Methods of making sugar cone spheres

Abstract

A method of making sugar cone spheres is disclosed having an interior of an edible filling such as ice cream or frozen yoghurt encapsulated by a wafer. The method includes: baking a wafer dough mix on a heated waffle iron to produce a wafer, shaping the wafer into a shape by placing the wafer between an outer mold and an inner half mold and pressing the outer mold against the inner mold, cutting the wafer at a perimeter of the shape to produce a half-molded wafer shell, adding an edible filling to a cavity of the half-molded wafer shell, adding another edible filling to a cavity of another half-molded wafer shell, joining a perimeter of the half-molded wafer shell and a perimeter of the other half-molded wafer shell, and freezing the half-molded wafer shell and the other half-molded wafer shell together to produce a bite-size edible treat.

Claims

1. A method for producing a bite-size edible treat enclosed within a wafer shell, the method comprising: baking a wafer dough mix on a heated waffle iron to produce a wafer; shaping the wafer into a shape by placing the wafer between an outer mold and an inner half mold and pressing the outer mold against the inner mold, wherein a diameter of the shape is in a range from approximately 0.5 inches to approximately 2 inches; cutting the wafer, using a cutter, at a perimeter of the shape to produce a half-molded wafer shell, wherein the cutter comprises an outer shell and an inner shell, wherein the outer shell of the cutter comprises a first bottom, an inwardly sloped spacer, and a first top, wherein the inner shell of the cutter comprises a second top and a second bottom, wherein a diameter of the inner shell is approximately a diameter of the half-molded wafer shell, and wherein a diameter of the outer shell is between about 0.1-0.3 inches greater than a diameter of the inner shell; adding an edible filling to a cavity of the half-molded wafer shell; adding another edible filling to a cavity of another half-molded wafer shell; joining a perimeter of the half-molded wafer shell and a perimeter of the other half-molded wafer shell; and freezing the half-molded wafer shell and the other half-molded wafer shell together to produce a bite-size edible treat.

2. The method of claim 1, further comprising: placing a sugar cone connector at an interface between the half-molded wafer shell and the other half-molded wafer shell.

3. The method of claim 1, wherein the edible filling and/or the other edible filing comprises a frozen dessert selected from the group consisting of ice cream and frozen yoghurt.

4. The method of claim 3, wherein the frozen dessert further comprises chocolate chips.

5. The method of claim 1, further comprising: coating an interior and/or an exterior surface of the half-molded wafer shell and/or the other half-molded wafer shell with chocolate.

6. The method of claim 3, wherein the frozen dessert has a single flavor.

7. The method of claim 3, wherein the frozen dessert has two or more different flavors.

8. The method of claim 3, wherein the frozen dessert comprises fragments of fruit.

9. The method of claim 1, wherein the outer mold and the inner mold together form a spherical shape.

10. The method of claim 1, wherein the wafer has a pattern on its exterior surface.

11. A method for producing a bite-size ice cream sugar cone sphere, the method comprising: baking a wafer dough mix on a heated waffle iron to produce a wafer; shaping the wafer into a shape by placing the wafer between an outer mold and an inner mold and pressing the outer mold against the inner mold, wherein a diameter of the shape is in a range from approximately 0.5 inches to approximately 2 inches, and wherein the outer mold and the inner mold together form a spherical shape; cutting, using a cutter, the wafer at a perimeter of the shape to produce a half-molded wafer shell, wherein the cutter comprises an outer shell and an inner shell, wherein the outer shell of the cutter comprises a first bottom, an inwardly sloped spacer, and a first top, wherein the inner shell of the cutter comprises a second top and a second bottom, wherein a diameter of the inner shell is approximately a diameter of the half-molded wafer shell, and wherein a diameter of the outer shell is between about 0.1-0.3 inches greater than a diameter of the inner shell; filling a cavity of the half-molded wafer shell with ice cream; filling a cavity of another half-molded wafer shell with the ice cream; joining a perimeter of the half-molded wafer shell and a perimeter of the other half-molded wafer shell; freezing the half-molded wafer shell and the other half-molded wafer shell together to produce the bite-size ice cream sugar cone product.

12. The method of claim 11, further comprising: placing a sugar cone connector at an interface between the half-molded wafer shell and the other half-molded wafer shell.

13. The method of claim 11, further comprising: coating an interior and/or an exterior of the half-molded wafer shell and/or the other half-molded wafer shell with chocolate.

14. The method of claim 11, wherein the ice cream consists of a single flavor.

15. The method of claim 11, wherein the ice cream comprises two or more different flavors.

16. The method of claim 11, wherein the ice cream comprises candy.

17. The method of claim 16, wherein the candy comprises chocolate chips.

18. The method of claim 11, wherein the ice cream comprises fragments of fruit.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 depicts an exemplary top perspective view of a waffle baking machine with temperature/color control and indicator lights showing when the wafer dough mix is baking and when baking is complete.

(2) FIG. 2 shows an exemplary perspective view of the waffle baking machine having a hinge connected top and bottom heated waffle iron.

(3) FIG. 3 shows an exemplary top perspective view with the top waffle iron place on the bottom waffle iron.

(4) FIG. 4 shows an exemplary top perspective view ½ spherical molds.

