Component Carrier with Embedded High-Frequency Component and Integrated Waveguide for Wireless Communication

Abstract

A component carrier which includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a high-frequency component embedded in the stack. At least one waveguide is integrated in the stack. A transmission line and a coupling element configured transmit a signal between the high-frequency component and the at least one waveguide. A transmission and/or reception unit wirelessly transmits and/or receives one or more signals.

Claims

1. A component carrier, comprising: a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a high-frequency component embedded in the stack; at least one waveguide integrated in the stack; a transmission line and a coupling element configured for transmitting a signal between the high-frequency component and the at least one waveguide; and a transmission and/or reception unit configured for wirelessly transmitting and/or receiving a signal.

2. The component carrier according to claim 1, wherein the transmission line and/or the coupling element is or are arranged on a main surface of the stack.

3. The component carrier according to claim 1, wherein the component carrier is configured for transmitting a signal from the high-frequency component via the transmission line, the coupling element and the at least one waveguide to the transmission and/or reception unit for wireless transmission.

4. The component carrier according to claim 1, wherein the component carrier is configured for wirelessly receiving a signal by the transmission and/or reception unit, and transmitting the received signal via the at least one waveguide, the coupling element and the transmission line to the high-frequency component.

5. The component carrier according to claim 1, wherein the transmission and/or reception unit is configured for wirelessly transmitting and/or receiving a signal at a main surface of the stack, in particular at a main surface of the stack opposing another main surface of the stack at which the transmission line and the coupling element are formed.

6. The component carrier according to claim 1, wherein the transmission and/or reception unit is configured for wirelessly transmitting and/or receiving a signal at a sidewall of the stack.

7. The component carrier according to claim 1, wherein the transmission and/or reception unit is configured for wirelessly transmitting and/or receiving a signal via at least one transmission and/or receiving notch in a surface of the stack.

8. The component carrier according to claim 1, wherein the at least one waveguide comprises a first waveguide and a second waveguide.

9. The component carrier according to claim 8, wherein the first waveguide and the second waveguide are coupled with each other by a coupling through hole connecting the first waveguide and the second waveguide and extending through part of the stack.

10. The component carrier according to claim 8, wherein the first waveguide and the second waveguide are coupled with each other by an aperture in one of the at least one electrically conductive layer structure and/or at least one electrically insulating layer structure of the stack.

11. The component carrier according to claim 8, wherein one of the first waveguide and the second waveguide is a substantially horizontally extending waveguide and the other one is a substantially vertically extending waveguide, and wherein the substantially horizontally extending waveguide and the substantially vertically extending waveguide are connected by a bending section.

12. The component carrier according to claim 1, having only one waveguide.

13. The component carrier according to claim 1, wherein at least one of the at least one waveguide is filled with air.

14. The component carrier according to claim 1, wherein at least one of the at least one waveguide is filled with a low DF dielectric solid.

15. The component carrier according to claim 1, wherein the component carrier is configured for carrying out a mode conversion between the high-frequency component and the at least one waveguide.

16. The component carrier according to claim 1, wherein the stack comprises three interconnected cores; wherein the transmission line and the high-frequency component are electrically coupled by at least one vertical through connection embedded in the stack.

17. The component carrier according to claim 1, comprising at least one of the following features: wherein the embedded high-frequency component is fully circumferentially surrounded by material of the stack; wherein the component carrier is configured as a radar module; wherein the coupling element is a coupling antenna.

18. An electronic device, comprising: a component carrier having a stack; a high-frequency component; at least one waveguide; a transmission line; a coupling element; and a transmission unit and/or a reception unit, the stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, the high-frequency component embedded in the stack, the at least one waveguide integrated in the stack, the transmission line and the coupling element configured for transmitting a signal between the high-frequency component and the at least one waveguide, and the transmission and/or the reception unit configured for wirelessly transmitting and/or receiving a signal.

