POWER ELECTRONICS UNIT HAVING AT LEAST ONE SEMICONDUCTOR MODULE ATTACHED BY MEANS OF A PLASTIC HOLDER

Abstract

A power electronics unit for an electric motor of a motor vehicle drive, having a plate-like cooling element, at least one semiconductor module and a module holder which consists of plastic and secures the at least one semiconductor module relative to the cooling element. The module holder is fixed to the cooling element via an interlocking snap connection.

Claims

1. A power electronics unit for an electric motor of a motor vehicle drive, comprising, a plate-like cooling element, at least one semiconductor module and a module holder comprised of plastic and secures the at least one semiconductor module relative to the cooling element, wherein the module holder is fixed to the cooling element via an interlocking snap connection.

2. The power electronics unit according to claim 1, wherein the snap connection is implemented by an interlocking element which is integrally formed with the module holder and forms a snap-hook contour or by an interlocking element formed separately from the module holder.

3. The power electronics unit according to claim 1, wherein a first interlocking element of the snap connection, which is integrally molded with the module holder, is locked with receiving in the cooling element.

4. The power electronics unit according to claim 3, wherein a second interlocking element of the snap connection, which is formed separately from the module holder, is interlocked to the module holder and the cooling element.

5. The power electronics unit according to any one of claims 2 to 4, wherein the first or the second interlocking element is secured by a securing element against a loosening of the snap connection.

6. The power electronics unit according to claim 1, wherein a circuit board is attached directly to the module holder.

7. The power electronics unit according to claim 6, wherein the circuit board is attached to the module holder by fastening elements formed separately from the module holder and the circuit board or by fastening elements formed integrally with the module holder.

8. The power electronics unit according to claim 6, wherein the circuit board is attached to a side of the module holder facing away from the at least one semiconductor module.

9. The power electronics unit according to claim 1, wherein the module holder is formed from multiple stiffening rib.

10. The power electronics unit according to claim 9, wherein the module holder is formed from a fiber-reinforced plastic.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The disclosure will now be explained in more detail with reference to figures, in which connection various exemplary embodiments are also shown.

[0020] In the figures:

[0021] FIG. 1 shows a perspective view of a power electronics unit according to the disclosure, designed according to a first exemplary embodiment,

[0022] FIG. 2 shows a perspective exploded representation of the power electronics unit according to FIG. 1, wherein a plurality of semiconductor modules attached to a cooling element via a module holder can be clearly seen,

[0023] FIG. 3 shows a further perspective representation of the power electronics, wherein a circuit board fixed on the module holder is shown transparently,

[0024] FIG. 4 shows a sole perspective representation of the inserted module holder used in FIGS. 1 to 3 from a side facing the circuit board,

[0025] FIG. 5 shows a side representation of the module holder according to FIG. 4,

[0026] FIG. 6 shows a view from an underside of the module holder according to FIGS. 4 and 5,

[0027] FIG. 7 shows a perspective view of the underside according to FIG. 6,

[0028] FIG. 8 shows a perspective detail view of the module holder according to FIGS. 4 to 7 with an interlocking element to be attached in a receiving hole of the module holder, wherein the interlocking element is secured by a securing element in the fully assembled position before the snap connection with the cooling element is released again,

[0029] FIG. 9 shows a perspective representation of a module holder designed according to a second exemplary embodiment according to the disclosure, which differs from the first exemplary embodiment in terms of the design of the plurality of interlocking elements, and

[0030] FIG. 10 shows a representation of the underside of the module holder according to FIG. 9.

DETAILED DESCRIPTION

[0031] The figures are only schematic in nature and serve only for understanding the disclosure. The same elements are provided with the same reference symbols.

[0032] In connection with FIGS. 1 to 3 of the first exemplary embodiment, power electronics unit 1 according to the disclosure, which can be easily recognized, is designed for use in/on an electric drive motor, i.e., in an electric motor used for a drive of a motor vehicle. The power electronics unit 1 is shown in the region of a converter unit. The power electronics unit 1 consequently has multiple semiconductor modules 3a, 3b, 3c which convert the voltage provided by the vehicle electrical system to the drive of the electric motor, or a voltage generated by the electric motor itself, into a voltage of the vehicle electrical system.

