TWO-STAGE EPOXY BONDING OIL, PREPARATION METHOD AND APPLICATION THEREOF

Abstract

A two-stage epoxy bonding oil includes a main agent A and a curing agent B in a weight ratio of 1:1 to 3:1. The curing agent B includes 70 to 90 parts of a linear bifunctional secondary amine curing agent, 10 to 30 parts of a high-melting-point latent curing agent and 1 to 5 parts of an anti-settling agent. A two-stage curing of epoxy bonding oil includes a first-stage curing at room temperature whereby the cured product is in a thermoplastic state and a second-stage curing at 100° C. to 180° C. whereby the cured product is in a thermosetting state. It solves the contradiction between sticking wheels and bonding performance of the bonding layer in field of road and bridge pavement, exploring a new direction for the waterproof bonding layer materials in road and bridge pavement such as steel bridge deck pavement, concrete bridge deck pavement and tunnel pavement.

Claims

1. A two-stage epoxy bonding oil comprising a main agent A and a curing agent B in a weight ratio of 1:1 to 3:1, wherein the curing agent B comprises 70 to 90 parts of a linear bifunctional secondary amine curing agent, 10 to 30 parts of a high-melting-point latent curing agent and 1 to 5 parts of an anti-settling agent.

2. The two-stage epoxy bonding oil according to claim 1, wherein the main agent A comprises 80 to 90 parts of a linear phenolic polyglycidyl ether, 10 to 20 parts of a monofunctional reactive diluent and 1 to 3 parts of an epoxy silane coupling agent.

3. The two-stage epoxy bonding oil according to claim 1, wherein the linear bifunctional secondary amine curing agent is prepared by grafting a bifunctional primary amine curing agent with a monoepoxy compound.

4. The two-stage epoxy bonding oil according to claim 3, wherein the bifunctional primary amine curing agent is one or more of hexamethylenediamine, decanediamine, dodecylamine and amino-terminated polyethers.

5. The two-stage epoxy bonding oil according to claim 3, wherein the monoepoxy compound is one or more of butyl glycidyl ether, benzyl glycidyl ether, octyl glycidyl ether and C12-C14 glycidyl ether.

6. The two-stage epoxy bonding oil according to claim 1, wherein the high-melting-point latent curing agent is an organic acid hydrazide with a melting point between 100° C. and 180° C. obtained through hydrothermal reaction of an organic ester and hydrazine hydrate.

7. The two-stage epoxy bonding oil according to claim 6, wherein the organic acid ester is represented by formula R.sub.1(COOR.sub.2).sub.n, wherein when n=1, R.sub.1 is phenyl or o-hydroxyphenyl and R.sub.2 is methyl or ethyl, and when n=2, R.sub.1 is methylene or ethylene and R.sub.2 is methyl or ethyl.

8. The two-stage epoxy bonding oil according to claim 1, wherein the anti-settling agent is one or more of hydrophilic fumed silica, hydrophobic fumed silica R974 and modified bentonite.

9. The two-stage epoxy bonding oil according to claim 2, wherein the linear phenolic polyglycidyl ether is one or more of phenol novolac epoxy resin, o-cresol epoxy resin and bisphenol F epoxy resin.

10. The two-stage epoxy bonding oil according to claim 2, wherein the monofunctional reactive diluent is one or more of butyl glycidyl ether, phenyl glycidyl ether, octyl glycidyl ether, C8-C10 glycidyl ether and C12-14 glycidyl ether.

11. The two-stage epoxy bonding oil according to claim 2, wherein the epoxy silane coupling agent is one or more of SCA-E87M, SCA-E87E, SCA-E87T, SCA-E87F, SCA-E86M and SCA-E86.

