposite directions, said first rotating cutting device preferably being configured to operate in a down-cut direction and said second rotating cutting device preferably being configured to operate in an up-cut direction.
15. The method according to item 13 or 14, wherein a cutting element of the second rotating cutting device is laterally offset with respect to a cutting element of the first rotating cutting device.
16. The method according to any of the preceding items 13-15, wherein at least one cutting element of the second rotating cutting device is laterally aligned with respect to a corresponding number of cutting elements of the first rotating cutting device.
17. The method according to any of the preceding items, wherein said forming of at least one groove comprises forming a first groove arrangement (41) and forming a second groove arrangement (42), wherein grooves of the first groove arrangement preferably have the same characteristics, such as cross sections, and grooves of the second groove arrangement preferably have the same characteristics, such as cross sections.
18. The method according to item 17, wherein said first and second groove arrangements are at least partially, such as completely, formed by the same processing tool, such as a single rotating cutting device.
19. The method according to item 17 or 18, wherein said first groove arrangement is at least partially, such as completely, formed by a first rotating cutting device (131a) and said second groove arrangement is at least partially, such as completely, formed by a second rotating cutting device (131b).
20. The method according to any of the preceding items, wherein the processing tool comprises a first (93) and a second (94) group of cutting elements, said first group and second group comprising cutting elements each having a first diameter (d1) and a second diameter (d2), respectively, wherein the second diameter is different from the first diameter.
21. The method according to item 20, wherein the first rotating cutting device comprises cutting elements each having the same diameter (d0), such as an outer diameter and/or wherein the second rotating cutting device comprises cutting elements each having the same diameter (d0), such as an outer diameter.
22. The method according to any of the preceding items, further comprising controlling a position, preferably a position in a lateral direction, of an aligning element (160) and/or a blocking element (162).
23. The method according to any of the preceding items, further comprising counteracting, such as preventing, a displacement of the board element away from the support member during forming of said at least one groove.
24. The method according to item 23, wherein said counteracting, such as preventing, comprises arranging at least a portion of the board element between an obstruction element (170) and the support member (120).
25. The method according to item 23 or 24, wherein said obstruction element has a varying profile, such as a varying thickness (T), along a longitudinal direction (X), preferably being parallel to a feeding direction (F) of the board element, and optionally comprising a chamfer (175, 176, 177, 178) on at least one side of the obstruction element along the longitudinal direction (X).
26. The method according to any of the preceding items 23-25, wherein said counteracting, such as preventing, comprises adjusting a distance, such a vertical distance (Z1), between the obstruction element and the support member.
27. The method according to any of the preceding items 24-26, wherein said portion of the board element engages with the obstruction element and the support member during forming of the at least one groove, preferably by a pressured engagement, such as a pretensioned engagement.
28. The method according to any of the preceding items 23-27, wherein said forming at least one groove comprises arranging a portion of the processing tool through at least one slot (171) in the obstruction element.
29. The method according to any of the preceding items, wherein the forming of any, some or each of said at least one groove comprises forming a first groove profile (11) and, thereafter, a second groove profile (12), said second groove profile having a larger cross-sectional area than said first groove profile.
30. The method according to any of the preceding items, wherein the forming of the at least one groove comprises forming at least two grooves having different lengths (LE) along a feeding direction (F) of the board element.
31. The method according to any of the preceding items, further comprising collecting the removed material (80), such as at least from the board element and/or the support member, preferably by suction and/or blowing, and preferably during a displacement of the board element.
32. The method according to any of the preceding items, wherein said board element (200) is a panel (300).
33. The method according to any of the preceding items 1-31, further comprising dividing said board element (200) into at least two panels (300).
34. The method according to item 33, wherein said dividing of the board element comprises forming at least one notch (203) in the board element.
35. The method according to any of the preceding items, further comprising forming at least one functional groove (70) in the board element, preferably in said rear side.
36. The method according to item 35, when depending on item 33 or 34, further comprising controlling said dividing by providing a guiding element (73) in the at least one functional groove of the board element.
37. The method according to any of the preceding items, wherein said forming of the at least one groove comprises carving or scraping the board element, or drilling or milling the board element.
38. The method according to any of the preceding items, wherein the board element comprises at least one layer (340), wherein any layer, some layers, or each layer preferably comprises a thermoplastic material and, optionally, a filler.
39. The method according to any of the preceding items, wherein the board element comprises at least two layers (341, 342, 343, 344).
40. The method according to item 38 or 39, wherein said forming at least one groove comprises forming a first portion of the at least one groove in a first layer and, thereafter, forming a second portion of the at least one groove in the first layer and/or in a second layer.
41. The method according to any of the preceding items, wherein the board element comprises at least one reinforcement layer (250; 350) and wherein the method further comprises controlling a penetration depth of said processing tool such that said at least one reinforcement layer is left unprocessed.
42. The method according to any of the preceding items, further comprising extruding and/or calendering at least one layer for forming said board element.
43. A panel (300) obtainable by the method according to any of the preceding items 1-42.
44. A system (100) for forming grooves (10) in a board element (200; 300), comprising: a frame member (110), a support member (120) for supporting the board element during said forming, and a processing tool (130).
45. The system according to item 44, wherein the processing tool comprises or is a rotating cutting device (131) comprising a plurality of tooth elements (133) configured to rotate around a rotational axis.
46. The system according to item 45, wherein the rotating cutting device comprises at least two cutting elements (132), preferably a plurality of cutting elements.
47. The system according to item 45 or 46, wherein a first tooth element is angularly offset around said rotational axis with respect to a second tooth element.