[0033] The power electronics unit 1 has a plate-like cooling element 2, which can be seen clearly in FIG. 2. During operation, the cooling element 2 is typically connected to a cooling device to form a cooling element and a cooling medium flows therethrough. A plurality of receiving regions 15a to 15c are provided on the cooling element 2 towards one side of the cooling element 2 to accommodate multiple semiconductor modules 3a to 3c. The cooling element 2 has a first receiving region 15a for a first semiconductor module 3a. This first receiving region 15a is essentially formed as a trough in the cooling element 2, into which the first semiconductor module 3a is inserted. The two further receiving regions 15b and 15c are arranged in a row along with the first receiving region 15a along the rectangular cooling element 2. The two further receiving regions 15b and 15c are shaped essentially in accordance with the first receiving region 15a. A second semiconductor module 3b is inserted in a second receiving region 15b, and a third semiconductor module 3c is inserted in a third receiving region 15c.

[0034] For ultimately positionally accurate fixing of the semiconductor modules 3a, 3b, 3c on the cooling element 2, a holder designated as a module holder 4 is used. The module holder 4 is made of a plastic, namely a fiber-reinforced plastic. This module holder 4, as it is shown alone in connection with FIGS. 4 to 7, is essentially plate-like. According to the disclosure, the module holder 4 is fixed by an interlocking snap connection 5 in the finally assembled state on the part of the cooling element 2, wherein the individual semiconductor modules 3a, 3b, 3c are secured on the cooling element 2 (FIGS. 1 and 3). From FIG. 3 it can also be seen that the individual semiconductor modules 3a, 3b, 3c are held between a plate region 16 of the module holder 4 and the cooling element 2 in the fully assembled position of the power electronics unit 1. By being accommodated within the receiving regions 15a, 15b, the semiconductor modules 3a, 3b, 3c are at the same time secured against slipping out to the side of the module holder 4.

[0035] In this embodiment, the module holder 4 has both multiple first interlocking elements 7 and multiple second interlocking elements 8 to implement the snap connection 5. The first interlocking elements 7, as they can be seen in connection with FIGS. 4 to 7, are formed integrally with the module holder 4 in one piece. The first interlocking elements 7 are therefore also formed from the plastic of the module holder 4. The first interlocking elements 7 are implemented as snap hooks. Two first interlocking elements 7 are provided on the module holder 4 for a first axial end region 17a; two further first interlocking elements 7 are provided for a second axial end region 17b opposite the first axial end region 17a. The first interlocking elements 7 are latched behind first receiving holes 9a of the cooling element 2, which first receiving holes 9a are implemented in the form of elongated holes, forming the snap connection 5.

[0036] In addition, several second interlocking elements 8 are provided. These second interlocking elements 8, as can be seen in detail in FIG. 8, are designed separately from the module holder 4 and implemented essentially in the form of a sleeve. Each second interlocking element 8 has a collar 18 towards a first end and multiple snap-in lugs 19 towards a second end. While the snap-in lugs 19 in turn form a snap hook contour 6 and, in the fully assembled position with the formation of the snap connection 5, are locked behind a (third) receiving hole 9c of the cooling element 2, the collar 18 rests flat on the module holder 4. The module holder 4 is provided with multiple second receiving holes 9b for receiving the second interlocking elements 8. Each second interlocking element 8 is secured in the locked position thereof with a securing element 10, which forms a securing pin. For this purpose, the securing element 10 is pushed into a central hole in the second interlocking element 8 and prevents the snap-in lugs 19 from springing back again and thus from loosening the snap connection 5.

[0037] Overall, four second interlocking elements 8 are provided for each longitudinal side 20a, 20b of the module holder 4, the interlocking elements 8 of one longitudinal side 20a, 20b being arranged in a row next to one another. In particular, on each longitudinal side 20a, 20b, a second interlocking element 8 is arranged towards the first end region 17a, another second interlocking element 8 is arranged towards the second end region 17b and two further second interlocking elements 8 are arranged between the first semiconductor module 3a and the second semiconductor module 3b or between the second semiconductor module 3b and the third semiconductor module 3c. In the region between the semiconductor modules 3a, 3b, 3c, support webs 21 are also provided on the module holder 4, which rest flat on the cooling element 2, in the region between the semiconductor modules 3a, 3b, 3c.

[0038] In conjunction with FIGS. 6 and 7, it can be clearly seen that multiple stiffening ribs 13 are typically provided on a side of the module holder 4 facing the cooling element 2. These stiffening ribs 13 run essentially in the longitudinal direction of the module holder 4 and parallel to one another.