12. A method for the preparation of two-stage epoxy bonding oil, comprising the following steps: S1: adding 1 to 5 parts (molar mass) of a bifunctional primary amine curing agent into the reactor and raising the temperature to 80° C., and slowly adding 2 to 10 parts (molar mass) of a monoepoxy compound dropwise into the reactor, followed by stirring for reaction, whereby a linear bifunctional secondary amine curing agent is obtained; S2: adding 1 to 5 parts (molar mass) of hydrazine hydrate into the reactor and raising the temperature to 70° C., slowly adding 1 to 5 parts of 50% concentration isopropanol solution of an organic acid ester into the reactor dropwise, then adding an appropriate amount of xylene into the reactor and distilling the azeotrope of xylene, water, hydrazine hydrate and alcohol under vacuum conditions, whereby an organic acid hydrazide, namely, a high-melting-point latent curing agent is obtained; S3: weighing a linear phenolic polyglycidyl ether, a monofunctional reactive diluent and an epoxy silane coupling agent, and stirring the same for 60 minutes at 60° C., whereby a main agent A is obtained; S4: weighing the linear bifunctional secondary amine curing agent, the high-melting-point latent curing agent and an anti-settling agent, and stirring the same for 60 minutes at 50° C., whereby a curing agent B is obtained; and S5: stirring and mixing the main agent A and the curing agent B, whereby the two-stage epoxy bonding oil is obtained.

13. Application of two-stage epoxy bonding oil, comprising the following steps: A1: substrate cleaning, comprising cleaning a bonding substrate; A2: spraying a silane interface agent, comprising preparing the silane interface agent and spraying the prepared silane interface agent to the cleaned substrate in A1 through mechanical spraying to realize viscosity-increasing and modification of the cleaned substrate; A3: coating the two-stage epoxy bonding oil, comprising coating the two-stage epoxy bonding oil to the modified cleaned substrate to form a bonding layer; A4: first-stage curing, comprising curing the two-stage epoxy bonding oil, wherein the completion of the first-stage curing is indicated by fact that the cured product is dry when pressed with fingers; A5: construction with a hot mixture, comprising performing construction with the hot mixture on the two-stage epoxy bonding oil after the first-stage curing in order to form a protective layer or wear layer; and A6: second-stage curing, comprising further curing the two-stage epoxy bonding oil using the residual heat of the protective layer or wear layer to form a thermosetting cured product.

14. The application of two-stage epoxy bonding oil according to claim 13, wherein the silane interface agent is prepared according to the mass ratio of 1 to 2% silane coupling agent, 85 to 99% isopropanol, 0 to 10% water, and 0 to 1.5% acetic acid.

Description

DESCRIPTION OF THE DRAWINGS

[0035] FIG. 1 is a schematic diagram of steel deck pavement structure.

[0036] Reference signs: 1. Steel bridge deck, 2. Anti-corrosion layer, 3. Waterproof bonding layer, 4. Protective layer, 5. Bonding layer, 6. Wear layer.

DESCRIPTION OF THE EMBODIMENTS

[0037] The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art of the present invention. The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the invention. The term “and/or” as used herein includes any and all combinations of one or more of the related listed items.

[0039] FIG. 1 is a schematic diagram of a conventional steel bridge deck pavement structure. The upper surface of steel bridge deck 1 is provided with an anti-corrosion layer 2, a waterproof bonding layer 3, a protective layer 4, a bonding layer 5 and a wear layer 6 from bottom to top.

Example 1

[0040] 1 part (molar mass) of hexamethylenediamine was added into the reactor and the temperature was raised to 80° C.; 2 parts (molar mass) of butyl glycidyl ether was slowly added into the reactor dropwise for 2 h, with a material temperature of 80° C. and a stirring rate of 60 r/min, whereby a linear bifunctional secondary amine curing agent was obtained; 1 part (molar mass) of hydrazine hydrate was added into the reactor and the temperature was raised to 70° C.; 1 part of 50% concentration isopropanol solution of dimethyl malonate was slowly added into the reactor dropwise for 2 h, followed by reaction for 5 h, with a material temperature of 70° C. and a stirring rate of 60 r/min, then an appropriate amount of xylene was added into the reactor and the azeotrope of xylene, water, hydrazine hydrate and alcohol was distilled under vacuum conditions, whereby an organic acid hydrazide, namely, a high-melting-point latent curing agent was obtained.

[0041] 80 parts of linear phenolic polyglycidyl ether, 10 parts of benzyl glycidyl ether and 1 part of SCA-E87M were stirred at 60° C. for 60 minutes to obtain a main agent A; 70 parts of the bifunctional secondary amine curing agent, 10 parts of the high-melting-point latent curing agent and 1 part of fumed silica R974 anti-settling agent were stirred at 50° C. for 60 minutes to obtain a curing agent B, and then the main agent A and the curing agent B were mixed to obtain a two-stage epoxy bonding oil.

