METHOD FOR JACKETING ELONGATE ARTICLES, IN PARTICULAR LINES

Abstract

The invention relates to a method for jacketing elongate articles, such as lines or cable harnesses in particular, by means of an adhesive tape comprising a tape-shaped substrate, which substrate has, on at least one side, a thermally curable, meltable, preferably pressure-sensitive adhesive layer, the adhesive layer comprising an epoxide-functionalized acrylonitrile-butadiene copolymer which has on average more than 1.5 epoxide groups per molecule and comprising the reaction product of phthalic anhydride and diethylene-triamine, the adhesive tape being led in a helix around the elongate article or the elongate article being enveloped by the adhesive tape in the axial direction, the elongate article together with the enveloping adhesive tape being brought into the desired arrangement, in particular into the cable harness plan, the elongate article being held in this arrangement, and the curable adhesive mass being cured by supplying thermal energy, in particular at a temperature of up to 110° C.

Claims

1. A method comprising jacketing an elongated item with an adhesive tape comprising a tapelike carrier provided on at least one side with a thermally curable, meltable adhesive layer, the adhesive layer comprising an epoxide-functionalized acrylonitrile/butadiene copolymer having on average more than 1.5 epoxide groups per molecule and the reaction product of phthalic anhydride and diethylenetriamine, where the adhesive tape is guided in a helical line around the elongated item or the elongated item is wrapped in an axial direction by the adhesive tape, the elongated item together with the adhesive tape wrapping is brought into a desired disposition, the elongated item is held in this disposition, and the curable adhesive is brought to cure by the supply of thermal energy.

2. The method as claimed in claim 1, wherein the epoxide-functionalized acrylonitrile/butadiene copolymer, containing in the thermally curable, meltable is the chemical reaction product of a carboxyl-terminated acrylonitrile/butadiene copolymer with a bisphenol A diglycidyl ether or a bisphenol F diglycidyl ether or epichlorohydrin.

3. The method as claimed in claim 1, wherein the epoxide-functionalized acrylonitrile/butadiene copolymer is the chemical reaction product of a carboxyl-terminated acrylonitrile/butadiene copolymer with a bisphenol A diglycidyl ether or bisphenol F diglycidyl ether chain-extended by chemical reaction with bisphenol A or bisphenol F.

4. The method as claimed in claim 1, wherein the reaction product of phthalic anhydride and diethylenetriamine has a free diethylenetriamine content of between inclusively 1.0 and 5.0 percent by weight.

5. The method as claimed in claim 1, wherein the reaction product of phthalic anhydride and diethylenetriamine has to an extent of at least 95 percent by weight a particle size of less than or equal to 70 um, measured by laser light scattering according to ISO 13320:2009.

6. The method as claimed in claim 1, wherein the carrier material comprises a polyester nonwoven.

7. The method as claimed in claim 1, wherein the adhesive has sunk into the carrier to an extent of more than 10%.

8. The method as claimed in claim 1, wherein the thermally curable, meltable adhesive layer is thermally curable at a temperature between 60° C. and 110° C.

9. The method as claimed in claim 1, wherein the thermal energy is supplied over a period of 0.5 sec to 10 min.

10. A jacketed elongated item obtained by the method as claimed in claim 1.

11. A method of using a jacketed elongated item as claimed in claim 10 in a vehicle.

Description

EXAMPLES

Example 1

[0108] The composition of the adhesive is as follows:

[0109] Composition of example 1:

TABLE-US-00002 Ratio of number of Number of epoxide epoxide groups to or NH groups number of NH groups, Weight introduced, based standardized to fraction on the percentage 1.00 mmol epoxide Raw material [wt %] weight fraction groups Struktol ® 91.4 152.3 mmol epoxide 1.00 Polydis 3610 Aradur ® 9506 8.6 110.7 mmol NH 0.73 Total 100.00

[0110] Production took place in a laboratory batch (1 liter) and in an extrusion process.

[0111] Results:

[0112] Lap-shear strengths [MPa]:

TABLE-US-00003 Substrate Curing CDP temperature 110° C. 130° C. 160° C. Cure time 5 minutes 2.1 (A) 5.9 (A) 17.9 (MF) 15 minutes 10.7 (MF) 16.3 (MF) 20.8 (C) 30 minutes 13.4 (C) 20.2 (C) 22.6 (C) Fracture modes: A = adhesive, MF = mixed fracture, C = cohesive (no brittle fracture)

[0113] The storage stability was longer than one month at 60° C. and longer than one year at 23° C.

