DEEP-DRAWN MCPCB

Abstract

The invention provides a light generating device (1000) comprising (i) a light source (100), wherein the light source comprises a solid state light source, (ii) a support (200) for the light source (100), (iii) a housing (300) comprising a housing wall (310), and (iv) a thermally conductive element (400); wherein the support (200) is a monolithic support, wherein the support (200) comprises at least two support parts (210) which are configured bent relative to each other, wherein a first support part (211) of the at least two support parts (210) is configured to support the light source (100), and wherein a second support part (212) of the at least two support parts (210) is associated to one or more of the housing wall (310) and the thermally conductive element (400) and configured in thermal contact with the thermally conductive element (400), wherein the support (200) is thermally conductive.

Claims

1. A light generating device comprising (i) a light source, wherein the light source comprises a solid state light source, (ii) a support for the light source, (iii) a housing comprising a housing wall, and (iv) a thermally conductive element; wherein the support is a monolithic support, wherein the support comprises at least two support parts which are configured bent relative to each other, wherein a first support part of the at least two support parts is configured to support the light source, and wherein a second support part of the at least two support parts is associated to one or more of the housing wall and the thermally conductive element and configured in thermal contact with the thermally conductive element, wherein the support is thermally conductive; wherein the second support part is in physical contact with the housing wall and/or the thermally conductive element; wherein the second support part is configured in an interference fit with the thermally conductive element; and wherein at least part of the thermally conductive element has a shape conformal to a shape of the housing wall; and wherein the second support part is configured between the housing wall and the thermally conductive element.

2. The light generating device according to claim 1, wherein the support comprises a metal-core printed circuit board, and wherein the thermally conductive element comprises a heatsink.

3. The light generating device according to claim 1, wherein the second support part is in physical contact with the housing wall and the thermally conductive element.

4. The light generating device according to claim 1, wherein the second support part is configured in an interference fit between the housing wall and the thermally conductive element.

5. The light generating device according to claim 3, wherein at least part of the thermally conductive element is in physical contact with the housing wall; and wherein the second support part is associated to the thermally conductive element via a press fit.

6. The light generating device according to claim 1, wherein the support is a deep-drawn support.

7. The light generating device according to claim 1, wherein the first support part and the second support part share a metal core, wherein the first support part further comprises a dielectric layer and one or more electrically conductive tracks, and wherein at least part of the second support part does not comprise one or more electrically conductive tracks.

8. The light generating device according to claim 7, wherein at least part of the second support part does not comprise the dielectric layer.

9. The light generating device according to claim 1, wherein the first support part and the second support part share a metal core, wherein the first support part further and the second support part comprise a dielectric layer and one or more electrically conductive tracks, wherein at least part of the second support part does not comprise one or more electrically conductive tracks, and wherein optional available electrically conductive tracks are not electrically connected with the one or more electrically conductive tracks comprised by the first support part, and wherein optionally a discontinuity is configured between the dielectric layer of the first support part and the second support part.

10. The light generating device according to claim 1, wherein the first support part and the second support part are configured under a first angle selected from the range 35-350°.

11. The light generating device according to claim 1, further comprising electronics, wherein the electronics are physically coupled to the first support part and functionally coupled to the light source, and wherein the electronics comprise a driver, and wherein the electronics further optionally comprise a communication device for control of the light source.

12. The light generating device according to claim 1, comprising a plurality of light sources, wherein the first support part has a circular shape, and wherein the first support part is configured to support the plurality of light sources; wherein the light generating device is a retrofit lamp.

13. A method for producing the light generating device according to claim 1, wherein the method comprises: providing a light source, a support for the light source, a housing comprising a housing wall, and a thermally conductive element; deep-drawing the support into the first support part and the second support part which are configured bent relative to each other; associating the second support part to one or more of the housing wall and the thermally conductive element and configuring the second support part in thermal contact with the thermally conductive element; wherein the second support part is in physical contact with the housing wall and/or the thermally conductive element; wherein the second support part is configured in an interference fit with the thermally conductive element; and wherein at least part of the thermally conductive element has a shape conformal to a shape of the housing wall; and the second support part is configured between the housing wall and the thermally conductive element; and providing the light generating device.