[0042] The construction was carried out by the steps of sand blasting and shot blasting on the substrate, spraying of silane interface agent, coating of two-stage epoxy bonding oil (to form the waterproof bonding layer 3), first-stage curing, construction with hot mixture, and second-stage curing.

Example 2

[0043] 1 part (molar mass) of hexamethylenediamine was added into the reactor and the temperature was raised to 80° C.; 2 parts (molar mass) of butyl glycidyl ether was slowly added into the reactor dropwise for 2 h, with a material temperature of 80° C. and a stirring rate of 60 r/min, whereby a linear bifunctional secondary amine curing agent was obtained; 1 part (molar mass) of hydrazine hydrate was added into the reactor and the temperature was raised to 70° C.; 1 part of 50% concentration isopropanol solution of dimethyl malonate was slowly added into the reactor dropwise for 2 h, followed by reaction for 5 h, with a material temperature of 70° C. and a stirring rate of 60 r/min, then an appropriate amount of xylene was added into the reactor and the azeotrope of xylene, water, hydrazine hydrate and alcohol was distilled under vacuum conditions, whereby an organic acid hydrazide, namely, a high-melting-point latent curing agent was obtained;

[0044] 90 parts of linear phenolic polyglycidyl ether, 20 parts of benzyl glycidyl ether and 3 parts of SCA-E87M were stirred at 60° C. for 60 minutes to obtain a main agent A; 90 parts of the bifunctional secondary amine curing agent, 30 parts of the high-melting-point latent curing agent and 5 parts of fumed silica R974 anti-settling agent were stirred at 50° C. for 60 minutes to obtain a curing agent B, and then the main agent A and the curing agent B were mixed to obtain a two-stage epoxy bonding oil.

[0045] The construction was carried out by the steps of sand blasting and shot blasting on the substrate, spraying of silane interface agent, coating of two-stage epoxy bonding oil, first-stage curing, construction with hot mixture, and second-stage curing.

Example 3

[0046] 1 part (molar mass) of decanediamine was added into the reactor and the temperature was raised to 80° C.; 2 parts (molar mass) of octyl glycidyl ether was slowly added into the reactor dropwise for 2 h, with a material temperature of 80° C. and a stirring rate of 60 r/min, whereby a linear bifunctional secondary amine curing agent was obtained; 1 part (molar mass) of hydrazine hydrate was added into the reactor and the temperature was raised to 70° C.; 1 part of 50% concentration isopropanol solution of diethyl succinate was slowly added into the reactor dropwise for 2 h, followed by reaction for 5 h, with a material temperature of 70° C. and a stirring rate of 60 r/min, then an appropriate amount of xylene was added into the reactor and the azeotrope of xylene, water, hydrazine hydrate and alcohol was distilled under vacuum conditions, whereby an organic acid hydrazide, namely, a high-melting-point latent curing agent was obtained.

[0047] 80 parts of linear phenolic polyglycidyl ether, 20 parts of benzyl glycidyl ether and 1 part of SCA-E87E were stirred at 60° C. for 60 minutes to obtain a main agent A; 80 parts of the bifunctional secondary amine curing agent, 20 parts of the high-melting-point latent curing agent and 2 parts of fumed silica R974 anti-settling agent were stirred at 50° C. for 60 minutes to obtain a curing agent B, and then the main agent A and the curing agent B were mixed to obtain a two-stage epoxy bonding oil.

[0048] The construction was carried out by the steps of sand blasting and shot blasting on the substrate, spraying of silane interface agent, coating of two-stage epoxy bonding oil, first-stage curing, construction with hot mixture, and second-stage curing.

Example 4

[0049] 1 part (molar mass) of amino-terminated polyether was added into the reactor and the temperature was raised to 80° C.; 2 parts (molar mass) of C8-C10 alkyl glycidyl ether was slowly added into the reactor dropwise for 2 h, with a material temperature of 80° C. and a stirring rate of 60 r/min, whereby a linear bifunctional secondary amine curing agent was obtained; 1 part (molar mass) of hydrazine hydrate was added into the reactor and the temperature was raised to 70° C.; 1 part of 50% concentration of isopropanol solution of ethyl benzoate was slowly added into the reactor dropwise for 2 h, followed by reaction for 5 h, with a material temperature of 70° C. and a stirring rate of 60 r/min, then an appropriate amount of xylene was added into the reactor and the azeotrope of xylene, water, hydrazine hydrate and alcohol was distilled under vacuum conditions, whereby an organic acid hydrazide, namely, a high-melting-point latent curing agent was obtained.