[0114] The adhesive is pressure-sensitively adhesive prior to curing.

Example 2

[0115] The composition of the adhesive is as follows:

[0116] Composition of example 2:

TABLE-US-00004 Ratio of number of Number of epoxide epoxide groups to or NH groups number of NH groups, Weight introduced, based standardized to fraction on the percentage 1.00 mmol epoxide Raw material [wt %] weight fraction groups Struktol ® 95.5 159.2 mmol epoxide 1.00 Polydis 3610 Aradur ® 9506 4.5 57.9 mmol NH 0.36 Total 100.00

[0117] Production took place in a laboratory batch (1 liter) and in an extrusion process.

[0118] Results:

[0119] Lap-shear strengths [MPa]:

TABLE-US-00005 Substrate Curing CDP temperature 110° C. 130° C. 160° C. Cure time 5 minutes 1.2 (A) 3.6 (A) 10.5 (MF) 15 minutes 3.1 (MF) 6.0 (C) 12.2 (C) 30 minutes 5.0 (MF) 8.9 (C) 13.6 (C) Fracture modes: A = adhesive, MF = mixed fracture, C = cohesive (no brittle fracture)

[0120] The storage stability was longer than one month at 60° C. and longer than one year at 23° C.

[0121] The adhesive is pressure-sensitively adhesive prior to curing.

Example 3

[0122] The composition of the adhesive is as follows:

[0123] Composition of example 3:

TABLE-US-00006 Ratio of number of Number of epoxide epoxide groups to or NH groups number of NH groups, Weight introduced, based standardized to fraction on the percentage 1.00 mmol epoxide Raw material [wt %] weight fraction groups Struktol ® 73.1 121.8 mmol epoxide 1.00 Polydis 3610 Aradur ® 9506 6.9 88.8 mmol NH 0.73 Talkum Pharma 20.0 M ® Total 100.00

[0124] Production took place in a laboratory batch (1 liter) and in an extrusion process.

[0125] Results:

[0126] Lap-shear strengths [MPa]:

TABLE-US-00007 Substrate Curing CDP temperature 110° C. 130° C. 160° C. Cure time 5 minutes 1.9 (A) 4.5 (MF) 10.2 (C) 15 minutes 6.4 (C) 8.9 (C) 11.0 (C) 30 minutes 8.7 (C) 11.4 (C) 12.2 (C)

TABLE-US-00008 Curing temperature/cure time 180° C./30 minutes Oiled Oiled Hot- hot- electro- dip dip Electro- galvan- galvan- galvan- Oiled galvanized ized ized ized Substrate Steel steel steel steel steel steel Lap-shear 11.6 12.9 14.7 (C) 10.6 15.3 12.3 strength (C) (C) (MF) (C) (MF) [MPa]

[0127] Fracture modes: A=adhesive, MF=mixed fracture, C=cohesive (no brittle fracture)

[0128] The storage stability was longer than one month at 60° C. and longer than one year at 23° C.

[0129] The adhesive is pressure-sensitively adhesive prior to curing.

Example 4

[0130] The composition of the adhesive is as follows:

[0131] Composition of example 4:

TABLE-US-00009 Ratio of number of Number of epoxide epoxide groups to or NH groups number of NH groups, Weight introduced, based standardized to fraction on the percentage 1.00 mmol epoxide Raw material [wt %] weight fraction groups Struktol ® 54.9 91.5 mmol epoxide 1.00 Polydis 3610 Aradur ® 9506 5.1 65.6 mmol NH 0.72 Talkum Pharma 20.0 M ® Omyacarb ® 20.0 5-GU Total 100.00

[0132] Production took place in a laboratory batch (1 liter).

[0133] Results:

[0134] Lap-shear strengths [MPa]:

TABLE-US-00010 Substrate Curing CDP temperature 110° C. 130° C. 160° C. Cure Time 5 minutes 1.3 (A) 3.5 (A) 8.1 (MF) 15 minutes 5.9 (C) 7.0 (MF) 11.9 (C) 30 minutes 8.2 (C) 10.7 (C) 13.8 (C)

TABLE-US-00011 Curing temperature/cure time 180° C./30 minutes Oiled Oiled Hot- hot- electro- dip dip Electro- galvan- galvan- galvan- Oiled galvanized ized ized ized Substrate Steel steel steel steel steel steel Lap-shear 13.0 9.5 13.1 (MF) 7.7 13.5 8.5 strength (C) (A) (A) (C) (MF) [MPa]

[0135] Fracture modes: A=adhesive, MF=mixed fracture, C=cohesive (no brittle fracture)

[0136] The storage stability was longer than one month at 60° C. and longer than one year at 23° C.

