EDGE-EMITTING SEMICONDUCTOR LASER AND METHOD FOR PRODUCING AN EDGE-EMITTING SEMICONDUCTOR LASER

Abstract

The invention relates to an edge-emitting semiconductor laser comprising —at least two laser diodes, each of which is designed to generate electromagnetic radiation, wherein —the laser diodes are arranged on top of one another in a vertical direction, —the laser diodes are monolithically connected to one another, and —at least one frequency-stabilizing element is arranged in an end region of the laser diodes. The invention also relates to a method for producing an edge-emitting semiconductor laser.

Claims

1. An edge emitting semiconductor laser comprising at least two laser diodes, each of which is configured to generate electromagnetic radiation, wherein the laser diodes are arranged one above another in a vertical direction, the laser diodes are monolithically connected to one another, and one or a plurality of frequency-stabilizing element is are arranged in an end region of the laser diodes, wherein at least one of the laser diodes regionally is not covered by a laser diode arranged thereabove in a vertical direction and has one of the frequency-stabilizing elements in the uncovered region.

2. The edge emitting semiconductor laser as claimed in claim 1, where a single frequency-stabilizing element is assigned to all the laser diodes.

3. The edge emitting semiconductor laser as claimed in claim 1, wherein a common frequency-stabilizing element is assigned to at least two laser diodes.

4. The edge emitting semiconductor laser as claimed in claim 1, wherein a frequency-stabilizing element is assigned one-to-one to each laser diode.

5. The edge emitting semiconductor laser as claimed in claim 4, wherein the frequency-stabilizing elements are arranged offset with respect to one another in a longitudinal direction in plan view.

6. The edge emitting semiconductor laser as claimed in claim 1, comprising at least three laser diodes, wherein a first frequency-stabilizing element is assigned to at least two first laser diodes, and a second frequency-stabilizing element is assigned to at least one further second laser diode, and the second frequency-stabilizing element is arranged offset with respect to the first frequency-stabilizing elements in a longitudinal direction in plan view.

7. The edge emitting semiconductor laser as claimed in claim 6, comprising at least four laser diodes, wherein a first frequency-stabilizing element is assigned to at least two first laser diodes, and a second frequency-stabilizing element is assigned to at least two second laser diodes, and the second frequency-stabilizing element is arranged offset with respect to the first frequency-stabilizing elements in a longitudinal direction in plan view.

8. The edge emitting semiconductor laser as claimed in claim 1, wherein at least one of the frequency-stabilizing elements comprises cutouts in the material of at least one laser diode.

9. The edge emitting semiconductor laser as claimed in claim 8, wherein the cutouts are filled with a gas.

10. The edge emitting semiconductor laser as claimed in claim 8, wherein the cutouts each have a width of at least 40 nanometers and at most 4000 nanometers.

11. The edge emitting semiconductor laser as claimed in claim 1, wherein at least one of the frequency-stabilizing elements is a Bragg mirror.

12. The edge emitting semiconductor laser as claimed in claim 1, wherein the laser diodes are arranged in a manner stacked one above another on a substrate, a contact layer is arranged on the laser diodes, a counter-contact layer is arranged on the substrate, and the contact layer is arranged in a manner free of overlap with the frequency-stabilizing elements in a longitudinal direction in plan view.

13. A method for producing an edge emitting semiconductor laser comprising: providing at least two laser diodes, wherein the laser diodes are applied in a manner stacked one above another in a vertical direction, the laser diodes are monolithically connected to one another, and the laser diodes have a common planar front side surface, regionally removing material of at least one of the laser diodes after the process of providing the laser diodes in such a way that a laser diode arranged underneath is regionally exposed, producing one or a plurality of frequency-stabilizing element in an end region of the laser diodes, wherein one of the frequency-stabilizing elements is produced in the exposed region of the regionally exposed laser diode.

14. The method as claimed in claim 13, wherein after providing the laser diodes, material of at least one laser diode is removed regionally, in such a way that a laser diode arranged underneath is exposed regionally.

15. The method as claimed in claim 14, wherein in the exposed laser diodes a frequency-stabilizing element is produced in each case in an end region.