14. The method according to claim 13, comprising: (i) providing the light source to the support before deep-drawing the support, or (ii) providing the light source to first part of the support after deep-drawing the support; and wherein the support comprises a metal-core printed circuit board; wherein the second support part is associated to the one or more of the housing wall and the thermally conductive element via a press fit; and wherein the thermally conductive element is a heatsink.

15. The method according to claim 13, wherein the first support part and the second support part share a metal core, wherein the first support part further comprises a dielectric layer and one or more electrically conductive tracks, and wherein the method comprises removing at least part of the one or more electrically conductive tracks, and optionally also at least part of the dielectric layer, on part of the support that is to be deep-drawn into the second support part.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0102] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

[0103] FIGS. 1a-1b schematically depict some embodiments; and

[0104] FIGS. 2a-2b schematically depict some further embodiments.

[0105] The schematic drawings are not necessarily to scale.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0106] FIG. 1a schematically depicts an embodiment of a light generating device 1000, wherein for the sake of understanding, some components are depicted at some distance of each other.

[0107] The light generating device 1000 comprises a light source 100 (here by way of example two are depicted). Especially, the light source is configured to generate light source light 101. The light generating device 1000 is configured to generate device light 1001, which may comprise, or essentially consist of the light source light 101.

[0108] In embodiments, the light source comprises a solid state light source such as a LED.

[0109] The light generating device 1000 further comprises a support 200 for the light source 100. Yet further, the light generating device 1000 comprises a housing 300 comprising a housing wall 310. Yet further, the light generating device 1000 comprises a thermally conductive element 400.

[0110] Especially, the support 200 is a monolithic support. Further, the support 200 comprises at least two support parts 210 which are configured bent relative to each other. A first support part 211 of the at least two support parts 210 is configured to support the light source 100, and a second support part 212 of the at least two support parts 210. Especially, the second support part 212 may be configured between the housing wall 310 and the thermally conductive element 400. Further, the second support part 212 may be configured in thermal contact with the thermally conductive element 400. Especially, the support 200 is thermally conductive. Especially, the second support part 212 may be in physical contact with the housing wall 310 and the thermally conductive element 400. In yet further specific embodiments, the second support part 212 may be configured in an interference fit between the housing wall 310 and the thermally conductive element 400.

[0111] Further, in embodiments at least part of the thermally conductive element 400 is in physical contact with the housing wall 310. In embodiments, at least part of the thermally conductive element 400 has a shape conformal to a shape of the housing wall 310.

[0112] In embodiments, the support 200 may comprise a metal-core printed circuit board, and wherein the thermally conductive element 400 comprises a heatsink.

[0113] Reference 1005 refers to a screw cap, like an Edison screw cap, though other similar end parts for connection with a socket may also be applied.

[0114] Reference 1005 indicates a lamp cap, like e.g. an E27 cap (of course other caps may also be possible), though other similar end parts for connection with a socket may also be applied. Reference 1006 indicates a light transmissive window, such as e.g. of PMMA or PC or glass.

[0115] FIG. 1b schematically depicts the same embodiment, but with the components integrated. Note that the support 200 may essentially close the heatsink 400. The heatsink 400 may have a part having an essentially cylindrical shape, though other shapes may also be possible. The second support part 212 may be enclosed by the thermally conductive element, such as the heatsink (as shown), or may optionally enclose part of the thermally conductive element, such as the heatsink. Especially, a press fit may be chosen, though other or additional ways of fixation may also be chosen.

[0116] Hence, the light generating device 1000 may in embodiments not comprise a separate heat spreader between the support 200 and the thermally conductive element 400. Especially, the support 200 may be in physical contact with the heatsink and/or housing wall, especially in embodiments at least the former.

[0117] Referring to FIGS. 1a-1b, in specific embodiments, the device may comprise a plurality of light sources 100, wherein the first support part 211 has a circular shape, and wherein the first support part 211 is configured to support the plurality of light sources 100; wherein the light generating device 1000 is a retrofit lamp.

[0118] Especially, in embodiments the support 200 is a deep-drawn support.