48. The system according to any of the preceding items 45-47, wherein a cutting surface (134) of at least one tooth element is inclined.
49. The system according to any of the preceding items 45-48, wherein a shape and/or an inclination of a cutting surface of a first tooth element and a cutting surface of a second tooth element are different.
50. The system according to any of the preceding items 45-49, wherein said rotating cutting device is a first rotating cutting device (131a) and wherein processing tool further comprises a second rotating cutting device (131b) comprising a plurality of tooth elements (133) configured to rotate around a rotational axis (A2), the second rotating cutting device preferably being located downstream of the first rotating cutting device in a feeding direction (F).
51. The system according to item 50, wherein said first rotating cutting device is configured to operate in a down-cut direction and wherein said second rotating cutting device is configured to operate in an up-cut direction
52. The system according to item 50 or 51, wherein a cutting element of the second rotating cutting device is laterally offset with respect to a cutting element of the first rotating cutting device.
53. The system according to any of the preceding items 50-52, wherein at least one cutting element of the second rotating cutting device is laterally aligned with respect to a corresponding number of cutting elements of the first rotating cutting device.
54. The system according to any of the preceding items 50-53, wherein the first rotating cutting device comprises cutting elements each having the same diameter (d0) and/or wherein the second rotating cutting device comprises cutting elements each having the same diameter (d0).
55. The system according to any of the preceding items 50-54, wherein at least one of the first and second rotating cutting devices comprises cutting elements having at least two different diameters (d1, d2).
56. The system according to any of the preceding items 44-55, further comprising an aligning element (160), optionally comprising a chamfer (161), for example at a longitudinal end portion (164) thereof.
57. The system according to item 56, further comprising a blocking element (162), wherein the board element is configured to be provided between the aligning element and the blocking element, the blocking element optionally comprising a chamfer (163), for example at a longitudinal end portion (165) thereof.
58. The system according to any of the preceding items 44-57, further comprising an obstruction element (170) configured to counteract, such as prevent, a displacement of the board element away from the support member.
59. The system according to item 58, wherein said obstruction element has a varying profile, such as a varying thickness (T), along a longitudinal direction (X), preferably being parallel to a feeding direction (F) of the board element, optionally comprising a chamfer (175, 176, 177, 178) on at least one side of the obstruction element along the longitudinal direction (X).
60. The system according to item 58 or 59, wherein a portion of the processing tool is configured to be arranged through at least one slot (171) in the obstruction element.
61. The system according to any of the preceding items 44-60, further comprising a pressure member (180), optionally being a resilient member (183), configured to exert pressure on, such as providing a pretensioned engagement against, the board element.
61. The system according to any of the preceding items 44-61 further comprising a material collecting device (190), such as a suction device and/or a blowing device, for collecting the removed material (80).
62. The system according to item 61, further comprising a material separating device (192) and/or an enclosure element (191).
63. The system according to any of the preceding items 44-62, further comprising a board dividing device (400) configured to divide a board element into at least two panels (300).
64. The system according to item 63, further comprising a guiding element (73) for controlling the dividing of the board element.
65. The system according to any of the preceding items 44-64, wherein the processing tool comprises a carving tool or scraping tool or a drilling tool (151) or a milling tool (152).
66. A panel (300) comprising at least one layer (340), wherein the panel comprises at least one groove (10) in a rear side (320) of the panel, preferably a plurality of grooves.
67. The panel according to item 66, wherein the at least one groove comprises one bevel (14) or two bevels (14, 15), each preferably being disposed between a respective groove wall (18) and said rear side.
68. The panel according to item 66 or 67, wherein the at least one groove comprises a first groove arrangement (41) and a second groove arrangement (42), each of the first and second groove arrangements comprising at least one groove, preferably a plurality of grooves.
69. The panel according to item 68, wherein grooves of the first and/or second groove arrangement(s) have the same characteristics, the characteristics of the first and second groove arrangements being different from each other.
70. The panel according to any of the preceding items 66-69, wherein said at least one groove is provided in an interior of the rear side being spaced from a pair of opposite edge portions (330), such as opposite short edge portions, of the panel, preferably being spaced from all edge portions of the panel.
71. The panel according to any of the preceding items 66-70, wherein the at least one groove comprises at least two grooves having different lengths along the first (x) and/or second (y) horizontal direction(s) of the panel.
72. The panel according to any of the preceding items 66-71, wherein end portions (16) of the grooves, preferably longitudinal end portions of the grooves, are disposed along a joining curve (51), such as a straight curve or a non-linear curve.
73. The panel according to any of the preceding items 66-72, comprising at least a first layer and a second layer, such as a plurality of layers (341, 342, 343, 344), for example comprising a core layer (343), a decorative layer (342) and/or a wear layer (341).
74. The panel according to item 74, further comprising a backing layer (344) and/or a cover layer.
75. The panel according to item 73 or 74, wherein the at least one groove is provided in the first layer only.
76. The panel according to items 73 or 74, wherein the at least one groove is provided in the first and second layers only.
77. The panel according to any of the preceding items 66-76, wherein the panel comprises at least one reinforcement layer (350), the at least one reinforcement layer optionally comprises at least one opening.
78. The panel according to any of the preceding items 73-77, wherein any layer, some layers, or each layer comprises a thermoplastic material, such as PVC, and, optionally, a filler, such as a mineral material.
79. The panel according to any of the preceding items 73-78, wherein any layer, some layers or each layer is calendered or extruded, such as coextruded, each of the calendered or extruded layer preferably comprising a thermoplastic material, such as PVC, and optionally a filler.
80. The panel according to any of the preceding items 66-79, wherein the at least one groove has a substantially vertical groove wall (18).