Method for embedding electronics into a puck and puck having embedded electronics

Abstract

A puck embedding at least one transmitter circuit, and a method for producing a puck embedding at least one transmitter circuit. To protect the electronics from displacement or damage, the puck employs a layered structure. The puck has a centrally located cavity, containing a carrier structure having a rigid shell, at least one transmitter circuit supported by the carrier structure, and a battery provided within the carrier structure. The battery is embedded in a first elastic material provided within the carrier structure. The carrier structure is embedded in a second elastic material provided within the centrally located cavity.

Claims

1. A puck having a centrally located cavity, the puck comprising: a carrier structure having a rigid shell, the carrier structure being positioned within the centrally located cavity; at least one transmitter circuit secured to and in direct contact with the carrier structure to prevent relative displacement among the transmitter circuit under mechanical stress; and a battery provided within the carrier structure, wherein the battery is embedded in a first elastic material provided within the carrier structure, and wherein the carrier structure is embedded in a second elastic material provided within the centrally located cavity, wherein the at least one transmitter circuit comprises a first transmitter circuit and a second transmitter circuit, wherein the puck further comprises: a switching circuitry configured to determine which transmitter circuit of the first transmitter circuit or the second transmitter circuit is currently near a planar surface of the puck facing upwards using input provided by an inertial measurement unit, to activate the transmitter circuit near the planar surface of the puck currently facing upwards and to deactivate the transmitter circuit near a planar surface of the puck currently facing downwards.

2. The puck of claim 1, wherein the second elastic material has a hardness less than a hardness of the first elastic material.

3. The puck of claim 1, wherein the carrier structure is surrounded by a glass fiber thread infused with epoxy.

4. The puck of claim 2, wherein the carrier structure is surrounded by a glass fiber thread infused with epoxy.

5. The puck of claim 1, wherein the first elastic material is a two-component silicone rubber of hardness Shore A 40 or wherein the second elastic material is a two-component silicone rubber of hardness Shore A 0.

6. The puck of claim 2, wherein the first elastic material is a two-component silicone rubber of hardness Shore A 40 or wherein the second elastic material is a two-component silicone rubber of hardness Shore A 0.

7. The puck of claim 3, wherein the first elastic material is a two-component silicone rubber of hardness Shore A 40 or wherein the second elastic material is a two-component silicone rubber of hardness Shore A 0.

8. The puck of claim 1, wherein the first elastic material or the second elastic material exhibit a change in stiffness.

9. The puck of claim 2, wherein the first elastic material or the second elastic material exhibit a change in stiffness.

10. The puck of claim 3, wherein the first elastic material or the second elastic material exhibit a change in stiffness.

11. The puck of claim 1, wherein the first transmitter circuit is comprised in a first printed circuit board and the second transmitter circuit is comprised in a second printed circuit board, wherein the first printed circuit board is fitted to a top opening of the carrier structure and the second printed circuit board is fitted to a bottom opening of the carrier structure.

12. The puck of claim 11, wherein an antenna structure of the second printed circuit board is rotated by 90° with respect to an antenna structure of the first printed circuit board.

13. The puck of claim 1, wherein the battery is a rechargeable battery, and wherein the puck further comprises: a coil that allows inductive charging of the rechargeable battery, and contacts on the puck surface which allow plugging a power supply for charging the rechargeable battery.

14. The puck of claim 1, wherein each of the at least one transmitter circuits is comprised in a respective transceiver circuitry.

15. A method for producing a puck comprising at least one transmitter circuit, comprising: assembling a battery into a carrier structure having a rigid shell; securing to and being in direct contact with at least one transmitter circuit to the carrier structure; filling the inner volume of the carrier structure with a first elastic material; inserting the carrier structure into a recess on the inner surface of a first half of the puck; filling the remaining space with a second elastic material; and glueing a second half of the puck to the first half of the puck, wherein the second half of the puck has a recess such that the recess in the first half of the puck and the recess in the second half of the puck combine to form a cavity which is centrally located within the puck, wherein the at least one transmitter circuit comprises a first transmitter circuit and a second transmitter circuit, wherein the puck further comprises: a switching circuitry configured to determine which transmitter circuit of the first transmitter circuit or the second transmitter circuit is currently near a planar surface of the puck facing upwards using input provided by an inertial measurement unit, to activate the transmitter circuit near the planar surface of the puck currently facing upwards and to deactivate the transmitter circuit near a planar surface of the puck currently facing downwards.