[0119] FIG. 2a schematically depicts how a mother PCB support 20 may be converted into a plurality of (circular) PCBs. These may be used for the support 200, which may be deep drawn, see also FIG. 2b.

[0120] The first support may comprise a support layer indicated with reference 219, which may comprise the metal core. This support layer may have a first face 217 and a second face 218. On the support layer, there may be a dielectric layer 204 and one or more electrically conductive tracks 203 and also a solder mask 205 (see also below). Optionally, at the other side of the support layer there may also be one or more layers (which will not further be discussed).

[0121] FIG. 2b schematically depicts an embodiment of a method for producing the light generating device 1000 such as described above.

[0122] Referring to FIG. 2b, but also referring to FIGS. 1a-1b, the method comprises providing a light source 100, a support 200 for the light source 100, a housing 300 comprising a housing wall 310, and a thermally conductive element 400.

[0123] In the top of FIG. 2b, by way of example light sources 100 are depicted (see embodiment/stage I). These may be provided before or after deep-drawing.

[0124] The method comprises deep-drawing the support 200 into the first support part 211 and the second support part 212 which are configured bent relative to each other, see embodiment/stage IV.

[0125] The method may comprise introducing the second support part 212 between the housing wall 310 and the thermally conductive element 400 and configuring the second support part 212 in thermal contact with the thermally conductive element 400 (see FIGS. 1a-1b). Thereby, the light generating device 1000 is provided.

[0126] As indicated above, the method may comprise: (a) providing the light source 100 to the support 200 before deep-drawing the support 200, or (b) providing the light source 100 to first part 211 of the support 200 after deep-drawing the support 200; and wherein the support 200 comprises a metal-core printed circuit board.

[0127] For instance, when using a MCPCB, the support may include a metal layer that is thermally conductive, such as an Al or a Cu layer.

[0128] As further shown in FIG. 2b, it may be desirable to introduce a discontinuity, indicated with reference 207, such that there may be no electrical contact between the electrically conductive track 203 at the first support part 211 and the second support part 212.

[0129] Hence, the first support part 211 and the second support part 212 may share a metal core, wherein the first support part 211 further comprises a dielectric layer 204 and one or more electrically conductive tracks 203, and (then) the method may comprise removing at least part of the one or more electrically conductive tracks 203, and optionally also at least part of the dielectric layer 204, on part of the support 200 that is to be deep-drawn into the second support part 212. This is schematically depicted in embodiments II and III in FIG. 2b. Thereafter, deep-drawing may take place, which is shown for embodiment III but which may of course also be executed after the stage shown in embodiment/stage III.

[0130] Optionally, further bending or deep-drawing may take place, as schematically depicted in embodiment/stage V in FIG. 2b. This may facilitate fixating the support 200 in the housing 300.

[0131] Hence, as shown e.g. in FIG. 2b, the first support part 211 and the second support part 212 share a metal core, wherein the first support part 211 further comprises a dielectric layer 204 and one or more electrically conductive tracks 203, and wherein at least part of the second support part 212 does not comprise one or more electrically conductive tracks 203.

[0132] In embodiments, at least part of the second support part 212 does not comprise the dielectric layer 204.

[0133] As shown in FIG. 2b, in embodiments the first support part 211 and the second support part 212 share a metal core, wherein the first support part 211 further and the second support part 212 comprise a dielectric layer 204 and one or more electrically conductive tracks 203, wherein at least part of the second support part 212 does not comprise one or more electrically conductive tracks 203, and wherein optional available electrically conductive tracks 203 are not electrically connected with the one or more electrically conductive tracks 203 comprised by the first support part 211, and wherein optionally a discontinuity is configured between the dielectric layer 204 of the first support part 211 and the second support part 212. Reference 205 indicates a solder mask. This solder mask 205 may partly be removed, e.g. via etching, and e.g. solder paste is provided (small hatched areas, indicated with references 209) for a functional coupling with the one or more conductive tracks 203.

[0134] As shown in FIG. 2b, the first support part 211 and the second support part 212 are configured under a first angle α selected from the range 35-350°.