(5) FIG. 5 shows an exemplary views of a cylindrical shape cutter. FIGS. 5A and 5B show a side view and top view of an outer cylinder respectively. FIGS. 5C and 5D show top view and side view of the inner cylinder. FIG. 5E depicts a piece of the waffle wafer after molding into a semi-spherical shape. FIG. 5F depicts a semi-spherical waffle wafer shell after being cut at the midline by the cylindrical shape cutter shown in FIGS. 5A-D.

(6) FIG. 6 shows a exemplary schematic and picture of a baked wafer with a circular cut out, an upper and lower ½ spherical mold and a half-spherical wafer shell.

(7) FIG. 7 shows an exemplary perspective view of brushes used to coat molten chocolate on to the half-spherical wafer shell.

(8) FIG. 8 shows an exemplary perspective view of a bite-size sugar cone sphere.

(9) FIG. 9 shows an exemplary top view of the bite-size sugar cone sphere of FIG. 8.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

(10) The preferred embodiments of the present invention will now be described with reference to the drawings. Identical elements in the various figures are identified with the same reference numerals.

(11) Reference will now be made in detail to each embodiment of the present invention. Such embodiments are provided by way of explanation of the present invention, which is not intended to be limited thereto. In fact, those of ordinary skill in the art may appreciate upon reading the present specification and viewing the present drawings that various modifications and variations can be made thereto.

(12) FIGS. 1-3 disclose an exemplary depiction of an electric WaffleCone baking machine.

(13) FIG. 1 shows the top of the upper waffle iron 1 and a color control 2 that regulates the baking temperature. The LED light “READY” signals when the upper and lower waffle iron has reached an appropriate temperature. The LED light “BAKING” indicates when baking of the wafer dough mix is in progress.

(14) FIG. 2 depicts the WaffleCone baking machine with a handle 5, a hinge-connected heated upper waffle iron 3 and lower waffle iron 4 and a base 6.

(15) As shown in FIG. 3, the upper and lower waffle irons (3, 4) are opposite to each other when closed. The waffle iron can have a grid pattern that is rectilinear with the pattern lines running dominantly from the front of the waffle maker to the rear as well as from left to right. The wafer dough mix is spread evenly across the waffle plates. Generally the mix is introduced manually onto the center of the lower heater waffle plate and is then spread out between the upper and lower plates as the upper plate is lowered into contact with the lower plate. The wafer is baked until the consistency of the wafer is still soft.

(16) In certain embodiments, the wafer can be about 0.1, 0.2, 0.3, 0.4 or 0.5 inches thick.

(17) As shown in FIGS. 4-5, the wafer 11 can be shaped into a ½ spherical shape 9 by placing the wafer between and pressing an outer ½ spherical mold 8 against an inner ½ spherical mold 7 to produce a ½ spherical shape 9. The diameter of the outer ½ spherical mold can be about 0.1, 0.2, 0.3 inches greater than the inner ½ spherical mold to allow for the placement of the outer mold on to the inner mold. In certain embodiments, the ½ spherical shape 9 can have a diameter of about ½, about 1, about 1.5, or about 2 inches. The ½ spherical shape 9 is then cut at the midline 12 using a cylindrical cutter that can be placed over the ½ spherical shape 9 (see FIGS. 5A-5D).

(18) The cylindrical cutter has an outer cylindrical shell depicted in FIGS. 5A-5B with a circular bottom 15, an inwardly sloped spacer 14 and a circular top 16 and an inner cylindrical shell depicted in FIGS. 5C-5D that has a circular top 17 and a sharp circular bottom 18. In a preferred embodiment, the inner cylindrical shell has a diameter that approximates the diameter of the ½ spherical shape 9. The diameter of the outer cylindrical shell can be about 0.1, 0.2, 0.3 inches greater than the inner cylindrical shell so as to allow for the movement of the inner cylinder within the outer cylinder. The circular aperture at the bottom 15 of the outer cylinder is then placed over the ½ spherical shape 9 attached to the wafer 11 (see FIG. 5E). The circular bottom 18 of the inner cylindrical shell is placed inside the outer cylinder through the aperture at the top of the outer cylindrical shell 16 and pressure is applied to the circular top 17 to cut out the periphery of the ½ spherical shape 9 at the midline 12 (see FIG. 5F). FIG. 6 depicts the circular cut out 10 of the wafer, the ½ spherical shape 9 and the an outer mold 8 and an inner mold 7.

(19) FIG. 7 depicts brushes that may be used to apply molten chocolated to the interior and/or exterior surface of the ½ spherical shape 9.

(20) An edible filling is then added to the interior of the ½ spherical shape 9. The edible filling can be ice cream, frozen yoghurt, a creme filling, chocolate or other dessert. The ice cream can have one flavor or multiple flavors. Exemplary flavors include, but are not limited to, vanilla, strawberry, chocolate, pineapple and cheesecake. In certain embodiments, the edible filling may include candy, e.g. chocolate chips and/or M&Ms and/or fragments of fruit.

(21) As shown in FIGS. 8-9, two ½ spherical shapes 9 filled with the edible filling, such as ice cream, are joined together at their midline 12 and flash frozen to produce a bite-size sugar cone sphere.

(22) Although this invention has been described with a certain degree of particularity, it is to be understood that the present disclosure has been made only by way of illustration and that numerous changes in the details of construction and arrangement of parts may be resorted to without departing from the spirit and the scope of the invention.