19. The electronic device according to claim 18, configured as one of the group consisting of a level sensor device for sensing a filling level in a container, a communication device for wireless data communication with a communication partner device, and an automotive device configured for assembly in a vehicle.

20. A method of manufacturing a component carrier, comprising: providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; embedding a high-frequency component in the stack; integrating at least one waveguide in the stack; forming a transmission line and a coupling element for transmitting a signal between the high-frequency component and the at least one waveguide; and forming a transmission and/or reception unit for wirelessly transmitting and/or receiving a signal.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0069] FIG. 1 illustrates a schematic cross-sectional view of a component carrier according to an exemplary embodiment.

[0070] FIG. 2 illustrates a three-dimensional cross-sectional view of a component carrier according to another exemplary embodiment.

[0071] FIG. 3 illustrates another three-dimensional cross-sectional view of the component carrier according to FIG. 2.

[0072] FIG. 4 illustrates a three-dimensional cross-sectional view of a component carrier according to still another exemplary embodiment.

[0073] FIG. 5 illustrates an electronic device comprising a component carrier according to an exemplary embodiment.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

[0074] The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.

[0075] Before referring to the drawings, exemplary embodiments will be described in further detail, some basic considerations will be summarized based on which exemplary embodiments of the invention have been developed.

[0076] Conventionally, high-frequency devices have been built with a front-end module utilizing a substrate with waveguide. A plurality of separate printed circuit boards, each comprising surface mounted constituents, have then been soldered together. Such conventional approaches require a high space consumption, are bulky and suffer from poor signal transmission quality.

[0077] According to an exemplary embodiment of the invention, a high-frequency component (such as an RFIC) can be embedded in a component carrier (such as a printed circuit board, PCB) in combination with one or more embedded waveguides to form a self-packaged component carrier. The embedded high-frequency component may be functionally coupled with the integrated waveguide(s) by a transmission line and a coupling element, and electromagnetic signals may be wirelessly transmitted and/or received by a transmission and/or reception unit of the component carrier. Hence, all mentioned constituents may be integrated in a single component carrier in a space-saving configuration and with excellent signal transmission quality.

[0078] Although multiple applications of such a component carrier are possible, an exemplary application of exemplary embodiments of the invention relates to an automotive radar module. A further application of exemplary embodiments of the invention is a device operating in accordance with a 60 GHz wireless network protocol, also denoted as 60 GHz Wi-Fi or WiGig.

[0079] Descriptively speaking, an exemplary embodiment of the invention provides a PCB-type component carrier that fulfills a comparable functionality as the three above mentioned PCBs with significantly smaller space consumption and significantly improved transmission quality. Since soldering or comparable connection techniques may be dispensable according to exemplary embodiments of the invention and since multiple PCBs may be combined in one single component carrier, signal losses may be strongly suppressed. Moreover, a (for instance air filled) waveguide embedded in the stack of the component carrier offers a better signal performance than conventional approaches. Also, PCB-packaged waveguide antennas may contribute to the excellent signal performance of a component carrier according to an exemplary embodiment of the invention.

[0080] Hence, an exemplary embodiment combines conventionally separate PCBs into one while offering better signal performance, in particular by integrating an empty (i.e., air filled) substrate-integrated waveguide (SIW). Furthermore, a high-frequency component (in particular a front-end RFIC) may be embedded in the same core or stack of the component carrier to offer excellent RF performance.

[0081] A gist of an exemplary embodiment is to embed a whole radar front-end into one printed circuit board in order to circumvent the need for at least one additional separate PCB assembly and to offer a highly efficient and low-loss antenna.

[0082] In automotive radar systems, high-performance antennas may be desired in order to offer high reliability, high efficiency of the overall system and low power consumption. According to an exemplary embodiment of the invention, one or more high-frequency components (such as RFIC chips) and a feeding network to the waveguide-based antennas can all be integrated in one PCB, rather than relying on separately build-up PCBs which are then soldered together.