[0050] 85 parts of linear phenolic polyglycidyl ether, 15 parts of benzyl glycidyl ether and 2 parts of SCA-E87F were stirred at 60° C. for 60 minutes to obtain a main agent A; 90 parts of the bifunctional secondary amine curing agent, 10 parts of the high-melting-point latent curing agent and 2 parts of fumed silica R974 anti-settling agent were stirred at 50° C. for 60 minutes to obtain a curing agent B, and then the main agent A and the curing agent B were mixed to obtain a two-stage epoxy bonding oil.

[0051] The construction was carried out by the steps of sand blasting and shot blasting on the substrate, spraying of silane interface agent, coating of two-stage epoxy bonding oil, first-stage curing, construction with hot mixture, and second-stage curing.

Example 5

[0052] 1 part (molar mass) of amino-terminated polyether was added into the reactor and the temperature was raised to 80° C.; 2 parts (molar mass) of phenyl glycidyl ether was slowly added into the reactor dropwise for 2 h, with a material temperature of 80° C. and a stirring rate of 60 r/min, whereby a linear bifunctional secondary amine curing agent was obtained; 1 part (molar mass) of hydrazine hydrate was added into the reactor and the temperature was raised to 70° C.; 1 part of 50% concentration isopropanol solution of methyl salicylate was slowly added into the reactor dropwise for 2 h, followed by reaction for 5 h, with a material temperature of 70° C. and a stirring rate of 60 r/min, then an appropriate amount of xylene was added into the reactor and the azeotrope of xylene, water, hydrazine hydrate and alcohol was distilled under vacuum conditions, whereby an organic acid hydrazide, namely, a high-melting-point latent curing agent was obtained.

[0053] 90 parts of linear phenolic polyglycidyl ether, 10 parts of benzyl glycidyl ether and 3 parts of SCA-E86M were stirred at 60° C. for 60 minutes to obtain a main agent A; 85 parts of the bifunctional secondary amine curing agent, 15 parts of the high-melting-point latent curing agent and 3 parts of modified bentonite anti-settling agent were stirred at 50° C. for 60 minutes to obtain a curing agent B, and then the main agent A and the curing agent B were mixed to obtain a two-stage epoxy bonding oil.

[0054] The construction was carried out by the steps of sand blasting and shot blasting on the substrate, spraying of silane interface agent, coating of two-stage epoxy bonding oil, first-stage curing, construction with hot mixture, and second-stage curing.

Comparative Example 1

[0055] 1 part (molar mass) of hexamethylenediamine was added into the reactor and raising the temperature to 80° C.; 2 parts (molar mass) of butyl glycidyl ether was slowly added into the reactor dropwise for 2 h, with a material temperature of 80° C. and a stirring rate of 60 r/min, whereby a linear bifunctional secondary amine curing agent is obtained.

[0056] 80 parts of linear phenolic polyglycidyl ether, 10 parts of benzyl glycidyl ether and 1 part of SCA-E87M were stirred at 60° C. for 60 minutes to obtain a main agent A; 80 parts of the bifunctional secondary amine curing agent and 1 part of fumed silica R974 anti-settling agent were stirred at 50° C. for 60 minutes to obtain a curing agent B, and then the main agent A and the curing agent B were mixed to obtain a two-stage epoxy bonding oil.

[0057] The construction was carried out by the steps of sand blasting and shot blasting on the substrate, spraying of silane interface agent, coating of two-stage epoxy bonding oil, first-stage curing, construction with hot mixture, and second-stage curing.

Comparative Example 2

[0058] 1 part (molar mass) of hydrazine hydrate was added into the reactor and the temperature was raised to 70° C.; 1 part of 50% concentration isopropanol solution of dimethyl malonate was slowly added into the reactor dropwise for 2 h, followed by reaction for 5 h, with a material temperature of 70° C. and a stirring rate of 60 r/min, then adding an appropriate amount of xylene into the reactor and distilling the azeotrope of xylene, water, hydrazine hydrate and alcohol under vacuum conditions, whereby an organic acid hydrazide, namely, a high-melting-point latent curing agent is obtained.