[0137] The adhesive is pressure-sensitively adhesive prior to curing.

Example 5

[0138] The composition of the adhesive is as follows:

[0139] Composition of example 5:

TABLE-US-00012 Ratio of number of Number of epoxide epoxide groups to or NH groups number of NH groups, Weight introduced, based standardized to fraction on the percentage 1.00 mmol epoxide Raw material [wt %] weight fraction groups Struktol ® 90.7 164.9 mmol epoxide 1.00 Polydis 3611 Aradur ® 9506 9.3 119.7 mmol NH 0.73 Total 100.00

[0140] Production took place in a laboratory batch (1 liter).

[0141] Results:

[0142] Lap-shear strengths [MPa]:

TABLE-US-00013 Substrate Curing CDP temperature 110° C. 130° C. 160° C. Cure time 5 minutes 1.9 (A) 3.8 (A) 15.2 (MF) 15 minutes 7.2 (MF) 13.0 (C) 16.9 (C) 30 minutes 9.4 (C) 14.1 (C) 17.4 (C) Fracture modes: A = adhesive, MF = mixed fracture, C = cohesive (no brittle fracture)

[0143] The storage stability was longer than one month at 60° C. and longer than one year at 23° C.

[0144] The adhesive is pressure-sensitively adhesive prior to curing.

Example 6

[0145] The composition of the adhesive is as follows:

[0146] Composition of example 6:

TABLE-US-00014 Ratio of number of Number of epoxide epoxide groups to or NH groups number of NH groups, Weight introduced, based standardized to fraction on the percentage 1.00 mmol epoxide Raw material [wt %] weight fraction groups Struktol ® 42.7 129.4 mmol epoxide 1.00 Polydis 3614 Aradur ® 9506 7.3 94.0 mmol NH 0.73 Talkum Pharma 30.0 M ® Omyacarb ® 20.0 5-GU Total 100.00

[0147] Production took place in a laboratory batch (1 liter).

[0148] Example 7

[0149] The composition of the adhesive is as follows:

[0150] Composition of example 7:

TABLE-US-00015 Ratio of number of Number of epoxide epoxide groups to or NH groups number of NH groups, Weight introduced, based standardized to fraction on the percentage 1.00 mmol epoxide Raw material [wt %] weight fraction groups Struktol ® 39.2 191.2 mmol epoxide 1.00 Polydis 3691 Aradur ® 9506 10.8 139.0 mmol NH 0.73 Talkum Pharma 30.0 M ® Omyacarb ® 20.0 5-GU Total 100.00

[0151] Production took place in a laboratory batch (1 liter).

[0152] Example 8

Bending Test for Determining the Stiffness

[0153] A test specimen consisting of 250 individual leads with a lead cross section of 0.35 mm.sup.2 was bundled using a 9 mm wide adhesive tape (tesa 51618) to form a specimen lead set, and so the specimen lead set had a diameter of 23±5 mm and a length of 300±50 mm. This specimen lead set was wrapped spirally with the stiffening material, ensuring an overlap of 50%. The stiffening material was subsequently cured using heat.

[0154] The cured specimen lead set was subjected to a bending test in order to determine the influence of the stiffening material on the stiffness. The bending test was performed on a tensile testing machine. For this test, the specimen lead set was placed onto two jaws with a spacing of 70 mm and pressed in centrally with a crosshead by a distance of 30 mm and loaded. The force required for the deformation of the measurement travel was recorded by a tensile testing machine in newtons. The testing velocity was 100 mm/min, both during loading and unloading of the specimen lead set. The test was carried out at 3 different points on the lead set (start, middle and end). The bending force results from the mean value of the three individual measurements, and was evaluated in three categories as follows:

[0155] Evaluation categories, 3-point bending test:

TABLE-US-00016 + highly suitable for the application (500-750 N) ◯ of limited suitability for the application (400-500 N and 700-800 N) − not suitable for the application (<400 and >800 N)

[0156] For comparison a commercially available adhesive tape, tesa® 51036, was subjected to the same test. The results are set out in table 1 hereinafter.