16. The method of claim 15, wherein the at least one transmitter circuit comprises a first transmitter circuit and a second transmitter circuit, wherein the first transmitter circuit is comprised in a first printed circuit board and the second transmitter circuit is comprised in a second printed circuit board, and wherein the method further comprises: fitting the first printed circuit board to a top opening of the rigid shell of the carrier structure and fitting the second printed circuit board to a bottom opening of the rigid shell of the carrier structure.

17. The method of claim 16, wherein the rigid shell of the carrier structure has at least one hole located on faces of the rigid shell, and wherein filling the inner volume of the carrier structure with a first elastic material comprises injecting the first elastic material through at least one of the holes into the inner volume of the carrier structure.

18. The method of claim 15, further comprising, before inserting the carrier structure into a recess on the inner surface of a first half of the puck: wrapping a glass-fiber thread infused with epoxy around the rigid shell of the carrier structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Embodiments of the present invention are shown in the enclosed drawings in which:

(2) FIG. 1 is an exploded view showing a carrier structure, a battery and two printed circuit boards comprising transmitter circuits according to an embodiment of the invention;

(3) FIG. 2 shows a cross-section of the assembled carrier structure according to an embodiment of the invention;

(4) FIG. 3 shows a cross-section of one half of the assembled carrier structure provided with a high-stiffness layer according to an embodiment of the invention;

(5) FIG. 4 shows a cross-section of one half of the puck containing a carrier structure positioned within a centrally located cavity according to an embodiment of the invention; and

(6) FIG. 5 shows a flow chart for producing a puck containing transmitter circuitry according to embodiments of the present invention.

(7) The following detailed description and accompanying drawings provide a more detailed understanding of the nature and advantages of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

(8) A puck containing a transmitter circuit and a method of producing the puck will be described in detail in the following. For purposes of explanation, examples and specific details are set forth in order to provide a thorough understanding of the embodiments of the present invention. Embodiments as defined by the claims may include some or all of the features in these examples alone or in combination with other features described below and may further include modifications and equivalents of the features and concepts described herein. The following description will refer to FIGS. 1 to 5 explaining embodiments of the present invention in detail.

(9) FIG. 1 shows an exploded view of components positioned within a puck according to embodiments of the invention. FIG. 1 shows a carrier structure 11 having a rigid shell. In an embodiment, the carrier structure 11 may be 3D printed. A battery 12, which may be a primary cell or a rechargeable battery, is located within the carrier structure 11. Further electronic circuitry (not shown in FIG. 1) connecting transmitter circuits to the battery 12, or an inertial measurement unit (IMU, not shown in FIG. 1) may be contained in the volume of the carrier structure 11. Preferably, the IMU is located near the center of mass of the puck. The IMU may comprise accelerometers, gyroscopes, and magnetometers. According to an embodiment, output of an accelerometer comprised in the IMU is used to detect an abrupt stop and/or change in direction of motion of the puck.

(10) The rigid shell of the carrier structure 11 is illustrated as having the shape of a square cuboid. However, the rigid shell of the carrier structure 11 could also have another shape, such as a round shape. FIG. 1 further shows that the rigid shell of the carrier structure 11 includes holes 14 which may be used to fill the volume of the carrier structure 11 with an elastic material.

(11) Transmitter circuits 13 are supported by the carrier structure 11. According to the exemplary embodiment, two transmitter circuits 13 supported by the carrier structure 11 are shown. Preferably, the battery 12 is positioned between the two transmitter circuits 13.

