Abstract
A device for determining a surface state of a roadway traveled or to be traveled by a vehicle, wherein the device comprises at least one light source for emitting primary light in the direction of the roadway traveled or to be traveled; at least one detector device for detecting secondary light that has been reflected and/or scattered by the roadway traveled or to be traveled; and an evaluation unit configured to emit, on the basis of the secondary light detected, the surface state of the roadway traveled or to be traveled by the vehicle. The essence of the invention is that the device furthermore comprises at least one first semiconductor chip, wherein at least two diodes are arranged on the at least one first semiconductor chip.
Claims
1. A device for determining a surface state of a roadway, which is one of traveled and to be traveled by a vehicle, the device comprising: at least one light source configured to emit primary light in a direction of the roadway; at least one detector configured to detect secondary light that has been one of reflected and scattered from the roadway; an evaluation device configured to determine, based on the detected secondary light, the surface state of the roadway; and at least one first semiconductor chip having at least two diodes arranged thereon.
2. The device as claimed in claim 1, wherein the at least two diodes arranged on the at least one first semiconductor chip include (i) at least one emitting diode of the at least one light source and (ii) at least one photodiode of the at least one detector.
3. The device as claimed in claim 2, wherein a number of emitting diodes of the at least one light source is greater than a number of photodiodes of the at least one detector.
4. The device as claimed in claim 2, wherein a number of photodiodes of the at least one detector is greater than a number of emitting diodes of the at least one light source.
5. The device as claimed in claim 1 further comprising: at least one second semiconductor chip having at least one diode arranged thereon.
6. The device as claimed in claim 5, wherein the at least two diodes arranged on the at least one first semiconductor chip include at least two emitting diodes of the at least one light source and the at least one diode arranged on the at least one second semiconductor chip include at least one photodiode of the at least one detector.
7. The device as claimed in claim 6, wherein the at least two diodes arranged on the at least one first semiconductor chip include as at least two photodiodes of the at least one detector and the at least one diode arranged on the at least one second semiconductor chip include at least one emitting diode of the at least one light source.
8. The device as claimed in claim 1 further comprising: at least one first temperature stabilization element arranged on the at least one first semiconductor chip.
9. A method for determining a surface state of a roadway, which is one of traveled and to be traveled by a vehicle, the method comprising: emitting, using at least one light source of a device, primary light in a direction of the roadway; detecting, using at least one detector of the device, secondary light that has been one of reflected and scattered from the roadway; and determining, using an evaluation device of the device, the surface state of the roadway based on the detected secondary light, wherein the device has at least one first semiconductor chip having at least two diodes arranged thereon.
Description
DRAWINGS
[0016] Exemplary embodiments of the present invention are explained in more detail hereinafter on the basis of the appended drawings. Identical reference signs in the figures identify identical or identically acting elements, in which:
[0017] FIG. 1 shows an exemplary embodiment of a device for determining a surface state of a roadway traveled or to be traveled by a vehicle having a first semiconductor chip and a second semiconductor chip;
[0018] FIG. 2 shows an exemplary embodiment of a first semiconductor chip;
[0019] FIG. 3 shows an exemplary embodiment of a first semiconductor chip and a second semiconductor chip;
[0020] FIG. 4 shows a further exemplary embodiment of a first semiconductor chip;
[0021] FIG. 5 shows a further exemplary embodiment of a first semiconductor chip and a second semiconductor chip;
[0022] FIG. 6 shows a further exemplary embodiment of a first semiconductor chip;
[0023] FIG. 7 shows a further exemplary embodiment of a first semiconductor chip.
[0024] FIG. 1 shows an exemplary embodiment of a device 100 for determining a surface state of a roadway 101 traveled or to be traveled by a vehicle having a first semiconductor chip 108-1 and a second semiconductor chip 108-2. The device 100 has the light source 102 for emitting primary light 103 in the direction of the roadway 101 traveled or to be traveled. The light source 102 can be activatable by means of the activation unit 106. The device 100 furthermore has the detector device 104 for detecting secondary light 105, which has been reflected and/or scattered by the roadway 101 traveled or to be traveled. Furthermore, the device 100 has the evaluation unit 107, which is designed to determine, on the basis of the detected secondary light 105, the surface state of the roadway 101 traveled or to be traveled by the vehicle. The device 100 has the first semiconductor chip 108-1. The four diodes 102-1 to 102-4 are arranged on the first semiconductor chip 108-1. The four diodes 102-1 to 102-4 are designed as four emitting diodes of the light source 102. The device 100 furthermore has the second semiconductor chip 108-2. A diode 104-1 is arranged on the second semiconductor chip 108-2. The diode 104-1 is designed as a photodiode 104-1 of the detector device 104. The number of the emitting diodes 102-1 to 102-4 on the first semiconductor chip 108-1 is thus greater than the number of the photodiodes 104-1 on the second semiconductor chip 108-2. The device 100 furthermore has a first temperature stabilization element 109 in the example. The temperature stabilization element 109 is shown by dashed lines, since it can optionally be provided. The first temperature stabilization element 109 is arranged on the first semiconductor chip 108-1. The device 100 furthermore has a second temperature stabilization element 110 in the example. The temperature stabilization element 110 is shown by dashed lines, since it can optionally be provided. The second temperature stabilization element 110 is arranged on the second semiconductor chip 108-2.