[0039] Furthermore, a circuit board 11 is fixed directly to the module holder 4 via multiple fastening elements 12. The circuit board 11 implemented as a gate circuit board is arranged on a side of the module holder 4 facing away from the cooling element 2. The fastening elements 12 are implemented as self-tapping screws. Each fastening element 12 penetrates a through-hole 14 in the circuit board 11 and is screwed to a base 22 of the module holder 4, which is formed integrally. For this purpose, the base 22 preferably already has a hole 23 which is smaller than a diameter (screw thread diameter) of the fastening element 12.

[0040] In this context, it should be pointed out in principle that the fastening elements 12 can also be implemented in other ways. According to a further preferred embodiment, which is not shown here for the sake of clarity, the bases 22 themselves are implemented directly as fastening elements. According to this further embodiment, each through-hole 14 made in the circuit board 11 is selected to be larger than the respective base 22 and pushed over this base 22 so that the base 22 penetrates the circuit board 11. A region of the base 22 that protrudes through the circuit board 11 and forms a free end is subsequently reshaped (preferably thermally) in such a way that this free end forms a shape that engages behind the circuit board 11, for example a mushroom shape, and the circuit board 11 is held thereby relative to the module conductor 4.

[0041] In conjunction with FIGS. 9 and 10, reference is made to an alternative second exemplary embodiment. In this second exemplary embodiment, the rest of the structure of the power electronics 1 is designed in accordance with the first exemplary embodiment, which is why only the differences in the shape of the module holder 4 will be discussed below. As in conjunction with FIGS. 9 and 10, the second interlocking elements 8 are now dispensed with. The regions of the module holder 4 which previously had the second receiving holes 9b in the first exemplary embodiment are replaced by first interlocking elements 7 which are implemented as snap hooks. Thus, several, namely four, first interlocking elements 7 are also provided on the two longitudinal sides 20a and 20b of the module holder 4, each of which is latched onto the cooling element 2 with a third receiving hole 9c, not shown here for the sake of clarity.

[0042] In other words, according to the disclosure, power semiconductors (semiconductor modules 3a, 3b, 3c) are provided with a holder 4 made of plastic with the aid of snap hooks 6; 7 connected to the cooling element 2. The snap hooks 6; 7 are additionally secured with securing elements 10 against unintentional opening. The construction enables the converter 1 to be constructed as compactly as possible. By integrating the module holder 4 and the gate driver board 11, components can be saved. Since the gate driver 11 and the power modules (semiconductor modules 3a, 3b, 3c) are both mounted with the power module holder 4, relative movements at the auxiliary contacts, such as vibration, can be reduced. These relative movements are critical for the service life of the electrical contacts. The snap hooks 6; 7 enable simple and inexpensive assembly. Previous screwing processes that needed to be monitored for torque and handling of the screws are no longer necessary. In the case of cooling elements 2 made of plastic, thread inserts therefore needed to be introduced before the power modules 3a, 3b, 3c could be screwed on. These requirements for the cooling element material do not apply with the snap hooks 6, 7. Due to the plastic construction of the module holder 4, the design of the ribs 13 and the setting of the modulus of elasticity of the plastic used by fillers, such as glass fibers, allow effective measures to stiffen and dampen vibration excitations in specific frequency ranges. The gate driver board 11 can be fastened to the module holder 4 with self-tapping screws 12. The forces on the plate 11 are so small that thread inserts are not necessary. Thanks to the plastic module carrier 4, hot caulking can also be used as a fastening method for the gate driver board 11. For this purpose, instead of the holes 23 for the screws 12, pins (base 22) are injection-molded onto the module holder 4. The board 11 is threaded there onto at the fastening holes 14 and the protruding pin 22 is formed into a mushroom shape with a warm stamp (similar to a riveted connection).

LIST OF REFERENCE NUMBERS

[0043] 1 Power electronics unit [0044] 2 Cooling element [0045] 3a First semiconductor module [0046] 3b Second semiconductor module [0047] 3c Third semiconductor module [0048] 4 Module holder [0049] 5 Snap connection [0050] 6 Snap hook contour [0051] 7 First interlocking element [0052] 8 Second interlocking element [0053] 9a First receiving hole [0054] 9b Second receiving hole [0055] 9c Third receiving hole [0056] 10 Securing element [0057] 11 Circuit board [0058] 12 Fastening element [0059] 13 Stiffening rib [0060] 14 Through-hole [0061] 15a First receiving region [0062] 15b Second receiving region [0063] 15c Third receiving region [0064] 16 Plate region [0065] 17a First end region [0066] 17b Second end region [0067] 18 Collar [0068] 19 Snap-in lug [0069] 20a First longitudinal side [0070] 20b Second longitudinal side [0071] 21 Support web [0072] 22 Base