(12) In another embodiment, only one transmitter circuit 13 is employed.

(13) Furthermore, FIG. 1 shows the first transmitter circuit 13a as comprised on a first printed circuit board 15 and the second transmitter circuit 13b as comprised on a second printed circuit board 16.

(14) In an embodiment, the first transmitter circuit 13a is positioned close to a first planar surface of the puck, and the second transmitter circuit 13b is positioned close to a second planar surface of the puck. Thus, when the puck is sliding on an ice surface, one of the two transmitter circuits 13 is close to a planar surface of the puck facing upwards, away from the surface of the ice, and therefore can transmit effectively so that its signals can be properly received by receiving means.

(15) In an embodiment, an antenna structure on the second printed circuit board 16 is rotated by 90° with respect to an antenna structure on the first printed circuit board 15. This configuration reduces the interference between the two antennas.

(16) In an embodiment, the printed circuit boards 15,16 may also provide support for one or more IMUs.

(17) Furthermore, the puck may contain switching circuitry (not shown in FIG. 1) configured to switch between activating the first or the second transmitter circuit such that the transmitter circuit near the surface of the puck facing upwards is activated while the second transmitter circuit near the surface of the puck facing downwards is deactivated. The switching circuitry may be configured to determine which of the transmitter circuits 13 is currently near the surface of the puck facing upwards using input provided by an IMU.

(18) FIG. 2 shows a cross-section of the assembled carrier structure 20. Assembled carrier structure 20 comprises carrier structure 11, battery 12, the first transmitter circuit 13a comprised on the first printed circuit board 15, and the second transmitter circuit 13b comprised on the second printed circuit board 16. As shown in FIG. 2, the volume of carrier structure 11 is filled with a first elastic material 21. The first elastic material 21 fills the volume of the carrier structure 11 so that no free volume remains. The first elastic material 21, which may be a two-component silicone rubber, has a relatively high hardness. In an embodiment, the first elastic material 21 has a hardness of about Shore A 40, which exhibits a solid level of protection for the enclosed circuitry and components.

(19) FIG. 3 shows a cross-section of a portion of an assembled structure 30 which comprises assembled carrier structure 20 and a layer 31 of material having high stiffness, such as a glass fiber thread infused with epoxy which surrounds assembled carrier structure 20. The other portion of the assembled carrier structure 20 left of plane 32 is analogously surrounded by a high-stiffness layer 31. Plane 32 as shown in the view of FIG. 2 may contain the axis of rotation of the puck when the assembled structure 30 is centrally positioned in a centrally located cavity of a puck.

(20) In an embodiment, the high-stiffness layer 31 covers the faces of the rigid shell of the assembled carrier structure 20 which are parallel to the axis of rotation of the puck. This protects the assembled carrier structure 20 against the strong mechanical stress acting on the lateral cylinder surface when the lateral cylinder surface of the puck impacts on a stick or on a barrier.

(21) FIG. 4 shows a cross-section of a portion of a puck 40. The puck 40 has a centrally located cavity in which the assembled structure 30 is positioned. Alternatively, the centrally located cavity contains the assembled carrier structure 20 without being wrapped in a layer 31 of material having high stiffness such as a glass fiber thread infused with epoxy. According to an embodiment, the cavity is formed by a recess on the inner surface of a first half 43 of a puck, and a recess on the inner surface of a second half 44 of the puck. The second half 44 of the puck may be glued to the first half of the puck 43, for example, using cyanoacrylate.

(22) In the embodiment as shown in FIG. 4, the recess in the first half 43 of the puck and the recess in the second half 44 of the puck are formed so that the contact surface 45 between the inner surfaces of the recess in the first half 43 of the puck and the recess in the second half 44 of the puck comprises a surface parallel to the axis of rotation of the puck. This increases the contact surface 45 along which the second half 44 of the puck is glued to the first half 43 of the puck. In addition, glueing surfaces parallel to the axis of rotation in addition to glueing surfaces orthogonal to the axis makes the glued connection more persistent under strong mechanical stress. Still further, providing the separation of the puck into two halves in the manner depicted in FIG. 4 allows for simplified filling of the recess in the first half 43 of the puck up to its brim.

