Method to Manufacture an Electronic Device for a Rubber Article

Abstract

A method to manufacture an electronic device to be applied to rubber article. The device comprises an electronic element, two layers of thermoplastic material which are arranged in a sandwich-like manner so as to contain, between one another, the electronic element, and at least an outer rubber layer arranged to cover an outer surface of at least one of the respective thermoplastic layers. The method comprises a preliminary step comprising (a) a deposition operation, during which an adhesive solution consisting of a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde is applied on at least one outer surface of one of the layers of thermoplastic material; and (b) a heating operation, during which the layers of thermoplastic material on which the adhesive solution was applied are kept at a temperature ranging from 120 to 230° C. for an amount of time ranging from 2 to 15 min.

Claims

1-12. (canceled)

13. A method to manufacture an electronic device to be applied to a rubber article, wherein the device comprises an electronic element, two layers of thermoplastic material which are arranged in a sandwich like manner so as to contain said electronic element there between, and at least an outer rubber layer arranged to cover an outer surface of at least one of the thermoplastic layers, said method comprising: a deposition operation, during which an adhesive solution comprising a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde is applied on at least one outer surface of one of the layers of thermoplastic material; and a heating operation, during which the layers of thermoplastic material on which the adhesive solution was applied are kept at a temperature ranging from 120 to 230° C. for an amount of time ranging from 2 to 15 min.

14. The method of claim 13, wherein at least one of the layers of thermoplastic material is made of insulating material.

15. The method of claim 14, wherein said insulating material is chosen in a group comprising polyesters, polyamides, and polyimides.

16. The method of claim 14, wherein said insulating material is comprised in a group consisting of PET, Nylon, and polyethylene naphtalate.

17. The method of claim 13, wherein said basic water solution comprises a pre-condensed resin comprising resorcinol and formaldehyde with isocyanate blocking groups.

18. The method of claim 17, wherein said basic water solution comprises lignin and a chemical chosen between urea and thiourea.

19. The method of claim 13, wherein said elastomer rubber latex comprises a latex of styrene-butadiene-vinylpyridine or a mixture of styrene-butadiene-vinylpyridine and styrene-butadiene.

20. The method of claim 13, wherein said deposition operation involves said adhesive solution being applied on both surfaces of the layers of thermoplastic material.

21. The method of claim 13, wherein said rubber article is a tire.

22. The method of claim 13, wherein said electronic element comprises an RFID chip, a first antenna connected to the chip, and a second antenna electromagnetically coupled to the first antenna.

23. An electronic device to be used in a rubber article, wherein the device comprises: an electronic element; two layers of thermoplastic material which are arranged in a sandwich like manner so as to contain said electronic element there between; at least an outer rubber layer arranged to cover an outer surface of at least one of the thermoplastic layers; and an adhesive solution comprising a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde applied on at least one outer surface of one of the layers of thermoplastic material, wherein the layers of thermoplastic material on which the adhesive solution was applied are kept at a temperature ranging from 120 to 230° C. during a heating operation of manufacture of the electronic device for an amount of time ranging from 2 to 15 min.

24. The electronic device of claim 23, wherein the electronic device is a radio-frequency identification (RFID) device.

25. The electronic device of claim 24, wherein said electronic element comprises an RFID chip, a first antenna connected to the chip, and a second antenna electromagnetically coupled to the first antenna.

26. The electronic device of claim 23, wherein at least one of the layers of thermoplastic material is made of insulating material.

27. The electronic device of claim 26, wherein said insulating material is chosen in a group comprising polyesters, polyamides, and polyimides.

28. The electronic device of claim 27, wherein said insulating material is comprised in a group consisting of PET, Nylon, and polyethylene naphtalate.

29. The electronic device of claim 23, wherein said basic water solution comprises a pre-condensed resin comprising resorcinol and formaldehyde with isocyanate blocking groups.

30. The electronic device of claim 29, wherein said basic water solution comprises lignin and a chemical chosen between urea and thiourea.

31. The electronic device of claim 23, wherein said elastomer rubber latex comprises a latex of styrene-butadiene-vinylpyridine or a mixture of styrene-butadiene-vinylpyridine and styrene-butadiene.

32. The electronic device of claim 23, wherein said rubber article is a tire.

Description

[0025] The invention will be best understood upon perusal of the following description of an explanatory and non-limiting embodiment, with reference to the accompanying FIGURE, which shows the radio-frequency identification device in an exploded view.

[0026] In the FIGURE, number 1 indicates, as a whole, a radio-frequency identification (RFID) device according to the invention.

[0027] The device 1 comprises a transceiver assembly 2, two PET layers 3 arranged in a sandwich-like manner on opposite sides of the transceiver assembly 2 and two outer rubber layers 4, each arranged on a respective outer surface 3a of a PET layer 3. The transceiver assembly 2 comprises an RFID chip 5, a first antenna 6 connected to the RFID chip 5 and a second antenna 7 electromagnetically coupled to the first antenna 6.