Example 9

C-Shape Testing for Determining Stiffness at Different Temperatures

[0157] In order to determine the stiffness of a curved cable specimen, a test method was developed (C-cable specimen bending test). To produce a C-cable specimen (see FIG. 1) a cable lead (10) having a lead cross section of 0.35 mm.sup.2 is wound 100 times around a mount (1) to form a specimen lead set. The mount (1) has two opposite, semicircular guides (2, 3) with a diameter of 120 mm, which are spaced apart with a spacing (A) of about 210 mm. The wound cable set is represented in FIG. 1.

[0158] The number of cable turns is 100. The resulting specimen lead set has a diameter of 15±5 mm and a perimeter of 690 mm. At the apices of the semicircle segments and at two linear sections (legs) in each case, the cable bundle (10) is tied together and secured using cable ties (4, 5, 6, 7, 8, 9) with a tensile force of 210±10 N, and so after removal from the mount, the cable bundle (10) possesses sufficient stiffness not to deform. To further improve the stiffness of the cable bundle (10), a support (11) is positioned between the legs of the cable bundle and is likewise secured using cable ties.

[0159] The cable bundle (10) thus produced is removed from the mount and wrapped, with a 50% overlap, with the adhesive tape under test (width 19 mm-20 mm). Wrapping for this purpose is commenced at a cable tie (e.g., (6) or (7)) of the leg in the circle segment direction ((6)->(4) or (7)->(5)). When the wrapping reaches the cable tie (4) or (5) at the apex of the semicircle segment, the tie is removed and the winding is continued up to the next cable tie ((4)->(8) or (5)->(9)) of the opposite leg. Exactly the same procedure is carried out on the other side, on the other semicircle segment.

[0160] The specimens thus prepared undergo the corresponding crosslinking method (thermal energy, 110° C.). Using wire cutters, the specimens are cut adjacent to the remaining cable ties, to give two “C-shaped” cable specimens (C-cable specimens), which each also have an unwrapped section on both sides of the semicircular wrapped section. The cut is made at the distance of the diameter (120 mm) from the apex of the semicircle segment, projected onto the circle center.

[0161] With one piece of cable respectively, loops are tied to the leg ends of the specimens, allowing the specimens to be hung up at one end and a weight to be hung on at the other end. The remaining cable ties are now removed, since they can distort the test result. The distance between the legs is now determined.

[0162] One of the two specimens is stored at room temperature, and the other at 60° C.

[0163] A 1 kg weight is hung from the respective lower leg of the “C-test specimen”. After an hour the deflection of the cable bundle is recorded (deflection behavior, 1 h at RT or 60° C.) and the weight is removed. After one minute the deflection is determined again (resilience behavior, 1 min at RT or 60° C.). After an hour, the deflection is then determined again and recorded (resilience behavior, 1 h at RT or 60° C.)

[0164] The values determined for the C-shape deformation were graded into three categories: highly suitable for the application, of limited suitability for the application, and unsuitable for the application. The categories were evaluated as follows:

[0165] Evaluation categories, C-shape bending test (room temperature):

TABLE-US-00017 + highly suitable for the application (<15% deflection) ◯ of limited suitability for the application (>15-30%) − unsuitable for the application (>30%)

[0166] Evaluation categories, C—shape bending test (60° C.):

TABLE-US-00018 + highly suitable for the application (<25% deflection) ◯ of limited suitability for the application (>25-40%) − unsuitable for the application (>40%)

[0167] Evaluation categories, C-shape bending test (resilience behavior at RT and 60° C.):

TABLE-US-00019 + highly suitable for the application (<10% deflection) ◯ of limited suitability for the application (10-30%) − unsuitable for the application (>30%)

[0168] For comparison a commercially available adhesive tape, tesa° 51036, was subjected to the same test. The results are likewise set out in table 1 hereinafter.

TABLE-US-00020 TABLE 1 3-Point C-shape C-shape resilience bending test deformation at RT behavior at RT Example 1 + + + tesa ® 51036 − − − C-shape C-shape resilience deformation at 60° C. behavior at 60° C. Example 1 + + tesa ® 51036 − − Key: + highly suitable for the application ◯ of limited suitability for the application − unsuitable for the application

LIST OF REFERENCE NUMERALS

[0169] 1 mount

[0170] 2, 3 semicircular guides

[0171] 4, 5, 6, 7, 8, 9 cable ties

[0172] 10 cable bundle

[0173] 11 support