(23) A second elastic material 42 fills the space between the assembled structure 30 and the inner surface of the centrally located cavity. The second elastic material 42 supports the assembled structure 30 inside the centrally located cavity,

(24) In an embodiment, the second elastic material 42 is a two component silicone rubber. The second elastic material 42 may have a hardness of about Shore A 0.

(25) In an embodiment, the different layers comprising the first and the second elastic materials are realized as discrete layers of distinct hardness. In an embodiment, the second elastic material 42 has a smaller hardness than the first elastic material 21. This allows the second elastic material 42 to compensate for the strong impact shocks suffered by an ice hockey puck, e.g. when it is hit by an ice hockey stick. One combination that has shown good characteristics according to the aim of embedding the electronic circuitry in an improved manner is a first elastic material 21 of a hardness of about Shore A 40 and a second elastic material 42 of a hardness of about Shore A 0.

(26) As is known in the art, hardness of a material according to the Shore A scale is an indentation hardness value, empirically obtained by measuring the depth of an indentation created by a given force on a standardized presser foot. In contrast, stiffness is directly derived from Young's elasticity module. Materials of low stiffness can efficiently absorb mechanical energy. As is known to one skilled in the art, in many materials, stiffness increases with Shore A hardness. For example, for elastomers such as silicone rubber, a relation between stiffness and Shore A hardness is known.

(27) Therefore, alternatively, the first and second elastic materials may be characterized by their stiffness. In particular, the first elastic material 21 and the second elastic material 42 have a relatively low stiffness, allowing the first elastic material 21 and the second material 42 to absorb the mechanical energy transferred to the puck on impact on a stick or a barrier. In an embodiment, the second elastic material 42 has a smaller stiffness than the first elastic material 21.

(28) In alternative embodiments, instead of discrete layers of distinct stiffness, materials with a gradual change in stiffness may be employed. Such a material may be fabricated utilizing a multi-component injection mold or as a structured 3D print.

(29) FIG. 5, described with reference to FIGS. 1 and 4, shows elements shown in a flow chart of a method 500 for producing a puck containing a transmitter circuit. The method comprises assembling, 501, a battery 12 into a carrier structure 11, and attaching, 502, at least one transmitter circuit 13 to the carrier structure 11.

(30) In an embodiment, the method further comprises fitting, 503, a first printed circuit board 15 comprising the first transmitter circuit 13a to a top opening of the carrier structure 11 and fitting a second printed circuit board 16 comprising the second transmitter circuit 13b to a bottom opening of the carrier structure 11. In this embodiment, the first printed circuit board 15 acts as a top lid for the carrier structure 11, while the second printed circuit board 16 acts as a bottom lid of the carrier structure.

(31) The method 500 proceeds to filling, 504, an inner volume of the carrier structure 11 with a first elastic material 21, thereby embedding the battery 12 and further circuitry contained in the inner volume of the carrier structure 11.

(32) In an embodiment, a rigid shell of the carrier structure 11 may further comprise at least two holes 14 located on faces of the rigid shell, and filling, 504, the inner volume of the carrier structure 11 with the first elastic material 21 comprises injecting the first elastic material 21 through at least one of the holes 14.

(33) In an embodiment, the top opening of the rigid shell of the carrier structure 11 is covered by the first printed circuit board 15 forming a top lid, and the bottom opening of the rigid shell of the carrier structure 11 is covered by the second printed circuit board 16 forming a bottom lid. Thus, the first printed circuit board 15 forming a top lid and the second printed circuit board 16 forming a bottom lid seal the inner volume of the carrier structure 11 as the first elastic material 21 is injected through at least one of the holes 14.

