Receiver architectures with parametric circuits
11424772 · 2022-08-23
Assignee
Inventors
Cpc classification
H04B1/10
ELECTRICITY
H03F1/26
ELECTRICITY
H03F2200/168
ELECTRICITY
H03G3/3052
ELECTRICITY
H03F7/04
ELECTRICITY
H03F2200/408
ELECTRICITY
H03F1/56
ELECTRICITY
H04B1/0475
ELECTRICITY
International classification
H03F1/26
ELECTRICITY
H03F7/04
ELECTRICITY
Abstract
An RF receiver circuit configuration and design is limited by conditions and frequencies to simultaneously provide steady state low-noise signal amplification, frequency down-conversion, and image signal rejection. The RF receiver circuit may be implemented as one of a CMOS single chip device or as part of an integrated system of CMOS components.
Claims
1. An RF receiver circuit design limited by conditions and frequencies to simultaneously provide steady state low-noise signal amplification, frequency down-conversion and image signal rejection, the RF receiver circuit design comprising: an antenna coupled to an input of a first RF band select filter RF-BPF1 with center frequency FIN which is connected on an output side to an input side of a low-noise amplifier LNA; a second RF band select filter RF-BPF2 with center frequency FIN connected on an input side to the output of low-noise amplifier LNA and connected on an output side to an input side of a mixer block; a variable gain amplifier VGA coupled on an input side to an output of the mixer block and coupled on an output side to an input of an analog-to-digital converter from whose output is coupled a base-band block BB; and wherein the mixer block comprises a first parametric diode circuit PAR1 connected at a first input to filter RF-BPF2 and connected at a second input to a local oscillator LO with frequency F and further connected at an output to an input side of an IF filter IF-BPF with center frequency FIF.
2. The RF receiver circuit design of claim 1, wherein frequency F=FIN+FIF.
3. The RF receiver circuit design of claim 2, wherein the frequency pair (FIN, FIF) comprises one of the pairs (1.575 GHz, 0.008 GHz), (19 GHz, 3 GHz), (28 GHz, 3 GHz), (39 GHz, 5 GHz), (66 GHz, 5 GHz), (77 GHz, 5 GHz), or (94 GHz, 5 GHz).
4. The RF receiver circuit design of claim 3, wherein band select filter RF-BF1 comprises one of a BAW or SAW filter and is connected on its output side to the input side of the mixer block eliminating low-noise amplifier LNA and second band select filter RF-BPF2, and wherein parametric diode circuit PAR1 operates as a low-noise amplifier with down-conversion and image rejection.
5. The RF receiver circuit design of claim 3, implemented as one of a CMOS single chip device or as part of an integrated system of CMOS components.
6. An RF receiver circuit design limited by conditions and frequencies to simultaneously provide steady state low-noise signal amplification, frequency down-conversion and image signal rejection, the RF receiver circuit design comprising: an antenna coupled to an input of a first RF band select filter RF-BPF1 with center frequency FIN which is connected on an output side to an input side of a mixer block; a variable gain amplifier VGA coupled on an input side to an output of the mixer block and coupled on an output side to an input of an analog-to-digital converter from whose output is coupled a base-band block BB; wherein the mixer block comprises: a first parametric diode circuit PAR1 connected at a first input to filter RF-BPF1 and connected at a second input to a local oscillator LO with frequency F and further connected at an output to an input side of a second RF band select filter RF-BPF2 with center frequency F−FIN; and a second parametric diode circuit PAR2 connected at a first input to filter RF-BPF2 and coupled at a second input through a divide by two frequency divider to local oscillator LO and further connected at an output to an input side of an IF filter IF-BPF with center frequency FIF.
7. The RF receiver circuit design of claim 6, wherein frequency F=2FIN−2FIF.
8. The RF receiver circuit design of claim 7 wherein the frequency pair (FIN, FIF) comprises one of the pairs (1.575 GHz, 0.008 GHz), (19 GHz, 3 GHz), (28 GHz, 3 GHz), (39 GHz, 5 GHz), (66 GHz, 5 GHz), (77 GHz, 5 GHz), or (94 GHz, 5 GHz).
