SEMICONDUCTOR COMPONENT ON A HEAT PIPE

Abstract

The invention relates to a method for joining a power semiconductor component (1.1) to a heat pipe (2), wherein, during joining, the external pressure (p2) acting on the heat pipe (2) is changed proportionally to the internal pressure (p1) of the heat pipe (2), which internal pressure changes under heat during joining. The invention also relates to a device for carrying out the method, a power module, a converter and a vehicle.

Claims

1. A method for joining a power semiconductor component to a heat pipe, the method comprising: joining the power semiconductor component to the heat pipe, the joining comprising changing an external pressure acting on the heat pipe proportionally to an internal pressure of the heat pipe, the internal pressure changing as a result of an action of heat during the joining.

2. The method of claim 1, wherein the external pressure at a start of the joining is greater than the internal pressure.

3. The method of claim 1, wherein the joining comprises soldering.

4. The method of claim 1, wherein the joining comprises sintering, and wherein the heat pipe and the power semiconductor component are located in a pocket that presses the power semiconductor component onto the heat pipe when the external pressure is increased.

5. The method of claim 1, wherein the joining comprises sintering, and wherein the heat pipe and the power semiconductor component are located under a plastic film that presses the power semiconductor component onto the heat pipe when the external pressure is increased.

6. A device for joining a power semiconductor component to a heat pipe, the device comprising: a pressure chamber, in which the power semiconductor component is joinable to the heat pipe, the pressure chamber being configured to change an external pressure acting on the heat pipe proportionally to an internal pressure of the heat pipe, the internal pressure changing as a result of an action of heat during the join.

7. A power module comprising: at least one power semiconductor component; and at least one heat pipe, wherein the at least one power semiconductor component and the at least one heat pipe are joined by a change of an external pressure acting on the heat pipe proportionally to an internal pressure of the heat pipe, the internal pressure changing as a result of heat during the join.

8. A converter comprising: a plurality of power modules, a power module of the plurality of power modules comprising: at least one power semiconductor component; and at least one heat pipe, wherein the at least one power semiconductor component and the at least one heat pipe are joined by a change of an external pressure acting on the heat pipe proportionally to an internal pressure of the heat pipe, the internal pressure changing as a result of heat during the join.

9. The converter of claim 8, wherein the converter is an inverter.

10. A vehicle comprising: a converter for an electric or hybrid-electric drive, the converter comprising: a plurality of power modules, a power module of the plurality of power modules comprising: at least one power semiconductor component; and at least one heat pipe, wherein the at least one power semiconductor component and the at least one heat pipe are joined by a change of an external pressure acting on the heat pipe proportionally to an internal pressure of the heat pipe, the internal pressure changing as a result of heat during the join.

11. The vehicle of claim 10, wherein the vehicle is an aircraft.

12. The vehicle of claim 11, wherein the aircraft is an airplane.

13. The vehicle of claim 12, further comprising: an electric motor supplied with electrical energy by the converter; and a propeller set rotating rotatable by the electric motor.

14. The method of claim 2, wherein the joining comprises soldering.

15. The method of claim 2, wherein the joining comprises sintering, and wherein the heat pipe and the power semiconductor component are located in a pocket that presses the power semiconductor component onto the heat pipe when the external pressure is increased.

16. The method of claim 2, wherein the joining comprises sintering, and wherein the heat pipe and the power semiconductor component are located under a plastic film that presses the power semiconductor component onto the heat pipe when the external pressure is increased.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0036] FIG. 1 shows a side view of a power module according to the prior art;

[0037] FIG. 2 shows a view of one embodiment of a pressure chamber for soldering;

[0038] FIG. 3 shows a view of one embodiment of a pressure chamber for sintering with a pocket;

[0039] FIG. 4 shows a view of one embodiment of a pressure chamber for sintering with a plastic film;

[0040] FIG. 5 shows a block diagram of one embodiment of a converter having a power module; and

[0041] FIG. 6 shows one embodiment of an aircraft having an electric thrust-generating unit.

DETAILED DESCRIPTION

[0042] FIG. 1 shows a side view of parts of a power module 1 of a converter according to the prior art. A plurality of power semiconductor components 1.1 (only one is visible) are joined to a heat pipe 2 with the aid of an integral connection 3 (e.g., adhesive). The heat pipe 2 is used for effective heat dissipation of a power loss of the power semiconductor components 1.1. The heat pipe 2 is, for example, filled with water.