[0083] In one embodiment, a component carrier with an air-filled substrate embedded waveguide may be provided. In another embodiment, a component carrier may be equipped with a substrate integrated waveguide, which is particularly simply in manufacture. Both configurations offer a high performance. The one or more high-frequency components may be embedded in the stack of the component carrier to obtain a compact configuration, rather than being surface mounted in a bulky fashion.

[0084] In one embodiment, the at least one waveguide may be a PCB embedded air-filled waveguide.

[0085] However, in one embodiment the at least one waveguide may be a substrate integrated waveguide (SIW). The term “substrate-integrated waveguide (SIW)” specifies a structure that enables a waveguide like propagation mode. The sidewalls for an SIW may be not continuous metal walls, but they may be formed by plated through holes and/or vias. The density of such a via fence may yield a maximum operational frequency of the SIW, and the propagation mode may be different from other types of waveguides.

[0086] In particular, an RFIC-type high-frequency component may be embedded in a PCB-type layer stack. It may then be possible to feed the substrate integrated waveguide (which may be optionally air-filled) through a cutout in the layer stack with a microstrip antenna. The substrate integrated waveguide may be advantageously formed with a high-frequency dielectric having a low DF value as its base, while an air-filled substrate embedded waveguide can be formed with a simple FR4 dielectric. By taking this measure, a proper alignment between the different parts of the overall PCB-type component carrier may be obtained.

[0087] In particular, a self-packaged automotive radar module with excellent signal performance may be obtained. By embedding a high-frequency component in a laminated layer stack rather than soldering a high-frequency component in a surface mounted fashion, RF performance may be significantly improved by avoiding the negative influence of solder balls on the transition resistance. Furthermore, a waveguide (such as at least one substrate integrated waveguide) may be implemented according to exemplary embodiments of the invention and may show a significant performance improvement compared to standard PCB transmission modes. Embedding an integrated waveguide in the stack of the component carrier according to an exemplary embodiment of the invention may also reduce the manufacturing effort for the passive RF circuit compared to an externally assembled waveguide. Preferably, the high-frequency component (in particular an RFIC) and the waveguide may be embedded on top of each other which saves space in a lateral direction.

[0088] Hence, a component carrier according to an exemplary embodiment of the invention implements an embedded RF front-end with an integrated RFIC inside the PCB. Such a configuration may be particularly advantageous for automotive applications, but is not limited to it.

[0089] FIG. 1 illustrates a schematic cross-sectional view of a component carrier 100 according to an exemplary embodiment of the invention.

[0090] Component carrier 100 according to FIG. 1 may be configured as a plate-shaped laminate-type printed circuit board (PCB). Thus, the component carrier 100 shown in FIG. 1 may be highly compact in a vertical direction. More specifically, the component carrier 100 may comprise a laminated layer stack 102 of electrically conductive layer structures 104 and electrically insulating layer structures 106 (see detail 154 in FIG. 1). Again referring to detail 154 in FIG. 1, the electrically conductive layer structures 104 may comprise patterned or continuous copper foils and vertical through connections, for example copper filled laser vias which may be created by plating. The electrically insulating layer structures 106 may comprise a respective resin (such as a respective epoxy resin), preferably comprising reinforcing particles therein (for instance glass fibers or glass spheres). For instance, the electrically insulating layer structures 106 may be made of prepreg or FR4.

[0091] Moreover, the component carrier 100 comprises a high-frequency component 108 embedded in the stack 102. This promotes compactness of the design of the component carrier 100. In the shown embodiment, the embedded high-frequency component 108 is fully circumferentially surrounded by material of the stack 102 and is thus properly mechanically protected. Also, creation of a shielding (not shown, for instance, a magnetic cage or a metallic cage surrounding at least part of the high-frequency component 108) of the high-frequency component 108 with respect to electromagnetic stray radiation from the environment is easily possible when the high-frequency component 108 is fully circumferentially embedded in the stack 102. Although not shown in FIG. 1, one or more further high-frequency components 108 may be embedded in the stack as well (for instance, one or more further RFICs, radio-frequency integrated circuits). This may allow to further extend the electronic functionality of the component carrier 100. For instance, the high-frequency component 108 may comprise front end circuitry. The high-frequency component 108 may for instance be embodied as a semiconductor chip, which may be a naked die or a packaged chip.