9. The RF receiver circuit design of claim 8, wherein: the first RF band select filter RF-BPF1 is connected on an output side to an input side of a low-noise amplifier LNA and the output of low-noise amplifier LNA and connected on an output side to an input side of the mixer block; and wherein parametric diode circuits PAR1 and PAR2 operate as a low-noise amplifier with down-conversion and image rejection.
10. The RF receiver circuit design of claim 8 implemented as one of a CMOS single chip device or as part of an integrated system of CMOS components.
11. An RF receiver circuit design limited by conditions and frequencies to simultaneously provide steady state low-noise signal amplification, frequency down-conversion and image signal rejection, the RF receiver circuit design comprising: an antenna coupled to an input of a first RF band select filter RF-BPF1 with center frequency FIN which is connected on an output side to an input side of a mixer block; a variable gain amplifier VGA coupled on an input side to an output of the mixer block and coupled on an output side to an input of an analog-to-digital converter from whose output is coupled a base-band block BB; wherein the mixer block comprises: a first parametric diode circuit PAR1 connected at a first input to filter RF-BPF1 and connected at a second input through a divide by two frequency divider to a local oscillator LO with frequency F and further connected at an output to an input side of a second RF band select filter RF-BPF2 with center frequency F−FIN; and a second parametric diode circuit PAR2 connected at a first input to filter RF-BPF2 and coupled at a second input to local oscillator LO with frequency F and further connected at an output to an input side of an IF filter IF-BPF with center frequency FIF.
12. The RF receiver circuit design of claim 11, wherein frequency F=2FIN+2FIF.
13. The RF receiver circuit design of claim 12, wherein the frequency pair (FIN, FIF) comprises one of the pairs (1.575 GHz, 0.008 GHz), (19 GHz, 3 GHz), (28 GHz, 3 GHz), (39 GHz, 5 GHz), (66 GHz, 5 GHz), (77 GHz, 5 GHz), or (94 GHz, 5 GHz).
14. The RF receiver circuit design of claim 13, wherein: the first RF band select filter RF-BPF is connected on an output side to an input side of a low-noise amplifier LNA and the output of low-noise amplifier LNA and connected on an output side to an input side of the mixer block; and wherein parametric diode circuits PAR1 and PAR2 operate as a low-noise amplifier with up-conversion and down-conversion and image rejection with low noise figure for the overall receiver chain.
15. The RF receiver circuit design of claim 13, implemented as one of a CMOS single chip device or as part of an integrated system of CMOS components.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The accompanying drawings illustrate the present invention.
(2)
(3)
(4)
(5)
(6)
(7)
(8)
DETAILED DESCRIPTION OF THE INVENTION
(9) Various embodiments of an RF receiver circuit configuration with a specific combination of conditions and frequencies that result in optimized and simultaneous low-noise amplification, down conversion, and image rejection are described herein. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. One skilled in the relevant art will recognize, however, that the techniques described herein can be practiced without one or more of the specific details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring certain aspects.
(10) Throughout the specification and claims, the following terms take the meanings explicitly associated herein, unless the context clearly dictates otherwise. The terms “coupled” and “connected”, which are utilized herein, are defined as follows. The term “connected” is used to describe a direct connection between two circuit elements, for example, by way of a metal line formed in accordance with normal integrated circuit fabrication techniques. In contrast, the term “coupled” is used to describe either a direct connection or an indirect connection between two circuit elements. For example, two coupled elements may be directly coupled by way of a metal line, or indirectly connected by way of an intervening circuit element (e.g., a capacitor, resistor, or by way of the source/drain terminals of a transistor). The term “circuit” means either a single component or a multiplicity of components, either active or passive, that are coupled together to provide a desired function. The term “signal” means at least one current, voltage, or data signal. Although circuit elements may be fabricated on the back side, when reference is made to certain circuit elements residing within or formed in a substrate, this is generally accepted to mean the circuits reside on the front side of the substrate.