[0028] Two radio-frequency identification (RFID) devices of the type shown in the FIGURE were manufactured. The two devices are different from one another only because one of them was manufactured by depositing an adhesive solution according to the invention on an outer surface 3a of each PET layer 3.

[0029] The adhesive solution was applied on the surface 3a by means of a brush (deposition operation).

[0030] Table I shows the composition, in parts by weight, of the adhesive solution used.

TABLE-US-00001 TABLE I Latex stirene-butadiene-vinylpyridine 72.7 Resorcinol 5.0 Formaldehyde 2.3 Methylene diphenyl diisocyanate 20.0

[0031] After having applied the adhesive solution (deposition operation), the two PET layers 3 were subjected to a heating operation. The heating operation involved keeping the two PET layers 3 on which the adhesive solution was applied in an oven at 220° C. for an amount of time of 3 minutes.

[0032] Unlike what described above, according to a further embodiment of the invention, the adhesive solution comprises a pre-condensed resin consisting of resorcinol and formaldehyde with isocyanate blocking groups, lignin and a chemical chosen between urea and thiourea. This adhesive solution offers the advantage of not having to use formaldehyde in a free form.

[0033] After having carried out the preliminary step described above, the process goes on with a first step, in which the transceiver assembly 2 is housed between the two PET layers 3, and, subsequently, with a second step, in which the two PET layers 3 are covered on the outside with two respective layers 4 of non-vulcanized rubber.

[0034] Alternatively, the two PET layers 3 can be covered on the outside with two respective layers 4 of partially or totally vulcanized rubber.

[0035] By so doing, a first RFID device was manufactured.

[0036] The second RFID device was manufactured repeating the method described above with the sole exception of not having carried out the preliminary step. In other words, in the manufacturing process of the second RFID device, the first step was carried out using the PET layers 3 without having applied the adhesive solution on them.

[0037] Unlike what described above, according to a preferred embodiment of the invention, the adhesive solution can be applied on both surfaces of the PET layers 3.

[0038] In use, the RFID devices described above are included in a green rubber portion of a tire.

[0039] Alternatively, the RFID devices described above can be applied on a cured rubber portion of a tire.

[0040] Once the RFID device has been inserted inside the tire, the vulcanization step is carried out. By so doing, the rubber layers of the RFID device, during the vulcanization, are cross-linked with the surrounding rubber, ensuring the stability of the position of the device.

[0041] The first and the second RFID devices were subjected to an adhesion test according to ASTM D1876 method. Said test measures the adhesion force between each one of the PET layers 3 and the respective rubber layer 4 arranged so as to cover the outer surface 3a.

[0042] Table II shows the values obtained with the aforesaid test.

TABLE-US-00002 TABLE II First RFID device Second RFID device Adhesion force 6.73 0.37 (N/mm)

[0043] The values shown in Table II clearly prove that the method of the invention can ensure a strong adhesion between the PET layer 3 and the respective rubber layer 4, thus avoiding a splitting up of the device and the problems caused by it.

[0044] Two other radio-frequency identification (RFID) devices (the third and the fourth RFID devices) of the type shown in the FIGURE were manufactured. The third and the fourth RFID devices differ from the first and the second RFID devices because they comprise layer 3 made of Nylon and not PET.

[0045] In addition, the third and the fourth RFID devices differ from each other in the conditions used in the heating operation (b).

[0046] In particular, [0047] for the third RFID device, the adhesive solution of table I was applied on the surface 3a of the Nylon layer by means of a brush (deposition operation).

[0048] After having applied the adhesive solution (deposition operation), the two Nylon layers 3 were subjected to a heating operation. The heating operation involved keeping the two Nylon layers 3 on which the adhesive solution was applied in an oven at 220° C. for an amount of time of 5 minutes. [0049] for the fourth RFID device, the adhesive solution of table I was applied on the surface 3a of the Nylon layer by means of a brush (deposition operation).

[0050] After having applied the adhesive solution (deposition operation), the two Nylon layers 3 were subjected to a heating operation. The heating operation involved keeping the two Nylon layers 3 on which the adhesive solution was applied in an oven at 155° C. for an amount of time of 10 minutes.

[0051] For the first, third and fourth RFID devices the same amount of adhesive solution was applied on the respective surfaces 3a.

[0052] The third and the fourth RFID devices were subjected to an adhesion test according to ASTM D1876 method for measuring the adhesion force between each one of the Nylon layers 3 and the respective rubber layer 4 arranged so as to cover the outer surface 3a.

[0053] Table III shows the values obtained with the aforesaid test.

TABLE-US-00003 TABLE III Third RFID device Fourth RFID device Adhesion force 6.9 7.9 (N/mm)

[0054] Also the values shown in Table III clearly prove that the method of the invention can ensure a strong adhesion between the Nylon layer 3 and the respective rubber layer 4, thus avoiding a splitting up of the device and the problems caused by it.

[0055] As stated above, the present invention adapts to any electronic device to be applied to a rubber article, e.g. a tire.

[0056] Depending on the electronic device, only one rubber layer 4 can be used.