[0059] 80 parts of linear phenolic polyglycidyl ether, 10 parts of benzyl glycidyl ether and 1 part of SCA-E87M were stirred at 60° C. for 60 minutes to obtain a main agent A; 30 parts of the high-melting-point latent curing agent and 1 part of fumed silica R974 anti-settling agent were stirred at 50° C. for 60 minutes to obtain a curing agent B, and then the main agent A and the curing agent B were mixed to obtain a two-stage epoxy bonding oil.

[0060] The construction was carried out by the steps of sand blasting and shot blasting on the substrate, spraying of silane interface agent, coating of two-stage epoxy bonding oil, first-stage curing, construction with hot mixture, and second-stage curing.

Comparative Example 3

[0061] 80 parts of linear phenolic polyglycidyl ether, 10 parts of benzyl glycidyl ether and 1 part of SCA-E87M were stirred at 60° C. for 60 minutes to obtain a main agent A; 40 parts of curing agent (651) and 1 part of fumed silica R974 anti-settling agent were stirred at 50° C. for 60 minutes to obtain a curing agent B, and then the main agent A and the curing agent B were mixed to obtain a two-stage epoxy bonding oil.

[0062] The construction was carried out by the steps of sand blasting and shot blasting on the substrate, spraying of silane interface agent, coating of two-stage epoxy bonding oil, first-stage curing, construction with hot mixture, and second-stage curing.

[0063] The performance test results of the two-stage epoxy bonding oil in Examples 1-5 and Comparative Examples 1-3 are shown in the table below.

TABLE-US-00001 TABLE 1 Performance test results of the two-stage epoxy bonding oil Test Comparative Comparative Comparative Test Item Method Example 1 Example 2 Example 3 Example 4 Example 5 Example 1 Example 2 Example 3 Melting point of high- — 153 163 114 151 148 — 140 — melting-point latent curing agent/° C. 23° C. Tensile GB/T 4.2 6.8 5.6 4.5 5.2 1.4 0.9 6.5 Tensile strength/ 16777 properties MPa Elongation 513 487 498 523 435 690 452 27 at break/% Water impermeability Impermeable Impermeable Impermeable Impermeable Impermeable Impermeable Impermeable Impermeable (0.3 MPa, 24 h) Water absorption GB/T 0.2 0.1 0.2 0.1 0.2 2.8 2.3 1.1 at 25° C./% 1034 Melting Behavior — Melt Melt Melt Melt Melt Melt Melt Does (150° C., 30 min) not melt Bonding Without GB/T 6.8 9.4 8.9 7.8 8.2 2.1 1.8 12 strength thermal 5210 to steel shock plate at With 6.5 9.6 8.2 8.4 7.3 2.2 1.7 3.3 25° C./ thermal MPa shock Bonding Epoxy JTG/T >2 MPa, and all epoxy asphalt 0.4 MPa 0.3 MPa 0.5 MPa strength asphalt 3364-02 mixture cohesive failure to mixture mixture at Modified >1 MPa, and all modified asphalt 0.3 MPa 0.3 MPa 0.4 MPa 25° C./ asphalt mixture cohesive failure MPa mixture

[0064] Through the verification of the above experimental results, aiming at the contradiction between sticking wheels and bonding performance of the (waterproof) bonding layer in the field of the road and bridge pavement such as steel bridge deck pavement, concrete bridge deck pavement and tunnel pavement, the present invention achieves the preparation of epoxy bonding oil with two-stage curing characteristics by compounding bifunctional secondary amine curing agent and high-melting-point latent curing agent. With the first-stage curing at room temperature, the cured product is not sticky to wheels; with the second-stage curing at 100° C. to 180° C., the cured product is in thermosetting state to ensure the bonding effect between the substrate and the upper pavement, effectively resolving the above contradiction and achieving a good bonding effect without sticking the wheels.

[0065] Those skilled in the industry should understand that the present invention is not limited by the foregoing embodiments. The foregoing embodiments and descriptions only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, which fall within the scope of the claimed invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.