[0043] FIG. 2 shows a view of a device for soldering power semiconductor components 1.1 of a power module 1 to a water-filled heat pipe 2. The integral connection 3 is produced by a solder. In order that an internal pressure p1 in an interior of the heat pipe 2 during soldering does not cause the heat pipe 2 to burst, the soldering operation is carried out in a pressure chamber 4 that builds up an external pressure p2. The external pressure p2 is automatically adjusted such that the internal pressure p1 is always approximately equal to the external pressure p2.

[0044] This may be done, for example, by the internal pressure p1 in the heat pipe 2 being estimated by a temperature measurement on the heat pipe 2 and, for example, the external pressure p2 being increased in accordance with a recorded and stored table of the vapor pressure of water.

[0045] FIG. 3 shows a view of one embodiment of a device for sintering power semiconductor components 1.1 of a power module 1 onto a water-filled heat pipe 2. The integral connection 3 is produced by fine-grained ceramic or metallic materials. In order to apply the necessary pressure for sintering to the power semiconductor components 1.1, the power module 1 is arranged in a pocket 5. By increasing the external pressure p2, the fine-grained ceramic or metallic substances are melted.

[0046] In order that the internal pressure p1 in the interior of the heat pipe 2 during the soldering does not cause the heat pipe 2 to burst, the soldering operation is carried out in a pressure chamber 4 that builds up an external pressure p2. The external pressure p2 is automatically adjusted such that the internal pressure p1 is always approximately equal to the external pressure p2.

[0047] This may be done, for example, by the internal pressure p1 in the heat pipe 2 being estimated by a temperature measurement on the heat pipe 2 and, for example, the external pressure p2 being increased in accordance with a recorded and stored table of the vapor pressure of water.

[0048] FIG. 4 shows a view of an alternative device to FIG. 3 for sintering power semiconductor components 1.1 of a power module 1 onto a water-filled heat pipe 2. The integral connection 3 is produced by fine-grained ceramic or metallic materials. In order to apply the necessary pressure for sintering to the power semiconductor components 1.1, the power module 1 is enclosed by a plastic film 6. By increasing the external pressure p2, the plastic film 6 is pressed onto the power semiconductor components 1.1, and the fine-grained ceramic or metallic substances are melted.

[0049] In order that the internal pressure p1 in the interior of the heat pipe 2 during the soldering does not cause the heat pipe 2 to burst, the soldering operation is carried out in a pressure chamber 4 that builds up an external pressure p2. The external pressure p2 is automatically adjusted such that the internal pressure p1 is approximately equal to the external pressure p2.

[0050] This may be done, for example, by the internal pressure p1 in the heat pipe 2 being estimated by a temperature measurement on the heat pipe 2 and, for example, the external pressure p2 being increased in accordance with a recorded and stored table of the vapor pressure of water.

[0051] FIG. 5 shows a block diagram of one embodiment of a converter 7.3 (e.g., an inverter) having a power module 1 according to the illustrations of FIG. 2 to FIG. 4, joined according to the present embodiments.

[0052] FIG. 6 shows one embodiment of an electric or hybrid-electric aircraft 7 (e.g., an airplane) having a converter 7.3 according to FIG. 5, which supplies an electric motor 7.1 with electrical energy. The electric motor 7.1 drives a propeller 7.2. Both are part of an electric thrust-generating unit.

[0053] Although the invention has been illustrated and described in more detail via the exemplary embodiments, the invention is not restricted by the examples disclosed, and other variations may be derived therefrom by those skilled in the art without departing from the protective scope of the invention.

[0054] The elements and features recited in the appended claims may be combined in different ways to produce new claims that likewise fall within the scope of the present invention. Thus, whereas the dependent claims appended below depend from only a single independent or dependent claim, it is to be understood that these dependent claims may, alternatively, be made to depend in the alternative from any preceding or following claim, whether independent or dependent. Such new combinations are to be understood as forming a part of the present specification.

[0055] While the present invention has been described above by reference to various embodiments, it should be understood that many changes and modifications can be made to the described embodiments. It is therefore intended that the foregoing description be regarded as illustrative rather than limiting, and that it be understood that all equivalents and/or combinations of embodiments are intended to be included in this description.