16. The method as claimed in claim 13, wherein an edge emitting semiconductor laser is produced comprising at least two laser diodes, each of which is configured to generate electromagnetic radiation, wherein the laser diodes are arranged one above another in a vertical direction, the laser diodes are monolithically connected to one another, and one or a plurality of frequency-stabilizing element are arranged in an end region of the laser diodes, wherein at least one of the laser diodes regionally is not covered by a laser diode arranged thereabove in a vertical direction and has one of the frequency-stabilizing elements in the uncovered region.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0071] In the figures:

[0072] FIG. 1 shows a schematic illustration of an edge emitting semiconductor laser in accordance with one exemplary embodiment,

[0073] FIG. 2 shows an exemplary schematic illustration of an excerpt from a laser diode, and

[0074] FIGS. 3 and 4 show schematic illustrations of an edge emitting semiconductor laser in accordance with a respective exemplary embodiment.

DETAILED DESCRIPTION

[0075] Elements that are identical, of identical type or act identically are provided with the same reference signs in the figures. The figures and the size relationships of the elements illustrated in the figures among one another should not be regarded as to scale. Rather, individual elements may be illustrated with an exaggerated size in order to enable better illustration and/or in order to afford a better understanding.

[0076] FIG. 1 shows a schematic illustration of one exemplary embodiment of an edge emitting semiconductor laser 1 described here. The semiconductor laser 1 comprises three laser diodes 2 arranged on a substrate 18. The laser diodes are arranged one above another in a vertical direction, corresponding in particular to a growth direction of the laser diodes 2. In this exemplary embodiment, the laser diodes 2 are grown epitaxially one on top of another. That is to say that the laser diodes 2 are monolithically connected to one another.

[0077] Each laser diode 2 comprises a facet 22, through which electromagnetic radiation is able to be coupled out during operation of the laser diodes 2. The facets 22 here are arranged in each case at a front side surface 8 in a start region 10 of the laser diode 2. In this exemplary embodiment, the facets 22 are arranged in a common plane. That is to say that the front side surface 8 is a common planar surface. This surface extends for example substantially perpendicular to a main extension plane of the laser diodes 2.

[0078] The laser diodes 2 here are electrically conductively connected. In this case, all the laser diodes 2 are able to be energized via a contact layer 19 and a counter-contact layer 20. The contact layer 19 is arranged on an outermost laser diode 2 facing away from the substrate 18. The counter-contact layer 20 is arranged on a side of the substrate 18 facing away from the laser diodes 1. For the case where the substrate 18 is removed, the counter-contact layer 20 can also directly adjoin the side of the laser diodes 2 facing away from the contact layer 19.

[0079] Furthermore, a frequency-stabilizing element 12 is assigned to each laser diode 2 in an end region 11 of the laser diodes 2. The end regions 11 are each arranged opposite the start region 10.

[0080] The frequency-stabilizing elements 12 each comprise cutouts 17 in the material of the laser diodes 2. In this case, the cutouts 17 of a frequency-stabilizing element 12 penetrate through a one-to-one assigned laser diode 2 in a vertical direction. The cutouts extend perpendicular to the longitudinal direction of the laser diodes 2. Furthermore, the cutouts 17 are arranged along the longitudinal direction.

[0081] Furthermore, the frequency-stabilizing elements 12 are each arranged opposite the assigned facet 22. A frequency-stabilizing element 12 and the assigned facet 22 thus delimit a resonator of a laser diode 2.

[0082] In this exemplary embodiment, the frequency-stabilizing elements 12 are arranged offset with respect to one another in a longitudinal direction in plan view. That is to say that the frequency-stabilizing elements 12 are embodied in a manner free of overlap in a longitudinal direction in plan view. In this case, the end regions 11 of the laser diodes are also embodied in a manner free of overlap in a longitudinal direction in plan view. As a result of such an arrangement, the outer surfaces of the frequency-stabilizing elements 12 facing away from the substrate are freely accessible in each case.

[0083] The freely accessible frequency-stabilizing elements 12 are not covered by the contact layer 19 either. In this case, the contact layer 19 is arranged in a manner free of overlap with the frequency-stabilizing elements 12 and the end regions 11 in a longitudinal direction in plan view.

[0084] FIG. 2 illustrates an excerpt from a laser diode 2 in accordance with the exemplary embodiment in FIG. 1. Each laser diode 2 comprises a semiconductor layer sequence 23. The semiconductor layer sequences 23 each comprise a first cladding layer 3 and a second cladding layer 4, which each extend in a longitudinal direction. Furthermore, the first cladding layer 3 and the second cladding layer 4 are arranged one above the other in a vertical direction.