(34) In an embodiment, method 500 proceeds with adding, 505, a layer 31 of material of high stiffness around the assembled carrier structure 20 to produce assembled structure 30. In an embodiment, adding a layer 31 of high stiffness around the assembled carrier structure 20 may comprise infusing a glass fiber thread with epoxy, wrapping the glass fiber thread infused with epoxy around the assembled carrier structure 20, and letting the thread infused with epoxy dry.

(35) Method 500 proceeds with inserting, 506, the assembled carrier structure 20 or the assembled structure 30 into a recess on the inner surface of a first half 43 of a puck. The recess in the first half 43 of the puck can be produced by milling out a recess in the inner surface of a half 43 of an ice hockey puck. In an embodiment, the recess and/or the carrier structure 11 may be such that in radial direction, towards the lateral cylinder surface 46 of the puck 40, the recess leaves more space between the outer surface of the carrier structure 11 and the inner surface of the recess, while the recess leaves less space in vertical direction between the top or bottom of the carrier structure 11 and the respective inner surface of the cavity.

(36) Method 500 proceeds with filling, 507, the remaining space between the assembled carrier structure 20 or the assembled structure 30 and the inner surface of the recess with a second elastic material 42.

(37) Method 500 concludes with glueing, 508, a second half 44 of the puck to the first half 43 of the puck. The recess in the second half 44 of the puck can be produced by milling out a recess in the inner surface of a second half 44 of the ice hockey puck. The second half 44 of the puck has an analogous recess on its inner surface, so that the recess in the first half 43 of the puck and the recess in the second half 44 of the puck form a centrally located cavity within the assembled puck 40, after the second half 44 of the puck has been glued to the first half 43 of the puck. Glueing the second half 44 of the puck to the first half 43 of the puck may employ glueing a contact surface 45 of the first half 43 of the puck with the second half 44 of the puck using cyanoacrylate.

(38) The materials of the layers, including the carrier structure 11, the electronics, the battery 12, the first elastic material 21, the second elastic material 42, and, optionally, the high-stiffness layer 31 are chosen such that the average density of the layered structure matches the density of the puck material. Therefore, the weight of the assembled puck 40 is not changed by the layered structure contained in the centrally located cavity in comparison with a puck not containing the centrally located cavity and the layered structure.

(39) In an embodiment, the battery 12 comprised in the puck is a rechargeable battery, and the puck 40 further comprises a coil that allows inductive charging of the rechargeable battery, and/or contacts on the puck surface which allow plugging a power supply for charging the rechargeable battery.

(40) For tracking of the current location of the puck 40, signals emitted by the at least one transmitter circuit 13 embedded in the puck 40 may be received by several receivers connected to processing means. The processing means or the electronic device may comprise a computer, a mobile phone, a smartphone, a tablet computer, a notebook computer, or a wearable device. The processing means can be connected to the one or more receivers to process the radio signal and/or the radio signal characteristics measured by the one or more receivers. The processing means may be connected wirelessly or wired to the one or more receivers.

(41) As is known to one skilled in the art, the position of the puck may be determined by utilizing at least one of Time-of-Arrival ToA, Time-Difference of Arrival TDoA, Two-Way Ranging TWR, Three-Way Ranging 3WR, Angle-of-Arrival AoA, Phase Difference of Arrival, PDoA, and Radio Signal Strength Indicator (RSSI)-based techniques.

(42) The processing means may employ a Kalman filter to increase the accuracy of the tracking of the puck.

(43) According to an embodiment, output of an accelerometer comprised in the IMU in the puck 40 is used to determine whether an abrupt stop and/or change in direction of motion of the puck has occurred. Upon determining that an abrupt stop and/or change in direction of motion of the puck has occurred, a corresponding signal is transmitted, via the at least one transmitter comprised in the puck 40, to the one or more receivers connected to the processing means. Upon receiving the signal indicating that an abrupt stop and/or change in direction of motion of the puck has occurred, the processing means resets the parameters of the Kalman filter.