[0135] Angle α may especially be the angle between the first support part and the second support part of the first face 217 of the support layer 219. This angle is 180 before deep-drawing. Angle R is especially be the angle between the first support part and the second support part of the second face 218 of the support layer 219. This angle is 180 before deep-drawing. With deep drawing, part of the second face 218 is drawn to another part of the second face, and the first support part and the second support part under an angle α unequal to 180 is obtained. Note that α+β may be 360°.

[0136] The length of the second support part 212 that extends from the first support part 211 may be in the order of about 0.5 mm up to about 8 cm.

[0137] Note that in embodiment V the second support may further be bent, e.g. by deep drawing. This may not necessarily have an impact on the angle α (and β). Such V-shaped feature as shown in embodiments V may also allow other fixations than via e.g. a press fit. For instance, this may allow a spring mounting option. Note that the invention is not limited to press fit options.

[0138] Hence, the second support part may essentially comprise a single facet (which may be curved), like e.g. embodiments IV and VII, or the second support part may comprise a plurality of facets, see FIG. 2b. Especially, such facets are all created via deep-drawing. Especial, the facet of the second support part closest to the first support part may define the angle α (and β).

[0139] As schematically depicted in FIG. 2b, the light generating device 1000 further comprising electronics 500, wherein the electronics 500 are physically coupled to the first support part 211 and functionally coupled to the light source 100, and wherein the electronics 500 comprise a driver and wherein the electronics 500 further optionally comprise a communication device for control of the light source 100.

[0140] As can be derived from the above, the electronics 500 may be configured to the support 200 before or after deep-drawing. The latter is especially shown by starting with embodiment VI. The dielectric layer 204, the one or more electrically conductive tracks 203, and the solder mask 205 may be removed, followed by deep-drawing. This results in embodiments VII (or V). Then the electrical components, such as the light source(s) 100 and optional other electronics 500 may be configured.

[0141] The term “plurality” refers to two or more.

[0142] The terms “substantially” or “essentially” herein, and similar terms, will be understood by the person skilled in the art. The terms “substantially” or “essentially” may also include embodiments with “entirely”, “completely”, “all”, etc. Hence, in embodiments the adjective substantially or essentially may also be removed. Where applicable, the term “substantially” or the term “essentially” may also relate to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, including 100%.

[0143] The term “comprise” also includes embodiments wherein the term “comprises” means “consists of”.

[0144] The term “and/or” especially relates to one or more of the items mentioned before and after “and/or”. For instance, a phrase “item 1 and/or item 2” and similar phrases may relate to one or more of item 1 and item 2. The term “comprising” may in an embodiment refer to “consisting of” but may in another embodiment also refer to “containing at least the defined species and optionally one or more other species”.

[0145] Furthermore, the terms first, second, third and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.

[0146] The devices, apparatus, or systems may herein amongst others be described during operation. As will be clear to the person skilled in the art, the invention is not limited to methods of operation, or devices, apparatus, or systems in operation.

[0147] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims.

[0148] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.

[0149] Use of the verb “to comprise” and its conjugations does not exclude the presence of elements or steps other than those stated in a claim. Unless the context clearly requires otherwise, throughout the description and the claims, the words “comprise”, “comprising”, and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to”.

[0150] The article “a” or “an” preceding an element does not exclude the presence of a plurality of such elements.

[0151] The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a device claim, or an apparatus claim, or a system claim, enumerating several means, several of these means may be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

[0152] The invention also provides a control system that may control the device, apparatus, or system, or that may execute the herein described method or process. Yet further, the invention also provides a computer program product, when running on a computer which is functionally coupled to or comprised by the device, apparatus, or system, controls one or more controllable elements of such device, apparatus, or system.

[0153] The invention further applies to a device, apparatus, or system comprising one or more of the characterizing features described in the description and/or shown in the attached drawings. The invention further pertains to a method or process comprising one or more of the characterizing features described in the description and/or shown in the attached drawings.

[0154] The various aspects discussed in this patent can be combined in order to provide additional advantages. Further, the person skilled in the art will understand that embodiments can be combined, and that also more than two embodiments can be combined. Furthermore, some of the features can form the basis for one or more divisional applications.