(11) Reference throughout this specification to “one embodiment,” “an embodiment,” “one example,” or “an example” means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. Thus, the appearances of the phrases such as “in one embodiment” or “in one example” in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments or examples. Directional terminology such as “top”, “down”, “above”, “below” are used with reference to the orientation of the figure(s) being described. Also, the terms “have,” “include,” “contain,” and similar terms are defined to mean “comprising” unless specifically stated otherwise. Particular features, structures or characteristics may be included in an integrated circuit, an electronic circuit, a combinational logic circuit, or other suitable components that provide the described functionality.
(12)
(13) Many architectures of GPS receivers are known which resemble the architecture illustrated in
(14)
(15) Consider a simplified charge model for a varactor diode with second order non-linear characteristic:
q.sub.C=C.sub.0V.sub.C+αV.sub.C.sup.2 (1)
(16) One can write a voltage equation for the circuit illustrated in
V.sub.C=V.sub.1+V.sub.pump−V.sub.2 (2)
(17) Assume current from a signal source is a harmonic signal:
I.sub.S=I cos(ω.sub.1t+ψ) (3)
(18) Define voltage signals for an input RF, an output IF, and an LO (pump) signal as:
V.sub.1=A.sub.1 cos(ω.sub.1t+φ.sub.1) (4)
V.sub.2=A.sub.2 cos(ω.sub.2t+φ.sub.2) (5)
V.sub.pump=A.sub.pump cos(ω.sub.pumpt) (6)
(19) There are two possible steady-state solutions to achieve voltage amplitudes at the input and output circuits which are dependent on a resonant frequency choice relative to input signal frequency RF and output frequency IF:
(20) 1) Solution 1—High-Frequency Pump (Degenerate Circuit):
(21)
(22) 2) Solution 2—Low-Frequency Pump (Non-Degenerate Circuit):
(23)
(24) System equations (7) and (8) are well known for parametric amplifiers with two resonant circuits. An amplified signal can be taken either from an input circuit (amplitude A1) at frequency RF or from an output circuit (amplitude A2) at frequency IF.
(25) It is also known that power of a signal at a matched load is defined as:
(26)
(27) Here Ri is an intrinsic resistance of a signal source. If one applies an RF signal to an input circuit close to resonant frequency ω.sub.1 and tunes an output circuit with resonant frequency ω.sub.2 in such a way that ω.sub.pump≈ω.sub.1+ω.sub.2, one can get a down-converted signal with simultaneous amplification at IF frequency ω.sub.2 (degenerate type circuit). However, a proper choice of circuit parameters and pump amplitude is also required.
(28) If a signal source is conjugate matched to an input impedance of the circuit, then conversion voltage gain from an RF input signal frequency ω.sub.1 to an IF output signal frequency ω.sub.2 is:
(29)
(30) At the same time, an RF voltage gain at signal frequency ω.sub.1 at input circuit due to degeneration is:
(31)
(32) Equation (11) presents an important parameter for an antenna leakage estimation (i.e. LO frequency which could be close to operating frequencies and not rejected by RF-BPF1). In addition, a received signal could be amplified and transmitted back to surrounding area via the same antenna.
(33) If one wants to have a conversion gain greater than 1 at IF frequency ω.sub.2 the following condition should be met:
2αω.sub.2R.sub.2A.sub.pump>1−α.sup.2ω.sub.1ω.sub.2R.sub.1R.sub.2A.sub.pump.sup.2 (12)
(34) Solving the above equation and taking into account that pump amplitude can only have positive values, one can get a minimum pump voltage amplitude at which conversion gain equals to 1:
(35)
(36) The critical pump amplitude above at which the parametric circuit becomes unstable can be defined as:
(37)
(38) Finally, conditions for a stable down-conversion from RF frequency ω.sub.1 to IF frequency ω.sub.2 can be defined as:
(39)
(40) So if the LO (pump) frequency ω.sub.pump≈ω.sub.1+ω.sub.2 is higher than an input signal RF frequency ω.sub.1, at any combinations of ω.sub.1 and ω.sub.2 as well as R.sub.1 and R.sub.2, there is a possible solution when G.sub.conv>1 if one exceeds a pump voltage amplitude A.sub.pump.sup.min(G.sub.conv=1). A degenerate amplification phenomenon is pertinent to the above-noted circuit during down-conversion operation. If one applies an RF signal to an input circuit close to its resonant frequency ω.sub.1 and tunes an output circuit to satisfy the condition ω.sub.pump≈ω.sub.1−ω.sub.2, one can get a down-converted signal with simultaneous amplification or damping at an IF frequency (non-degenerate type circuit). However, a proper choice of circuit parameters and pump amplitude is required in this case as well. Also, contrary to a typical low-IF down-conversion operation with a mixer, the circuit does not have an image signal reject problem if circuit parameters are properly chosen.