[0025] FIGS. 2-7 show further exemplary embodiments of the region 111 of the device 100 shown in FIG. 1. The optionally provided temperature stabilization elements were not shown here for the sake of simplicity.
[0026] FIG. 2 shows an exemplary embodiment of a first semiconductor chip 108-1. The at least two diodes on the first semiconductor chip 108-1 are designed as four emitting diodes 102-1 to 102-4 and as one photodiode 104-1. The emitting diodes 102-1 to 102-4 and the photodiode 104-1 are thus arranged jointly on the first semiconductor chip 108-1. The number of the emitting diodes of the light source 102 is greater here than the number of the photodiodes of the detector device 104 on the first semiconductor chip 108-1.
[0027] FIG. 3 shows an exemplary embodiment of a first semiconductor chip 108-1 and a second semiconductor chip 108-2. The at least two diodes on the first semiconductor chip 108-1 are designed as four emitting diodes 102-1 to 102-4. The four photodiodes 104-1 to 104-4 are arranged on the second semiconductor chip 108-2. The number of the emitting diodes 102-1 to 102-4 on the first semiconductor chip 108-1 is thus equal to the number of the photodiodes 104-1 to 104-4 on the second semiconductor chip 108-2.
[0028] Therefore, the light source 102 is arranged on the first semiconductor chip 108-1 and the detector device 104 is arranged on the second semiconductor chip 108-2. The light source 102 and the detector device 104 are arranged separately from one another. The detector device 104 can furthermore have at least one wavelength filter (not shown here) for distributing secondary light of various wavelengths onto the photodiodes 104-1 to 104-4.
[0029] FIG. 4 shows a further exemplary embodiment of a first semiconductor chip 108-1. The at least two diodes on the first semiconductor chip 108-1 are designed as four emitting diodes 102-1 to 102-4 and as four photodiodes 104-1 to 104-4. The emitting diodes 102-1 to 102-4 and the photodiodes 104-1 to 104-4 are thus arranged jointly on the first semiconductor chip 108-1, The number of the emitting diodes of the laser device 102 is equal to the number of the photodiodes of the detector device 104 on the first semiconductor chip 108-1 in this case. The detector device 104 can furthermore have at least one wavelength filter (not shown here) for distributing secondary light of various wavelengths onto the photodiodes 104-1 to 104-4.
[0030] FIG. 5 shows a further exemplary embodiment of a first semiconductor chip 108-1 and a second semiconductor chip 108-2. The at least two diodes on the first semiconductor chip 108-1 are designed as four photodiodes 104-1 to 104-4. One emitting diode 102-1 is arranged on the second semiconductor chip 108-2. The number of the photodiodes 104-1 to 104-4 on the first semiconductor chip 108-1 is thus greater than the number of the emitting diodes on the second semiconductor chip 108-2. The detector device 104 is thus arranged on the first semiconductor chip 108-1 and the light source 102 is arranged on the second semiconductor chip 108-2. The light source 102 and the detector device 104 are arranged separately from one another. The detector device 104 can furthermore have at least one wavelength filter (not shown here) for distributing secondary light of various wavelengths onto the photodiodes 104-1 to 104-4.
[0031] FIG. 6 shows a further exemplary embodiment of a first semiconductor chip 108-1. The at least two diodes on the first semiconductor chip 108-1 are designed as four photodiodes 104-1 to 104-4 and as one emitting diode 102-1. The photodiodes 104-1 to 104-4 and the emitting diode 102-1 are thus jointly arranged on the first semiconductor chip 108-1, The number of the photodiodes of the detector device 104 is greater here than the number of the emitting diodes of the laser device 102 on the first semiconductor chip 108-1, The detector device 104 can furthermore have at least one wavelength filter (not shown here) for distributing secondary light of various wavelengths onto the photodiodes 104-1 to 104-4.
[0032] FIG. 7 shows a further exemplary embodiment of a first semiconductor chip and a second semiconductor chip 108-1. The at least two diodes on the first semiconductor chip 108-1 are designed as one emitting diode 102-1 and as one photodiode 104-1. The emitting diode 102-1 and the photodiode 104-1 are thus arranged jointly on the first semiconductor chip 108-1. The number of the emitting diodes of the light source 102 is equal here to the number of the photodiodes of the detector device 104 on the first semiconductor chip 108-1.