[0085] Furthermore, a first propagation layer 5 and a second propagation layer 6 are arranged between the first cladding layer 3 and the second cladding layer 4. An active zone 7 is furthermore arranged between the first propagation layer 5 and the second propagation layer 6. In particular, the semiconductor layer sequence 23 has the following layer order: first cladding layer 3, first propagation layer 5, active zone 7, second propagation layer 6 and second cladding layer 4. Directly adjacent elements can in particular be in direct contact with one another.

[0086] Furthermore, a beam profile 21 of the electromagnetic radiation generated is illustrated for the active zone. The beam profile has a lateral and a vertical extent in cross section perpendicular to the longitudinal direction. By way of example, the beam profile 21 projects beyond the active zone 7, the first propagation layer 5 and the second propagation layer 6 in a vertical direction. Furthermore, it is possible for the beam profile 21 to decay exponentially in the first cladding layer 3 and the second cladding layer 4.

[0087] In contrast to the exemplary embodiment in FIG. 1, the exemplary embodiment in FIG. 3 shows an edge emitting semiconductor laser 1 comprising two first laser diodes 15 and two second laser diodes 16. The four laser diodes 2 are arranged in a manner stacked one above another in a vertical direction.

[0088] Furthermore, the four laser diodes 2 are monolithically connected to one another. In this exemplary embodiment, the at least two first laser diodes 15 are directly adjacent laser diodes 2. The two second laser diodes 16 are likewise directly adjacent.

[0089] A first frequency-stabilizing element 13 is assigned to the two first laser diodes 15. A second frequency-stabilizing element 14 is assigned to the two second laser diodes 16. The first frequency-stabilizing element 13 is a common frequency-stabilizing element 12 of the two first laser diodes 15. Furthermore, the second frequency-stabilizing element 14 is a common frequency-stabilizing element 12 of the two second laser diodes 16.

[0090] In this exemplary embodiment, cutouts 17 of the two first laser diodes 15 both penetrate through the two first laser diodes 15, in particular both active regions 7 of the two first laser diodes 15. Furthermore, it is possible for the cutouts 17 of the two first laser diodes 15 to completely perforate the first propagation layers 5, the active zones 7 and the second propagation layers 6 of the two first laser diodes 15.

[0091] The cutouts 17 of the two second laser diodes 16 penetrate through the two second laser diodes 16, in particular both active regions 7 of the two first laser diodes 16. Furthermore, it is possible for the cutouts 17 of the two second laser diodes 16 to completely perforate the first propagation layers 5, the active zones 7 and the second propagation layers 6 of the two second laser diodes 16.

[0092] The second frequency-stabilizing element 14 here is arranged offset with respect to the first frequency-stabilizing element 13 in a longitudinal direction in plan view. That is to say that the first frequency-stabilizing element 13 is embodied in a manner free of overlap with respect to the second frequency-stabilizing element 14 in a longitudinal direction in plan view. Furthermore, the first frequency-stabilizing element 13 and the second frequency-stabilizing element 14 are freely accessible from outside.

[0093] In contrast to the exemplary embodiment in FIG. 1, the exemplary embodiment in FIG. 4 shows an edge emitting semiconductor laser 1 comprising three laser diodes 2 and a single frequency-stabilizing element 12. In this exemplary embodiment, each resonator is delimited by the single frequency-stabilizing element 12.

[0094] The cutouts 17 of the laser diodes 2 penetrate through the semiconductor layers of the laser diodes 2. In particular, the cutouts 17 completely penetrate through the first propagation layers 5, the active zones 7 and the second propagation layers 6 of each laser diode 2.

[0095] The features and exemplary embodiments described in association with the figures can be combined with one another in accordance with further exemplary embodiments, even if not all of the combinations are explicitly described. Furthermore, the exemplary embodiments described in association with the figures can alternatively or additionally have further features in accordance with the description in the general part.

[0096] The invention is not restricted to the exemplary embodiments by the description on the basis thereof. Rather, the invention encompasses any novel feature and also any combination of features, which in particular includes any combination of features in the patent claims, even if this feature or this combination itself is not explicitly explained in the patent claims or exemplary embodiments.