(41) For the main down-converted signal one can utilize a degenerate type of circuit, while for an image signal this circuit will behave as a non-degenerate type, “automatically” rejecting an image signal at an IF output.
(42) For proper operation, an input RF signal should be substantially rejected at an output IF circuit. This can be easily achieved at the design stage by choosing a very large frequency separation between RF and IF signals. One can define an image reject ratio IRR from system equations (7) and (8) as a ratio of IF voltage amplitude down-converted from a useful RF signal to IF voltage amplitude down-converted from an image RF signal to the same output by the following formula:
(43)
(44) The voltage amplitude at an IF output circuit is proportional to the amplitude at a RF input circuit as well as being proportional to an IF frequency.
A.sub.2=(αω.sub.2R.sub.2A.sub.pump)*A.sub.1 (17)
(45) This can result in an IF signal linear distortion over the frequency bandwidth of a signal. A proper choice of a low-pass filter shape at the output can compensate for this distortion. This formula is valid for either degenerate or non-degenerate down-conversion to IF frequency. So, if one chooses pump (LO) frequency above a useful RF signal, one can get low-IF down-conversion with proper image reject ratio (IRR). Useful down-converted signal is linearly amplified (within a certain dynamic range of a signal) and mirrored around a center frequency while an image signal is damped without changing phase characteristics.
(46) A simplified charge model of a varactor diode capacitance has been considered in the above description (see formula (1)) and the non-linearity properties of the entire circuit have not been taken into account. A higher order charge model for a varactor diode should be used for full signal analysis.
(47) If one defines a pump parameter as PumpX=√{square root over (α.sup.2ω.sub.1ω.sub.2R.sub.1R.sub.2A.sub.pump.sup.2)} (the critical pump voltage amplitude at which circuit starts oscillating) then an image reject ratio, a conversion gain from RF to IF as well as an RF voltage gain at an input circuit due to degeneration are presented in
(48) For a degenerate mode of operation, there is a minimum voltage gain of 6 dB for a signal at RF frequency at an input circuit. RF gain at an input circuit has very similar levels with IF gain at pump parameters above 0.9. So, an input RF circuit could be used to extract an amplified signal as well (i.e. via an inductive coupling to an input RF circuit or by use of a circulator) but this topic is out of discussion in this disclosure. It is worth noting that for the circuit architecture in
(49)
(50) The RF receiver circuit illustrated in
(51)
(52) The RF receiver circuit illustrated in
(53)
(54) The RF receiver circuit illustrated in
(55) For a particular RF frequency received at an antenna, the choice of IF frequency could be different depending on the architecture and frequency planning for an entire receiver. The proposed solutions offer flexible frequency choices and could be beneficial while considering off-the-shelf components available in a market, especially at mm-wave frequencies. Designing new filtering and LO components may be too costly. Everything mentioned in the above is valid for all the architectures and choices of FIN, FIF pairs. Certainly the proposed architectures could be used in receiver chains facing not only the antenna side but further down the receiver chain when converting from IF signals to low-IF in heterodyne receivers at mm-waves. Proposed architectures do not reveal particular parametric circuitry as they apply universally.
(56) The above description of illustrated examples of the present invention are not intended to be exhaustive or to be limited to the precise forms disclosed. While specific embodiments of, and examples for, the invention are described herein for illustrative purposes, various equivalent modifications are possible without departing from the broader spirit and scope of the present invention, and such alternative embodiments should be considered within the scope of the present invention. The terms used in the following claims should not be construed to limit the invention to the specific embodiments disclosed in the specification and the claims. Rather, the scope is to be determined entirely by the following claims.