[0092] Furthermore, a first waveguide 110 (which may be embodied as a cavity in stack 102, for instance filled with air or with a low DF and/or low DK dielectric) and a second waveguide 111 (which may be embodied as a cavity in stack 102, for instance filled with air or with a low DF and/or low DK dielectric) are formed or integrated in an interior of the stack 102. This promotes compactness of the design of the component carrier 100. The illustrated waveguide design may provide a highly accurate signal transmission with low RF losses. As shown, the first waveguide 110 and the second waveguide 111 are efficiently coupled by a narrow coupling through hole 124 (which may be denoted as a hollow coupling neck) extending vertically through part of the stack 102.

[0093] Although not shown, the first waveguide 110 and the second waveguide 111 may also be coupled with each other by an aperture in a layer of the stack 102. It is also possible that one of the first waveguide 110 and the second waveguide 111 is a substantially horizontally extending waveguide and the other one is a substantially vertically extending waveguide, wherein the substantially horizontally extending waveguide and the substantially vertically extending waveguide are connected by a 90° bending section.

[0094] In the shown embodiment, the first waveguide 110 is filled with air. Moreover, the second waveguide 111 may be filled with a low DF and/or low DK dielectric solid 126, such as a ceramic or RO3003™ material, as commercialized by the company Rogers Corporation. Both designs may keep the losses small.

[0095] Beyond this, a transmission line 112 and a coupling element 114 (preferably, but not necessarily embodied as a coupling antenna) are formed, preferably as a common patterned metal layer, on a main surface 118 of the stack 102. This may keep the signal path between component 108 and waveguide 110 short. As shown, both the transmission line 112 and the coupling element 114 are arranged on the upper main surface 118 of the stack 102. The transmission line 112 may be embodied as a stripline which may be connected to vertical through connections 130, here embodied as copper filled laser vias. The vertical through connections 130, in turn, may be connected to pads of the high-frequency component 108. Hence, the transmission line 112 and the high-frequency component 108 may be electrically coupled by the vertical through connections 130 embedded in the stack 102 and embodied as metal-filled vias.

[0096] The coupling element 114 may be configured for irradiating an electromagnetic signal, which is based on an electric signal propagating along the transmission line 112, into the first waveguide 110. Thus, the combination of transmission line 112 and coupling element 114 is configured for efficiently transmitting a signal between the high-frequency component 108 and the first waveguide 110.

[0097] Moreover, a transmission and/or reception unit 116 is provided which is coupled with the waveguides 110, 111. In the shown embodiment, the transmission and/or reception unit 116 is formed at a lower main surface 117 of the component carrier 100 opposing the upper main surface 118 of the component carrier 100 at which the transmission line 112 and the coupling element 114 are formed. The transmission and/or reception unit 116 may be configured for wirelessly transmitting a signal to a communication partner device (not shown) and/or for receiving a signal from a communication partner device (not shown). In the shown embodiment, the component carrier 100 is configured for transmitting a signal from the high-frequency component 108 via the transmission line 112, the coupling element 114 and the waveguides 110, 111 to the transmission and/or reception unit 116 for wireless transmission. Furthermore, the component carrier 100 may be configured for wirelessly receiving a signal (in particular electromagnetic radiation signals 158) by the transmission and/or reception unit 116, and transmitting the received signal via the waveguides 110, 111, the coupling element 114 and the transmission line 112 to the high-frequency component 108. Thus, the described signal path between high-frequency component 108 and transmission and/or reception unit 116 may be bidirectional, so that the transmission and/or reception unit 116 can be denoted as a transceiver unit. In another embodiment, also a unidirectional communication path is possible. Advantageously, the transmission and/or reception unit 116 may be configured for wirelessly transmitting and/or receiving a signal via a number of (in the shown embodiment three) trans-mission and/or receiving notches 122 formed in the lower main surface 117.

[0098] Spatially separating the signal transmission between coupling element 114 and first waveguide 110 on the one hand and wireless signal transmission by transmission and/or reception unit 116 on the other hand on opposing main surfaces 117, 118 of the stack 102 may efficiently prevent an undesired interaction between the signals and increases signal quality.

[0099] As indicated in FIG. 1 as well, the transmission and/or reception unit 116 may be additionally or alternatively configured for wirelessly transmitting and/or receiving a signal at a sidewall 120 of the component carrier 100. This keeps the lower main surface 117 free for other tasks, such as surface mounting further components (not shown).

[0100] The coupling element 114 of the component carrier 100 may be configured for carrying out a mode conversion between the high-frequency component 108 and the waveguides 110, 111. This may reduce RF losses. Said mode conversion may convert a mode of the signal between a transverse electromagnetic mode and a transverse electric mode. More specifically, the mentioned transverse electromagnetic mode may be present at the high-frequency component 108, whereas the transverse electric mode may be present at the waveguides 110, 111.

[0101] For example, the component carrier 100 is configured as a radar mod-ule for an automotive application.

[0102] FIG. 2 illustrates a three-dimensional cross-sectional view of a component carrier 100 according to another exemplary embodiment of the invention. FIG. 3 illustrates another three-dimensional cross-sectional view of the component carrier 100 according to FIG. 2. FIG. 2 and FIG. 3 show cross-sectional views of waveguides 110, 111. For instance, both waveguides 110, 111 may be air filled cavities. Shape and dimensions of the waveguides 110, 111 may be selected in accordance with a desired frequency and/or a desired mode. Electrically insulating layer structures 106 may be made of prepreg. Advantageously, only electrically insulating layer structures 106′ may be made of high-frequency dielectric. By taking this measure, the higher effort involved with high-frequency dielectrics may be limited to regions of the component carrier 100 where they are of utmost advantage, such as at a bottom of waveguide 110. All other dielectrics may be ordinary prepreg which may be provided with lower effort.

[0103] FIG. 4 illustrates a three-dimensional cross-sectional view of a component carrier 100 according to still another exemplary embodiment of the invention. FIG. 4 show a cross-sectional view of waveguides 110, 111 with SIW. For instance, waveguide 110 may be an air-filled cavity, whereas waveguide 111 may be filled with a low DF and/or low DK dielectric.

[0104] The feature according to reference sign 124 does not necessarily have to be a real physical hole, as shown in FIG. 4. In another embodiment, it can also be an aperture in a ground plane.

[0105] FIG. 5 illustrates an electronic device 150 comprising a component carrier 100 according to an exemplary embodiment of the invention.

[0106] The electronic device 150 comprises a component carrier 100 according to FIG. 1 to FIG. 4. For instance, the electronic device 150 is configured as a level sensor device for sensing a filling level in a container, a communication device for wireless data communication with a communication partner device, an automotive device for assembly in a car, etc. Furthermore, the electronic device 150 may comprise a processor 152 which is coupled with the component carrier 100, for instance for controlling the component carrier 100 and/or for being controlled by the component carrier 100. By the component carrier 100, electromagnetic radiation signals 158 may be emitted and/or received.

[0107] It should be noted that the term “comprising” does not exclude other elements or steps and the article “a” or “an” does not exclude a plurality. Also, elements described in association with different embodiments may be combined.

[0108] Implementation of the invention is not limited to the preferred embodiments shown in the figures and described above. Instead, a multiplicity of variants is possible which use the solutions shown and the principle according to the invention even in the case of fundamentally different embodiments.